KR100699336B1 - Method and apparatus for etching a substrate - Google Patents

Abstract

According to the size of the substrate, it is not necessary to increase the size of the processing tank to such an extent, and to provide an apparatus which does not cause etching defects as in the case of immersion treatment.

Etching liquid toward the surface of the board | substrate W arrange | positioned in the 1st process tank 14, the 1st process tank 14, the support roller 20 which supports and conveys the board | substrate W, and the board | substrate conveyance path. Conveying to support and convey the substrate W, which is disposed in the spray nozzle 22 for discharging the liquid, the second processing tank 28 extending to the first processing tank 14, and the second processing tank 28. A discharge nozzle for supplying etching liquid to the roller 30 and the surface of the substrate W carried out from the first processing tank 14 and carried into the second processing tank 28 to accumulate etching liquid on the entire surface of the substrate W. 32) constitute a device

Substrate, Etching, Immersion, Treatment Tank, Paddle Type

Description

Etching treatment method and etching processing apparatus of a substrate {METHOD AND APPARATUS FOR ETCHING A SUBSTRATE}

BRIEF DESCRIPTION OF THE DRAWINGS It is a typical side view which shows one Embodiment of 1st invention, and shows an Example of schematic structure of the apparatus for etching a substrate.

FIG. 2: is a schematic side view which shows schematic structure of the paddle etching process part in the etching process apparatus which concerns on 1st invention, and shows the other structural example which is shown in FIG.

FIG. 3 is a perspective view of a liquid storage container which is a component of a heating means of a conveying roller in the paddle etching processing unit shown in FIG. 2.

It is a perspective view which shows the other structural example of the heating means of a conveyance roller in a paddle etching process part.

FIG. 5: is a perspective view which shows another structural example to the heating means of a conveyance roller in a paddle etching process part, and shows the conveyance roller in the state which cut | disconnected partially.

FIG. 6 is a schematic side view showing one embodiment of the second invention and showing one example of a schematic configuration of an apparatus for etching a substrate.

It is a front view which shows an example of a structure of the conveyance roller provided in the processing tank of the spray type etching process part which comprises the etching process apparatus shown in FIG.

It is a front view which shows an example of each structure of the conveyance roller and etching liquid supply part provided in the processing tank of the liquid-flow type etching process part which comprises the etching process apparatus shown in FIG.

9 is a partially enlarged cross-sectional view for explaining the operation of the present invention.

10 is a partially enlarged cross-sectional view for explaining the operation of the present invention in the case of etching a metal film made of a laminated film of two or more kinds of metals or alloys on the surface of a glass substrate.

11 is a partially enlarged cross-sectional view for explaining a problem in the conventional immersion etching process.

12-1 is a partially enlarged sectional view showing a substrate on which a metal film formed of a laminated film of two or more kinds of metals or alloys is formed on a surface thereof.

12-2 is a partially enlarged cross-sectional view for explaining a conventional problem in the case of etching the substrate shown in FIG. 12-1 by an immersion method.

<Description of the code>

W board

10, 40 Spray Etch Treatment

100 paddle etching process

14, 44 first treatment tank

20, 30, 50a, 50b, 64, 102, 134 conveying roller

22, 56 spray nozzles

24, 34, 58, 82, 108 etching solution supply pipe

28, 62, 106 second treatment tank

32, 78, 104 discharge nozzle

38 etching solution

42 Liquid Flow Etching Treatment

52 Roller mounting member

76 Etchant supply part

128 Liquid Storage Container

132 Liquid Discharge Nozzles

136 fluid passage

142 Hot Water Supply Pipe

The present invention is an etching process for a substrate in which an etching solution is supplied to the surface of a substrate such as a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a printed circuit board, a semiconductor wafer, and the like to etch a metal film formed on the surface of the substrate in a predetermined pattern. A method and an etching treatment apparatus.

As a method of etching the substrates one by one by supplying the etching liquid to the surface of the substrate, the etching liquid is sprayed onto the surface of the substrate from the spray nozzle while holding the substrate on a spin chuck and rotating the substrate around the vertical axis in the horizontal plane. Is discharged and the etching liquid is discharged toward the surface of the substrate from a plurality of spray nozzles disposed above the substrate transport path while supporting the substrate by a plurality of transport rollers and transporting the substrate in a horizontal direction. And a method of etching the substrate by storing the etching liquid in the processing tank and reciprocating the substrate in a horizontal direction while the substrate is immersed in the etching liquid by a plurality of rollers arranged inside the processing tank.

