KR102512418B1 - Display device - Google Patents

Abstract

The present invention provides a display device capable of preventing moisture from being diffused into an organic light emitting device disposed in a display area. A display device according to an exemplary embodiment of the present invention includes a substrate including a display area and a non-display area surrounding the display area, and an organic light emitting element disposed in the display area and including a first electrode, an organic light emitting layer, and a second electrode. , a dam formed to surround the display area in the non-display area, a first pattern formed on the organic light emitting device, and a second pattern formed on the dam with the same material as the first pattern.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device.

As the information society develops, demands for display devices for displaying images are increasing in various forms. Accordingly, recently, various display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting display (OLED) have been utilized.

Among the display devices, the organic light emitting display device is a self-emission type, and has an excellent viewing angle and contrast ratio compared to a liquid crystal display (LCD), and is lightweight and thin as it does not require a separate backlight, and has advantages in power consumption. . In addition, the organic light emitting display device can be driven at low DC voltage, has a fast response speed, and has low manufacturing cost.

The organic light emitting display device includes pixels each including an organic light emitting element, and a bank partitioning the pixels to define the pixels. The bank may serve as a pixel defining layer. The organic light emitting device includes an anode electrode, a hole transporting layer, an organic light emitting layer, an electron transporting layer, and a cathode electrode. In this case, when a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the organic light emitting layer to emit light.

The organic light emitting device has a disadvantage in that deterioration easily occurs due to external factors such as external moisture and oxygen. To prevent this, the organic light emitting display device forms an encapsulation film to prevent external moisture and oxygen from penetrating the organic light emitting element. The encapsulation layer includes at least one inorganic layer and at least one organic layer.

The organic film is generally composed of a polymer, and is formed through a curing process after being applied on a substrate in a liquid form. Since such an organic film has fluidity until the curing process, it may overflow outside the area where the encapsulation film is to be formed. In order to solve this problem, recently, a dam blocking the flow of an organic film has been formed along the outer edge of the organic light emitting device.

Since the flow of the organic film constituting the encapsulation film is blocked by the dam, it is formed inside the dam. On the other hand, the inorganic film constituting the encapsulation film is formed to cover the dam as well as the organic film. Dams are generally made of organic material. At this time, in the case of the dam made of organic material, the interfacial adhesive force between the inorganic films constituting the encapsulation film is weak, so that the interface may be lifted. Moisture or oxygen may be injected due to such interfacial excitation, and the injected moisture may diffuse to the organic light emitting device along the inorganic layer. Moisture penetrates into the organic light emitting layer and the cathode electrode and oxidizes the organic light emitting device, thereby deteriorating the organic light emitting device.

The present invention provides a display device capable of preventing moisture from being diffused into an organic light emitting device disposed in a display area.

A display device according to an exemplary embodiment of the present invention includes a substrate including a display area and a non-display area surrounding the display area, and an organic light emitting element disposed in the display area and including a first electrode, an organic light emitting layer, and a second electrode. , a dam formed to surround the display area in the non-display area, a first pattern formed on the organic light emitting device, and a second pattern formed on the dam with the same material as the first pattern.

According to the present invention, the first inorganic film constituting the encapsulation film may be patterned. In the present invention, by arranging the first inorganic film formed on the dam and the first inorganic film formed on the organic light emitting device to be spaced apart, even if moisture penetrates into the first inorganic film formed on the dam, diffusion to the organic light emitting device can be prevented. .

Also, according to the present invention, a capping layer may be formed between the dam and the first inorganic layer. Since the interfacial adhesion between the dam and the capping layer is higher than the interfacial adhesion between the dam and the first inorganic film, the present invention can improve the interfacial adhesion at the dam. Accordingly, the present invention can prevent interface lifting in the dam.

Also, according to the present invention, a capping layer may be patterned between the dam and the first inorganic layer. In the present invention, by disposing the capping layer formed on the dam and the capping layer formed on the organic light emitting device at a distance from each other, even if moisture penetrates into the capping layer formed on the dam, diffusion to the organic light emitting device can be prevented.

Also, according to the present invention, the capping layer and the second electrode may be formed to have the same area using one mask. Accordingly, the present invention can reduce manufacturing cost.

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below. .

1 is a perspective view showing a display device according to an exemplary embodiment of the present invention.
FIG. 2 is a plan view illustrating a first substrate, a source drive IC, a flexible film, a circuit board, and a timing controller of FIG. 1 .
3 is a plan view schematically showing a first substrate according to a first embodiment of the present invention.
4 is a cross-sectional view showing an example of a pixel of the display area of FIG. 3 .
FIG. 5 is a cross-sectional view showing a first embodiment along the line II-II′ shown in FIG. 3 .
FIG. 6 is a cross-sectional view showing a second embodiment along the line II-II' shown in FIG. 3;
FIG. 7 is a view showing a modified embodiment of FIG. 6 .
FIG. 8 is a cross-sectional view showing a third embodiment along the line II-II′ shown in FIG. 3 .

Advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only the present embodiments make the disclosure of the present invention complete, and those skilled in the art in the art to which the present invention belongs It is provided to fully inform the person of the scope of the invention, and the invention is only defined by the scope of the claims.

Since the shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining the embodiment of the present invention are exemplary, the present invention is not limited to the matters shown. Like reference numbers designate like elements throughout the specification. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal precedence relationship is described in terms of 'after', 'following', 'next to', 'before', etc. It can also include non-continuous cases unless is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

"X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is made upright, and may be broader within the range in which the configuration of the present invention can function functionally. It can mean having a direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It may mean a combination of all items that can be presented from one or more.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each embodiment can be implemented independently of each other or can be implemented together in an association relationship. may be

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a display device according to an exemplary embodiment of the present invention. FIG. 2 is a plan view illustrating a first substrate, a source drive IC, a flexible film, a circuit board, and a timing controller of FIG. 1 .

Hereinafter, the display device according to an exemplary embodiment of the present invention has been mainly described as an organic light emitting display (OLED), but is not limited thereto. That is, the display device according to an embodiment of the present invention includes not only an organic light emitting display device, but also a liquid crystal display device, a field emission display device, and a quantum dot light emitting display device. ) and an electrophoresis display.

