KR102612737B1 - Display device - Google Patents

Abstract

The present invention provides a display device that can prevent seams from forming in the inorganic film forming the encapsulation film without reducing the resistance of the power line. A display device according to an embodiment of the present invention includes a first substrate including a display area on which pixels are arranged and a non-display area on which a plurality of pads are arranged, and at least one of the plurality of pads. It includes a power line that supplies a power voltage supplied from the pixel to the pixel, and a dam formed to cover one end of the power line.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Accordingly, recently, non-light emitting displays such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), and quantum dot emitting displays have been developed. Various display devices, such as electroluminescence displays (QLED: Quantum dot Light Emitting Display), are being used.

Among display devices, organic light emitting displays and quantum dot light emitting displays are self-emitting types and have superior viewing angles and contrast ratios compared to liquid crystal displays (LCDs). They do not require a separate backlight, allowing for lightweight and thin design, and are expected to increase consumption. Power is an advantage. In addition, organic light emitting display devices have the advantage of being capable of driving at low direct current voltages, having a fast response speed, and especially low manufacturing costs.

An organic light emitting display device includes pixels including light emitting elements in a display area. The bank can serve as a pixel defining layer. The light emitting device includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the light-emitting layer through the hole transport layer and electron transport layer, respectively, and combine with each other in the light-emitting layer to emit light.

Light-emitting devices have the disadvantage of being easily deteriorated by external factors such as external moisture and oxygen. To prevent this, the organic light emitting display device forms an encapsulation film to prevent external moisture and oxygen from penetrating the light emitting device. Generally, the encapsulation film includes an inorganic film and an organic film to prevent oxygen or moisture from penetrating into the organic light emitting device.

Voltage is applied to the anode electrode and cathode electrode of each pixel through power lines disposed in the non-display area. The power lines apply the power voltage supplied from the pad to the anode electrode and cathode electrode of each pixel. These power lines are placed in non-display areas to create a step difference. When forming an encapsulation film on power lines, seams may occur in the inorganic film constituting the encapsulation film due to steps generated by the power lines. In this case, moisture or oxygen may penetrate through the seam. Because of this, deterioration of the light emitting device may occur.

The present invention provides a display device that can prevent seams from forming in the inorganic film forming the encapsulation film.

Additionally, the present invention provides a display device that can prevent the resistance of a power line from decreasing.

A display device according to an embodiment of the present invention includes a first substrate including a display area on which pixels are arranged and a non-display area on which a plurality of pads are arranged, and at least one of the plurality of pads. It includes a power line that supplies a power voltage supplied from the pixel to the pixel, and a dam formed to cover one end of the power line.

According to the present invention, the edge of the second power line can be formed to be covered by the first dam or the second dam. Accordingly, the present invention can prevent seams from occurring in the first inorganic film or the second inorganic film forming the encapsulation film by the second power line.

Additionally, the present invention can form an upper auxiliary line on a second substrate and electrically connect the upper auxiliary line to a second power line formed on the first substrate. The present invention allows the second power voltage to be stably supplied to the second electrode without being affected by resistance by electrically connecting the second power line to the upper auxiliary line even if the formation area of the second power line is reduced.

Additionally, the present invention can reduce the width of the second power line. As a result, the present invention can implement a narrow bezel.

The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. .

1 is a perspective view showing a display device according to an embodiment of the present invention.
FIG. 2 is a plan view showing the first substrate, source drive IC, flexible film, circuit board, and timing control unit of FIG. 1.
Figure 3 is a plan view schematically showing the first substrate.
FIG. 4 is a cross-sectional view showing an example of a pixel in the display area of FIG. 3.
Figure 5 is a cross-sectional view schematically showing a cross-section taken along line II-II' shown in Figure 3.
FIG. 6 is a cross-sectional view schematically showing a cross section taken along line III-III' shown in FIG. 3.
Figure 7 is a cross-sectional view showing a modified embodiment of Figure 5.
Figure 8 is a plan view schematically showing the first and second substrates.
FIG. 9 is a cross-sectional view schematically showing a cross section taken along line IV-IV' shown in FIG. 8.
FIG. 10 is a cross-sectional view schematically showing a cross section taken along line V-V' shown in FIG. 8.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. These embodiments only serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as 'after', 'successfully after', 'after', 'before', etc., 'immediately' or 'directly' Unless used, non-consecutive cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

“X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted as only geometrical relationships in which the relationship between each other is vertical, and should not be interpreted as a wider range within which the configuration of the present invention can function functionally. It can mean having direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It can mean a combination of all items that can be presented from more than one.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, various technical interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

1 is a perspective view showing a display device according to an embodiment of the present invention. FIG. 2 is a plan view showing the first substrate, source drive IC, flexible film, circuit board, and timing control unit of FIG. 1.

