JP2010027504A - Organic el device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure that achieves a reduction in frame width without impairing sealing performance of an organic EL device. <P>SOLUTION: An organic EL device includes a first auxiliary electrode 41 provided on a barrier rib 16 above a device substrate 11 so as to be electrically connected with a negative electrode 14, a negative electrode protecting layer 17 provided on the device substrate 11 so as to cover the barrier rib 16, the negative electrode 14, and the first auxiliary electrode 41, a conduction wiring 26 provided above the barrier rib 16 and arranged inside each contact hole penetrating through the negative electrode protecting layer 17 so as to be electrically connected with the first auxiliary electrode 41, each conductive conduction-connection part 42 provided on the upper surface of the conduction wiring 26, and a routing wiring 22 provided so as to be electrically connected with each conduction connection part 42. The routing wiring 22 is provided on a sealing substrate 21 so as to be partially overlapped with a region that faces a non-display region M while facing the barrier rib 16. The negative electrode 14 is electrically connected with the routing wiring 22 above the barrier rib 16, provided in the non-display region M, via the first auxiliary electrode 41, the conduction wiring 26, and each conduction connection part 42. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an organic EL device and an electronic apparatus.

  In recent years, as one of next-generation flat displays, a display device using an organic EL element as a pixel (hereinafter referred to as an organic EL device) has attracted attention due to advantages such as low-voltage driving, light weight and thinness, high viewing angle, and high-speed response. Has been. 2. Description of the Related Art Conventionally, an organic EL device connects a cathode wiring to a non-display area around a display area excluding a mounting side when arranging the cathode wiring to connect the cathode to the inside of a pixel in the display area. For this reason, the non-display area requires a wide cathode wiring including capacity securing, and it is difficult to narrow the frame of the organic EL device.

  Various techniques for solving such problems have been studied. For example, in Patent Document 1, display data input from an external signal source is supplied to a drive circuit to a display region of a sealing substrate facing a transparent substrate. An input wiring and a lead wiring for transmitting a scanning signal from the driving circuit to the scanning wiring and transmitting a display signal to the signal wiring are arranged. Thereby, the display area is not limited by the formation portion of the drive circuit and the lead wiring, and it is possible to realize the enlargement of the display area, that is, the narrowing of the frame on the transparent substrate having a predetermined size.

  In Patent Document 2, by providing a patterned conductive film having a low specific resistance to be an auxiliary electrode on the second substrate side provided to face the first substrate, the clearance width between the cathode and the auxiliary wiring becomes unnecessary, and an opening is formed. It is possible to increase the rate.

In Patent Document 3, by providing an auxiliary electrode that is electrically connected to a common electrode formed on the light emitting layer and to which a common voltage is applied, it is possible to smoothly apply a voltage through the auxiliary electrode. .
JP 2004253303 A JP 2006-318776 A JP 2007-141844 A

  By the way, in these organic EL devices, an auxiliary electrode is formed on the sealing substrate side, and the cathode on the array substrate side and all the pixels in the display area are vertically connected one-on-one. When providing a thin film sealing layer for sealing the organic EL element in the display region, a contact hole must be opened in the thin film sealing layer for every pixel in the display region, so that the sealing performance is impaired. There is a case.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the structure which aims at narrowing a frame, without impairing the sealing performance of an organic electroluminescent apparatus.