By the way, when forming a metal wiring pattern on a board | substrate, it is required to etch so that the cross section of a metal wiring may become trapezoid for the purpose of improving the insulation characteristic at the time of forming an insulating film on a metal wiring. For this reason, the board | substrate was etched conventionally by the method of immersing a board | substrate in etching liquid. That is, using the processing apparatus which arrange | positioned several conveyance roller inside the processing tank, and provided the water tank for timely collect | recovering the etching liquid in the processing tank, a processing tank is circulated-supplied from a water tank to a processing tank, In the state which immersed the board | substrate in the etching liquid stored inside, the board | substrate was reciprocated to the horizontal direction by the conveyance roller, and the board | substrate was immersed. (See Japanese Patent Application Publication No. 19767, for example.)

By the way, in recent years, there exists a tendency for a board | substrate to enlarge, for example, when looking at the glass substrate for liquid crystal display devices, the large board | substrate whose length of one side is 2 m is used. In the apparatus for immersing the substrate, the processing tank also needs to be enlarged in order to cope with the increase in the size of the substrate. As the processing tank is enlarged, the amount of the etching solution is significantly increased, and the etching solution is circulated and supplied from the water tank to the processing tank. The pump to do this also needs a large capacity. In addition, the strength of the treatment tank also needs to be increased, and the amount of storing and storing the etchant, which is a dangerous substance, increases in the office, so that there is a problem that its management is cumbersome.

Further, in the conventional method of immersing the substrate, when a part of the metal film is dissolved by the etching solution, fine bubbles of hydrogen generated in the liquid remain on the substrate surface without floating in the liquid direction. When bubbles remain on the surface of the substrate in this manner, since the contact between the metal film and the etchant is prevented by the bubbles in the portion, the metal does not dissolve. As a result, as shown in a partially enlarged cross-sectional view in FIG. 11, there is a problem that the metal film 4 remains on the granularity or the film between the metal wiring patterns 2 of the substrate surface 1. Reference numeral 3 in FIG. 11 denotes a resist film.

In a manufacturing process such as a liquid crystal display device or a plasma display, as shown in FIG. 12-1, a laminated film of two or more kinds of metals or alloys, for example, aluminum (or aluminum alloy), is formed on the surface of the glass substrate 6. Etching a metal film composed of the first metal layer 7 and the second metal layer 8 such as molybdenum and chromium in a predetermined pattern is performed. In this case, in the conventional method of immersing the substrate, as shown in Fig. 12-2, in the second metal layer 8c of the metal film after etching, the sunshade is formed on the first metal layer 7c. It occurs that the unnecessary part of (i) remains. As the cause, since the metal film is formed of a laminated film of two kinds of metals, in the process of immersing the substrate, Mo or Cr, which is a metal in one direction, is immobilized and the second metal layer 8 It can be considered that the etching reaction stops in the middle. As shown in Fig. 12-2, when an emergency unnecessary part is formed in the second metal layer 8c on the first metal layer 7c, the insulating film and the metal are attempted even if the insulating film is subsequently formed on the metal film. There is a problem that voids are generated between the coating and product defects. Reference numeral 9 in FIGS. 12-1 and 12-2 denotes a resist film.

The present invention has been made in view of the above circumstances, and in order to cope with an increase in size of the substrate, it is not necessary to enlarge the processing tank to such an extent, and an etching treatment method of a substrate which does not cause etching defects as in the case of immersion treatment. It is an object of the present invention to provide an etching treatment apparatus capable of providing the method and the method appropriately.

In the invention according to claim 1, an etching solution is supplied to a surface of a substrate to etch a metal film formed on the surface of the substrate in a predetermined pattern, wherein the etching liquid is ejected toward the surface of the substrate, and the metal film is sprayed. After the first step of etching the film mainly in the film thickness direction and the etching by the first step, the etching solution is supplied to the surface of the substrate, and the etching solution is sprayed on the entire surface of the substrate, whereby the metal film is mainly in the direction along the film surface. It has a 2nd process of etching, It is characterized by the above-mentioned.

The invention according to claim 2 is, in the etching treatment method according to claim 1, in the second step, the substrate on which the etching liquid is sprayed on the entire surface is supported and moved by a plurality of conveying rollers arranged in parallel with each other. The conveying rollers are heated to a temperature equivalent to that of the etching liquid sprayed on the substrate.

The invention according to claim 3 is a method of etching a substrate in which an etching solution is supplied to a surface of the substrate to etch a metal film formed on the surface of the substrate in a predetermined pattern, wherein the etching liquid is ejected toward the surface of the substrate, The etching liquid is supplied to the short side of the upper side in the inclination direction of the surface of the substrate supported in the oblique posture after the first step of etching the film mainly in the film thickness direction and the etching by the first step. And a second process of etching the metal film mainly in the direction along the film surface by causing the etching liquid to flow down from the upper short side to the lower short side on the surface of the substrate.

The invention according to claim 4 is the etching treatment method according to any one of claims 1 to 3, wherein the substrate is a glass substrate, and the metal film formed on the surface of the glass substrate is a laminated film of two or more kinds of metals or alloys. The etchant used in the first step and the etchant used in the second step are chemical liquids of the same composition.

