KR100717327B1 - Organic Electro Luminescence Display Device And Method For Fabricating Thereof - Google Patents

Abstract

The present invention relates to an organic electroluminescent display device capable of preventing defective pad portions and a manufacturing method thereof.

An organic light emitting display according to the present invention includes: an organic electroluminescent array; A packaging plate surrounding the organic electroluminescent array; A pad provided outside the packaging plate, the first and second conductive layers supplying a driving signal to the organic electroluminescent array; And a signal supply film electrically connected to the pad, wherein the second conductive layer exposes the first conductive layer in a region where the signal conductive film is not overlapped with the signal supply film.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic electroluminescence display device,             

1 is a cross-sectional view schematically showing a conventional organic light emitting display device.

FIG. 2 is a cross-sectional view of the organic electroluminescent array shown in FIG. 1 taken along the line I-I '.

3 is a view showing a pad region of a conventional organic light emitting display device.

4 is a view showing a defect of a conventional pad portion.

5 is a view showing a pad region of an organic light emitting display according to the present invention.

6 is a flowchart showing a method of manufacturing an organic light emitting display according to the present invention.

Description of the Related Art

2,102: substrate 4: first electrode

10: organic light emitting layer 12: second electrode

28, 128: packaging plate 26, 126: sealant

TCP: 32,312 30,130: ACF

36, 136: transparency layer 34, 134: opacity layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device capable of preventing a pad portion from being defective and a method of manufacturing the same.

2. Description of the Related Art In recent years, various flat panel display devices capable of reducing weight and volume, which are disadvantages of a cathode ray tube (CRT), have been developed. Such a flat panel display device includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an electroluminescent And an electro-luminescence (hereinafter referred to as "EL") display device. [0004] Researches for increasing the display quality of such a flat panel display device and attempting to make it larger have been actively conducted.

Among these PDPs, PDPs are attracting attention as a display device that is most advantageous for large screen size but large screen size because of simple structure and manufacturing process, but it has disadvantage of low luminous efficiency, low luminance and high power consumption. On the other hand, an active matrix LCD, in which a thin film transistor (hereinafter referred to as "TFT") is applied as a switching element, is difficult to make a large screen because of using a semiconductor process and has a drawback in that power consumption is large due to a backlight unit, , A prism sheet, a diffuser plate, and the like, and has a narrow viewing angle.

On the other hand, the EL display device is divided into an inorganic EL element and an organic EL element depending on the material of the light emitting layer, and has the advantage of high response speed, large light emitting efficiency, high luminance and wide viewing angle. Inorganic EL elements have higher power consumption than organic EL elements and can not obtain high luminance, and can not emit various colors of R, G, and B. On the other hand, the organic EL device is driven by a low DC voltage of several tens volts, has a fast response speed, can obtain high luminance, and emits various colors of R, G, and B, and is suitable for a next generation flat panel display device.

FIG. 1 is a cross-sectional view schematically showing a conventional organic EL display device, and FIG. 2 is a cross-sectional view of the organic EL array shown in FIG. 1, taken along line I-I '.

The organic EL devices shown in FIGS. 1 and 2 are formed in a direction in which the first electrode (or the anode electrode) 4 and the second electrode (or the cathode electrode) 12 cross each other on the substrate 2.

A plurality of first electrodes 4 are formed on the substrate 2 at a predetermined interval. On the substrate 2 on which the first electrode 4 is formed, an insulating film 6 having an opening for each EL cell (EL) region is formed. On the insulating film 6, a partition wall 8 for separating the organic light emitting layer 10 and the second electrode 12 to be formed thereon is disposed. The barrier rib 8 is formed in a direction crossing the first electrode 4 and has an overhang structure in which the upper end portion has a larger width than the lower end portion. An organic light emitting layer 10 and a second electrode 12, which are organic compounds, are sequentially deposited on the insulating layer 6 on which the barrier ribs 8 are formed. The organic light emitting layer 10 displays colors of red (R), green (G) and blue (B). In general, a separate organic material emitting red, green, And is formed by patterning.