1 and 2, a display device 100 according to an embodiment of the present invention includes a display panel 110, a source drive integrated circuit (hereinafter referred to as "IC") 140, and a flexible film. 150, a circuit board 160, and a timing controller 170.

The display panel 110 includes a first substrate 111 and a second substrate 112 . The second substrate 112 may be an encapsulation substrate. The first substrate 111 may be a plastic film or a glass substrate. The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film.

Gate lines, data lines, and pixels are formed on one surface of the first substrate 111 facing the second substrate 112 . Pixels are provided in an area defined by a cross structure of gate lines and data lines.

Each of the pixels may include an organic light emitting device including a thin film transistor, a first electrode, an organic light emitting layer, and a second electrode. Each of the pixels uses a thin film transistor to supply a predetermined current to the organic light emitting device according to the data voltage of the data line when a gate signal is input from the gate line. Due to this, the organic light emitting device of each of the pixels may emit light with a predetermined brightness according to a predetermined current. A description of the structure of each of the pixels will be described later with reference to FIG. 4 .

The display panel 110 may be divided into a display area DA where pixels are formed to display images and a non-display area NDA where images are not displayed. Gate lines, data lines, and pixels may be formed in the display area DA. A gate driver and pads may be formed in the non-display area NDA.

The gate driver supplies gate signals to the gate lines according to the gate control signal input from the timing controller 170 . The gate driver may be formed in the non-display area DA outside one or both sides of the display area DA of the display panel 110 in a gate driver in panel (GIP) method. Alternatively, the gate driver may be manufactured as a driving chip, mounted on a flexible film, and attached to the non-display area DA outside one or both sides of the display area DA of the display panel 110 by a tape automated bonding (TAB) method. may be

The source drive IC 140 receives digital video data and a source control signal from the timing controller 170. The source drive IC 140 converts digital video data into analog data voltages according to a source control signal and supplies them to data lines. When the source drive IC 140 is manufactured as a driving chip, it may be mounted on the flexible film 150 in a chip on film (COF) or chip on plastic (COP) method.

Pads such as data pads may be formed in the non-display area NDA of the display panel 110 . Wires connecting pads and the source drive IC 140 and wires connecting pads and wires of the circuit board 160 may be formed on the flexible film 150 . The flexible film 150 is attached to the pads using an anisotropic conducting film, so that the pads and wires of the flexible film 150 can be connected.

The circuit board 160 may be attached to the flexible films 150 . A plurality of circuits implemented as driving chips may be mounted on the circuit board 160 . For example, the timing controller 170 may be mounted on the circuit board 160 . The circuit board 160 may be a printed circuit board or a flexible printed circuit board.

The timing controller 170 receives digital video data and timing signals from an external system board through a cable of the circuit board 160 . The timing controller 170 generates a gate control signal for controlling the operation timing of the gate driver and a source control signal for controlling the source drive ICs 140 based on the timing signal. The timing controller 170 supplies a gate control signal to the gate driver and supplies a source control signal to the source drive ICs 140 .

No. 1 Example

3 is a plan view schematically showing a first substrate according to a first embodiment of the present invention.

Referring to FIG. 3 , the first substrate 111 is divided into a display area DA and a non-display area NDA, and a pad area PA where pads are formed may be formed in the non-display area NDA. .

Data lines and gate lines crossing the data lines are formed in the display area DA. Also, in the display area DA, pixels P displaying an image in a matrix form are formed at intersections of the data lines and the gate lines. Each of the pixels P supplies a predetermined current to the light emitting device according to the data voltage of the data line when the gate signal of the gate line is input. Due to this, the light emitting device of each of the pixels P may emit light with a predetermined brightness according to a predetermined current. In addition, a power supply voltage is supplied to the power line. The power line supplies a power voltage to each of the pixels P.

Hereinafter, the structure of the pixel P of the display area DA according to the exemplary embodiments will be described in detail with reference to FIG. 4 .

4 is a cross-sectional view showing an example of a pixel of the display area of FIG. 3 .

Referring to FIG. 4 , thin film transistors 210 and capacitors 220 are formed on one surface of the first substrate 111 .

A buffer film (not shown) may be formed on the first substrate 111 to protect the thin film transistors 210 from moisture penetrating through the first substrate 111 , which is vulnerable to moisture permeation.

Each of the thin film transistors 210 includes an active layer 211 , a gate electrode 212 , a source electrode 213 and a drain electrode 214 . In FIG. 4 , it is illustrated that the gate electrodes 212 of the thin film transistors 210 are formed in a top gate (top gate) method located above the active layer 211, but it should be noted that the present invention is not limited thereto. That is, the thin film transistor 210 is a bottom gate (bottom gate) method in which the gate electrode 212 is positioned below the active layer 211 or the gate electrode 212 is located above and below the active layer 211. It may be formed in a double gate method located in both.

An active layer 211 is formed on the buffer layer of the first substrate 111 . The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be formed on the first substrate 111 to block external light incident on the active layer 211 .

A gate insulating layer 230 may be formed on the active layer 211 . The gate insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof.

A gate electrode 212 may be formed on the gate insulating layer 230 . The gate electrode 212 is any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or these It may be a single layer or multi-layer made of an alloy of, but is not limited thereto.

An interlayer insulating layer 240 may be formed on the gate electrode 212 . The interlayer insulating layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof.

A source electrode 213 and a drain electrode 214 may be formed on the interlayer insulating layer 240 . Each of the source electrode 213 and the drain electrode 214 may be connected to the active layer 211 through contact holes CH1 and CH2 penetrating the gate insulating layer 230 and the interlayer insulating layer 240 . The source electrode 213 and the drain electrode 214 are composed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper ( Cu) may be a single layer or a multi-layer made of any one or an alloy thereof, but is not limited thereto.

Each of the capacitors 220 includes a lower electrode 221 and an upper electrode 222 . The lower electrode 221 is formed on the gate insulating layer 230 and may be formed of the same material as the gate electrode 212 . The upper electrode 222 is formed on the interlayer insulating layer 240 and may be formed of the same material as the source electrode 223 and the drain electrode 224 .