In order to solve the above problems, an organic EL device of the present invention includes an element substrate, an organic EL element in which an anode, an organic light emitting layer, and a cathode are sequentially stacked on the element substrate, and the organic EL element in a plan view. In the organic EL device, comprising: a partition provided so as to surround the periphery of the element substrate; and a sealing substrate provided via a transparent adhesive layer facing the side of the element substrate on which the partition is provided The substrate has a display region in which a plurality of the organic EL elements are arranged in a matrix, a first auxiliary electrode provided on the partition to be electrically connected to the cathode, and the partition on the element substrate A cathode protective layer provided so as to cover the cathode and the first auxiliary electrode; an organic buffer layer provided on the element substrate so as to cover the cathode protective layer; and the organic buffer provided on the element substrate. Provided to cover the layer A gas barrier layer, a conductive wiring disposed on the partition and in a contact hole penetrating the gas barrier layer, the organic buffer layer, and the cathode protective layer, and electrically connected to the first auxiliary electrode; A conductive conductive connecting portion provided on an upper surface of the conductive wiring; and a lead wiring provided so as to be electrically connected to the conductive connecting portion, wherein the lead wiring is provided on the sealing substrate. And is provided so as to face the non-display area corresponding to the outside of the display area and partially overlap the area facing the partition.
The cathode is electrically connected to the lead-out wiring and the partition provided in the non-display area through the first auxiliary electrode, the conductive wiring, and the conductive connection portion. To do.
According to this configuration, the lead-out wiring is provided in the non-display area on the sealing substrate so as to partially overlap the area facing the partition wall, so that the frame can be narrowed. Further, when conducting the cathode and the lead-out wiring, it is sufficient to penetrate the cathode protective layer, the organic buffer layer, and the gas barrier layer on the partition provided in the non-display area on the element substrate. There is no need to open contact holes. Therefore, an organic EL device with a narrow frame can be obtained without impairing the sealing performance.

In the present invention, it is preferable that the conductive connection portion is made of an Ag paste.
According to this structure, since it is excellent in electroconductivity compared with another metal, a low voltage drive can be aimed at. Moreover, since a small amount of fine coating is possible, a thinner organic EL device can be obtained. Moreover, since the viscosity is larger than the adhesive of the material for forming the transparent adhesive layer, it can be efficiently molded without being poured by the adhesive.

In the present invention, the conductive wiring is preferably made of a metal film.
According to this configuration, even when contact holes are opened in the gas barrier layer, the organic buffer layer, and the cathode protective layer in order to make the routing wiring and the cathode conductive, the sealing performance is prevented from being lowered because the metal is sealed. be able to.

In the present invention, a second auxiliary electrode wider than the first auxiliary electrode is provided so as to overlap the routing wiring and cross the first auxiliary electrode, and the second auxiliary electrode is provided in the routing. It is desirable that the wiring is electrically connected to the partition provided in the non-display area on the element substrate.
According to this configuration, since the second auxiliary electrode is wider than the first auxiliary electrode, it is possible to secure the lead wiring and a sufficient contact diameter. As a result, the conduction resistance is reduced, and the organic EL device can be driven at a lower voltage.

An electronic apparatus according to the present invention includes the above-described organic EL device according to the present invention.
According to this configuration, it is possible to provide an electronic device with a narrow frame without impairing the sealing performance.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment shows one aspect of the present invention, and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. Moreover, in the following drawings, in order to make each structure easy to understand, an actual structure and a scale, a number, and the like in each structure are different.

(First embodiment)
FIG. 1 is a perspective view showing a schematic configuration of an organic EL device 1 and a control board 5 according to the first embodiment of the present invention. The organic EL device 1 includes an element substrate 11 and a sealing substrate 21. A plurality of thin film transistors (TFTs) (not shown) and various wirings (not shown) are formed on the element substrate 11. A first flexible substrate 61 is provided on one side of the element substrate 11. A first terminal 51 is provided on the first side of the control board 5. Various wirings on the element substrate 11 are electrically connected to the control substrate 5 via the first flexible substrate 61 and the first terminals 51.

  On the side of the sealing substrate 21 facing the element substrate 11, routing wirings 22 and 23 are provided. A second flexible substrate 62 is provided on one side of the sealing substrate 21. A second terminal 52 is provided on the second side facing the first side of the control board 5. The routing wirings 22 and 23 are electrically connected to the control board 5 via the second flexible board 62 and the second terminals 52. The routing wirings 22 and 23 are provided so as to extend along two sides adjacent to one side where the flexible substrate 62 of the sealing substrate 21 is provided.

  FIG. 2 is a schematic plan view of the element substrate 11 on the side facing the sealing substrate 21. A partition wall 16 is provided on a rectangular element substrate 11 having a length in the horizontal direction in the figure, and the plurality of organic EL elements 10 are separated from each other by the partition wall 16. In other words, the partition 16 is formed so as to surround the periphery of the organic EL element 10 in plan view. The organic EL element 10 includes an organic light emitting element that generates light of a single color, for example, white light. On the element substrate 11, the plurality of organic EL elements 10 are regularly arranged in a matrix to form a display region L. In addition, the organic EL element 10 is formed by using three organic materials of RGB, and is divided into three types of organic light emitting elements, for example, an organic light emitting element that generates red light, an organic light emitting element that generates green light, and an organic that generates blue light. A light emitting element may be used. Note that a region corresponding to the outside of the display region L is a non-display region M.