The organic light emitting layer 10 includes a hole injecting layer 10e, a hole transporting layer 10d, a light emitting layer 10c, an electron transporting layer 10b and an electron injecting layer 10c sequentially formed on the first electrode 4, Layer 10a.

When an electric voltage is applied between the first electrode 4 and the second electrode 12, electrons generated from the second electrode 12 pass through the electron injection layer 10a and the electron transport layer 10b, And the holes generated from the first electrode 4 move toward the light emitting layer 10c through the hole injection layer 10d and the hole transport layer 10d. Accordingly, in the light emitting layer 10c, electrons and holes supplied from the electron transporting layer 10b and the hole transporting layer 10d collide with each other and recombine to generate light. The light is emitted to the outside through the first electrode 4 And an image is displayed.

Such an organic EL array 50 is easily deteriorated in moisture and oxygen. In order to solve such a problem, the encapsulation process is performed so that the substrate 2 on which the organic EL array 50 is formed and the packaging plate 28 are bonded together through the sealant 26. [

3 is a view showing a pad region of a conventional organic EL device.

A pad 37 of a pad region of the organic EL device shown in FIG. 3 is connected to a TCP (Tape Carrier Package) 32 via a conductive film (ACF: Antisotropic Conductive Film) 30 to receive driving signals from the outside. And the like. The pads 37 are formed of a transparent conductive layer 36 connected to the first electrode 4 or the second electrode 12 of the organic EL array 50 and an opaque conductive layer 34 for enhancing the conductivity of the transparent conductive layer 36. [ Has a laminated structure. Indium Tin Oxide (ITO), Indium Tin Oxide (IZO), Indium Tin Zinc Oxide (ITZO) and the like are used for the transparent conductive layer 36, and molybdenum (Mo) is used for the opaque conductive layer 34. A silicon layer 38 is formed on the opacity layer 34 to prevent oxidation of the opacity layer 34 by moisture and oxygen.

On the other hand, the opacity layer 34 formed in the pad region of the conventional organic EL display device is oxidized by moisture (H ₂ O) and oxygen (O ₂ ), so that a drive signal applied through the TCP 32 is not applied The pad defects frequently occur.

This will be described in more detail as follows.

Generally, the opacity layer 34 formed of molybdenum (Mo) or the like has a property of being oxidized when exposed to moisture, oxygen, or the like. The opaque conductive layer 34 is formed by a bonding process of the substrate 2 on which the organic EL array 50 is formed and the packaging plate 28 and a process of connecting the pads 37 and TCP 32 with the ACF 30 interposed therebetween Is exposed to moisture and oxygen in the atmosphere as shown in Fig. Oxidation occurs in the exposed opaque layer 34 and this oxidation promotes galvanic corrosion due to a voltage difference that is imposed on each pad 37 so that an external driving signal is applied to the organic EL array 50 Resulting in a problem of poor pad portion.

Accordingly, an object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same that can prevent a pad portion from being defective.

According to an aspect of the present invention, there is provided an organic light emitting display including: an organic electroluminescent array; A packaging plate surrounding the organic electroluminescent array; A pad provided outside the packaging plate, the first and second conductive layers supplying a driving signal to the organic electroluminescent array; And a signal supply film electrically connected to the pad, wherein the second conductive layer exposes the first conductive layer in a region where the signal conductive film is not overlapped with the signal supply film.
And a silicon layer formed on the first conductive layer.
And the second conductive layer is partially removed in a region other than the packaging plate and the connection film.
The first conductive layer includes oxide, and the second conductive layer includes molybdenum (Mo).
The organic electroluminescent array includes an anode electrode and a cathode electrode, and the first conductive layer is the same material as at least one of the anode electrode and the cathode electrode.
A method of manufacturing an organic light emitting display according to the present invention includes: forming an organic electroluminescent array and a pad for supplying a driving signal to the organic electroluminescent array; Packaging the organic electroluminescent array using a packaging plate and exposing the pad to the outside; And connecting the pad and the signal supply film, wherein the forming the pad comprises: forming a first conductive layer; And forming a second conductive layer, which is formed in a region that is not overlapped with the signal supply film, exposing the first conductive layer.
And forming a silicon layer on the first conductive layer.
And the second conductive layer is partially removed in areas other than the packaging plate and the connection film.
The first conductive layer includes oxide, and the second conductive layer includes molybdenum (Mo).
Other objects and features of the present invention will become apparent from the following description of embodiments with reference to the accompanying drawings.