A protective film (not shown) may be formed on the thin film transistor 210 and the capacitor 220 . The protective film may serve as an insulating film. The protective layer may be formed of an inorganic layer, for example, a silicon oxide layer, a silicon nitride layer, or a multilayer thereof. The protective film may be omitted.

A planarization layer 250 may be formed on the passivation layer to flatten a level difference between the thin film transistor 210 and the capacitor 220 . The planarization layer 250 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

The organic light emitting device 270 , the bank 260 , and the spacer 265 are formed on the planarization layer 250 . The organic light emitting device 270 includes a second electrode 273 , an organic light emitting layer 272 , and a first electrode 271 . The second electrode 273 may be a cathode electrode, and the first electrode 271 may be an anode electrode. An area in which the second electrode 273 , the organic light emitting layer 272 , and the first electrode 271 are stacked may be defined as the light emitting unit EA.

The first electrode 271 may be formed on the planarization layer 250 . The first electrode 271 is connected to the drain electrode 214 of the thin film transistor 210 through the contact hole CH3 penetrating the passivation layer and the planarization layer 250 . The first electrode 271 may include a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/APC /ITO) may be formed of a metal material with high reflectivity. An APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 260 may be formed to cover the edge of the first electrode 271 on the planarization layer 250 to partition the light emitting units EA. The bank 260 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. .

A spacer 265 may be formed on the bank 260 . The spacer 265 may be formed of an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. . Spacers 265 may be omitted.

An organic emission layer 272 is formed on the first electrode 271 , the bank 260 and the spacer 265 . The organic light emitting layer 272 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the first electrode 271 and the second electrode 273, holes and electrons move to the light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the light emitting layer to emit light.

The organic light emitting layer 272 may include a white light emitting layer that emits white light. In this case, it may be formed to cover the first electrode 271 and the bank 260 . In this case, a color filter (not shown) may be formed on the second substrate 112 .

Alternatively, the organic light emitting layer 272 may include a red light emitting layer emitting red light, a green light emitting layer emitting green light, or a blue light emitting layer emitting blue light. In this case, the organic emission layer 272 may be formed in an area corresponding to the first electrode 271 , and the color filter may not be formed on the second substrate 112 .

The second electrode 273 is formed on the organic light emitting layer 272 . When the organic light emitting display device is formed with a top emission structure, the second electrode 273 may be a transparent conductive material (TCO) such as ITO or IZO capable of transmitting light, or magnesium (Mg). ), silver (Ag), or a semi-transmissive conductive material such as an alloy of magnesium (Mg) and silver (Ag).

A capping layer 280 is formed on the organic light emitting device 270 . The capping layer 280 is formed on the second electrode 273 to protect the first electrode 271 , the organic emission layer 272 , and the second electrode 273 . In addition, the capping layer 280 allows light generated from the organic light emitting layer 272 to be efficiently emitted outward. The capping layer 280 is made of at least one of an inorganic material and an organic material. The capping layer 280 may be formed of an inorganic layer, an organic layer, or an organic layer containing inorganic particles.

The capping layer 280 is an inorganic film, and includes zinc oxide, titanium oxide, zirconium oxide, niobium oxide, tantalum oxide, and tin oxide. oxide), nickel oxide, silicon nitride, indium nitride, and gallium nitride.

In addition, the capping layer 280 may include poly(3,4-ethylenedioxythiophene) (PEDOT), 4,4'-bis[N-(3-methylphenyl)-N-phenyl Amino]biphenyl (TPD), 4,4',4''-tris[(3-methylphenyl)phenylamino]triphenylamine (m-MTDATA), 1,3,5-tris[N,N-bis( 2-methylphenyl)-amino]-benzene (o-MTDAB), 1,3,5-tris[N,N-bis(3-methylphenyl)-amino]-benzene (m-MTDAB), 1,3,5- Tris[N,N-bis(4-methylphenyl)-amino]-benzene (p-MTDAB), 4,4′-bis[N,N-bis(3-methylphenyl)-amino]-diphenylmethane (BPPM) , 4,4'-dicarbazolyl-1,1'-biphenyl (CBP), 4,4',4''-tris(N-carbazole)triphenylamine (TCTA), 2,2',2 ''-(1,3,5-benzentolyl)tris-[1-phenyl-1H-benzoimidazole] (TPBI), and 3-(4-biphenyl)-4-phenyl-5-t-butylphenyl -1,2,4-triazole (TAZ) and the like.

An encapsulation film 290 is formed on the capping layer 280 . The encapsulation film 290 serves to prevent penetration of oxygen or moisture into the organic light emitting layer 272 and the second electrode 273 . To this end, the encapsulation layer 290 may include at least one inorganic layer and at least one organic layer.

For example, the encapsulation film 290 may include a first inorganic film 291 , an organic film 292 , and a second inorganic film 293 . In this case, the first inorganic layer 291 is formed to cover the second electrode 273 . An organic layer 292 is formed on the first inorganic layer 291 . The organic layer 292 is preferably formed to a thickness sufficient to prevent particles from penetrating the first inorganic layer 291 and being injected into the organic emission layer 272 and the second electrode 273 . The second inorganic layer 293 is formed to cover the organic layer 292 .

First to third color filters (not shown) and a black matrix (not shown) may be formed on the encapsulation film 290 . A red color filter may be formed in the red light emitting unit, a blue color filter may be formed in the blue light emitting unit, and a green color filter may be formed in the green light emitting unit.

The encapsulation film 290 of the first substrate 111 and the color filters (not shown) of the second substrate 112 are bonded using an adhesive layer (not shown). The substrate 112 may be bonded. The adhesive layer may be a transparent adhesive resin.

Referring back to FIG. 3 , the pad area PA may be disposed on one edge of the first substrate 111 . The pad area PA includes a plurality of pads, and the plurality of pads may be electrically connected to wires of the flexible film 150 by using an anisotropic conducting film.

