KR100779946B1 - Organic Light Emitting Diode - Google Patents

Abstract

The present invention relates to an organic light emitting device capable of reducing contact resistance between a wiring pattern of a pad part and a tape carrier package (TCP).

A substrate having an image display unit and a pad unit defined therein, a plurality of positive electrode layers and negative electrode layers formed on the substrate of the image display unit to cross each other, and defining a plurality of pixels; An organic light emitting layer formed between the layers, a plurality of wiring patterns formed on the pad substrate to be connected to the plurality of positive electrode layers and the negative electrode layers, and formed on both sidewalls of the respective wiring patterns higher than the wiring patterns. An organic light-emitting device comprising an insulating pattern and a plurality of barrier rib patterns formed on the substrate between the plurality of wiring patterns than the wiring pattern.

Organic light emitting element, pad, TCP, insulation pattern, partition pattern

Description

Organic Light Emitting Diode

1 is a schematic plan view showing a configuration of a general organic light emitting device,

FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1 illustrating a problem when TCP is mounted on a pad portion of an organic light emitting diode according to the prior art.

3A is a cross-sectional view taken along line AA ′ of FIG. 1 schematically illustrating a pad portion of an organic light emitting diode according to a first exemplary embodiment of the present invention.

3B is a cross-sectional view taken along line AA ′ of FIG. 1 illustrating a state in which TCP is mounted on a pad portion of the organic light emitting diode of FIG. 3A.

4 is a cross-sectional view taken along line AA ′ of FIG. 1 showing a schematic configuration of a pad portion of an organic light emitting diode according to a second exemplary embodiment of the present invention and a state in which TCP is mounted on the pad portion.

FIG. 5 is a cross-sectional view taken along line AA ′ of FIG. 1 illustrating a schematic configuration of a pad portion of an organic light emitting diode according to a third exemplary embodiment of the present invention and a state in which TCP is mounted on the pad portion.

   -Explanation of symbols for the main parts of the drawings-

10 substrate 12 image display unit

14 pad portion 16 positive electrode layer

18: negative electrode layer 20: pixel

22: wiring pattern 24: ACF

26: conductive ball 28: insulation pattern

30: bulkhead pattern

The present invention relates to an organic light emitting device capable of reducing contact resistance between a wiring pattern of a pad part and a tape carrier package (TCP).

In general, the organic light emitting device is one of the flat panel display devices, and is formed between the positive electrode layer and the negative electrode layer on the transparent substrate through an organic thin film layer including the organic light emitting layer, and forms a very thin matrix.

The organic light emitting device is a display device using an electroluminescence phenomenon in which light is generated when a predetermined electric field is applied to a phosphor. When a predetermined electric field is applied to the positive electrode layer and the negative electrode layer, holes and electrons are respectively formed from the positive electrode layer and the negative electrode layer. Moves to the organic light-emitting layer, and these holes and electrons meet each other in the organic light-emitting layer to form an electron-hole pair to generate high energy excitons, and light is generated on the principle that these excitons fall to the ground state to generate light energy. Let's go.

Such an organic light emitting device can be driven at a low voltage of 15V or less, and exhibits excellent characteristics in brightness, viewing angle, power consumption, and the like, compared to other display devices, for example, TFT-LCD. In addition, the organic light emitting device has a fast response speed of 1 kHz compared to other display devices, and thus is suitable for a next-generation multimedia display, in which video is essential.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the configuration and the problems of the conventional organic light emitting device.

1 is a schematic plan view showing the configuration of a general organic light emitting device, Figure 2 is a cross-sectional view taken along the line A-A 'of Figure 1 showing a problem in the case of mounting the TCP in the pad portion of the organic light emitting device according to the prior art,

Referring to FIG. 1, in a conventional organic light emitting diode, first, a plurality of positive electrodes are arranged in parallel in a stripe shape on an image display unit 12 of a substrate 10 divided into an image display unit 12 and a pad unit 14. Layer 16 is formed. In addition, a plurality of negative electrode layers 18 arranged orthogonally to the plurality of positive electrode layers 16 are formed on the plurality of positive electrode layers 16. As described above, the plurality of pixels 20 of the organic light emitting diode is defined at a portion where the plurality of positive electrode layers 16 and the negative electrode layers 18 which are perpendicular to each other meet each other. In the plurality of pixels 20, an organic thin film layer (not illustrated) including an organic light emitting layer and the like is formed between the plurality of positive electrode layers 16 and the negative electrode layers 18.