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Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS. 5 and 6. FIG.

The organic EL array of the organic EL device according to the present invention is the same as the conventional one. A first electrode (or an anode electrode) 4 and a second electrode (or a cathode electrode) 12 are formed in a direction crossing each other on a substrate 2 as shown in FIG.

A plurality of first electrodes 4 are formed on the substrate 2 at a predetermined interval. On the substrate 2 on which the first electrode 4 is formed, an insulating film 6 having an opening for each EL cell (EL) region is formed. On the insulating film 6, a partition wall 8 for separating the organic light emitting layer 10 and the second electrode 12 to be formed thereon is disposed. The barrier rib 8 is formed in a direction crossing the first electrode 4 and has an overhang structure in which the upper end portion has a larger width than the lower end portion. On the insulating layer 6 on which the barrier ribs 8 are formed, an organic light emitting layer 10 composed of an organic compound and a second electrode 12 are sequentially deposited on the entire surface.

5 is a view showing a pad region of the organic EL device according to the present invention.

A pad 137 of a pad region of the organic EL device shown in FIG. 5 is connected to a TCP (Tape Carrier Package) 132 via an electrically conductive film (ACF: Anisotropic Conductive Film) 130 to receive driving signals from the outside. And the like. The pads 137 are formed by a transparent conductive layer 136 connected to the first electrode 4 or the second electrode 12 of the organic EL array 50 and an opaque conductive layer 134 for enhancing the conductivity of the transparent conductive layer 136 And has a laminated structure. Here, the opacity layer 134 is formed on the transparent conductive layer 136, and the transparent conductive layer 136 is partially exposed. More specifically, the transparent conductive layer 136 is formed so as to be exposed in a region other than the region overlapping with the packaging plate 128 and the TCP 132. [ A silicon layer 138 is formed on the opaque conductive layer 134 and the transparent conductive layer 136 to prevent oxidation of the opaque conductive layer 134 by moisture and oxygen.

As described above, in the pad region of the organic EL display device according to the present invention, the packaging plate 128 and the TCP 132 are overlapped on the transparent conductive layer 136 connected to any one of the first and second electrodes 4 and 12 The opaque whole layer 134 is formed. Accordingly, the transparent conductive layer 136 is exposed in the region of the pad region that is not overlapped with the packaging plate 128 and the TCP 132, so that the transparent conductive layer 136 is exposed by moisture (H ₂ O) and oxygen (O ₂ ) It becomes possible to prevent the opacity layer 134 from being oxidized.

This will be described in more detail as follows.

In general, the opaque conductive layer 134 formed of molybdenum (Mo) or the like is oxidized when exposed to moisture or oxygen, whereas the transparent conductive layer 136 is formed of indium tin oxide (ITO), indium zinc oxide (IZO) ITO (Indium Tin Zinc Oxide) or the like and is not oxidized by oxygen and moisture. That is, since the transparent conductive layer 136 includes oxide, the transparent conductive layer 136 has a stronger property to the acid than the opaque conductive layer 134.

Thus, while the bonding process of the substrate 102 on which the organic EL array 50 is formed and the packaging plate 128 and the connection process of the pad 137 and the TCP 132 are performed with the ACF 130 interposed therebetween The opaque conductive layer 134 is not exposed to moisture and oxygen by the packaging plate 128 and the TCP 132 so that the conductive layer 136 is not exposed to moisture and oxygen, The galvanic corrosion due to the voltage difference applied to each pad 37 does not occur. As a result, pad defects can be prevented.