The dam 120 is disposed to surround the display area DA in the non-display area NDA to block the flow of the organic film 292 constituting the encapsulation film 290 from being exposed to the outside. do. In addition, the dam 120 is disposed between the display area DA and the pad area PA to prevent the organic film 292 constituting the encapsulation film 290 of the pixel P from invading the pad area PA. The flow of the organic layer 292 is blocked.

Hereinafter, the display device according to the first embodiment of the present invention will be described in more detail with reference to FIG. 5 .

FIG. 5 is a cross-sectional view showing a first embodiment along the line II-II′ shown in FIG. 3 .

5 omits specific configurations of the thin film transistors 210 and the capacitor 220 for convenience of explanation, and shows the TFT substrate 200 including them. The TFT substrate 200 represents a substrate on which the thin film transistors 210 and the capacitor 220 are formed on the first substrate 111 .

Referring to FIG. 5 , the display device according to the first embodiment of the present invention includes an organic light emitting element 270, a capping layer 280, an encapsulation film 290, and a dam 120 formed on a TFT substrate 200. include At this time, the TFT substrate 200 includes a display area DA in which pixels P are formed and a non-display area NDA surrounding the display area DA. The non-display area NDA includes a pad area PA in which a plurality of pads are formed.

The organic light emitting device 270 is disposed in the display area DA. The organic light emitting device 270 includes a second electrode 273 , an organic light emitting layer 272 , and a first electrode 271 . The second electrode 273 may be a cathode electrode, and the first electrode 271 may be an anode electrode. An area in which the second electrode 273 , the organic light emitting layer 272 , and the first electrode 271 are stacked may be defined as the light emitting unit EA.

The first electrode 271 may be formed on the planarization layer 250 . The first electrode 271 may extend from the display area DA to a partial area of the non-display area NDA. As shown in FIG. 5 , the first electrode 271 may extend to the dam 120 disposed in the non-display area NDA. The first electrode 271 is the source electrode 213 or drain of the thin film transistor 210 through the contact hole CH3 penetrating the passivation layer and the planarization layer 250 in the display area DA where the pixel P is disposed. It is connected to the electrode 214.

The organic light emitting layer 272 is formed on the first electrode 271 . The organic light emitting layer 272 may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. In this case, when a voltage is applied to the first electrode 271 and the second electrode 273, holes and electrons move to the light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the light emitting layer to emit light.

The second electrode 273 is formed on the organic light emitting layer 272 . The second electrode 273 is formed to have a larger area than the display area DA. The second electrode 273 may extend from the display area DA to a partial area of the non-display area NDA. However, the second electrode 273 is formed inside the region where the dam 120 is formed and is spaced apart from the dam 120 .

The capping layer 280 is formed on the second electrode 273 . The capping layer 280 is made of at least one of an inorganic material and an organic material. The capping layer 280 may be formed of an inorganic layer, an organic layer, or an organic layer containing inorganic particles.

As shown in FIG. 5 , the capping layer 280 is formed to have the same size as the second electrode 273 and protects the first electrode 271 , the organic emission layer 272 , and the second electrode 273 . In FIG. 5 , it is described that the capping layer 280 is formed to have the same size as the second electrode 273, but is not limited thereto. In another embodiment, the capping layer 280 may be formed to have a size smaller than that of the second electrode 273 . The capping layer 280 needs to be formed in the display area DA so that the light generated in the organic light emitting layer 272 can be efficiently emitted outward, but does not necessarily need to be formed in the non-display area NDA. .

Meanwhile, in the display device according to the first embodiment of the present invention, the protective film formed on the thin film transistor 210 and the capacitor 220 may be omitted. In this case, the first inorganic film 291 or the second inorganic film 293 constituting the encapsulation film 290 is directly formed on the power line 310 formed in the non-display area NDA. At this time, the first inorganic film 291 or the second inorganic film 293 may have a seam in which the inorganic film is broken due to a step generated by the power line 310, and moisture may pass through the seam. can penetrate To prevent this, the organic passivation layer 320 may be additionally formed in the display device according to the exemplary embodiment of the present invention.

The organic passivation layer 320 may be formed to cover an edge of the power line 310 by being spaced apart from the dam 120 in the non-display area NDA. That is, one end of the power line 310 may be covered by the planarization layer 250 and the other end may be covered by the organic passivation layer 320 .

The organic passivation layer 320 may be formed simultaneously with at least one of the planarization layer 250, the bank 260, and the spacer 265 of the pixel P, and the planarization layer 250, the bank 260, and the spacer ( 265) may be made of the same material as at least one of them. For example, the organic passivation layer 320 and the bank 260 may be simultaneously formed of the same material. In this case, the organic passivation layer 320 is made of an organic material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. can be formed as

The encapsulation film 290 is formed to cover the organic light emitting diode 270 and the capping layer 280 formed in the display area DA to prevent oxygen or moisture from permeating the organic light emitting diode 270 . In this case, the encapsulation film 290 includes at least one inorganic film and at least one organic film. For example, the encapsulation film 290 may include a first inorganic film 291 , an organic film 292 , and a second inorganic film 293 .

The first inorganic layer 291 may be patterned on the organic light emitting device 270 , the capping layer 280 and the dam 120 . Specifically, the first inorganic layer 291 may include a first pattern 291a, a second pattern 291b, and a third pattern 291c. The first pattern 291a of the first inorganic layer 291 is formed to cover the organic light emitting device 270 and the capping layer 280 and is spaced apart from the first dam 121 . The second pattern 291b of the first inorganic layer 291 is formed to cover the first dam 121 and is spaced apart from the first pattern 291a and the third pattern 291c. The third pattern 291c of the first inorganic layer 291 is formed to cover the second dam 122 and is spaced apart from the second pattern 291b.

In addition, when the organic passivation layer 320 is formed apart from the second dam 122, the first inorganic layer 291 may further include a fourth pattern 291d. The fourth pattern 291d of the first inorganic layer 291 may be formed to cover the organic passivation layer 320 and spaced apart from the third pattern 291c.

The first inorganic layer 291 is formed in contact with the first dam 121 and the second dam 122 . At this time, the first dam 121 and the second dam 122 are made of organic materials. Since the interfacial adhesion between the first dam 121 and the second dam 122 made of organic material and the first inorganic film 291 is weak, interfacial lifting may occur. In this case, there is a high possibility that moisture penetrates into the interface between the first inorganic layer 291 and the dam 120 .

