KR100786421B1 - 집적 회로 본더의 본드 프로그램 오류를 감소시키는시스템 및 방법 - Google Patents

집적 회로 본더의 본드 프로그램 오류를 감소시키는시스템 및 방법 Download PDF

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KR100786421B1
KR100786421B1 KR1020010024007A KR20010024007A KR100786421B1 KR 100786421 B1 KR100786421 B1 KR 100786421B1 KR 1020010024007 A KR1020010024007 A KR 1020010024007A KR 20010024007 A KR20010024007 A KR 20010024007A KR 100786421 B1 KR100786421 B1 KR 100786421B1
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South Korea
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slave
master
bond
bonder
program
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Expired - Fee Related
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KR1020010024007A
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English (en)
Korean (ko)
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KR20010100971A (ko
Inventor
코두리스리니바산케이.
본데이빗제이.
Original Assignee
텍사스 인스트루먼츠 인코포레이티드
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part program, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45029—Mount and solder parts on board
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49113—Align elements like hole and drill, centering tool, probe, workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
KR1020010024007A 2000-05-04 2001-05-03 집적 회로 본더의 본드 프로그램 오류를 감소시키는시스템 및 방법 Expired - Fee Related KR100786421B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20191000P 2000-05-04 2000-05-04
US60/201,910 2000-05-04

Publications (2)

Publication Number Publication Date
KR20010100971A KR20010100971A (ko) 2001-11-14
KR100786421B1 true KR100786421B1 (ko) 2007-12-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010024007A Expired - Fee Related KR100786421B1 (ko) 2000-05-04 2001-05-03 집적 회로 본더의 본드 프로그램 오류를 감소시키는시스템 및 방법

Country Status (5)

Country Link
US (1) US6629013B2 (https=)
JP (1) JP2002016099A (https=)
KR (1) KR100786421B1 (https=)
CN (1) CN1211178C (https=)
TW (1) TW542989B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069102B2 (en) * 2000-05-16 2006-06-27 Texas Instruments Incorporated System and method to customize bond programs compensating integrated circuit bonder variability
US7021520B2 (en) * 2001-12-05 2006-04-04 Micron Technology, Inc. Stacked chip connection using stand off stitch bonding
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005223202A (ja) * 2004-02-06 2005-08-18 Seiko Epson Corp 半導体装置の製造方法及びその製造装置
JP4709535B2 (ja) * 2004-11-19 2011-06-22 株式会社東芝 半導体装置の製造装置
KR101133130B1 (ko) * 2006-03-28 2012-04-06 삼성테크윈 주식회사 기준 본드 패드들을 이용한 본딩 좌표 보정 방법
TWI315089B (en) * 2006-10-30 2009-09-21 Advanced Semiconductor Eng Wire-bonding method for wire-bonding apparatus
GB2457676B (en) * 2008-02-21 2012-04-18 Rolls Royce Plc Performing a process on a workpiece
US20120024089A1 (en) * 2008-02-29 2012-02-02 Kulicke And Soffa Industries, Inc. Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same
TWI567839B (zh) * 2014-08-27 2017-01-21 矽品精密工業股份有限公司 打線構造及銲線形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042247A (en) * 1997-07-11 2000-03-28 Texas Instruments Incorporated Efficient hybrid illuminator

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
JP3101853B2 (ja) * 1994-04-27 2000-10-23 株式会社新川 ボンデイング座標のティーチング方法
JP3106345B2 (ja) * 1995-10-23 2000-11-06 株式会社新川 ワイヤボンディング装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042247A (en) * 1997-07-11 2000-03-28 Texas Instruments Incorporated Efficient hybrid illuminator

Also Published As

Publication number Publication date
US6629013B2 (en) 2003-09-30
US20010044669A1 (en) 2001-11-22
TW542989B (en) 2003-07-21
JP2002016099A (ja) 2002-01-18
CN1211178C (zh) 2005-07-20
KR20010100971A (ko) 2001-11-14
CN1323672A (zh) 2001-11-28

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