Below, the description focuses on the fact that the display device according to an embodiment of the present invention is an organic light emitting display, but the present invention is not limited thereto. That is, the display device according to an embodiment of the present invention is not only an organic light emitting display device, but also a liquid crystal display device, a field emission display device, and a quantum dot light emitting diode display device. ) and an electrophoresis display.

1 and 2, a display device 100 according to an embodiment of the present invention includes a display panel 110, a source drive integrated circuit (hereinafter referred to as “IC”) 140, and a flexible film. It includes 150, a circuit board 160, and a timing control unit 170.

The display panel 110 includes a first substrate 111 and a second substrate 112. The second substrate 112 may be an encapsulation substrate. The first substrate 111 may be a plastic film or a glass substrate. The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film.

Gate lines, data lines, and pixels are formed on one side of the first substrate 111 facing the second substrate 112. Pixels are provided in an area defined by the intersection structure of gate lines and data lines.

Each of the pixels may include an organic light emitting device including a thin film transistor, a first electrode, an organic light emitting layer, and a second electrode. Each of the pixels uses a thin film transistor to supply a predetermined current to the organic light emitting device according to the data voltage of the data line when a gate signal is input from the gate line. Because of this, the organic light emitting element of each pixel can emit light with a predetermined brightness according to a predetermined current. A description of the structure of each pixel will be described later in conjunction with FIG. 4.

The display panel 110 can be divided into a display area (DA) in which pixels are formed to display images, and a non-display area (NDA) in which images are not displayed. Gate lines, data lines, and pixels may be formed in the display area DA. A gate driver and pads may be formed in the non-display area NDA.

The gate driver supplies gate signals to the gate lines according to the gate control signal input from the timing control unit 170. The gate driver may be formed in the non-display area (DA) outside the display area (DA) on one or both sides of the display panel 110 using a gate driver in panel (GIP) method. Alternatively, the gate driver may be manufactured as a driving chip, mounted on a flexible film, and attached to the non-display area (DA) outside one or both sides of the display area (DA) of the display panel 110 using a TAB (tape automated bonding) method. It may be possible.

The source drive IC 140 receives digital video data and source control signals from the timing control unit 170. The source drive IC 140 converts digital video data into analog data voltages according to the source control signal and supplies them to the data lines. When the source drive IC 140 is manufactured as a driving chip, it may be mounted on the flexible film 150 using a chip on film (COF) or chip on plastic (COP) method.

Pads such as data pads may be formed in the non-display area NDA of the display panel 110. Wires connecting the pads and the source drive IC 140 and wires connecting the pads and the wires of the circuit board 160 may be formed in the flexible film 150. The flexible film 150 is attached to the pads using an anisotropic conducting film, so that the pads and the wiring of the flexible film 150 can be connected.

The circuit board 160 may be attached to the flexible films 150. The circuit board 160 may be equipped with multiple circuits implemented with driving chips. For example, the timing control unit 170 may be mounted on the circuit board 160. The circuit board 160 may be a printed circuit board or a flexible printed circuit board.

The timing control unit 170 receives digital video data and timing signals from an external system board through a cable of the circuit board 160. The timing control unit 170 generates a gate control signal for controlling the operation timing of the gate driver and a source control signal for controlling the source drive ICs 140 based on the timing signal. The timing control unit 170 supplies a gate control signal to the gate driver and a source control signal to the source drive ICs 140.

Figure 3 is a plan view schematically showing the first substrate.

Referring to FIG. 3, the first substrate 111 is divided into a display area (DA) and a non-display area (NDA), and the non-display area (NDA) has a pad area (PA) where pads are formed, and a dam 310. , a first power line 320, and a second power line 330 may be formed.

Data lines and gate lines that intersect the data lines are formed in the display area DA. Additionally, in the display area DA, pixels P that display an image in a matrix form are formed in the intersection area of the data lines and the gate lines. When the gate signal of the gate line is input, each of the pixels P supplies a predetermined current to the light emitting device according to the data voltage of the data line. Because of this, each light emitting element of the pixels P can emit light with a predetermined brightness according to a predetermined current. Additionally, the first power line 320 supplies a first power voltage to each of the pixels (P), and the second power line 330 supplies a second power voltage to each of the pixels (P).

Hereinafter, the structure of the pixel P of the display area DA according to embodiments of the present invention will be examined in detail with reference to FIG. 4.

FIG. 4 is a cross-sectional view showing an example of a pixel in the display area of FIG. 3.

Referring to FIG. 4, thin film transistors 210 and capacitors 220 are formed on one surface of the first substrate 111.

A buffer film (not shown) may be formed on the first substrate 111 to protect the thin film transistors 210 from moisture penetrating through the first substrate 111, which is vulnerable to moisture permeation.

