TW542989B - System and method to reduce bond program errors of integrated circuit bonders - Google Patents

System and method to reduce bond program errors of integrated circuit bonders Download PDF

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Publication number
TW542989B
TW542989B TW090110560A TW90110560A TW542989B TW 542989 B TW542989 B TW 542989B TW 090110560 A TW090110560 A TW 090110560A TW 90110560 A TW90110560 A TW 90110560A TW 542989 B TW542989 B TW 542989B
Authority
TW
Taiwan
Prior art keywords
wire
slave
image
data
patent application
Prior art date
Application number
TW090110560A
Other languages
English (en)
Chinese (zh)
Inventor
Sreenivasan K Koduri
David J Bon
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW542989B publication Critical patent/TW542989B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part program, for the NC machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45029—Mount and solder parts on board
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45235—Dispensing adhesive, solder paste, for pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49113—Align elements like hole and drill, centering tool, probe, workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/533—Cross-sectional shape
    • H10W72/534—Cross-sectional shape being rectangular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
TW090110560A 2000-05-04 2001-05-03 System and method to reduce bond program errors of integrated circuit bonders TW542989B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20191000P 2000-05-04 2000-05-04

Publications (1)

Publication Number Publication Date
TW542989B true TW542989B (en) 2003-07-21

Family

ID=22747786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090110560A TW542989B (en) 2000-05-04 2001-05-03 System and method to reduce bond program errors of integrated circuit bonders

Country Status (5)

Country Link
US (1) US6629013B2 (https=)
JP (1) JP2002016099A (https=)
KR (1) KR100786421B1 (https=)
CN (1) CN1211178C (https=)
TW (1) TW542989B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567839B (zh) * 2014-08-27 2017-01-21 矽品精密工業股份有限公司 打線構造及銲線形成方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069102B2 (en) * 2000-05-16 2006-06-27 Texas Instruments Incorporated System and method to customize bond programs compensating integrated circuit bonder variability
US7021520B2 (en) * 2001-12-05 2006-04-04 Micron Technology, Inc. Stacked chip connection using stand off stitch bonding
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005223202A (ja) * 2004-02-06 2005-08-18 Seiko Epson Corp 半導体装置の製造方法及びその製造装置
JP4709535B2 (ja) * 2004-11-19 2011-06-22 株式会社東芝 半導体装置の製造装置
KR101133130B1 (ko) * 2006-03-28 2012-04-06 삼성테크윈 주식회사 기준 본드 패드들을 이용한 본딩 좌표 보정 방법
TWI315089B (en) * 2006-10-30 2009-09-21 Advanced Semiconductor Eng Wire-bonding method for wire-bonding apparatus
GB2457676B (en) * 2008-02-21 2012-04-18 Rolls Royce Plc Performing a process on a workpiece
US20120024089A1 (en) * 2008-02-29 2012-02-02 Kulicke And Soffa Industries, Inc. Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
JP3101853B2 (ja) * 1994-04-27 2000-10-23 株式会社新川 ボンデイング座標のティーチング方法
JP3106345B2 (ja) * 1995-10-23 2000-11-06 株式会社新川 ワイヤボンディング装置
US6042247A (en) * 1997-07-11 2000-03-28 Texas Instruments Incorporated Efficient hybrid illuminator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567839B (zh) * 2014-08-27 2017-01-21 矽品精密工業股份有限公司 打線構造及銲線形成方法

Also Published As

Publication number Publication date
US6629013B2 (en) 2003-09-30
US20010044669A1 (en) 2001-11-22
JP2002016099A (ja) 2002-01-18
CN1211178C (zh) 2005-07-20
KR20010100971A (ko) 2001-11-14
KR100786421B1 (ko) 2007-12-17
CN1323672A (zh) 2001-11-28

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