  A plurality of first auxiliary electrodes 41 extend in the horizontal direction in the figure so as to overlap the partition wall 16 and are arranged in parallel in the vertical direction. On the element substrate 11, a cathode protective layer 17 is provided in a rectangular shape having a length in the horizontal direction in the figure so as to cover the plurality of organic EL elements 10, the partition walls 16, and the first auxiliary electrodes 41. On the element substrate 11, an organic buffer layer 18 is provided in a rectangular shape having a length in the horizontal direction in the figure so as to cover the cathode protective layer 17. On the element substrate 11, a gas barrier layer 19 is provided in a rectangular shape having a length in the horizontal direction in the figure so as to cover the organic buffer layer 18.

  On the gas barrier layer 19, a plurality of conductive connection portions 42 are provided so as to overlap the partition walls 16 in the non-display area M and to overlap the plurality of first auxiliary electrodes 41. The first flexible substrate 61 is provided in a rectangular shape having a length in the horizontal direction in the drawing so as to partially overlap along one side of the element substrate 11.

  FIG. 3 is a schematic plan view of the sealing substrate 21 on the side facing the element substrate 11. A black matrix layer 32 is provided on a rectangular sealing substrate 21 having a length in the horizontal direction in the figure, and the color filters 31 are separated from each other by the black matrix layer 32. The color filter 31 includes, for example, a red colored layer 31R, a green colored layer 31G, and a blue colored layer 31B. On the sealing substrate 21, these three kinds of colored layers are regularly arranged in a matrix to form a display region L. Note that a region corresponding to the outside of the display region L is a non-display region M.

  The second flexible substrate 62 is provided in a rectangular shape having a length in the horizontal direction in the figure so as to partially overlap along one side of the sealing substrate 21. On two sides adjacent to one side of the sealing substrate 21 on which the second flexible substrate 62 is provided, the routing wirings 22 and 23 are arranged in the vertical direction in the drawing in the non-display area M so as to partially overlap the black matrix layer 32. It is provided to extend. One end of the routing wiring 22 is provided so as to partially overlap with one end of the second flexible substrate 62. One end of the routing wiring 23 is provided so as to partially overlap the other end of the second flexible substrate 62.

  FIG. 4 is a plan schematic enlarged view of the organic EL device 1 excluding the sealing substrate 21. On the element substrate 11, a plurality of organic EL elements 10 are provided so as to be divided into partition walls 16. A plurality of organic EL elements 10 are regularly arranged in a matrix to form a display area L. Note that a region corresponding to the outside of the display region L is a non-display region M. A plurality of first auxiliary electrodes 41 extend in the horizontal direction in the figure so as to overlap the partition wall 16 and are arranged in parallel in the vertical direction. A plurality of conductive connection portions 42 are provided so as to overlap the partition walls 16 in the non-display area M and to overlap the plurality of first auxiliary electrodes 41.

  In the non-display area M, the routing wiring 22 is provided so as to extend in the vertical direction in the figure so as to partially overlap the partition wall 16 and the conductive connection portion 42. One end of the routing wiring 22 is provided so as to overlap with one end of the second flexible substrate 62. A peripheral adhesive layer 35 for bonding to the sealing substrate 21 except for the second flexible substrate 62 is provided on the frame portion of the element substrate 11. In this figure, only the peripheral portion of the routing wiring 22 is shown in an enlarged manner, but the peripheral portion of the routing wiring 23 has the same configuration.

  FIG. 5 is a schematic configuration diagram of a cross-sectional portion along line AA shown in FIG. The organic EL device 1 includes a flat element substrate 11. The element substrate 11 is made of an insulating material such as glass or plastic, and a plurality of organic EL elements 10 are formed thereon. The organic EL element 10 has an organic light emitting layer 13 between an anode 12 and a cathode 14 and causes the organic light emitting layer 13 to emit light upon receiving electric energy.