Each of the thin film transistors 210 includes an active layer 211, a gate electrode 212, a source electrode 213, and a drain electrode 214. Although FIG. 4 illustrates that the gate electrodes 212 of the thin film transistors 210 are formed in a top gate manner located on top of the active layer 211, it should be noted that the present invention is not limited thereto. That is, the thin film transistors 210 are of the bottom gate type in which the gate electrode 212 is located below the active layer 211, or the gate electrode 212 is located at the top and bottom of the active layer 211. It can be formed as a double gate method located in both.

An active layer 211 is formed on the buffer film of the first substrate 111. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be formed on the first substrate 111 to block external light incident on the active layer 211.

A gate insulating layer 230 may be formed on the active layer 211. The gate insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof.

A gate electrode 212 may be formed on the gate insulating film 230. The gate electrode 212 is made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or a multi-layer made of an alloy, but is not limited thereto.

An interlayer insulating film 240 may be formed on the gate electrode 212. The interlayer insulating film 240 may be formed of an inorganic film, for example, a silicon oxide film, a silicon nitride film, or a multilayer thereof.

A source electrode 213 and a drain electrode 214 may be formed on the interlayer insulating film 240. Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through contact holes CH1 and CH2 penetrating the gate insulating film 230 and the interlayer insulating film 240. The source electrode 213 and the drain electrode 214 each include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper ( It may be a single layer or a multi-layer made of any one of (Cu) or an alloy thereof, but is not limited thereto.

Each of the capacitors 220 includes a lower electrode 221 and an upper electrode 222. The lower electrode 221 is formed on the gate insulating film 230 and may be formed of the same material as the gate electrode 212. The upper electrode 222 is formed on the interlayer insulating film 240 and may be formed of the same material as the source electrode 223 and the drain electrode 224.

A planarization film 260 may be formed on the thin film transistor 210 and the capacitor 220 to flatten the step caused by the thin film transistor 210 and the capacitor 220. The planarization film 260 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

An organic light emitting device 280, a bank 284, and a spacer 285 are formed on the planarization film 260. The organic light emitting device 280 includes a second electrode 282, an organic light emitting layer 283, and a first electrode 281. The second electrode 282 may be a cathode electrode, and the first electrode 281 may be an anode electrode. The area where the second electrode 282, the organic light emitting layer 283, and the first electrode 281 are stacked may be defined as the light emitting area (EA).

The first electrode 281 may be formed on the planarization film 260. The first electrode 281 is connected to the source electrode 213 or the drain electrode 214 of the thin film transistor 210 through a contact hole (CH3) penetrating the protective film 250 and the planarization film 260. The first electrode 281 has a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/APC /ITO) can be made of a highly reflective metal material. APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 284 may be formed to cover the edge of the first electrode 281 on the planarization film 260 to partition the light emitting units EA. The bank 284 may be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. .

Spacers 285 may be formed on the banks 284. The spacer 285 may be formed of an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. . Spacer 285 may be omitted.

An organic light-emitting layer 283 is formed on the first electrode 281, the bank 284, and the spacer 285. The organic light emitting layer 283 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when voltage is applied to the first electrode 281 and the second electrode 282, holes and electrons move to the light-emitting layer through the hole transport layer and electron transport layer, respectively, and combine with each other in the light-emitting layer to emit light.

The organic light-emitting layer 283 may be made of a white light-emitting layer that emits white light. In this case, it may be formed to cover the first electrode 281 and the bank 284. In this case, a color filter (not shown) may be formed on the second substrate 112.

Alternatively, the organic light-emitting layer 283 may be made of a red light-emitting layer that emits red light, a green light-emitting layer that emits green light, or a blue light-emitting layer that emits blue light. In this case, the organic light emitting layer 283 may be formed in an area corresponding to the first electrode 281, and the color filter may not be formed on the second substrate 112.

The second electrode 282 is formed on the organic light emitting layer 283. When the organic light emitting display device is formed with a top emission structure, the second electrode 282 is made of a transparent conductive material (TCO) such as ITO or IZO that can transmit light, or magnesium (Mg). ), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). A capping layer may be formed on the second electrode 282.

An encapsulation film 290 is formed on the organic light emitting device 280. The encapsulation film 290 serves to prevent oxygen or moisture from penetrating into the organic light emitting layer 283 and the second electrode 282. To this end, the encapsulation film 290 may include at least one inorganic film and at least one organic film.

For example, the encapsulation film 290 may include a first inorganic film 291, an organic film 292, and a second inorganic film 293. In this case, the first inorganic film 291 is formed to cover the second electrode 282. The organic layer 292 is formed on the first inorganic layer 291. The organic layer 292 is preferably formed to have a sufficient thickness to prevent particles from penetrating the first inorganic layer 291 and entering the organic light-emitting layer 283 and the second electrode 282. The second inorganic layer 293 is formed to cover the organic layer 292.