According to the configuration of the pixel 20 of the image display unit 12, when an electric field is applied to the positive electrode layer 16 and the negative electrode layer 18, holes and electrons are induced from the positive electrode layer 16 and the negative electrode layer 18, respectively. Each pixel 20 of the organic light emitting element emits light by moving to an organic light emitting layer in the thin film layer and forming holes of electrons and electrons in the organic light emitting layer.

1 and 2, a plurality of wiring patterns 22 connected to the positive electrode layer 16 and the negative electrode layer 18 are formed on the pad part 14 of the substrate 10. It is. The plurality of wiring patterns 22 are typically formed together with the positive electrode layer 16, and like the positive electrode layer 16, may be made of a transparent conductive material such as ITO. In addition, when an auxiliary electrode (not shown) made of chromium or the like is formed on a predetermined region of the positive electrode layer 16 to further lower its resistance, the plurality of wiring patterns 22 may be formed on the positive electrode layer 16. ) And the auxiliary electrode, and thus, ITO and chromium may be sequentially stacked.

On the other hand, in the organic light emitting device having the above-described configuration, on the plurality of wiring patterns 22 of the pad portion 14, as shown in FIG. 2, the pad portion ( A tape carrier package (TCP) 27 for driving an organic light emitting device by applying an electrical signal to the antenna 14 is mounted. The TCP 27 takes the form of an Anisotropic Conductor Film (ACF) film including the conductive balls 26, and the conductive balls 26 are flowing in the ACF 24. That is, the TCP 27 is in the form of a film having a ductility in itself according to the characteristics of the ACF (24).

In mounting the TCP 27 on the plurality of wiring patterns 22, the TCP 27 is pressed onto the pad portion 14 and applied to the film portion by applying heat of several tens to several hundred degrees Celsius. (27) is heat-sealed on the plurality of wiring patterns 22 of the pad portion 14.

By the way, in the organic light emitting device according to the related art, as shown in FIG. 2, the plurality of wiring patterns 22 protrude on the substrate 10 of the pad portion 14. When the pressure is applied to the plurality of wiring patterns 22, the conductive balls 26 in the film-type TCP 27 flow and collect between the plurality of protruding wiring patterns 22. Therefore, the density of the conductive balls 26 is lowered in the TCP 27 in the area in contact with the plurality of wiring patterns 22 (see the arrow in FIG. 2).

Therefore, as the conductivity of the contact surface between the wiring pattern 22 and the TCP 27 is lowered, the contact resistance between the wiring pattern and the tape carrier package (TCP) becomes very large.

Accordingly, the present invention is to provide an organic light emitting device that can lower the contact resistance between the wiring pattern of the pad portion and the TCP in order to solve the problems of the prior art as described above.

According to an embodiment of the present invention for achieving the above object, a plurality of positive electrode layer which is formed to cross the substrate on which the image display unit and the pad unit is defined, the substrate and the image display unit to define a plurality of pixels and A negative electrode layer, an organic light emitting layer formed between the plurality of positive electrode layers and the negative electrode layers in the plurality of pixels, and a plurality of wiring patterns formed on the substrate of the pad to be connected to the plurality of positive electrode layers and the negative electrode layers; An organic light emitting element including an insulating pattern formed on both sidewalls of each wiring pattern higher than the wiring pattern, and a plurality of barrier rib patterns formed on the substrate between the plurality of wiring patterns and higher than the wiring pattern. Is provided.

delete

The organic light emitting diode according to the exemplary embodiment of the present invention may further include a conductive layer formed on the entire surface of the substrate having the plurality of wiring patterns. In this case, the conductive layer may be made of aluminum.

In the organic light emitting diode according to the exemplary embodiment of the present invention, the wiring pattern may have a structure in which ITO and chromium are sequentially stacked.

In addition, according to another embodiment of the present invention for achieving the above object, a plurality of positive electrodes which are formed to cross the substrate on which the image display unit and the pad unit is defined, and a plurality of pixels formed on the substrate of the image display unit to cross each other Layers and negative electrode layers, organic light emitting layers formed between the plurality of positive electrode layers and negative electrode layers in the plurality of pixels, and a plurality of positive electrode layers and negative electrode layers formed on the substrate of the pad part. There is provided an organic light emitting element including a wiring pattern and a plurality of partition patterns formed on the substrate between the plurality of wiring patterns higher than the wiring pattern.

The organic light emitting diode according to another exemplary embodiment of the present invention may further include a conductive layer formed on the entire surface of the substrate on which the pad part is formed. In this case, the conductive layer may be made of aluminum.