In the invention according to claim 5, the etching treatment apparatus for a substrate which supplies an etching solution to a surface of a substrate and etches a metal film formed on the surface of the substrate in a predetermined pattern, comprising: a first processing tank and the first processing tank A substrate conveying means arranged inside the substrate carrying means for supporting and conveying the substrate, a spray nozzle disposed above the substrate carrying path of the substrate carrying means, and spraying etching liquid toward the surface of the substrate conveyed by the substrate carrying means; A second processing tank addressed to the first processing tank, a substrate supporting means disposed in the second processing tank to support the substrate, and carried out from the first processing tank and brought into the second processing tank; And an ejection nozzle for supplying etching liquid to the surface of the substrate supported by the substrate supporting means to spray the etching liquid over the entire surface of the substrate.

The invention according to claim 6 is the etching treatment apparatus according to claim 5, wherein the substrate conveying means is constituted by a plurality of conveying rollers arranged in parallel with each other, and the conveying roller is equivalent to the etching liquid sprayed onto the substrate. It is characterized by including the roller heating means for heating to a temperature.

In the invention according to claim 7, an etching treatment apparatus for a substrate which supplies an etching solution to a surface of a substrate and etches a metal film formed on the surface of the substrate in a predetermined pattern, comprising: a first processing tank and the first processing tank A substrate conveying means disposed in the substrate and supporting and conveying the substrate, a spray nozzle disposed above the substrate conveying path of the substrate conveying means, and spraying etching liquid toward the surface of the substrate conveyed by the substrate conveying means; A second treatment tank that is addressed to the first treatment tank, substrate inclination support means disposed in the second treatment tank, and inclined to support the substrate, and carried out from the first treatment tank to be in the second treatment tank. The etching liquid is supplied to the short side of the upper side in the inclined direction to the surface of the substrate carried in and supported by the substrate tilt support means in an inclined position. Characterized in that with the discharge nozzle to flow down to the lower side short side portions at the upper side of short side portion on the surface of the plate.

In the invention according to claim 8, in the etching apparatus according to any one of claims 5 to 7, the substrate is a glass substrate, and a metal film formed on the surface of the glass substrate is a laminate of two or more kinds of metals or alloys. It is a film | membrane, It is characterized by the etching liquid sprayed toward the surface of a board | substrate from the said spray nozzle, and the etching liquid supplied to the surface of a board | substrate from the said discharge nozzle.

According to the etching process method of the board | substrate which is invention of Claim 1, in a 1st process, a metal film is mainly etched in the film thickness direction by the etching liquid sprayed toward the surface of a board | substrate. That is, as the partial enlarged sectional view is shown in FIG. 9 (a), since the etching liquid 5 is ejected toward the substrate surface 1, the etching rate of the metal film 2a formed on the substrate surface 1 is It becomes larger in the film thickness direction compared with the direction along the film surface. For this reason, the metal film 2a is mainly etched in the film thickness direction, it corrodes to the bottom face, and the board | substrate surface 1 is exposed. Subsequently, in the second step, the metal film is mainly etched in the direction along the film surface in the same manner as when the immersion treatment is performed by the etching liquid sprayed on the entire surface of the substrate. As a result, as shown in FIG. 9B, a partially enlarged cross-sectional view, the metal film 2b is etched to form a trapezoidal cross section. And in this processing method, even if a board | substrate becomes large, it does not need a large processing tank like an immersion process. In this processing method, after the metal film is etched to its bottom by the first step to expose the substrate surface or the etching is carried out to near the bottom, the metal film is subjected to the film by the second step. Since it is etched in the direction, even if bubbles of hydrogen are generated in the second hole, there is no particular problem, and there is no worry that the metal film remains on the granularity or the film between the metal patterns on the substrate surface.

