KR100741198B1 - 전기 도금 배스 - Google Patents
전기 도금 배스 Download PDFInfo
- Publication number
- KR100741198B1 KR100741198B1 KR1020050122525A KR20050122525A KR100741198B1 KR 100741198 B1 KR100741198 B1 KR 100741198B1 KR 1020050122525 A KR1020050122525 A KR 1020050122525A KR 20050122525 A KR20050122525 A KR 20050122525A KR 100741198 B1 KR100741198 B1 KR 100741198B1
- Authority
- KR
- South Korea
- Prior art keywords
- electroplating bath
- anode
- screen
- acid
- electrolyte
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05009183.4 | 2005-04-27 | ||
EP05009183A EP1717351A1 (de) | 2005-04-27 | 2005-04-27 | Galvanikbad |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060113344A KR20060113344A (ko) | 2006-11-02 |
KR100741198B1 true KR100741198B1 (ko) | 2007-07-19 |
Family
ID=34935798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050122525A KR100741198B1 (ko) | 2005-04-27 | 2005-12-13 | 전기 도금 배스 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060272951A1 (zh) |
EP (1) | EP1717351A1 (zh) |
JP (1) | JP4404871B2 (zh) |
KR (1) | KR100741198B1 (zh) |
CN (1) | CN1854352B (zh) |
TW (1) | TWI332533B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
ES2698205T3 (es) | 2005-11-25 | 2019-02-01 | Macdermid Enthone Inc | Procedimiento y dispositivo para la purificación de soluciones de proceso |
EP1961842A1 (en) * | 2007-02-22 | 2008-08-27 | Atotech Deutschland Gmbh | Device and method for the electrolytic plating of a metal |
EP2009147A1 (en) * | 2007-06-20 | 2008-12-31 | METAKEM Gesellschaft für Schichtchemie der Metalle GmbH | Anode assembly for electroplating |
US8940158B2 (en) * | 2009-02-13 | 2015-01-27 | Chlorking, Inc. | System and method for chlorine generation and distribution |
US8221600B2 (en) | 2010-09-23 | 2012-07-17 | Sunpower Corporation | Sealed substrate carrier for electroplating |
US8317987B2 (en) | 2010-09-23 | 2012-11-27 | Sunpower Corporation | Non-permeable substrate carrier for electroplating |
US8221601B2 (en) | 2010-09-23 | 2012-07-17 | Sunpower Corporation | Maintainable substrate carrier for electroplating |
CN203795007U (zh) * | 2010-09-23 | 2014-08-27 | 太阳能公司 | 用于电镀的不可渗透基板载体 |
US9006147B2 (en) * | 2012-07-11 | 2015-04-14 | Faraday Technology, Inc. | Electrochemical system and method for electropolishing superconductive radio frequency cavities |
CN104073862A (zh) * | 2014-07-11 | 2014-10-01 | 张钰 | 一种用于碱性锌镍合金电镀的不溶性阳极装置 |
CN105887144B (zh) * | 2016-06-21 | 2018-09-21 | 广东光华科技股份有限公司 | 电镀铜镀液及其电镀铜工艺 |
DE102019202899B3 (de) * | 2019-03-04 | 2019-11-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150000A (ja) * | 1987-12-07 | 1989-06-13 | Nippon Steel Corp | 電気メッキ用不溶性陽極 |
US20030085133A1 (en) * | 2001-07-26 | 2003-05-08 | Electroplating Engineers Of Japan Limited (Japanese Corporation) | Copper plating solution for embedding fine wiring, and copper plating method using the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3607706A (en) * | 1967-08-04 | 1971-09-21 | Ionics | Method of making stable laminated cation-exchange membranes |
US3832296A (en) * | 1972-08-07 | 1974-08-27 | Kennecott Copper Corp | Electrowinning cell and method with provision for electrolyte circulation |
US3857683A (en) | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
US4138510A (en) * | 1973-09-27 | 1979-02-06 | Firma C. Conradty | Metal anode for electrochemical processing and method of making same |
US4033837A (en) * | 1976-02-24 | 1977-07-05 | Olin Corporation | Plated metallic cathode |
JPS5626554A (en) * | 1979-08-10 | 1981-03-14 | Asahi Chem Ind Co Ltd | Improved cation exchange membrane |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
US5378347A (en) | 1993-05-19 | 1995-01-03 | Learonal, Inc. | Reducing tin sludge in acid tin plating |
DE19545231A1 (de) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
DE19653681C2 (de) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens |
US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
DE19834353C2 (de) * | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
KR100366631B1 (ko) * | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
US6610192B1 (en) * | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US20040060728A1 (en) | 2001-01-04 | 2004-04-01 | Philippe Steiert | Method for producing electroconductive structures |
EP1310582A1 (en) | 2001-11-07 | 2003-05-14 | Shipley Company LLC | Process for electrolytic copper plating |
US20040217005A1 (en) * | 2002-07-24 | 2004-11-04 | Aron Rosenfeld | Method for electroplating bath chemistry control |
DE10261493A1 (de) | 2002-12-23 | 2004-07-08 | METAKEM Gesellschaft für Schichtchemie der Metalle mbH | Anode zur Galvanisierung |
EP1712660A1 (de) * | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
-
2005
- 2005-04-27 EP EP05009183A patent/EP1717351A1/de not_active Withdrawn
- 2005-11-02 CN CN2005101201051A patent/CN1854352B/zh active Active
- 2005-12-13 KR KR1020050122525A patent/KR100741198B1/ko not_active IP Right Cessation
-
2006
- 2006-03-02 TW TW095107051A patent/TWI332533B/zh active
- 2006-04-26 JP JP2006121511A patent/JP4404871B2/ja active Active
- 2006-04-27 US US11/380,559 patent/US20060272951A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150000A (ja) * | 1987-12-07 | 1989-06-13 | Nippon Steel Corp | 電気メッキ用不溶性陽極 |
US20030085133A1 (en) * | 2001-07-26 | 2003-05-08 | Electroplating Engineers Of Japan Limited (Japanese Corporation) | Copper plating solution for embedding fine wiring, and copper plating method using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2006307344A (ja) | 2006-11-09 |
EP1717351A1 (de) | 2006-11-02 |
CN1854352B (zh) | 2010-09-22 |
CN1854352A (zh) | 2006-11-01 |
JP4404871B2 (ja) | 2010-01-27 |
KR20060113344A (ko) | 2006-11-02 |
TW200704831A (en) | 2007-02-01 |
TWI332533B (en) | 2010-11-01 |
US20060272951A1 (en) | 2006-12-07 |
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Legal Events
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20110706 Year of fee payment: 5 |
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LAPS | Lapse due to unpaid annual fee |