KR100773415B1 - 평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 - Google Patents
평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 Download PDFInfo
- Publication number
- KR100773415B1 KR100773415B1 KR1020050135109A KR20050135109A KR100773415B1 KR 100773415 B1 KR100773415 B1 KR 100773415B1 KR 1020050135109 A KR1020050135109 A KR 1020050135109A KR 20050135109 A KR20050135109 A KR 20050135109A KR 100773415 B1 KR100773415 B1 KR 100773415B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- bonding
- electronic components
- transfer mechanism
- unloading
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
Claims (3)
- 다면체 형태로서 각 표면에는 기판장착부(10)가 마련되고 수평축(12)을 중심으로 각도회전이 가능하게 설치되는 이송기구(1)와; 그리고상기 이송기구(1)의 각 표면에 마련된 기판장착부(10)의 대향측엔 기판(7)을 이송기구(1)의 기판장착부(10)로 이동시켜 장착시키는 로딩기구(2)와,이방전도성 필름을 기판(7)에 부착하기 위하여 사용되는 필름접합기구(3)와,기판(7)에 장착을 요하는 칩이나 기타 전자부품을 예비적으로 접합하기 위한 예비접합기구(4)와,기판(7)에 장착을 요하는 칩이나 기타 전자부품을 주접합하기 위한 주접합기구(5)와, 그리고기판(7)에 전자부품의 주접합이 이루어진 상태에서 기판(7)을 이송기구(1)의 기판장착부(10)로부터 분리하고 언로딩시키는 언로딩기구(6)를 각각 배치 고정시켜 이루어지는 것을 특징으로 하는 평판디스플레이의 제조를 위한 전자부품의 접합장치.
- 제1항에 있어서,상기 이송기구(1)는 양측의 지지대(14,14)에 설치되는 수평축(12)을 중심으로 제자리에서 구동모터(16)에 의하여 각도 회전에 의한 변위가 가능하게 구성되고,상기 이송기구(1)에 마련되는 여러 기판장착부(10)는 표면에 다수의 흡기공이 형성되는 진공척 형태로 구성이 이루어지는 것을 특징으로 하는 평판디스플레이의 제조를 위한 전자부품의 접합장치.
- 전자부품의 접합을 위한 기판(7)의 로딩단계 후에 전자부품의 접합이 이루어진 기판(7)을 언로딩하는 단계에 이르기까지 이송기구(1)의 소정 위치에 일단 기판(7)을 고정 위치시킨 상태에서 접합이 이루어지게 되는 공정으로서 이방전도성 필름의 접합이 이루어지는 필름접합단계, 전자부품의 예비접합이 이루어지는 예비접합단계 및 전자부품의 주접합이 이루어지는 주접합단계가 순차적으로 이루어지되,상기 이송기구(1)가 수평축(12)을 기준으로 각 단계별로 상,하 각도회전이 이루어지는 각각의 단계에서 순차적으로 작업이 이루어지도록 하는 것을 특징으로 하는 평판디스플레이의 제조를 위한 전자부품의 접합방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050135109A KR100773415B1 (ko) | 2005-12-30 | 2005-12-30 | 평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050135109A KR100773415B1 (ko) | 2005-12-30 | 2005-12-30 | 평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020050037115U Division KR200411073Y1 (ko) | 2005-12-30 | 2005-12-30 | 평판디스플레이의 제조를 위한 전자부품의 접합장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070071555A KR20070071555A (ko) | 2007-07-04 |
KR100773415B1 true KR100773415B1 (ko) | 2007-11-08 |
Family
ID=38506672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050135109A KR100773415B1 (ko) | 2005-12-30 | 2005-12-30 | 평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100773415B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101248292B1 (ko) * | 2011-05-11 | 2013-04-03 | 박웅기 | 전자부품용 패널의 접합 방법 및 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07157232A (ja) | 1993-10-18 | 1995-06-20 | Inventio Ag | エレベータ・ケージ用安全装置 |
KR19980068190A (ko) * | 1997-02-17 | 1998-10-15 | 김광호 | 자동 적층 및 솔더링 장치 및 3차원 적층형 패키지 소자 제조 방법 |
