JP4404871B2 - 電気めっき槽 - Google Patents

電気めっき槽 Download PDF

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Publication number
JP4404871B2
JP4404871B2 JP2006121511A JP2006121511A JP4404871B2 JP 4404871 B2 JP4404871 B2 JP 4404871B2 JP 2006121511 A JP2006121511 A JP 2006121511A JP 2006121511 A JP2006121511 A JP 2006121511A JP 4404871 B2 JP4404871 B2 JP 4404871B2
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JP
Japan
Prior art keywords
electroplating
electroplating tank
anode
tank according
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006121511A
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English (en)
Japanese (ja)
Other versions
JP2006307344A (ja
Inventor
シュマーゲル ウルリッヒ
ラスムッセン ジャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of JP2006307344A publication Critical patent/JP2006307344A/ja
Application granted granted Critical
Publication of JP4404871B2 publication Critical patent/JP4404871B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
JP2006121511A 2005-04-27 2006-04-26 電気めっき槽 Active JP4404871B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05009183A EP1717351A1 (de) 2005-04-27 2005-04-27 Galvanikbad

Publications (2)

Publication Number Publication Date
JP2006307344A JP2006307344A (ja) 2006-11-09
JP4404871B2 true JP4404871B2 (ja) 2010-01-27

Family

ID=34935798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006121511A Active JP4404871B2 (ja) 2005-04-27 2006-04-26 電気めっき槽

Country Status (6)

Country Link
US (1) US20060272951A1 (zh)
EP (1) EP1717351A1 (zh)
JP (1) JP4404871B2 (zh)
KR (1) KR100741198B1 (zh)
CN (1) CN1854352B (zh)
TW (1) TWI332533B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1712660A1 (de) * 2005-04-12 2006-10-18 Enthone Inc. Unlösliche Anode
ES2698205T3 (es) 2005-11-25 2019-02-01 Macdermid Enthone Inc Procedimiento y dispositivo para la purificación de soluciones de proceso
EP1961842A1 (en) * 2007-02-22 2008-08-27 Atotech Deutschland Gmbh Device and method for the electrolytic plating of a metal
EP2009147A1 (en) * 2007-06-20 2008-12-31 METAKEM Gesellschaft für Schichtchemie der Metalle GmbH Anode assembly for electroplating
US8940158B2 (en) * 2009-02-13 2015-01-27 Chlorking, Inc. System and method for chlorine generation and distribution
US8221600B2 (en) 2010-09-23 2012-07-17 Sunpower Corporation Sealed substrate carrier for electroplating
US8317987B2 (en) 2010-09-23 2012-11-27 Sunpower Corporation Non-permeable substrate carrier for electroplating
US8221601B2 (en) 2010-09-23 2012-07-17 Sunpower Corporation Maintainable substrate carrier for electroplating
CN203795007U (zh) * 2010-09-23 2014-08-27 太阳能公司 用于电镀的不可渗透基板载体
US9006147B2 (en) * 2012-07-11 2015-04-14 Faraday Technology, Inc. Electrochemical system and method for electropolishing superconductive radio frequency cavities
CN104073862A (zh) * 2014-07-11 2014-10-01 张钰 一种用于碱性锌镍合金电镀的不溶性阳极装置
CN105887144B (zh) * 2016-06-21 2018-09-21 广东光华科技股份有限公司 电镀铜镀液及其电镀铜工艺
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607706A (en) * 1967-08-04 1971-09-21 Ionics Method of making stable laminated cation-exchange membranes
US3832296A (en) * 1972-08-07 1974-08-27 Kennecott Copper Corp Electrowinning cell and method with provision for electrolyte circulation
US3857683A (en) 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
US4138510A (en) * 1973-09-27 1979-02-06 Firma C. Conradty Metal anode for electrochemical processing and method of making same
US4033837A (en) * 1976-02-24 1977-07-05 Olin Corporation Plated metallic cathode
JPS5626554A (en) * 1979-08-10 1981-03-14 Asahi Chem Ind Co Ltd Improved cation exchange membrane
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPH01150000A (ja) * 1987-12-07 1989-06-13 Nippon Steel Corp 電気メッキ用不溶性陽極
US5378347A (en) 1993-05-19 1995-01-03 Learonal, Inc. Reducing tin sludge in acid tin plating
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
DE19653681C2 (de) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
DE19834353C2 (de) * 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
KR100366631B1 (ko) * 2000-09-27 2003-01-09 삼성전자 주식회사 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US20040060728A1 (en) 2001-01-04 2004-04-01 Philippe Steiert Method for producing electroconductive structures
JP2003105584A (ja) * 2001-07-26 2003-04-09 Electroplating Eng Of Japan Co 微細配線埋め込み用銅メッキ液及びそれを用いた銅メッキ方法
EP1310582A1 (en) 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
DE10261493A1 (de) 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
EP1712660A1 (de) * 2005-04-12 2006-10-18 Enthone Inc. Unlösliche Anode

Also Published As

Publication number Publication date
JP2006307344A (ja) 2006-11-09
EP1717351A1 (de) 2006-11-02
CN1854352B (zh) 2010-09-22
CN1854352A (zh) 2006-11-01
KR100741198B1 (ko) 2007-07-19
KR20060113344A (ko) 2006-11-02
TW200704831A (en) 2007-02-01
TWI332533B (en) 2010-11-01
US20060272951A1 (en) 2006-12-07

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