  On the element substrate 11, a plurality of thin film transistors (TFT) (not shown) and various wirings (not shown) corresponding to the plurality of organic EL elements 10 on a one-to-one basis are formed. An inorganic insulating layer 15 is formed on the element substrate 11 so as to cover the plurality of TFTs. The inorganic insulating layer 15 insulates a plurality of TFTs and various wirings, and is made of, for example, a silicon compound.

  An insulating partition 16 is formed on the inorganic insulating layer 15 from, for example, an acrylic resin. The inorganic insulating layer 15 and the partition 16 form a part of a recess, and the organic EL element 10 occupies the bottom of the recess.

  The organic EL element 10 includes an anode 12 and a cathode 14 that sandwich an organic light emitting layer 13. The anode 12 and the cathode 14 are electrodes for injecting holes and electrons into the organic light emitting layer 13 and generate an electric field by the supplied electric energy. The anode 12 is an electrode made of ITO (Indium Tin Oxide) or the like having a high hole injection property, and is connected to a TFT corresponding to the above wiring. The cathode 14 is a layer that is formed on the organic light emitting layer 13 and the partition wall 16 and functions as a common electrode straddling the plurality of organic EL elements 10. The cathode 14 has, for example, an electron injection buffer layer for facilitating injection of electrons into the organic light emitting layer 13 and a small electric resistance formed from a metal such as ITO or Al (aluminum) on the electron injection buffer layer. And having a layer. The electron injection buffer layer is made of, for example, LiF (lithium fluoride), Ca (calcium), or MgAg (magnesium-silver alloy).

  The organic light emitting layer 13 includes a light emitting layer that emits light when excited by recombination of holes and electrons injected by an electric field. In addition, it is also possible to comprise the organic light emitting layer 13 which consists of a multilayer so that layers other than a light emitting layer may also be included. As a layer other than the light emitting layer, a hole injection layer for facilitating injection of holes, a hole transport layer for facilitating transport of injected holes to the light emitting layer, or for facilitating injection of electrons. There are layers that contribute to the above recombination, such as an electron injection layer and an electron transport layer for facilitating transport of injected electrons to the light emitting layer.

  The light emitting layer of the organic light emitting layer 13 is formed from a polymer organic EL material. The high molecular weight organic EL material has a relatively high molecular weight among organic compounds that emit light when excited by recombination of holes and electrons. The polymer organic EL material forming the organic EL element 10 is a substance corresponding to the type (emission color) of the organic EL element 10. The material of the layer contributing to recombination in the light emitting layer is a substance corresponding to the material of the layer in contact with this layer.

  A first auxiliary electrode 41 is formed on the partition wall 16 so as to partially overlap the cathode 14. The first auxiliary electrode 41 can be made of a material having a specific resistance lower than that of the material constituting the cathode 14, for example, Al when the cathode 14 is made of ITO.

  On the element substrate 11, a cathode protective layer 17 is formed so as to cover the partition wall 16, the cathode 14, and the first auxiliary electrode 41. For example, SiON (silicon oxynitride) can be used as a material for forming the cathode protective layer 17. On the element substrate 11, an organic buffer layer 18 is formed so as to flatten the unevenness due to the partition wall 16 so as to cover the cathode protective layer 17. As a material for forming the organic buffer layer 18, for example, an organic compound such as an epoxy resin can be used. A gas barrier layer 19 is formed on the element substrate 11 so as to cover the organic buffer layer 18. As a material for forming the gas barrier layer 19, for example, an inorganic compound having a gas barrier property that protects the plurality of organic EL elements 10 such as SiON from the outside air can be used.

  On the partition wall 16, the conductive wiring 26 is bent so as to partially communicate with the first auxiliary electrode 41 that penetrates the gas barrier layer 19, the organic buffer layer 18, and the cathode protective layer 17 and is electrically connected to the cathode 14. Is formed. The material for forming the conductive wiring 26 is made of a metal film such as Al.

  A plurality of conductive connection portions 42 are formed on the upper surface of the conductive wiring 26. For example, Ag (silver) can be used as a material for forming the conductive connection portion 42, and it is particularly desirable to use a conductive adhesive such as an Ag paste.