In order to prevent the diffusion of moisture, the display device according to the first embodiment of the present invention is characterized in that the first inorganic film 291 is patterned as described above. In particular, in the display device according to the first embodiment of the present invention, the first inorganic film 291 directly formed on the second dam 122 is patterned into a third pattern 291c, and the second pattern 291b and By being spaced apart from each other, it is possible to prevent moisture penetrating into the third pattern 291c of the first inorganic layer 291 from diffusing into the second pattern 291b. In addition, in the display device according to the first embodiment of the present invention, the first inorganic film 291 directly formed on the first dam 121 is patterned into the second pattern 291b, and the first pattern 291a and By being spaced apart, it is possible to prevent moisture penetrating into the second pattern 291b of the first inorganic layer 291 from diffusing into the first pattern 291a.

In FIG. 5 , the first inorganic layer 291 is described as including the first pattern 291a, the second pattern 291b, and the third pattern 291c, but is not limited thereto. The first inorganic film 291 may be patterned on the second dam 122 disposed at the outermost part. Accordingly, in the first inorganic layer 291, the second pattern 291b is omitted or the first pattern 291a covers not only the organic light emitting element 270 and the capping layer 280 but also the first dam 121. may be formed. Even in this case, the first pattern 291a and the third pattern 291c should be spaced apart from each other.

An organic layer 292 is formed on the first inorganic layer 291 . Since the flow of the organic layer 292 is blocked by the first dam 121 , it is formed inside the first dam 121 . The second inorganic layer 293 is formed to cover the organic layer 292 and the dam 120 . At this time, unlike the first inorganic layer 291, the second inorganic layer 293 is formed to cover the organic layer 292 and the dam 120 in a single pattern, preventing moisture from penetrating into the organic layer 292. can block When the organic passivation layer 320 is formed apart from the second dam 122, the second inorganic layer 293 may be formed to cover not only the organic layer 292 and the dam 120 but also the organic passivation layer 320. .

Each of the first and second inorganic layers 291 and 293 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second inorganic layers 291 and 293 may be deposited using a chemical vapor deposition (CVD) technique or an atomic layer deposition (ALD) technique, but are not limited thereto.

The organic layer 292 may be transparent to pass light emitted from the organic light emitting layer 272 . The organic layer 292 may include an organic material capable of passing 99% or more of the light emitted from the organic light emitting layer 272, such as acrylic resin, epoxy resin, phenolic resin, or polyamide. It may be formed of a polyamide resin or a polyimide resin. The organic layer 292 may be formed by vapor deposition using an organic material, printing, or slit coating, but is not limited thereto, and the organic layer 292 may be formed using an ink-jet jet) process.

The dam 120 is spaced apart from the second electrode 273 and the capping layer 280 in the non-display area NDA. The dam 120 is formed to surround the periphery of the display area DA and blocks the flow of the organic layer 292 constituting the encapsulation layer 290 . The dam 120 is disposed between the display area DA and the pad area PA to prevent the flow of the organic film 292 constituting the encapsulation film 290 from invading the pad area PA. block Through this, the dam 120 may prevent the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

The dam 120 may include a first dam 121 and a second dam 122 . The first dam 121 may be formed to surround the periphery of the display area DA and primarily block the flow of the organic layer 292 constituting the encapsulation layer 290 . In addition, the first dam 121 is disposed between the display area DA and the pad area PA to prevent the organic film 292 constituting the encapsulation film 290 from invading the pad area PA. 292) can be primarily blocked.

The first dam 121 is preferably formed spaced apart from the region where the organic light emitting device 280 is formed so that the organic layer 292 can sufficiently cover the organic light emitting device 280 formed on the TFT substrate 200 . In addition, the first dam 121 is preferably formed to be spaced apart from components such as the planarization film 250 and the bank 260 made of an organic material vulnerable to the external environment.

As shown in FIG. 5 , the first dam 121 includes a power line 310 supplying a power voltage to each of the pixels P or a first electrode extending from the display area DA and contacting the power line 310 ( 271) can be formed on. The first dam 121 may include a first lower layer 121a. The first lower layer 121a may be formed on the power line 310 or the first electrode 271 .

The first lower layer 121a of the first dam 121 may be formed simultaneously with at least one of the planarization film 250, the bank 260, and the spacer 265 of the pixel P, and the planarization film 250, At least one of the bank 260 and the spacer 265 may be made of the same material. For example, the first lower layer 121a of the first dam 121 may be simultaneously formed of the same material as the planarization film 250 . For another example, the first lower layer 121a of the first dam 121 may be formed of the same material as the bank 260 at the same time. For another example, the first lower layer 121a of the first dam 121 may be formed of the same material as the spacer 265 at the same time. In this case, the first lower layer 121a of the first dam 121 is made of acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. (polyimide resin) or the like.

In FIG. 5 , the first dam 121 is described as including the first lower layer 121a, but is not limited thereto. In another embodiment, the first dam 121 may be formed in a two-layer structure with a lower layer and an upper layer. In another embodiment, the first dam 121 may be formed in a three-layer structure of a lower layer, a middle layer, and an upper layer.

The second dam 122 is formed outside the first dam 121 to secondarily block the organic layer 292 overflowing to the outside of the first dam 121 . Through this, the first dam 121 and the second dam 122 can more effectively block the organic layer 292 from being exposed to the outside of the display device or from invading the pad area PA.

The second dam 122 may be formed on the power line 310 supplying the power voltage to each of the pixels P as shown in FIG. 5 . The second dam 122 may include a second lower layer 122a and a second upper layer 122b. The second lower layer 122a may be formed on the power line 310 and the second upper layer 122b may be formed on the second lower layer 122a.