Moreover, in the etching process method of this invention of Claim 4, when a board | substrate is a glass substrate and the metal film formed in the surface of this glass substrate is a laminated film of two or more types of metals or alloys, ie, in FIG. As shown in a partially enlarged cross-sectional view, a laminated film of two or more kinds of metals or alloys, for example, a first metal layer 7 of aluminum (or an aluminum alloy) and a second such as molybdenum or chromium on the surface of the glass substrate 6. In the case of etching the metal film made of the metal layer 8, according to the etching treatment method of the invention according to claim 1, as described above, the first metal layer 7 and the second The metal layer 8 is mainly etched in the film thickness direction, and the etching of the metal layer 8 is performed until the surface of the glass substrate 6 is exposed or near as shown in FIG. 10B. Later, by the second step Since the 1st metal layer 7a and the 2nd metal layer 8a are etched in the direction along a film surface, the needless part of shading form is formed in the 2nd metal layer on a 1st metal layer like the immersion process of a board | substrate. (See Fig. 12-2.) Nothing happened. As shown in Fig. 10C, a partial enlarged cross-sectional view shows that the second metal layer 8b is also well etched together with the first metal layer 7b. The cross section (cross section of the portion to be metal wiring, etc.) of the metal film composed of the first metal layer 7b and the second metal layer 8b becomes trapezoidal as desired. This is because the etching method in the first step is to eject the etching solution toward the surface of the substrate, so that the metal (Mo or Mo alloy such as MoNb, MoNd, etc.) forming the second metal layer 8a is formed. The first metal layer 7a and the second metal layer until the surface of the glass substrate 6 is exposed to or close to it by being able to suppress the passivation and by the first process. In order to etch 8a, in the second step, the first metal layer 7a and the second metal layer 8a are etched in a relatively short time in the direction along the film surface, before the passivation of the metal occurs. It is considered that the etching is finished or the like. Reference numeral 9 in FIGS. 10A to 10C denotes a resist film.

In the etching treatment method of the invention according to claim 2, in the second step, the conveying roller is heated to a temperature equivalent to the etching liquid sprayed on the substrate, so that the temperature of the substrate and the etching liquid is maintained even when the substrate sprayed with liquid comes into contact with the conveying roller. There is no deterioration. Therefore, since the temperature of the substrate becomes uniform over the entire surface and no temperature unevenness occurs, there is no difference in the etching rate in the entire surface of the substrate, and the entire surface of the substrate is etched uniformly. .

According to the etching process method of invention of Claim 3, in a 1st process, a metal film is mainly etched in the film thickness direction by the etching liquid sprayed toward the surface of a board | substrate. That is, as shown in FIG. 9A, since the etching solution 5 is ejected toward the substrate surface 1, the etching rate of the metal film 2a formed on the substrate surface 1 is in the direction along the film surface. It becomes larger in the film thickness direction compared with the above. For this reason, the metal film 2a is etched mainly in the film thickness direction, and it corrodes to the bottom surface, and the board | substrate surface 1 is exposed, or it corrodes to near the bottom surface, and becomes the grade which an extremely thin film remains. Subsequently, in the second step, the metal film is etched mainly in the direction along the film surface, as in the case of the immersion treatment, by the etching liquid flowing down from the upper short side to the lower short side on the surface of the inclined substrate. As a result, as shown in FIG. 9B, the metal film 2b is etched to have a trapezoidal cross section. And in this processing method, even if a board | substrate becomes large, it does not need a large processing tank like an immersion process. In this processing method, after the metal film is etched to its bottom surface in the first step to expose the substrate surface, the metal film is etched in the direction along the film surface by the second step. Even if bubbles are generated, there is no particular problem, and there is no worry that the metal film remains on the granular film or the film between the metal wiring patterns on the substrate surface.

In addition, as in the etching treatment method of the invention according to claim 4, when the substrate is a glass substrate, and the metal film formed on the surface of the glass substrate is a laminated film of two or more kinds of metals or alloys, that is, FIG. As a partial enlarged cross-sectional view is shown in a), the first metal layer 7 of molybdenum or molybdenum niobium and a laminated film of two or more kinds of metals or alloys, such as aluminum (or aluminum alloy), are formed on the surface of the glass substrate 6. When etching the metal film which consists of 2nd metal layers 8, such as (Nb) and molybdenum alloys, such as molybdenum neodium (Nd), according to the etching process method of this invention, Claim 1 mentioned above As in the etching treatment method of the invention according to the above item, as in the case where the substrate is immersed, it is not necessary that the undesired portion of the shade shape is formed in the second metal layer on the first metal layer (see Fig. 12-2). 10 As shown in (c) of the partially enlarged cross-sectional view, the second metal layer 8b is also well etched together with the first metal layer 7b so that the first metal layer 7b and the second metal layer 8b are well etched. The cross section of the metal film (cross section of the portion to be a metal wiring or the like) consisting of) becomes trapezoidal as desired.

In the etching processing apparatus of the board | substrate of this invention of Claim 5, in a 1st process tank, a metal film is mainly in a film thickness direction by the etching liquid sprayed from a spray nozzle toward the surface of the board | substrate conveyed by a board | substrate conveying means. Is etched. Subsequently, in the second processing tank, the etching liquid is supplied from the discharge nozzle to the surface of the substrate supported by the substrate supporting means, the etching liquid is accumulated on the entire surface of the substrate, and is immersed by the etching liquid accumulated on the entire surface of the substrate. As is the case, the metal film is mainly etched in the direction along the film surface.