First to third color filters (not shown) and a black matrix (not shown) may be formed on the encapsulation film 290. A red color filter may be formed in the red light-emitting part, a blue color filter may be formed in the blue light-emitting part, and a green color filter may be formed in the green light-emitting part.

The encapsulation film 290 of the first substrate 111 and the color filters (not shown) of the second substrate 112 are bonded using an adhesive layer (not shown), thereby bonding the first substrate 111 and the second substrate 112 to each other. Substrate 112 may be cemented. The adhesive layer may be a transparent adhesive resin.

Referring again to FIG. 3, the non-display area NDA includes a first side non-display area NDA1 including a pad area PA, and a second side non-display area facing the first side non-display area NDA1. (NDA2), a third non-display area (NDA3) connecting one end of the first non-display area (NDA1) and one end of the second non-display area (NDA2), and facing the third non-display area (NDA3) It includes a fourth non-display area (NDA4) connecting the other end of the first non-display area (NDA1) and the other end of the second non-display area (NDA2).

The pad area PA includes a plurality of pads (PAD1, PAD2, DPAD), and some of the plurality of pads (PAD1, PAD2, DPAD) are formed by forming a flexible film 150 using an anisotropic conducting film. It can be electrically connected to the wiring of

The dam 310 is disposed between the display area DA and the pad area PA to prevent the organic layer 292 constituting the encapsulation film 290 of the pixel P from invading the pad area PA. Block the flow of (292). The dam 310 may include a second dam 312 and a first dam 311.

The first power line 320 is disposed in the non-display area NDA and applies the first power voltage to the pixel P disposed in the display area DA. The second power line 330 is disposed in the non-display area NDA and applies the second power voltage to the pixel P disposed in the display area DA.

Hereinafter, a plurality of pads (PAD1, PAD2, DPAD), dam 310, first power line 320, and second power line 330 will be examined in detail with reference to FIGS. 5 and 6.

FIG. 5 is a cross-sectional view schematically showing a cross section along line II-II' shown in FIG. 3, and FIG. 6 is a cross-sectional view schematically showing a cross section along line III-III' shown in FIG. 3. Figure 7 is a cross-sectional view showing a modified embodiment of Figure 5.

Referring to FIGS. 5 and 6 , the display device includes an encapsulation film 290, a dam 310, a first power line 320, a second power line 330, and a plurality of Includes pads (PAD1, PAD2, DPAD). In one embodiment, the display device may further include a crack prevention groove 340 formed on the first substrate 111.

The encapsulation film 290 is formed to cover the organic light emitting device 280 formed in the display area DA and prevents oxygen or moisture from penetrating into the organic light emitting device 280. At this time, the encapsulation film 290 includes at least one inorganic film and at least one organic film. For example, the encapsulation film 290 may include a first inorganic film 291, an organic film 292, and a second inorganic film 293. In this case, the first inorganic film 291 is formed to cover the second electrode 282. The organic layer 292 is formed on the first inorganic layer 291, and the second inorganic layer 293 is formed to cover the organic layer 292 and the dam 120.

Each of the first and second inorganic layers 291 and 293 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second inorganic layers 291 and 293 may be deposited using a CVD (Chemical Vapor Deposition) technique or an ALD (Atomic Layer Deposition) technique, but are not limited thereto.

The organic layer 292 may be transparent to allow light emitted from the organic emission layer 283 to pass through. The organic film 292 is made of an organic material that can pass more than 99% of the light emitted from the organic light-emitting layer 283, such as acrylic resin, epoxy resin, phenolic resin, and polyamide. It may be formed of polyamide resin or polyimide resin. The organic film 292 may be formed using vapor deposition, printing, or slit coating techniques using organic materials, but is not limited thereto. The organic film 292 may be formed using an inkjet (ink-jet) technique. It can also be formed by the jet process.

The dam 310 is formed to surround the outside of the display area DA and blocks the flow of the organic layer 292 constituting the encapsulation layer 290. The dam 310 is disposed between the display area DA and the pad area PA to prevent the flow of the organic film 292 constituting the encapsulation film 290 from invading the pad area PA. Block. Through this, the dam 310 can prevent the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

This dam 310 may include a first dam 311 and a second dam 312. The first dam 311 is formed to surround the outside of the display area DA and can primarily block the flow of the organic layer 292 constituting the encapsulation layer 290. In addition, the first dam 311 is disposed between the display area DA and the pad area PA to prevent the organic layer 292 constituting the encapsulation film 290 from invading the pad area PA. 292) can primarily block the flow.

The first dam 311 is preferably formed to be spaced apart from the area where the organic light emitting device 280 is formed so that the organic film 292 sufficiently covers the organic light emitting device 280 formed on the first substrate 111. . In addition, the first dam 311 is preferably formed separately from components such as the planarization film 260 and the bank 284 made of an organic material vulnerable to the external environment.