The second lower layer 122a and the second upper layer 122b of the second dam 122 may be formed simultaneously with at least one of the planarization layer 250, the bank 260, and the spacer 265 of the pixel P, , at least one of the planarization layer 250, the bank 260, and the spacer 265 may be made of the same material. For example, the second lower layer 122a of the second dam 122 may be simultaneously formed of the same material as the planarization film 250 . The second upper layer 122b of the second dam 122 may be formed of the same material as the bank 260 at the same time. In this case, the second lower layer 122a and the second upper layer 122b of the second dam 122 are made of acrylic resin, epoxy resin, phenolic resin, or polyamide resin ( It may be formed of an organic material such as polyamide resin or polyimide resin.

In FIG. 5 , the second dam 122 is described as including a second lower layer 122a and a second upper layer 122b, but is not limited thereto. In another embodiment, the second dam 122 may be formed as a single layer structure as a lower layer. In another embodiment, the second dam 122 may be formed in a three-layer structure of a lower layer, a middle layer, and an upper layer.

In FIG. 5 , the dam 120 is described as including the first dam 121 and the second dam 122, but is not limited thereto. In another embodiment, the dam 120 may include only the first dam 121.

2nd Example

FIG. 6 is a cross-sectional view of a second embodiment along the line II-II′ shown in FIG. 3, and FIG. 7 is a view showing a modified embodiment of FIG.

Referring to FIG. 6 , the display device according to the second embodiment of the present invention includes an organic light emitting element 270, a capping layer 280, an encapsulation film 290, and a dam 120 formed on a TFT substrate 200. and may further include an organic passivation layer 320. Since the organic light emitting element 270, the dam 120, and the organic passivation layer 320 are substantially the same as those shown in FIG. 5, a detailed description thereof will be omitted. Hereinafter, a configuration that is different from the configuration shown in FIG. 5 will be mainly described.

Referring to FIG. 6 , the TFT substrate 200 includes a display area DA in which pixels P are formed and a non-display area NDA surrounding the display area DA. The non-display area NDA includes a pad area PA in which a plurality of pads are formed.

The capping layer 280 is formed on the second electrode 273 . The capping layer 280 according to the second embodiment of the present invention is made of an inorganic material and may include a first pattern 280a, a second pattern 280b, and a third pattern 280c. The first pattern 280a of the capping layer 280 is formed on the organic light emitting diode 270 and is spaced apart from the first dam 121 . At this time, the first pattern 280a of the capping layer 280 is formed to have the same size as the second electrode 273, as shown in FIG. ) can be protected. Although FIG. 6 illustrates that the first pattern 280a of the capping layer 280 has the same size as the second electrode 273, it is not limited thereto. In another embodiment, the first pattern 280a of the capping layer 280 may be formed to have a size smaller than that of the second electrode 273 . The first pattern 280a of the capping layer 280 must be formed in the display area DA so that the light generated in the organic light emitting layer 272 can be efficiently emitted outward, and the first pattern 280a of the capping layer 280 must be formed in the non-display area NDA. does not necessarily have to be formed.

The second pattern 280b of the capping layer 280 is formed to cover the first dam 121 and is spaced apart from the first pattern 280a and the third pattern 280c. The third pattern 280c of the capping layer 280 is formed to cover the second dam 122 and is spaced apart from the second pattern 280b.

In addition, when the organic passivation layer 320 is formed apart from the second dam 122, the capping layer 280 may further include a fourth pattern 280d. The fourth pattern 280d of the capping layer 280 is formed to cover the organic passivation layer 320 and may be spaced apart from the third pattern 280c.

In a conventional display device, the first inorganic film 291 constituting the encapsulation film 290 is formed by contacting the first dam 121 and the second dam 122 . At this time, the first dam 121 and the second dam 122 are made of organic material, and the interfacial adhesion between the first dam 121 and the second dam 122 made of organic material and the first inorganic film 291 Since this is weak, interface lifting may occur. In this case, there is a high possibility that moisture penetrates into the interface between the first inorganic layer 291 and the dam 120 .

To prevent the diffusion of moisture, the display device according to the second embodiment of the present invention includes a second pattern 280b of the capping layer 280 between the first dam 121 and the first inorganic layer 291. and forming the third pattern 280c of the capping layer 280 between the second dam 122 and the first inorganic layer 291.

Specifically, in the display device according to the second embodiment of the present invention, the capping layer 280 is formed between the second dam 122 and the first inorganic layer 291 . In addition, in the display device according to the second embodiment of the present invention, the capping layer 280 directly formed on the second dam 122 is formed in a pattern with a third pattern 280c and spaced apart from the second pattern 280b. , it is possible to prevent moisture penetrating into the third pattern 280c of the capping layer 280 from being diffused into the second pattern 280b.

Also, in the display device according to the second embodiment of the present invention, the capping layer 280 is formed between the first dam 121 and the first inorganic layer 291 . In addition, in the display device according to the second exemplary embodiment of the present invention, the capping layer 280 directly formed on the first dam 121 is patterned as the second pattern 280b and spaced apart from the first pattern 280a. , it is possible to prevent moisture penetrating into the second pattern 280b of the capping layer 280 from being diffused into the first pattern 280c.

In FIG. 6 , the capping layer 280 is described as including a first pattern 280a, a second pattern 280b, and a third pattern 280c, but is not limited thereto. The capping layer 280 may be formed in a pattern on the outermost second dam 122 . Accordingly, in the capping layer 280 , the second pattern 280b may be omitted or the first pattern 280a may be formed to cover not only the organic light emitting device 270 but also the first dam 121 . Even in this case, the first pattern 280a and the third pattern 280c should be spaced apart from each other.

The capping layer 280 is an inorganic film, and includes zinc oxide, titanium oxide, zirconium oxide, niobium oxide, tantalum oxide, and tin oxide. oxide), nickel oxide, silicon nitride, indium nitride, or gallium nitride. The capping layer 280 made of such a material exhibits higher interfacial adhesion between organic materials than the first inorganic film 291 constituting the encapsulation film 290 .

In the display device according to the second embodiment of the present invention, by forming the capping layer 280 between the second dam 122 and the first inorganic film 291, the interfacial adhesion at the second dam 122 can be improved. can Accordingly, the display device according to the second embodiment of the present invention can prevent lifting of the interface at the second dam 122 .