In the etching process apparatus of Claim 6, since a conveyance roller is heated by the roller heating means at the temperature equivalent to the etching liquid sprayed on the board | substrate in a 2nd process tank, even if the board | substrate with which liquid accumulated contacted a conveyance roller, The temperature of the substrate and the etchant is not lowered. Therefore, the temperature of the substrate becomes uniform over the entire surface, and temperature unevenness does not occur. Therefore, no difference is caused in the etching rate over the entire surface of the substrate, and the entire surface of the substrate is etched uniformly.

In the etching processing apparatus of the board | substrate of this invention of Claim 7, in a 1st process tank, a metal film is mainly in a film thickness direction by the etching liquid sprayed from a spray nozzle toward the surface of the board | substrate conveyed by a board | substrate conveying means. Is etched. Subsequently, in the second processing tank, the etching liquid is supplied from the discharge nozzle to the short side of the upper surface in the inclined direction of the surface of the substrate supported by the substrate inclined support means, and thus on the surface of the substrate. The etching liquid flows from the upper short side portion to the lower short side portion, and the metal film is mainly etched in the direction along the film surface, as in the immersion process, by the etching liquid flowing down on the surface of the substrate.

In the etching apparatus of Claim 8, each layer of the 2 or more types of metal or alloy which comprise the laminated film formed on the glass substrate is etched favorably, and the cross section of the laminated film (section of a part used as metal wiring etc.) is desired. It becomes trapezoidal.

Best Mode for Carrying Out the Invention The best embodiment of this invention will be described below with reference to Figs.

FIG. 1: is a typical side view which shows one Embodiment of 1st invention and shows one Example of the schematic structure of the apparatus of the etching process of a board | substrate. This etching process apparatus is comprised by extending the spray type etching process part 10 and the paddle etching process part 12. As shown in FIG.

The spray etching process part 10 is equipped with the sealed 1st process tank 14 which has the carry-in opening 16 and the carry-out opening 18. In the inside of the 1st processing tank 14, several conveyance rollers 20 which can carry out the forward and reverse rotation which support the board | substrate W and convey in a horizontal direction are arrange | positioned in parallel with each other along the board | substrate conveyance path. By the conveyance rollers 20, the substrate W can be reciprocated in the processing tank 14. In addition, a plurality of spray nozzles 22 are arranged along the substrate transport path above the substrate transport path. The etching liquid supply pipe 24 is connected to these spray nozzles 22, and the etching liquid supply pipe 24 is connected by the flow path to the etching liquid supply apparatus which is not shown in figure. And the etching liquid, for example, the mixed liquid of phosphoric acid, nitric acid, and acetic acid, is sprayed from the spray nozzle 22 toward the surface of the board | substrate W conveyed by the conveyance roller 20. As shown in FIG. In addition, the drain pipe 26 is connected to the bottom of the processing tank 10 so that the used etching liquid is collected at the bottom of the processing tank 14 and discharged from the processing tank 14 through the drain pipe 26. It is.

The paddle etching process part 12 is equipped with the 2nd process tank 28 arrange | positioned adjacent to the 1st process tank 14. In the inside of the 2nd processing tank 28, the several forward and reverse rotational conveyance rollers 30 which support the board | substrate W and convey in a horizontal direction are arrange | positioned along the board | substrate conveyance path in parallel with each other. The conveyance rollers 30 allow the substrate W to reciprocate in the processing tank 28. Moreover, the discharge nozzle 32 in which the slit-shaped discharge port was formed in the lower end surface in the vicinity of the loading opening which opposes the carrying-out opening 18 of the 1st process tank 14 in the position just above the board | substrate conveyance path. This is excreted. An etching liquid supply pipe 34 is connected to the discharge nozzle 32, and the etching liquid supply pipe 34 is connected to an etching liquid supply device (not shown) in a flow path. Then, the substrate W, which is supported by the conveying roller 30 which can be carried in the second processing tank 28 from the slit-shaped discharge port of the discharge nozzle 32 and passes directly under the discharge nozzle 32, is provided. An etching liquid, for example, a mixed liquid of phosphoric acid, nitric acid and acetic acid having the same composition as the etching liquid used in the spray etching processing unit 10 is discharged in the form of a curtain, and the etching liquid 38 is accumulated on the entire surface of the substrate W. In addition, the drain pipe 36 is connected to the bottom of the processing tank 28, and the etching liquid which flows down from the inside of the processing tank 28 to the bottom of the processing tank 28 is connected to the drain pipe 36 from the processing tank 28. It is being discharged through.

In the etching processing apparatus having the structure shown in FIG. 1, first, the substrate W is reciprocated in the horizontal direction by the conveying roller 20 in the first processing tank 14 of the spray type etching processing unit 10. By moving the etching liquid toward the surface of the substrate W from the spray nozzle 22 while moving, the metal film formed on the surface of the substrate W is mainly etched in the film thickness direction in the etching liquid. Then, the portion of the metal film not covered with the resist film is deeply etched to the bottom of the metal film so that the surface of the substrate is completely exposed (see FIGS. 9A and 10B). The board | substrate W is carried out from the 1st process tank 14 through the carry-out side opening 18, and is conveyed to the paddle-type etching process part 12. FIG.