6 is a flowchart showing a manufacturing method of an organic EL display device according to the present invention.

An organic EL array 50 is formed on a substrate 102 and a transparent conductive layer 136 connected to the first electrode 4 and the second electrode 12 of the organic EL array 50 is formed (S2) Here, the transparent conductive layer 136 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), or the like.

The opaque conductive material is entirely deposited on the transparent conductive layer 136 by a deposition method such as sputtering and then the opaque conductive material is patterned by the photolithography process and the etching process using the mask to form the opaque conductive layer 134. (S4) Here, the opacity layer 134 overlaps with the TCP 132 electrically connected with the packaging plate 28 and the pad 137 to be bonded to the substrate 102 by a subsequent encapsulation process Region. As a result, the transparent conductive layer 136 in the region that is not overlapped with the packaging plate 128 and the TCP 132 is exposed. Thus, a pad 137 having a structure in which a transparent conductive layer 136 and an opaque conductive layer 134 are laminated is formed.

Then, the packaging plate 128 is bonded to the substrate 102 by an encapsulation process (S6), and the pad 137 and the TCP 132 are electrically connected through the ACF 130. (S8)

Thereafter, the silicon layer 138 is formed on the exposed transparent conductive layer 136. (S10)

As described above, the organic EL display device and the method of manufacturing the same according to the present invention partially expose the transparent conductive layer 136 on the transparent conductive layer 136 for supplying driving signals to the organic EL array, The opaque conductive layer 134 is formed in a region overlapping the opaque layer 132. [ Accordingly, the opacity layer 134 is not exposed by moisture (H ₂ O), oxygen (O ₂ ), or the like, thereby preventing the opacity layer 134 from being oxidized. As a result, galvanic corrosion due to a voltage difference applied to each pad 137 does not occur, and pad defects can be prevented.

As described above, the organic electroluminescence display device and the method of manufacturing the same according to the present invention partially expose the transparent conductive layer on the transparent conductive layer extended in the organic EL array, and form an opaque conductive layer so as to overlap with the packaging plate and TCP . As a result, the opacity layer is not exposed by moisture (H ₂ O), oxygen (O ₂ ), or the like, thereby preventing the opacity layer from being oxidized. This makes it possible to prevent the pad portion from being defective.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims (10)

An organic electroluminescent array; A packaging plate surrounding the organic electroluminescent array; A pad provided outside the packaging plate, the first and second conductive layers supplying a driving signal to the organic electroluminescent array; And a signal supply film electrically connected to the pad, Wherein the second conductive layer exposes the first conductive layer in a region that is not overlapped with the signal supply film. The method according to claim 1, Further comprising a silicon layer formed on the first conductive layer. 3. The method of claim 2, Wherein the second conductive layer is partially removed from regions other than the packaging plate and the connection film. The method according to claim 1, Wherein the first conductive layer comprises an oxide, Wherein the second conductive layer comprises molybdenum (Mo). The method according to claim 1, Wherein the organic electroluminescent array comprises an anode electrode and a cathode electrode, Wherein the first conductive layer is the same material as at least one of the anode electrode and the cathode electrode. Forming an organic electroluminescent array and a pad for supplying a driving signal to the organic electroluminescent array; Packaging the organic electroluminescent array using a packaging plate and exposing the pad to the outside; Connecting the pad and the signal supply film, Wherein forming the pad comprises: Forming a first conductive layer; And forming a second conductive layer formed in a region that is not overlapped with the signal supply film and exposing the first conductive layer. The method according to claim 6, Further comprising forming a silicon layer on the first conductive layer. ≪ Desc / Clms Page number 20 > 8. The method of claim 7, Wherein the second conductive layer is partially removed in a region other than the packaging plate and the connection film. The method according to claim 6, Wherein the first conductive layer comprises an oxide, Wherein the second conductive layer comprises molybdenum (Mo). The method according to claim 6, Wherein the organic electroluminescent array comprises an anode electrode and a cathode electrode, Wherein the first conductive layer is the same material as at least one of the anode electrode and the cathode electrode.

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