Meanwhile, in FIG. 6 , the capping layer 280 is described as being made of one layer as an inorganic film, but is not limited thereto. In another embodiment, the display device may include a first capping layer 280 and a second capping layer 285 as shown in FIG. 7 . The first capping layer 280 is an inorganic film and is substantially the same as the capping layer 280 shown in FIG. 6 . The second capping layer 285 may be an organic layer. Since the second capping layer 285 is an organic layer, it is preferably covered by the first capping layer 280 which is an inorganic layer. The second capping layer 285 may not be formed on the first dam 121 and the second dam 122 , but may be formed only on the second electrode 273 .

The encapsulation film 290 is formed to cover the organic light emitting diode 270 and the capping layer 280 formed in the display area DA to prevent oxygen or moisture from permeating the organic light emitting diode 270 . In this case, the encapsulation film 290 includes at least one inorganic film and at least one organic film. For example, the encapsulation film 290 may include a first inorganic film 291 , an organic film 292 , and a second inorganic film 293 .

The first inorganic layer 291 may be formed to cover the organic light emitting device 270 , the capping layer 280 and the dam 120 . When the organic passivation layer 320 is formed apart from the second dam 122, the first inorganic layer 291 forms the organic passivation layer 320 as well as the organic light emitting device 270, the capping layer 280 and the dam 120. It can be formed to cover up to.

An organic layer 292 is formed on the first inorganic layer 291 . Since the flow of the organic layer 292 is blocked by the first dam 121 , it is formed inside the first dam 121 . The second inorganic layer 293 is formed to cover the organic layer 292 and the dam 120 . When the organic passivation layer 320 is formed apart from the second dam 122, the second inorganic layer 293 may be formed to cover not only the organic layer 292 and the dam 120 but also the organic passivation layer 320. .

Each of the first and second inorganic layers 291 and 293 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second inorganic layers 291 and 293 may be deposited using a chemical vapor deposition (CVD) technique or an atomic layer deposition (ALD) technique, but are not limited thereto.

The organic layer 292 may be transparent to pass light emitted from the organic light emitting layer 272 . The organic layer 292 may include an organic material capable of passing 99% or more of the light emitted from the organic light emitting layer 272, such as acrylic resin, epoxy resin, phenolic resin, or polyamide. It may be formed of a polyamide resin or a polyimide resin. The organic layer 292 may be formed by vapor deposition using an organic material, printing, or slit coating, but is not limited thereto, and the organic layer 292 may be formed using an ink-jet jet) process.

In FIG. 6 , the dam 120 is described as including the first dam 121 and the second dam 122, but is not limited thereto. In another embodiment, the dam 120 may include only the first dam 121.

3rd Example

FIG. 8 is a cross-sectional view showing a third embodiment along the line II-II′ shown in FIG. 3 .

Referring to FIG. 8 , a display device according to a third embodiment of the present invention includes an organic light emitting element 270, a capping layer 280, an encapsulation film 290, and a dam 120 formed on a TFT substrate 200. and may further include an organic passivation layer 320. Since the dam 120, the encapsulation film 290, and the organic passivation film 320 are substantially the same as those shown in FIG. 6, a detailed description thereof will be omitted. Hereinafter, a configuration that is different from the configuration shown in FIG. 6 will be mainly described.

Referring to FIG. 8 , the TFT substrate 200 includes a display area DA in which pixels P are formed and a non-display area NDA surrounding the display area DA. The non-display area NDA includes a pad area PA in which a plurality of pads are formed.

The organic light emitting device 270 is disposed in the display area DA. The organic light emitting device 270 includes a second electrode 273 , an organic light emitting layer 272 , and a first electrode 271 . The second electrode 273 may be a cathode electrode, and the first electrode 271 may be an anode electrode. An area in which the second electrode 273 , the organic light emitting layer 272 , and the first electrode 271 are stacked may be defined as the light emitting unit EA.

The second electrode 273 is formed on the organic light emitting layer 272 . The second electrode 273 according to the third embodiment of the present invention may include a first pattern 273a, a second pattern 273b, and a third pattern 273c. The first pattern 273a of the second electrode 273 is formed on the organic light emitting layer 272 , the bank 260 and the spacer 265 and is spaced apart from the first dam 121 . The second pattern 273b of the second electrode 273 is formed to cover the first dam 121 and is spaced apart from the first pattern 273a and the third pattern 273c. The third pattern 273c of the second electrode 273 is formed to cover the second dam 122 and is spaced apart from the second pattern 273b.

In addition, when the organic passivation layer 320 is formed apart from the second dam 122, the second electrode 273 may further include a fourth pattern 273d. The fourth pattern 273d of the second electrode 273 may be formed to cover the organic passivation layer 320 and spaced apart from the third pattern 273c.

The capping layer 280 is formed on the second electrode 273 . The capping layer 280 according to the third embodiment of the present invention is made of an inorganic material and may include a first pattern 280a, a second pattern 280b, and a third pattern 280c. The first pattern 280a of the capping layer 280 is formed on the organic light emitting diode 270 and is spaced apart from the first dam 121 . The second pattern 280b of the capping layer 280 is formed to cover the first dam 121 and is spaced apart from the first pattern 280a and the third pattern 280c. The third pattern 280c of the capping layer 280 is formed to cover the second dam 122 and is spaced apart from the second pattern 280b.

In addition, when the organic passivation layer 320 is formed apart from the second dam 122, the capping layer 280 may further include a fourth pattern 280d. The fourth pattern 280d of the capping layer 280 is formed to cover the organic passivation layer 320 and may be spaced apart from the third pattern 280c.

As shown in FIG. 8 , the display device according to the third embodiment of the present invention may be formed such that the capping layer 280 overlaps the second electrode 273 to have the same formation area. In this case, the capping layer 280 and the second electrode 273 may be formed using one mask. That is, manufacturing costs can be reduced.

Meanwhile, in a conventional display device, the first inorganic film 291 constituting the encapsulation film 290 is formed by contacting the first dam 121 and the second dam 122 . At this time, the first dam 121 and the second dam 122 are made of organic material, and the interfacial adhesion between the first dam 121 and the second dam 122 made of organic material and the first inorganic film 291 Since this is weak, interface lifting may occur. In this case, there is a high possibility that moisture penetrates into the interface between the first inorganic layer 291 and the dam 120 .