  A transparent adhesive layer 34 is provided between the element substrate 11 and the sealing substrate 21. A known adhesive can be used as a material for forming the transparent adhesive layer 34, but includes filler particles such as spacers and inorganic fillers in order to prevent damage to the gas barrier layer 19 that seals the plurality of organic EL elements 10. Desirably not.

  A peripheral adhesive layer 35 is provided on the frame portion between the element substrate 11 and the sealing substrate 21. A known adhesive can be used as the material for forming the peripheral adhesive layer 35. However, like the transparent adhesive layer 34, it does not include filler particles such as spacers and inorganic fillers.

  The sealing substrate 21 is provided through the transparent adhesive layer 34 so as to face the side of the element substrate 11 where the partition wall 16 is provided. On the side of the sealing substrate 21 facing the element substrate 11, a black matrix layer 32 that suppresses light reflection is formed in a region corresponding to the partition wall 16. As a material for forming the black matrix layer 32, for example, Cr (chromium) can be used.

  On the side facing the element substrate 11 on the sealing substrate 21, a color filter 31 is formed in a region corresponding to the organic light emitting layer 13 of the plurality of organic EL elements 10. As a result, the light emitted from the organic light emitting layer 13 passes through the color filter 31 and is emitted to the viewer as, for example, each color light of red light, green light, and blue light.

  A planarizing layer 33 is formed on the sealing substrate 21 and the color filter 31. For the planarization layer 33, for example, a resin material such as acrylic or polyimide can be used.

  On the side facing the element substrate 11 on the sealing substrate 21, the routing wiring 22 is formed in the non-display region M through the planarization layer 33 so as to partially overlap the black matrix layer 32. The formation material of the routing wiring 22 is made of a metal such as Al. Note that the routing wiring 22 is electrically connected to the plurality of conductive connection portions 42.

(Method for manufacturing organic EL device)
Next, an example of a method for manufacturing the organic EL device 1 in the present embodiment will be described. The manufacturing process of the organic EL device 1 includes a process on the element substrate 11 side, a process on the sealing substrate 21 side, and a process of fixing the element substrate 11 and the sealing substrate 21.

  As a process on the element substrate 11 side, first, an inorganic insulating layer 15 made of silicon nitride or the like is formed on the element substrate 11 made of an insulating material such as glass by using a thermal oxidation method, a CVD method, a sputtering method, a spin coating method, or the like. Form. Next, a material film for the partition wall 16 is formed on the element substrate 11 on which the inorganic insulating layer 15 is formed using a resin material such as acrylic or polyimide, and a liquid phase method such as a spin coating method, and is heated and fired. Processing is performed to thermally cure the material film of the partition wall 16, and the thermally cured material film is patterned using a known resist technique, photolithography technique, etching technique, or the like to form the partition wall 16.

  Next, an anode 12 is first formed into an opening surrounded by the partition wall 16 by, for example, a droplet discharge method or a vapor deposition method, and then the organic light emitting layer 13 is formed into a hole injection layer, a hole transport layer, a light emitting layer, The electron transport layer and the electron injection layer are formed in this order, and the cathode 14 is formed to form the organic EL element 10. Thereafter, the first auxiliary electrode 41 is formed on the partition 16 so as to partially overlap the cathode 14 by using, for example, a CVD method or a photolithography technique.

  Next, the cathode protective film 17 is formed by, for example, a CVD method or a spin coating method so as to cover the partition wall 16, the cathode 14, and the first auxiliary electrode 41 on the element substrate 11. Next, a liquid organic compound having a predetermined viscosity is printed in a reduced-pressure atmosphere by, for example, a screen printing method or a spin coating method so as to cover the cathode protective film 17 on the element substrate 11, and nitrogen gas is introduced to atmospheric pressure. Then, the organic buffer layer 18 is formed by heating and curing. Next, a gas barrier layer 19 is formed on the element substrate 11 so as to cover the organic buffer layer 18 by, for example, a CVD method or a spin coating method.