This first dam 311 may be formed on the first power line 320 that supplies power voltage to each of the pixels (P). Specifically, the first dam 311 is formed on the second power line 330 in the second side non-display area NDA2, the third side non-display area NDA3, and the fourth side non-display area NDA4. It can be. At this time, the first dam 311 may be formed to cover the edge of the second power line 330.

Meanwhile, the first dam 311 may be formed on the first power line 320 and the second power line 330 in the first side non-display area NDA. At this time, the first dam 311 may only partially cover the edges of each of the first power line 320 and the second power line 330 extending to the pad area PA.

The first dam 311 may include a first lower layer 311a and a first upper layer 311b. The first lower layer 311a may be formed on the first power line 320 and the second power line 330.

The first lower layer 311a and the first upper layer 311b of the first dam 311 may be formed simultaneously with at least one of the planarization film 260, the bank 284, and the spacer 285 of the pixel P, , may be made of the same material as at least one of the planarization film 260, the bank 284, and the spacer 285. For example, the first lower layer 311a of the first dam 311 may be formed simultaneously with the planarization film 260 and the same material, and the first upper layer 311b of the first dam 311 may be formed of the bank 284. ) can be formed simultaneously with the same material. For another example, the first lower layer 311a of the first dam 311 may be formed simultaneously with the bank 284 of the same material, and the first upper layer 312b of the first dam 311 may be formed of the spacer 285. ) can be formed simultaneously with the same material. In this case, the first lower layer 311a and the first upper layer 311b of the first dam 312 are made of acryl resin, epoxy resin, phenolic resin, or polyamide resin ( It can be formed of organic materials such as polyamide resin and polyimide resin.

In FIGS. 5 and 6, the first dam 311 is described as including a first lower layer 311a and a first upper layer 311b, but is not limited thereto. In another embodiment, the first dam 311 may be formed in a three-layer structure including a lower layer, a middle layer, and an upper layer. In another embodiment, the first dam 311 may be formed as a single-layer structure with only the lower layer.

The second dam 312 is formed on the outside of the first dam 311 and can secondarily block the organic film 292 overflowing into the outside of the first dam 311. Through this, the second dam 312 and the first dam 311 can more effectively block the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

This second dam 312 may be formed on the interlayer insulating film 240 . Specifically, the second dam 312 may be formed on the interlayer insulating film 240 in the second side non-display area NDA2, the third side non-display area NDA3, and the fourth side non-display area NDA4. there is.

Additionally, the second dam 312 may be formed on the first power line 320 and the second power line 330 in the first side non-display area NDA1. At this time, the second dam 312 may only partially cover the edges of each of the first power line 320 and the second power line 330 extending to the pad area PA.

The second dam 312 may include a second lower layer 312a, a middle layer 312b, and a first upper layer 312c. The second lower layer 312a may be formed on the first power line 320 and the second power line 330, the middle layer 312b may be formed on the first lower layer 312a, and the first upper layer (312c) may be formed on the intermediate layer (312b).

The second lower layer 312a, the middle layer 312b, and the second upper layer 312c of the second dam 311 include at least one of the planarization film 260, the bank 284, and the spacer 285 of the pixel P. They may be formed simultaneously and may be made of the same material as at least one of the planarization film 260, the bank 284, and the spacer 285. For example, the second lower layer 312a of the second dam 312 may be formed simultaneously with the planarization film 260 and the same material. The middle layer 312b of the second dam 312 may be formed simultaneously with the bank 284 of the same material. The second upper layer 312c of the second dam 312 may be formed of the same material as the spacer 285. In this case, the second lower layer 312a, middle layer 312b, and second upper layer 312c of the second dam 312 are made of acrylic resin, epoxy resin, or phenolic resin. , may be formed of organic materials such as polyamide resin and polyimide resin.

5 and 6, the second dam 312 is described as including a second lower layer 312a, a middle layer 312b, and a second upper layer 312c, but is not limited thereto. In another embodiment, the second dam 312 may be formed as a single-layer structure as the lower layer. In another embodiment, the second dam 312 may be formed in a two-layer structure with a lower layer and an upper layer.

The first power line 320 applies the first power voltage supplied from an external power supply to each pixel P disposed in the display area DA. The first power line 320 may extend from the pad area PA to the display area DA. The first power line 320 may extend from the pad area PA and be disposed in the first non-display area NDA1. The first power line 320 may extend from the first non-display area NDA1 to the display area DA. Although not specifically shown in FIG. 3, the first power line 320 is a plurality of first voltage lines extending from the first power line 320 formed in the first non-display area NDA1 to the display area DA. (not shown) may be included. The first voltage lines (not shown) may be disposed on the same layer and formed integrally with the first power line 320 formed in the first non-display area NDA1, or may be disposed on a different layer and electrically connected through a contact hole. You can.