In addition, in the organic light emitting device according to another embodiment of the present invention, the wiring pattern may have a structure in which ITO and chromium are sequentially stacked.

Hereinafter, a structure and an operation of an organic light emitting diode according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In addition, the same reference numerals are attached to similar parts throughout the present specification.

3A is a cross-sectional view taken along line AA ′ of FIG. 1 schematically illustrating a pad portion of an organic light emitting diode according to a first exemplary embodiment of the present invention, and FIG. 3B is a diagram showing TCP mounted on a pad portion of the organic light emitting diode of FIG. 3A. 1 is a cross-sectional view taken along line AA ′ of FIG. 1, and FIG. 4 is a diagram illustrating a schematic pad configuration of an organic light emitting diode according to a second exemplary embodiment of the present invention and a state in which TCP is mounted on the pad. Sectional view along the AA 'line. Here, the first embodiment and the second embodiment of the present invention are both encompassed by the organic light emitting device according to the embodiment of the present invention.

First, the organic light emitting device according to the embodiment of the present invention has a configuration of an image display unit 12 that is similar to the organic light emitting device of the prior art shown in FIG.

That is, referring to FIG. 1, in the organic light emitting diode according to the exemplary embodiment of the present invention, stripes are formed on the image display unit 12 of the substrate 10 divided into the image display unit 12 and the pad unit 14. A plurality of positive electrode layers 16 arranged in parallel in the form are formed. In addition, a plurality of negative electrode layers 18 arranged orthogonally to the plurality of positive electrode layers 16 are formed on the plurality of positive electrode layers 16.

As described above, a plurality of pixels 20 of the organic light emitting diode is defined at a portion where the plurality of positive electrode layers 16 and the negative electrode layers 18 that are orthogonal to each other are defined, and in the plurality of pixels 20, the plurality of positive electrode layers is defined. An organic thin film layer (not shown) including an organic light emitting layer or the like is formed between the 16 and the negative electrode layer 18.

According to the configuration of the image display unit 12, when an electric field is applied to the positive electrode layer 16 and the negative electrode layer 18, holes and electrons from the positive electrode layer 16 and the negative electrode layer 18, respectively, are organic light emitting layers in the organic thin film layer. And the holes and electrons meet in the organic light emitting layer to form an electron-hole pair, so that each pixel 20 of the organic light emitting element emits light.

However, as described above, the configuration of the image display unit 12 of the organic light emitting device is in accordance with known configurations known to those skilled in the art, and does not correspond to the technical features of the present embodiment, further description thereof will be omitted. Let's do it. In addition, when it is necessary to demonstrate the structure of the image display part 12 below, the structure of such an image display part 12 is demonstrated with reference to FIG.

1 and 3A, a plurality of wiring patterns 22 connected to the positive electrode layer 16 and the negative electrode layer 18 are formed on the pad part 14 of the substrate 10. It is. The plurality of wiring patterns 22 are typically formed together with the positive electrode layer 16, and like the positive electrode layer 16, may be made of a transparent conductive material such as ITO. In addition, when the auxiliary electrode (not shown) made of chromium or the like for lowering the resistance of the positive electrode layer 16 is selectively formed on a predetermined region of the positive electrode layer 16, the plurality of wiring patterns 22 The positive electrode layer 16 and the auxiliary electrode may be formed together, and thus, ITO and chromium may be sequentially stacked.

The insulating pattern 28 is formed on both sidewalls of the plurality of wiring patterns 22 at a height higher than that of the wiring patterns 22. The insulating pattern 28 may be made of an insulating material such as a photosensitive film.

Typically, in the image display portion 12 of the organic light emitting element, an insulating film (not shown) having a lattice shape in plan view and made of a positive photoresist film is formed on the plurality of positive electrode layers 16 to form an insulating film of the lattice shape. A plurality of pixels 20 are defined, and an organic thin film layer including an organic light emitting layer on the plurality of positive electrode layers 16 in a region where the pixels 20 are defined, and a plurality of orthogonally arranged with the plurality of positive electrode layers. The negative electrode layer 18 may be formed.

Therefore, when the insulating film is formed on the image display unit 12, instead of forming the insulating pattern 28 through a separate process, the insulating pattern 28 may be formed together with the insulating film of the image display unit 12 in a single process. . In this case, the insulating pattern 28 is made of the same material constituting the insulating film, that is, a positive photoresist film, etc., and according to the characteristics of the positive photoresist film, as shown in FIG. 3A, the sidewalls thereof have a positive profile. Will be displayed.