  Next, a contact hole is formed at a predetermined position of the gas barrier layer 19 on the partition wall 16 in the non-display area M. The contact hole is formed through the gas barrier layer 19, the organic buffer layer 18, and the cathode protective layer 17 so as to reach the first auxiliary electrode 41. Next, on the partition wall 16 in the non-display area M, for example, using a CVD method or a photolithography technique so as to straddle the upper surface of the gas barrier layer 19 from the contact hole opening and to the first auxiliary electrode 41. Conductive wiring 26 is formed.

  Next, as a process on the sealing substrate 21 side, Cr is formed on the transparent sealing substrate 21 made of an insulating material such as glass by, for example, vapor deposition or sputtering, and this film is formed using a known resist technique, photo The black matrix layer 32 is formed by patterning using a lithography technique, an etching technique, or the like.

  Next, the color filter 31 is formed between the black matrix layers 32 on the sealing substrate 21 by using a droplet discharge method. Specifically, for example, liquid materials such as a red coloring layer 31R, a green coloring layer 31G, and a blue coloring layer 31B are selectively disposed between the droplet discharge head and a predetermined black matrix layer 32. It heat-drys at temperature, and forms the red colored layer 31R, the green colored layer 31G, and the blue colored layer 31B. In this way, the color filter 31 including the red colored layer 31R, the green colored layer 31G, and the blue colored layer 31B can be formed.

  Next, a planarization layer 33 is formed by, for example, a CVD method or a spin coating method so as to cover the black matrix layer 32 and the color filter 31 on the sealing substrate 21.

  Next, the routing wirings 22 and 23 are formed on the non-display area on the sealing substrate 21 through the planarizing layer 33 and partially overlap with the black matrix layer 32 by using, for example, a CVD method or a photolithography technique. Form.

  As a process for fixing the element substrate 11 and the sealing substrate 21, first, a material for forming the peripheral adhesive layer 35 is applied to the frame portion on the sealing substrate 21 via the planarizing layer 33. Similarly, a material for forming the transparent adhesive layer 34 is applied to the inside of the peripheral adhesive layer 35. However, when the forming material of the transparent adhesive layer 34 is applied, the portion where the conductive connection portion 42 of the opposing element substrate 11 is formed is left without being applied.

  Next, the Ag paste of the conductive conductive connection portion 42 is applied to the upper surface of the conductive wiring 26 on the element substrate 11 side. Note that the Ag paste has a slight head protruding in the concave portion of the conductive wiring 26 provided in the opening of the contact hole in order to prevent the Ag paste from spreading when the element substrate 11 and the sealing substrate 21 are bonded together. It can also be applied.

  Next, the surface of the sealing substrate 21 on which the color filter 31 is formed is arranged to face the side of the element substrate 11 on which the partition wall 16 is formed. Subsequently, the element substrate 11 and the sealing substrate 21 are bonded together over the entire surface via the transparent adhesive layer 34, the peripheral adhesive layer 35, and the Ag paste of the conductive connection portion 42. At this time, the bonding is performed so that the positions of the plurality of organic EL elements 10 and the colored layers 31R, 31G, and 31B of the color filter 31 are aligned, and the positions of the conductive connection portion 42 and the routing wiring 22 are aligned. Thereby, the organic EL device 1 is formed.

  According to the organic EL device 1 of the present embodiment, the routing wirings 22 and 23 are provided in the non-display area M on the sealing substrate 21 so as to partially overlap with the area facing the partition wall 16. Can be achieved. Further, when the cathode 14 and the lead wirings 22 and 23 are electrically connected, the cathode protection layer 17, the organic buffer layer 18, and the gas barrier layer 19 on the partition wall 16 provided in the non-display area M of the element substrate 11 may be penetrated. Well, since it is not necessary to make a contact hole for conduction to the display region L, the sealing performance is not impaired. Therefore, the organic EL device 1 can be made narrower without impairing sealing performance.

  In addition, according to this configuration, the conductive connection portion 42 is made of an Ag paste and is more conductive than other metals, and therefore, can be driven at a lower voltage. Moreover, since a small amount of fine coating can be performed, the thinner organic EL device 1 can be obtained. Moreover, since the viscosity is larger than the adhesive of the forming material of the transparent adhesive layer 34, it can be efficiently molded without being poured into the adhesive.