The first power line 320 is connected to the first pad PAD1 in the pad area PA and receives the first power voltage through the first pad PAD1. The first power line 320 is connected to the pixel P in the display area DA and can apply the first power voltage to the pixel P. The first power line 320 is connected to the first electrode 281 of the organic light emitting device 280 in the display area DA, and can apply the first power voltage to the first electrode 281. At this time, the first power voltage may be a high potential voltage.

The first power line 320 may be formed on the same layer as the source electrode 213 and the drain electrode 214. The first power line 320 may be formed of the same material as the source electrode 213 and the drain electrode 214. The first power line 320 is made of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or multiple layers made of any one or an alloy thereof.

The second power line 330 applies the second power voltage supplied from an external power supply to each pixel P arranged in the display area DA. The second power line 330 may extend from the pad area PA to the display area DA. The second power line 330 may be arranged to extend from the pad area PA to the third side non-display area NDA3, the fourth side non-display area NDA4, and the second side non-display area NDA2. . The second power line 330 may extend from each of the third side non-display area NDA3, the fourth side non-display area NDA4, and the second side non-display area NDA2 to the display area DA.

Although not specifically shown in FIG. 3, the second power line 330 is formed in each of the third side non-display area NDA3, the fourth side non-display area NDA4, and the second side non-display area NDA2. It may include a plurality of second voltage lines (not shown) extending from the second power line 330 to the display area DA. The second voltage lines (not shown) are the same as the second power line 330 formed in each of the third side non-display area (NDA3), the fourth side non-display area (NDA4), and the second side non-display area (NDA2). It may be placed on a layer and formed integrally, or may be placed on another layer and electrically connected through a contact hole.

The second power line 330 is connected to the second pad PAD2 in the pad area PA and receives the second power voltage through the second pad PAD2. The second power line 330 is connected to the pixel P in the display area DA and can apply the second power voltage to the pixel P. The second power line 330 is connected to the second electrode 282 of the organic light emitting device 280 in the display area DA, and can apply a second power voltage to the second electrode 282. At this time, the second power voltage may be a low-potential voltage lower than the first power voltage. The low potential voltage may be ground voltage.

The second power line 330 may be formed on the same layer as the source electrode 213 and the drain electrode 214. The second power line 330 may be formed of the same material as the source electrode 213 and the drain electrode 214. The second power line 330 is made of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or multiple layers made of any one or an alloy thereof.

The second power line 330 according to an embodiment of the present invention has a first dam ( 311) or the second dam 312. The second power line 330 is displayed in the area where the first dam 311 is formed in the second side non-display area NDA2, the third side non-display area NDA3, and the fourth side non-display area NDA4. Up to an area (DA) can be formed. At this time, one end of the second power line 330 may be covered by the first dam 311 and the other end may be covered by the planarization film 260, as shown in FIG. 5 .

In Figure 5, one end of the second power line 330 is shown covered by the first dam 311, but the present invention is not limited to this. In another embodiment, the second power line 330 may be formed from the area where the second dam 312 is formed to the display area DA, as shown in FIG. 7 . At this time, one end of the second power line 330 may be covered by the second dam 312 and the other end may be covered by the planarization film 260 .

Accordingly, the second power line 330 may not be exposed when forming the first inorganic layer 291 or the second inorganic layer 293 forming the encapsulation layer 290. Since the second power voltage is applied to the second power line 330, it is desirable to have a sufficient area in order to stably supply the second power voltage without being affected by resistance. The conventional second power line 330 is formed to the outside of the second dam 312 in order to have a sufficient area. The edge of the conventional second power line 330 may be exposed outside the second dam 312. In this case, when the first inorganic film 291 or the second inorganic film 293 forming the encapsulation film 290 is formed on the second power line 330, the edge of the second power line 330 A broken seam may occur in the first inorganic film 291 or the second inorganic film 293.

The second power line 330 according to an embodiment of the present invention includes a first dam 311 or a second dam ( 312) is not formed until the outskirts. As a result, the edge of the second power line 330 according to an embodiment of the present invention is covered by the first dam 311 or the second dam 312, and thus the first inorganic film 291 or the second inorganic film You can prevent seams from occurring at (293).

Meanwhile, as described above, since the second power line 330 according to the embodiment of the present invention is not formed outside the first dam 311 or the second dam 312, the formation area is reduced. Since the resistance of the second power line 330 increases as the formation area decreases, the second power voltage cannot be stably supplied to the second electrode 282.

An embodiment of the present invention may further include an auxiliary line 286 to reduce the resistance of the second power line 330. The first auxiliary line 286 may be spaced apart from the first electrode 281 on the planarization film 260 and extend below the first dam 311 . This first auxiliary line 286 may be connected to the second power line 330 as shown in FIG. 5. Accordingly, the formation area of the second power line 330 has the effect of being increased by the first auxiliary line 286, and thus the resistance can be reduced.