When the substrate W is loaded into the second processing tank 28 of the paddle etching treatment unit 12, the etching liquid is supplied from the discharge nozzle 32 to the surface of the substrate W, and the etching liquid 38 is applied to the entire surface of the substrate W. Stacked up. And the board | substrate W is immersed by the etching liquid sprayed on the whole surface of the board | substrate W, while being reciprocally moved in the 2nd process tank 28 by the conveyance roller 30 in the state containing liquid. As in the case of treatment, the metal film is mainly etched in the direction along the film surface. As a result, the portion of the metal film covered with the resist film is etched to have a trapezoidal cross section (see FIGS. 9B and 10C). When the etching process in the paddle etching process part 12 is complete | finished, the board | substrate W is carried out from the 2nd process tank 28, and is conveyed to the next water washing process part (not shown).

FIG. 2: is a schematic side view which shows schematic structure of a paddle etching process part, and is a figure which shows the structural example different from the thing of the said embodiment. The paddle etching processing unit 100 includes a plurality of conveying rollers 102 arranged along the substrate conveying path in parallel with each other, and the substrates W are supported by the plurality of conveying rollers 102 to linearly It is reciprocating (swinging in the horizontal plane). At one end side of the substrate conveying path, a discharge nozzle 104 is formed in which a slit-shaped discharge port is formed at a lower end surface at a position immediately above the substrate conveying path. Further, below the substrate transport path, a liquid recovery tank (second processing tank) 106 for collecting the etching liquid is disposed.

The etching liquid supply pipe 108 is connected to the discharge nozzle 104, and the etching liquid supply pipe 108 is connected to the liquid storage tank 112 in which the etching liquid 110 was stored in a flow path. In the etching liquid supply pipe 108, a pump for feeding liquid 114 is inserted between the filters, and a filter 116 and an opening / closing control valve 118 are inserted therebetween. Then, by opening and closing the control valve 118, the etching liquid 110 is supplied from the liquid storage tank 112 to the discharge nozzle 104 by the liquid feeding pump 114 through the etching liquid supply pipe 108, and discharged. The etching liquid is discharged in a curtain form from the slit discharge port of the nozzle 104, and the etching liquid is accumulated on the entire surface of the substrate W passing directly under the discharge nozzle 104. In addition, the recovery pipe 120 is connected to the bottom of the liquid recovery tank 106, and the tip outlet of the recovery pipe 120 is disposed in the liquid storage tank 112.

The liquid storage tank 112 is provided with a liquid circulation pipe 122 in which one end of the inlet is connected to the bottom thereof and the other end of the inlet is disposed in the liquid storage tank 112. The liquid circulation pump 124 is inserted in this liquid circulation piping 122, and the heater 126 is inserted. And by circulating the etching liquid 110 stored in the liquid storage tank 112 through the liquid circulation piping 122, the etching liquid is heated when it distribute | circulates the inside of the heater 126, and is a controller (not shown). By controlling the heater 126 by using &lt; RTI ID = 0.0 &gt;), the temperature of the etchant 110 in the liquid reservoir 112 is controlled to a constant temperature, e. In addition, the means for adjusting and holding the etching liquid 110 in the liquid reservoir 112 at a constant temperature is not limited to that of the illustrated example.

Each of the conveying rollers 102 is rotatable in the forward and reverse directions, and is always rotated during the processing of the substrate except for a small time during the loading of the substrate and the inversion of the substrate. Just below each conveyance roller 102, the liquid storage container 128 is each arrange | positioned. Branching pipes 130 branched from the etching liquid supply pipe 108 to the filter 116 and the opening / closing control valve 118 are connected to each of the liquid storage containers 128, respectively. During the processing of the substrate, the etching liquid adjusted to a constant temperature from the liquid reservoir 112 is continuously supplied to each of the liquid storage containers 128 through the etching liquid supply pipe 108 and the branch pipe 130, respectively. The etching liquid overflows from the liquid storage container 128, respectively. The etching liquid overflowed from the liquid storage container 128 flows into the liquid recovery tank 106 and is returned to the liquid storage tank 112 through the recovery pipe 120 in the liquid recovery tank 106.

As shown in FIG. 3, the liquid storage container 128 has a shape and a size such that a part of the main surface of the conveying roller 102 is immersed over its entire length in the etching liquid stored therein. Have In addition, although the liquid storage container 128 is provided for every conveyance roller 102 in the apparatus of an example of illustration, a large scale liquid storage container is provided for each of several conveyance rollers 102, and it is stored in one liquid storage container. The plurality of conveying rollers 102 may be immersed in the etched liquid, and a large liquid storage container may be provided to immerse all the conveying rollers 102 in the etching liquid stored in one liquid storage container. .