US6104595A (en) | 1998-04-06 | 2000-08-15 | Applied Materials, Inc. | Method and apparatus for discharging an electrostatic chuck |
KR20040039488A (ko) * | 2001-10-03 | 2004-05-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 엔드 이펙터 어셈블리 |
KR20040077575A (ko) * | 2003-02-28 | 2004-09-04 | 캐논 가부시끼가이샤 | 접합시스템과 반도체기판의 제조방법 |
-
2005
- 2005-12-30 KR KR1020050135109A patent/KR100773415B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07157232A (ja) | 1993-10-18 | 1995-06-20 | Inventio Ag | エレベータ・ケージ用安全装置 |
KR19980068190A (ko) * | 1997-02-17 | 1998-10-15 | 김광호 | 자동 적층 및 솔더링 장치 및 3차원 적층형 패키지 소자 제조 방법 |
US6104595A (en) | 1998-04-06 | 2000-08-15 | Applied Materials, Inc. | Method and apparatus for discharging an electrostatic chuck |
KR20040039488A (ko) * | 2001-10-03 | 2004-05-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 엔드 이펙터 어셈블리 |
KR20040077575A (ko) * | 2003-02-28 | 2004-09-04 | 캐논 가부시끼가이샤 | 접합시스템과 반도체기판의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20070071555A (ko) | 2007-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8991681B2 (en) | Die bonder and bonding method | |
TWI649810B (zh) | 半導體製造裝置及半導體裝置的製造方法 | |
TWI666720B (zh) | 帶有多個用於傳送電子器件進行鍵合的旋轉傳送臂的鍵合裝置 | |
KR100722452B1 (ko) | 구동용 회로기판 본딩장치 및 그 방법 | |
WO2012120956A1 (ja) | 搬送装置および組立装置 | |
KR100773415B1 (ko) | 평판디스플레이의 제조를 위한 전자부품의 접합방법 및장치 | |
KR200411073Y1 (ko) | 평판디스플레이의 제조를 위한 전자부품의 접합장치 | |
JP3275743B2 (ja) | チップの実装装置 | |
JP3246282B2 (ja) | 表示パネルモジュールの製造装置および表示パネルモジュールの製造方法 | |
JP5089879B2 (ja) | 表示装置の組み立て装置及び組み立て方法 | |
JP4295713B2 (ja) | 表示装置の組み立て装置及び表示装置の組み立て方法 | |
JPWO2013141388A1 (ja) | 電子部品の実装装置及び実装方法 | |
JP2012164706A (ja) | 被実装部材の実装装置及び実装方法 | |
KR20130004012A (ko) | 평판 디스플레이의 모듈 접합 방법 및 장치 | |
JP2013042070A (ja) | 電子部品の実装装置及び実装方法 | |
JP3094639B2 (ja) | 液晶表示モジュールにおける回路基板の接合方法 | |
JP5702114B2 (ja) | チップの積層装置及び積層方法 | |
JPH10163265A (ja) | チップの実装装置 | |
KR100565783B1 (ko) | 반도체 패키지용 다중 정렬장치 및 방법 | |
JP4520270B2 (ja) | 表示装置の組み立て装置及び組み立て方法 | |
JP4579658B2 (ja) | 被実装部材の実装装置及び実装方法 | |
KR100900710B1 (ko) | 디스플레이 패널과 피씨비의 접착장치 | |
JP4914751B2 (ja) | 表示装置の組み立て装置及び組み立て方法 | |
JP2007150077A (ja) | 表示装置の組み立て装置及び組み立て方法 | |
JP3233025B2 (ja) | 電子部品実装方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120808 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20130812 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20140808 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20150813 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20160824 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180912 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20190809 Year of fee payment: 13 |