In order to prevent the diffusion of moisture, the display device according to the third embodiment of the present invention has a second pattern 273b of the second electrode 273 between the first dam 121 and the first inorganic layer 291. and the second pattern 280b of the capping layer 280 is formed, and the third pattern 273c of the second electrode 273 and the capping layer ( 280) to form the third pattern 280c.

Specifically, in the display device according to the third embodiment of the present invention, the second electrode 273 and the capping layer 280 are formed between the second dam 122 and the first inorganic layer 291 . In addition, in the display device according to the third embodiment of the present invention, the second electrode 273 directly formed on the second dam 122 is formed as a third pattern 273c and is spaced apart from the second pattern 273b. , it is possible to prevent moisture penetrating into the third pattern 273c of the second electrode 273 from being diffused into the second pattern 273b.

In addition, in the display device according to the third embodiment of the present invention, the second electrode 273 and the capping layer 280 are formed between the first dam 121 and the first inorganic layer 291 . In addition, the display device according to the third embodiment of the present invention is patterned with the second pattern 273b of the second electrode 273 directly formed on the first dam 121, and is spaced apart from the first pattern 273a. Accordingly, moisture penetrating into the second pattern 273b of the second electrode 273 may be prevented from being diffused into the first pattern 273c.

8 illustrates that the second electrode 273 and the capping layer 280 include first patterns 273a and 280a, second patterns 273b and 280b, and third patterns 273c and 280c. Not limited to this. The second electrode 273 and the capping layer 280 may be patterned on the outermost second dam 122 . Accordingly, in the second electrode 273 and the capping layer 280, the second patterns 273b and 280b may be omitted, or the first patterns 273a and 280a may be applied to the organic light emitting device 270 as well as the first dam 121 ) can be formed to cover up to. Even in this case, the first patterns 273a and 280a and the third patterns 273c and 280c should be spaced apart from each other.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The protection scope of the present invention should be construed by the claims, and all technical ideas within the equivalent range should be interpreted as being included in the scope of the present invention.

100: display device 110: display panel
111: first substrate 112: second substrate
120: dam 140: source drive IC
150: flexible film 160: circuit board
170: timing controller 210: thin film transistor
211: active layer 212: gate electrode
213: source electrode 214: drain electrode
220: capacitor 221: lower electrode
222: upper electrode 230: gate insulating film
240: interlayer insulating film 250: planarization film
260: bank 270: organic light emitting device
271: first electrode 272: organic light emitting layer
273: second electrode 280: capping layer
290: encapsulation film 291: first inorganic film
292 organic layer 293 second inorganic layer

Claims (13)

a substrate including a display area and a non-display area surrounding the display area;
an organic light emitting element disposed in the display area and including a first electrode, an organic light emitting layer, and a second electrode;
a power line disposed on the substrate in the non-display area and supplying a power voltage to the organic light emitting device;
a first dam formed to surround the display area in the non-display area;
a second dam disposed spaced apart from the first dam in an outer direction of the substrate;
a first pattern covering the organic light emitting element, exposing a part of the surface of the first electrode to be spaced apart from the first dam, and including an inorganic material;
a second pattern including the same inorganic material as the first pattern, covering side surfaces and upper surfaces of the first dam, and spaced apart from the second dam to expose an upper surface of the power line;
a third pattern including the same inorganic material as the second pattern and exposing an upper surface of the power line while covering side surfaces and an upper surface of the second dam;
an organic film disposed on the first pattern inside the first dam; and
and an inorganic layer extending from an upper portion of the organic layer and covering exposed surfaces of the second pattern, the third pattern, and the power line. delete According to claim 1,
The display device characterized in that the second pattern and the third pattern are formed by contacting surfaces of the first dam and the second dam, respectively. delete delete According to claim 1,
The display device according to claim 1 , wherein the inorganic layer is formed in one pattern to continuously cover the organic layer, the second pattern, and the third pattern. According to claim 1,
Further comprising a capping layer formed on the organic light emitting device,
The display device according to claim 1 , wherein the first pattern, the second pattern, and the third pattern are the capping layer. According to claim 7,
The capping layer,
a second capping layer disposed on the second electrode and made of an organic material; and
a first capping layer disposed on the second capping layer and made of an inorganic material;
The display device according to claim 1 , wherein the first pattern, the second pattern, and the third pattern are the first capping layer. According to claim 8,
The display device, characterized in that the exposed surface of the second capping layer is covered by the first capping layer. According to claim 7,
The display device according to claim 1 , wherein the second electrode is formed to overlap the capping layer and have the same area. According to claim 1,
The display device further comprises an organic passivation layer formed to cover an edge of the power line. According to claim 11,
and a fourth pattern formed on the organic passivation layer using the same material as the first, second and third patterns. a substrate including a display area and a non-display area surrounding the display area;
a first electrode disposed in the display area;
an organic light emitting layer disposed on the first electrode disposed in the display area;
a power line disposed on the substrate in the non-display area;
a first dam formed to surround the display area in the non-display area;
a second dam disposed spaced apart from the first dam in an outer direction of the substrate;
A first pattern disposed in the display area and disposed on the organic light emitting layer, disposed in the non-display area, and disposed spaced apart from the second dam while covering the upper surface and side surface of the first dam to form an upper surface of the power line a second electrode including a second pattern that exposes the first pattern and includes the same material as the first pattern, and a third pattern that exposes an upper surface of the power line while covering side and upper surfaces of the second dam;
a first pattern of a capping layer disposed in the display area and disposed on the first pattern of the second electrode;
a second pattern of a capping layer disposed in the non-display area and disposed on the second pattern of the second electrode and exposing an upper surface of the power line;
a third pattern of a capping layer disposed on the third pattern of the second electrode and exposing an upper surface of the power line;
a first inorganic layer covering the exposed surfaces of the first to third patterns of the capping layer and the power line;
an organic layer disposed on the first inorganic layer inside the first dam; and
and a second inorganic layer extending from an upper portion of the organic layer and covering the first inorganic layer.

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