The auxiliary line 286 may be formed on the same layer as the first electrode 281 disposed in the display area DA. The auxiliary line 286 may be formed of the same material as the first electrode 281. The auxiliary line 286 is, for example, a laminated structure of aluminum and titanium (Ti/Al/Ti), a laminated structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a laminated structure of APC alloy and ITO ( It can be formed of a highly reflective metal material such as ITO/APC/ITO). APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

Additionally, the embodiment of the present invention may further include an upper auxiliary line 340 formed on the second substrate 112 to reduce the resistance of the second power line 330. A description of the upper auxiliary line 340 will be provided later in conjunction with FIGS. 8 to 10.

The first pad PAD1 is disposed in the pad area PA and connected to the first power line 320, and can be electrically connected to the wires of the flexible film 150 using an anisotropic conducting film. there is. This first pad (PAD1) receives the first power voltage from an external power supply through the flexible film 150. And the first pad (PAD1) supplies the first power voltage to the connected first power line 320.

The second pad PAD2 is disposed in the pad area PA and connected to the second power line 330, and can be electrically connected to the wires of the flexible film 150 using an anisotropic conducting film. there is. This second pad (PAD2) receives a second power voltage from an external power supply through the flexible film 150. And the second pad PAD2 supplies the second power voltage to the connected second power line 330.

The dummy pad DPAD is disposed in the pad area PAD and connected to the second pad PAD2, and may be electrically connected to the upper auxiliary line 340 formed on the second substrate 112. This dummy pad DPAD may be integrally formed by extending from the second pad PAD2 as shown in FIG. 6 .

Hereinafter, the upper auxiliary line 340 will be described in more detail with reference to FIGS. 8 to 10.

Figure 8 is a plan view schematically showing the first and second substrates. FIG. 9 is a cross-sectional view schematically showing a cross-section along line IV-IV' shown in FIG. 8, and FIG. 10 is a cross-sectional view schematically showing a cross-section along line V-V' shown in FIG. 8.

8 to 10, the first substrate 111 is divided into a display area (DA) and a non-display area (NDA), and pads (PAD1, PAD2, and DPAD) are formed in the non-display area (NDA). A pad area PA, a dam 310, a first power line 320, and a second power line 330 may be formed. Like the first substrate 111, the second substrate 112 is divided into a display area DA and a non-display area NDA, and an upper auxiliary line 340 may be formed in the non-display area NDA. The non-display area NDA of the second substrate 112 includes a first side non-display area NDA1, a second side non-display area NDA2 facing the first side non-display area NDA1, and a first side non-display area NDA1. A third side non-display area NDA3 connecting one end of the display area NDA1 and one end of the second side non-display area NDA2, and the other end of the first side non-display area NDA1 and the second side non-display area It includes a fourth side non-display area NDA4 connecting the other end of the area NDA2.

The pads PAD1, PAD2, and DPAD shown in FIGS. 9 and 10, the dam 310, the first power line 320, and the second power line 330 are the pads shown in FIGS. 3 to 7 ( Since they are substantially the same as the PAD1, PAD2, and DPAD), the dam 310, the first power line 320, and the second power line 330, description thereof will be omitted.

The second power line 330 is formed on one side of the first substrate 111 facing the second substrate. The second power line 330 is connected to the second pad PAD2 in the pad area PA, and applies the second power voltage supplied from the second pad PAD2 to the pixels P.

The second pad PAD2 is disposed in the pad area PA and connected to the second power line 330, and is used for wiring of the flexible film 150 using the anisotropic conductive film 360 including the conductive ball 360a. (152) can be electrically connected to them. At this time, the wiring 152 of the flexible film 150 is protected by the protective film 154.

This second pad (PAD2) receives the second power voltage from an external power supply through the flexible film 150 and supplies the second power voltage to the connected second power line 330.

The dummy pad DPAD is disposed in the pad area PAD and connected to the second pad PAD2, and may be electrically connected to the upper auxiliary line 340 formed on the second substrate 112. This dummy pad DPAD may extend from the second pad PAD2 and be integrally formed.

The upper auxiliary line 340 is formed on one side of the second substrate 112 facing the first substrate 111 and is electrically connected to the second power line 330 formed on the first substrate 111. The upper auxiliary line 340 extends from the pad connection portion 342 and the pad connection portion 342 formed to correspond to the dummy pad DPAD formed on the first substrate 111 in the first side non-display area NDA1. It includes a line portion 344 in which a line is formed to surround the area DA.

The pad connection portion 342 of the upper auxiliary line 340 is connected to the dummy pad DPAD formed in the pad area PAD of the first substrate 111 using an adhesive member 370 including a conductive ball 370a. do.