As described above, in the organic light emitting diode according to the exemplary embodiment in which the insulating patterns 28 are formed on the sidewalls of the plurality of wiring patterns 22, conductive balls are formed on the plurality of wiring patterns 22 of the pad part 14. When the TCP 27 of the ACF 24 type including the 26 is mounted in the same manner as in the conventional method (a method of pressing and pasting the TCP 27 onto a plurality of wiring patterns 22 and applying heat to heat) 3B, the conductive ball 26 is pressed in the process of pressing and attaching the TCP 27 due to the insulating pattern 28 formed on the sidewalls of the plurality of wiring patterns 22. It flows to the area | region which contacts this several wiring pattern 22 (refer the arrow of FIG. 3B). For this reason, since the density of the electroconductive ball 26 becomes high in the TCP 27 of the area | region which contacts the said some wiring pattern 22, eventually, of the said some wiring pattern 22 and the said TCP 27 The conductivity of the contact surfaces can be greatly improved, and the contact resistance between them can be significantly lowered.

On the other hand, the organic light emitting device according to the present embodiment, in addition to the insulating pattern 28, as shown in FIG. 4, on the pad portion 14 substrate 10 between the plurality of wiring patterns 22, The barrier rib pattern 30 may further include a plurality of barrier rib patterns 30 formed at a height greater than that of the wiring pattern 22. The barrier rib pattern 30 may also be made of an insulating material such as a photosensitive film.

According to the structure of a conventional organic light emitting element, a short circuit of the negative electrode layer 18 or the like between adjacent pixels 20 is prevented on the insulating film in a predetermined region orthogonal to the plurality of positive electrode layers 12 of the image display unit 12. A partition (not shown) of a negative profile structure may be formed. Such a partition may be made of a material such as a negative photoresist film.

Therefore, when the partition wall is formed in the image display unit 12, instead of forming the partition pattern 30 through a separate process, a single process may be formed together with the partition wall of the image display unit 12. . In this case, the barrier rib pattern 30 is made of the same material constituting the barrier rib, that is, a negative photoresist film, and the like, and as shown in FIG. 4, the sidewalls thereof have a negative profile according to the characteristics of the negative photoresist film. Will be displayed.

As described above, in the organic light emitting device according to the present embodiment, which further includes the partition pattern 30 between the plurality of wiring patterns 22, as illustrated in FIG. 4, the TCP 27 is connected to the plurality of wiring patterns 22. In the process of pressing and pasting on the wiring pattern 22, due to the partition pattern 30, the conductive balls 26 can flow more to the area in contact with the plurality of wiring patterns 22 (FIG. See arrow 4). For this reason, even if compared with the organic light emitting element shown in FIG. 3B, since the density of the conductive ball 26 in the TCP 27 of the area | region which contacts the said some wiring pattern 22 becomes higher, eventually, the said The contact resistance between the plurality of wiring patterns 22 and the TCP 27 may be further lowered.

The organic light emitting diode according to the present exemplary embodiment may further include a conductive layer (not shown) formed on the entire surface of the substrate 10 of the pad part 14 on which the plurality of wiring patterns 22 are formed.

That is, in the organic light emitting device illustrated in FIG. 3B, the conductive layer may be formed to cover the plurality of wiring patterns 22 and the insulating patterns 28 on both sidewalls of the organic light emitting device, and as illustrated in FIG. 4. The organic light emitting diode may be formed to cover the plurality of wiring patterns 22 and the insulating patterns 28 on both sidewalls of the plurality of wiring patterns 22 and on the top surface of the barrier rib pattern 30.

As described above, in the organic light emitting device according to the present embodiment, which further includes a conductive layer (not shown), when the TCP 27 is mounted on the plurality of wiring patterns 22 of the pad part 14, Since the area of the conductive material in contact with the TCP 27 can be wider as much as the formation area of the conductive layer formed in a wider area than the plurality of wiring patterns 22, it is different from the plurality of wiring patterns 22. It is possible to further minimize the contact resistance between the (27).

Since the conductive layer is made of a low resistance metal material such as aluminum, for example, the conductive layer may be formed together with the negative electrode layer 18 of the image display unit 12 without performing a separate process. have.

Next, the structure and operation of the organic light emitting device according to another embodiment of the present invention will be described in detail to be easily implemented by those skilled in the art. However, since the organic light emitting device according to another embodiment of the present invention, most of the configuration is the same as the above-described embodiment of the present invention, but only a part of the configuration, in the following other embodiments of the present invention Only the parts having a configuration different from the above-described embodiment of the present invention will be described in detail.