  Further, according to this configuration, since the conductive wiring 26 is made of a metal film, contact holes are opened in the gas barrier layer 19, the organic buffer layer 18, and the cathode protective layer 17 in order to connect the routing wirings 22 and 23 and the cathode 14. Even in this case, since the metal is sealed, it is possible to prevent the sealing performance from being lowered.

(Second Embodiment)
Next, a second embodiment according to the organic EL device of the present invention will be described. FIG. 6 is a schematic plan view of the organic EL device 2 according to the present embodiment excluding the sealing substrate 21. In the organic EL device 2 according to the present embodiment, a second auxiliary electrode 43 wider than the first auxiliary electrode 41 is provided so as to intersect the first auxiliary electrode 41 so as to overlap the routing wiring 22. Further, the second auxiliary electrode 43 is electrically connected to the routing wiring 22 and the partition 16 in the non-display area M of the element substrate 11 through the conductive connection portion 44. The configuration of the organic EL device 2 of the present embodiment is the same as that of the first embodiment except for the second auxiliary electrode 43 and the conductive connection portion 44 shown in FIG.

  FIG. 7 is a schematic configuration diagram of a cross section along the line BB shown in FIG. In the organic EL device 2, the second auxiliary electrode 43 is formed on the partition wall 16 provided in the non-display area M on the element substrate 11 so as to partially overlap the cathode 14. On the partition wall 16 in the non-display area M, the conductive wiring 27 is bent so as to penetrate the gas barrier layer 19, the organic buffer layer 18, and the cathode protective layer 17 and to be partially connected to the second auxiliary electrode 43 of the cathode 14. Is formed. Further, a conductive connection portion 44 having a contact diameter larger than that of the conductive connection portion 42 shown in FIG. The organic EL device 2 of the present embodiment has the same configuration as that of the first embodiment except for the second auxiliary electrode 43, the conductive wiring 27, and the conductive connection portion 44 shown in FIG. .

  According to the organic EL device 2 of the present embodiment, since the second auxiliary electrode 43 is wider than the first auxiliary electrode 41, a sufficient contact diameter with the lead wirings 22 and 23 can be ensured. As a result, the conduction resistance is reduced, and the organic EL device 2 can be driven at a lower voltage.

(Modification 1)
FIG. 8 is a perspective view showing another schematic configuration example of the organic EL device 1 and the control substrate 5 of the present invention. The organic EL device 1 includes an element substrate 11 and a sealing substrate 21. A plurality of thin film transistors (TFTs) (not shown) and various wirings (not shown) are formed on the element substrate 11. A first flexible substrate 61 is provided at one end of the element substrate 11. A first terminal 51 is provided at one end of the control board 5. Various wirings on the element substrate 11 are electrically connected to the control substrate 5 via the first flexible substrate 61 and the first terminals 51. On the element substrate 11, the V-shaped connection portions 55 and 56 that are electrically connected to the first flexible substrate are provided.

  On the side of the sealing substrate 21 facing the element substrate 11, an L-shaped lead wire 24 and a reverse L-shaped lead wire 25 are provided. The L-shaped lead-out wiring 24 is electrically connected to the control board 5 via the dog-shaped connecting portion 55 and the first flexible board 61. The inverted L-shaped lead-out wiring 25 is electrically connected to the control board 5 via the dog-shaped connection portion 56 and the first flexible board 61. Note that the routing wirings 24 and 25 have their L-shaped backs along the two sides of the sealing substrate 21 facing two sides adjacent to one side of the element substrate 11 on which the first flexible substrate 61 is provided. It is extended and provided.

  In this modification, connection portions 55 and 56 are provided on the first flexible substrate 61 at one end of the element substrate 11. As a result, the sealing substrate 21 is electrically connected to the control substrate 5 via the routing wirings 24 and 25, the connection portions 55 and 56, and the first flexible substrate 61. Therefore, since it is not necessary to provide the second flexible substrate 62 at one end of the sealing substrate 21, the organic EL device 1 with a narrower frame can be obtained.