When the paddle etching processing unit 100 is configured as shown in FIG. 2, a part of the peripheral surface of each conveying roller 102 is immersed in the etching liquid at a constant temperature stored in each liquid storage container 128, respectively. At the same time, each conveying roller 102 is always rotated in that state, so that the entire main surface of each conveying roller 102 is warmed to the same temperature as the etching liquid sprayed on the substrate W, respectively. For this reason, even if the board | substrate W in which the liquid was accumulated contacted with the conveyance roller 102, the temperature of the etching liquid sprayed on the board | substrate W and the whole surface does not fall. Therefore, the temperature of the board | substrate W becomes uniform over the whole surface, Since temperature nonuniformity does not generate | occur | produce, an etching rate becomes uniform over the whole surface of the board | substrate W, and there exists no fear of a process nonuniformity.

Next, FIG. 4 is a perspective view which shows the other structural example for heating the conveyance roller 102. As shown in FIG. In this example, the liquid discharge nozzle 132 in which the discharge path is arrange | positioned in the vicinity of the conveyance roller 102 is provided. And the branch pipe 130 branched from the etching liquid supply pipe 108 is connected to the liquid discharge nozzle 132 without providing the liquid storage container 128.

In the apparatus having such a configuration, the etching liquid adjusted to a constant temperature is supplied to the liquid discharge nozzle 132, and the constant temperature is applied to the peripheral surface of the conveying roller 102 which is constantly rotating from the discharge port of the liquid discharge nozzle 132. By discharging the etchant, the entire main surface of the conveying roller 102 is heated to a temperature equivalent to the etchant accumulated on the substrate W. For this reason, even if the board | substrate W containing liquid contacts the conveyance roller 102, the temperature of the etching liquid accumulated on the board | substrate W and the whole surface will not fall, and the temperature of the board | substrate W will become uniform over the whole surface. Therefore, the etching rate becomes uniform over the entire surface of the substrate W, and the occurrence of processing unevenness is prevented. In addition, the etching liquid discharged from the liquid discharge nozzle 132 to the main surface of the conveying roller 102 and vertically separated from the circumferential surface of the conveying roller 102 flows into the liquid recovery tank 106 and is discharged from the liquid recovery tank 106. It is returned to the liquid reservoir 112 through the recovery pipe 120.

5 is a perspective view which shows another structural example for heating the conveyance roller of a paddle etching process part, and shows a conveyance roller in a partly cut | disconnected state. This conveying roller 134 has a liquid passage 136 formed therein. Further, a liquid passage (not shown) communicating with the liquid passage 136 is also formed in the shaft center portions of the left and right rotation shafts 138a and 138b of the transfer roller 134, respectively. The rotary shaft 138a in one direction is connected to the rotary joint 140a, and the liquid passage of the rotary shaft 138a is supplied with a heating liquid such as hot water through the rotary joint 140a. It is connected to the hot water supply pipe 142 connected to when the flow path. The rotary shaft 138b in the other direction is connected to the rotary joint 140b, and the liquid passage of the rotary shaft 138b is connected to the drain pipe 144 via a rotary joint 140b as a flow path. 144 is connected to the hot water supply device by a flow path.

In the substrate processing apparatus provided with the conveyance roller 134 of such a structure, the hot water adjusted to a predetermined temperature, for example, 40 degreeC from the hot water supply apparatus, the liquid inside the conveyance roller 134 via the hot water supply pipe 142. As the hot water flows into the passage 136 and the hot water flows into the liquid passage 136, the entirety of the conveyance roller 134 is heated to a temperature equivalent to the etching liquid sprayed on the substrate W. The hot water whose temperature has decreased due to heat exchange while flowing in the liquid passage 136 is discharged from the liquid passage 136, returned to the hot water supply device through the drain pipe 144, and warmed to be used for circulation. . Thus, when the conveyance roller 134 is heated from the inside, even if the board | substrate W containing liquid contacts the conveyance roller 134, the temperature of the etching liquid accumulated on the board | substrate W and the whole surface will not fall, and a board | substrate The temperature of W becomes uniform across the entire surface. Therefore, the etching rate becomes uniform over the entire surface of the substrate W, and processing nonuniformity does not occur.

In addition, the means for heating a conveyance roller is not limited to the thing of the structure shown in FIGS. For example, the structure which heats a conveyance roller directly with a rubber heater etc. may be sufficient.

Next, FIG. 6: is a typical side view which shows one Embodiment of 2nd invention and shows an example of schematic structure of the etching processing apparatus of a board | substrate. This etching processing apparatus is comprised by extending the spray type etching process part 40 and the liquid flow type etching process part 42. As shown in FIG.