Accordingly, since the upper auxiliary line 340 is electrically connected to the dummy pad DPAD and the second pad PAD2, the second power voltage supplied to the second pad PAD2 from the external voltage supply is applied to the dummy pad. It can be approved through (DPAD).

The upper auxiliary line 340 may be formed of the same material as the second power line 330. The upper auxiliary line 340 is made of, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or multiple layers made of one or an alloy thereof.

Meanwhile, the encapsulation film 290 of the first substrate 111 and the upper auxiliary line 340 of the second substrate 112 are bonded using the adhesive layer 350, thereby bonding the first substrate 111 and the second substrate 112 to each other. Substrate 112 may be cemented. The adhesive layer 350 may be a transparent adhesive resin.

The display device according to an embodiment of the present invention is characterized in that the edge of the second power line 330 is covered by the first dam 311 or the second dam 312. Accordingly, the display device according to an embodiment of the present invention can prevent seams from occurring in the first inorganic layer 291 or the second inorganic layer 293 by the second power line 330.

In addition, the display device according to an embodiment of the present invention forms an upper auxiliary line 340 on the second substrate 112, and the upper auxiliary line 340 is connected to the second power line 330 formed on the first substrate 111. It is characterized by being electrically connected to. Since the display device according to an embodiment of the present invention does not form the second power line 330 outside the first dam 311 or the second dam 312, the formation area of the second power line 330 may be reduced. there is. The display device according to the embodiment of the present invention electrically connects the second power line 330 to the upper auxiliary line 340 even though the formation area of the second power line 330 is reduced, so that the second power voltage is affected by resistance. This ensures that it can be stably supplied to the second electrode 282 without receiving any damage.

Additionally, the display device according to an embodiment of the present invention can reduce the width of the second power line 330. As a result, the display device according to an embodiment of the present invention can implement a narrow bezel.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

100: display device 110: display panel
111: first substrate 112: second substrate
140: Source drive IC 150: Flexible film
160: circuit board 170: timing control unit
210: thin film transistor 211: active layer
212: gate electrode 213: source electrode
214: drain electrode 220: capacitor
221: lower electrode 222: upper electrode
230: gate insulating film 240: interlayer insulating film
260: Planarization film 280: Organic light emitting device
281: first electrode 283: organic light emitting layer
282: second electrode 284: bank
285: spacer 290: encapsulation film
291: first inorganic layer 292: organic layer
293: second inorganic membrane 310: dam
320: first power line 330: second power line
340: Upper auxiliary line

Claims (13)

A first substrate including a display area where pixels are arranged and a non-display area where a plurality of pads are arranged;
a power line formed on the first substrate and supplying a power voltage supplied from at least one of the plurality of pads to the pixel; and
It includes a dam formed to cover one end of the power line,
a second substrate disposed to face the first substrate, and
Further comprising an upper auxiliary line formed on one side of the second substrate facing the first substrate,
The plurality of pads include a pad directly connected to the power line, and a dummy pad that is directly connected to the pad and overlaps the upper auxiliary line in the thickness direction,
The display device wherein the upper auxiliary line is electrically connected to the dummy pad. According to paragraph 1,
The pixel includes a first electrode formed on the first substrate, an organic emission layer formed on the first electrode, and a second electrode formed on the organic emission layer,
The display device is characterized in that the power line supplies a power voltage to the second electrode. According to paragraph 1,
The non-display area includes a first side non-display area where the plurality of pads are disposed, a second side non-display area facing the first side non-display area, one end of the first side non-display area and the second side. a third side non-display area connecting one end of the non-display area, and a fourth side non-display area connecting the other end of the first side non-display area and the other end of the second side non-display area,
The power line extends from the plurality of pads to the second side non-display area, the third side non-display area, and the fourth side non-display area. delete According to paragraph 1,
The display device is characterized in that the upper auxiliary line is electrically connected to the power line. delete According to paragraph 1,
The display device wherein the dummy pad extends from the pad. According to paragraph 1,
The display device is characterized in that the upper auxiliary line is connected to the dummy pad and electrically connected to the power line. According to clause 8,
The display device wherein the upper auxiliary line is connected to the dummy pad using an adhesive member including a conductive ball. According to paragraph 1,
The pixel is,
Further comprising a thin film transistor including an active layer, a gate electrode, a source electrode, and a drain electrode formed on the first substrate,
The display device, wherein the power line is formed of the same material on the same layer as the source electrode and the drain electrode. According to clause 10,
The display device, wherein the plurality of pads are formed of the same material on the same layer as the source electrode and the drain electrode. According to clause 10,
The pixel is,
Further comprising a planarization film formed on the thin film transistor,
The display device is characterized in that the planarization film covers the other end of the power line. According to paragraph 1,
The dam,
a first dam formed to surround the display area; and
It includes a second dam formed to surround the first dam,
A display device, characterized in that one end of the power line is covered by one of the first dam and the second dam.

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