(Electronics)
Next, an electronic apparatus according to the present invention will be described using a mobile phone as an example. FIG. 9 is a perspective view showing the overall configuration of the mobile phone 600. The mobile phone 600 includes a housing 601, an operation unit 602 provided with a plurality of operation buttons, and a display unit 603 that displays images, moving images, characters, and the like. The display unit 603 is equipped with the organic EL device 1 according to the present invention.
As described above, since the organic EL device 1 with a narrow frame is provided without impairing the sealing performance, a highly reliable and compact electronic device (mobile phone) 600 can be obtained.

  In addition to the mobile phone 600, the electronic device includes a multimedia-compatible personal computer (PC), an engineering workstation (EWS), a pager, a projection type liquid crystal display device, a word processor, a television, and a viewfinder type. Or a monitor direct-view type video tape recorder, an electronic notebook, an electronic desk calculator, a car navigation device, a POS terminal, a touch panel, and the like.

It is a schematic structure perspective view of the organic EL device and control board of the present invention. It is a plane schematic diagram of the side facing the sealing substrate of the element substrate. It is a plane schematic diagram of the side facing the element substrate of the sealing substrate. It is a plane schematic enlarged view except the sealing substrate of the organic EL device according to the first embodiment. It is the cross-sectional schematic along the AA line shown in FIG. It is a plane schematic enlarged view except a sealing substrate of an organic EL device concerning a 2nd embodiment. FIG. 7 is a schematic cross-sectional view along the line BB shown in FIG. 6. It is a perspective view of the other schematic structural example of the organic electroluminescent apparatus of this invention, and a control board. It is a perspective view of the mobile phone which is an example of an electronic device.

Explanation of symbols

L ... display area, M ... non-display area, 1, 2 ... organic EL device, 10 ... organic EL element, 11 ... element substrate, 12 ... anode, 13 ... organic light emitting layer, 14 ... cathode, 16 ... partition, 17 ... Cathode protective layer, 18 ... organic buffer layer, 19 ... gas barrier layer, 21 ... sealing substrate, 22, 23, 24, 25 ... routing wiring, 26, 27 ... conductive wiring, 34 ... transparent adhesive layer, 41 ... first auxiliary Electrode, 42, 44 ... conductive connection part, 43 ... second auxiliary electrode, 600 ... mobile phone (electronic device)

Claims (5)

An element substrate; an organic EL element in which an anode, an organic light emitting layer, and a cathode are sequentially stacked on the element substrate; a partition wall that surrounds the periphery of the organic EL element in a plan view; In an organic EL device provided with a sealing substrate provided through a transparent adhesive layer facing the side on which the partition wall is provided,
The element substrate has a display region in which a plurality of organic EL elements are arranged in a matrix.
A first auxiliary electrode provided on the partition so as to be electrically connected to the cathode; and a cathode protective layer provided on the element substrate so as to cover the partition, the cathode and the first auxiliary electrode. An organic buffer layer provided on the element substrate so as to cover the cathode protective layer, a gas barrier layer provided on the element substrate so as to cover the organic buffer layer, the partition walls, and the gas barrier layer And a conductive wire disposed in a contact hole that penetrates the organic buffer layer and the cathode protective layer and electrically connected to the first auxiliary electrode, and a conductive conductive layer provided on the upper surface of the conductive wire. A connection portion, and a routing wiring provided so as to be electrically connected to the conductive connection portion,
The routing wiring is provided on the sealing substrate, is provided so as to face a non-display area corresponding to the outside of the display area, and partially overlap a region facing the partition,
The cathode is electrically connected to the routing wiring and the partition provided in the non-display area via the first auxiliary electrode, the conductive wiring, and the conductive connection portion. Organic EL device. The organic EL device according to claim 1,
The organic EL device, wherein the conductive connection portion is made of an Ag paste. The organic EL device according to claim 1 or 2,
The organic EL device, wherein the conductive wiring is made of a metal film. The organic EL device according to any one of claims 1 to 3,
A second auxiliary electrode wider than the first auxiliary electrode is provided so as to overlap the routing wiring and intersect the first auxiliary electrode, and the second auxiliary electrode includes the routing wiring and the element substrate. An organic EL device which is electrically connected on the partition provided in the non-display area.   An electronic apparatus comprising the organic EL device according to claim 1.

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