FIG. 5 is a cross-sectional view taken along line AA ′ of FIG. 1 illustrating a schematic configuration of a pad portion of an organic light emitting diode according to a third exemplary embodiment of the present invention and a state in which TCP is mounted on the pad portion. Here, the third embodiment of the present invention is encompassed by an organic light emitting device according to another embodiment of the present invention.

1 and 5, the organic light emitting device according to another embodiment of the present invention has the same configuration as the image display unit 12 as in the embodiment of the present invention (see FIG. 1). The configuration of the plurality of wiring patterns 22 formed on the substrate 10 is also the same as the above-described embodiment of the present invention.

However, as illustrated in FIG. 5, in the organic light emitting diode according to another embodiment of the present invention, an insulation pattern is not formed on the sidewalls of the plurality of wiring patterns 22, but only the plurality of wiring patterns ( On the board | substrate 10 of the pad part 14 between 22, only the some partition pattern 30 of the height larger than the said wiring pattern 22 is formed.

According to another embodiment of the present invention, the barrier rib pattern 30 is formed higher than the sidewalls of the plurality of wiring patterns 22, thereby pressing the TCP 27 on the plurality of wiring patterns 22. In the pasting process, the conductive balls 26 flow to an area in contact with the plurality of wiring patterns 22 (see arrows in FIG. 5). For this reason, since the density of the electroconductive ball 26 becomes high in the TCP 27 of the area | region which contacts the said some wiring pattern 22, eventually, of the said some wiring pattern 22 and the said TCP 27 The conductivity of the contact surfaces can be greatly improved, and the contact resistance between them can be significantly lowered.

In addition, the organic light emitting diode according to another embodiment of the present invention may further include a conductive layer (not shown) formed on the entire surface of the substrate 10 of the pad portion 14 on which the plurality of wiring patterns 22 are formed. Can be. The conductive layer may be formed to cover the plurality of wiring patterns 22 and may be formed on the top surface of the barrier rib pattern 30.

According to the configuration of the present embodiment, which further includes such a conductive layer, the area of the conductive material in contact with the TCP 27 is as much as that of the conductive layer formed in the wider area than the plurality of wiring patterns 22. Since it can be widened, the contact resistance between the plurality of wiring patterns 22 and the TCP 27 can be further minimized.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

As described above, according to the present invention, it is possible to minimize the contact resistance between the wiring pattern formed on the pad portion of the organic light emitting element and the TCP. Therefore, power consumption of the organic light emitting device can be reduced, and electrical characteristics can also be improved.

Claims (9)

A substrate on which an image display unit and a pad unit are defined; A plurality of positive electrode layers and negative electrode layers formed on the substrate of the image display unit to cross each other and defining a plurality of pixels; An organic light emitting layer formed between the plurality of positive electrode layers and the negative electrode layers in the plurality of pixels; A plurality of wiring patterns formed on the substrate of the pad to be connected to the plurality of positive electrode layers and the negative electrode layers; An insulating pattern formed on both sidewalls of each wiring pattern higher than the wiring pattern; An organic light emitting device comprising a plurality of barrier rib patterns formed on the substrate between the plurality of wiring patterns than the wiring pattern. delete The organic light-emitting device of claim 1, further comprising a conductive layer formed on an entire surface of the substrate on the pad portion on which the plurality of wiring patterns are formed. The organic light emitting device of claim 3, wherein the conductive layer is made of aluminum. The organic light emitting device of claim 1, wherein the wiring pattern has a structure in which ITO and chromium are sequentially stacked. A substrate on which an image display unit and a pad unit are defined; A plurality of positive electrode layers and negative electrode layers formed on the substrate of the image display unit to cross each other and defining a plurality of pixels; An organic light emitting layer formed between the plurality of positive electrode layers and the negative electrode layers in the plurality of pixels; A plurality of wiring patterns formed on the substrate of the pad to be connected to the plurality of positive electrode layers and the negative electrode layers; An organic light emitting device comprising a plurality of barrier rib patterns formed on the substrate between the plurality of wiring patterns than the wiring pattern. The organic light-emitting device as claimed in claim 6, further comprising a conductive layer formed on an entire surface of the substrate on the pad portion on which the plurality of wiring patterns are formed. The organic light emitting device of claim 7, wherein the conductive layer is made of aluminum. The organic light emitting device according to any one of claims 6 to 8, wherein the wiring pattern has a structure in which ITO and chromium are sequentially stacked.

Images