The spray etching processing unit 40, like the spray etching processing unit 10 shown in FIG. 1, uses the sealed first processing tank 44 having the carry-in opening 46 and the carry-out opening 48. Equipped. In the inside of the 1st processing tank 44, several conveyance rollers 50a and 50b which enable the forward and reverse rotation which support the board | substrate W and convey in a horizontal direction are arranged along the board | substrate conveyance path in parallel with each other, have. By these conveying rollers 50a and 50b, the substrate W is supported in a horizontal position to reciprocate in the processing tank 44. Moreover, the some conveyance roller 50b near the carrying-out opening 48 is condensed to the left and right pair of roller attachment members 52, respectively. As shown in the front view in FIG. 7, the roller mounting member 52 passes through the point O on the extension line of the rotation shaft 54 of the conveying roller 50b and is straight in parallel with the substrate conveying direction (FIG. 7). Among them, only a predetermined angle (generating angle between the dashed-dotted lines A and A ') is provided in a vertical direction by a driving device (not shown) centering on a straight line perpendicular to the ground passing through the point 0. Thus, by providing the mechanism which can rotate the conveyance roller 50b suitably, in the 1st process tank 44, the board | substrate W is changed from a horizontal posture to an inclined posture, and the board | substrate W is inclined 1st. It is possible to carry out from inside the process tank 44 of this.

Further, a plurality of spray nozzles 56 are arranged along the substrate transport path above the substrate transport path. An etching liquid supply pipe 58 is connected to this spray nozzle 56 in a communication manner, and the etching liquid supply pipe 58 is connected to an etching liquid supply device (not shown) in a flow path. And the etching liquid is sprayed from the spray nozzle 56 toward the surface of the board | substrate W supported by a horizontal posture by the conveyance roller 50a, 50b, and conveyed. In addition, the drain pipe 60 is connected to the bottom of the processing tank 44, and the used etchant is collected at the bottom of the processing tank 44 and is discharged from the processing tank 44 through the drain tube 60. It is going to be exhausted.

The liquid flow type etching treatment unit 42 includes a second processing tank 62 disposed adjacent to the first processing tank 44. In the inside of the 2nd process tank 62, several conveyance rollers 64 which can carry out the reverse rotation which support the board | substrate W and convey in a horizontal direction are arrange | positioned parallel to each other along the board | substrate conveyance path. The conveyance roller 64 has the roller shaft 66, for example, as shown in the figure seen from the front in FIG. 8, and the roller shaft 66 inclines with respect to a horizontal plane, for example, 5 degrees-20 degrees with respect to a horizontal plane. It is inclined and supported by rotation freedom (material), as it produces the angle of degrees. (The support mechanism is not shown.) The center roller 68 is fixed to the center part by the roller shaft 66, and the side roller is attached to both ends. The 70 is fixed to each other. Further, the blade portions 72 and 74 are fixed to the roller shaft 66 on the outer side of each side roller 70, respectively. And the board | substrate W is supported by the rollers 68 and 70, respectively, and it keeps in the inclined posture, and it connects the lower side stage valve part to the lower blade part 72 of a lower side, and it slips off. Do not By the several conveyance roller 64 which has such a structure, the board | substrate W is supported by the inclined posture, and can reciprocate in the process tank 62. FIG.

Moreover, the etching liquid supply part 76 is arrange | positioned above the board | substrate conveyance path over the substantially full length of the processing tank 62 in the direction according to a board | substrate conveyance direction. The etching liquid supply part 76 is arrange | positioned in the position just above the step valve part of the upper side in the inclination direction of the surface of the board | substrate W supported by the conveyance roller 64 in the inclined attitude | position. The etching liquid supply part 76 includes, for example, a discharge nozzle 78 in the form of a pipe, and a liquid receiving plate 80 disposed parallel to it, directly below the discharge nozzle 78, as shown in FIG. Consists of. In the discharge nozzle 78, a plurality of discharge ports are equally divided in the longitudinal direction on the lower surface side. The etching liquid supply pipe 82 is connected to this discharge nozzle 78 in communication, and the etching liquid supply pipe 82 is connected to the etching liquid supply apparatus which is not shown in the flow path. In the etching liquid supply part 76 of such a structure, The etching liquid discharged on the liquid receiving plate 80 from the plurality of discharge ports of the discharge nozzle 78 can be evenly spread in the direction along the upper side short side of the substrate W while flowing down the liquid receiving plate 80. Then, it flows down from the liquid receiving plate 80 to the upper side short side part of the board | substrate W. Then, as shown in FIG. And the etching liquid supplied to the upper side short side part of the board | substrate W flows on the surface of the board | substrate W from the upper side short side part to the lower side short side part, and the surface of the board | substrate W is etched between them.

In addition, the drain pipe 84 is connected to the bottom part of the processing tank 62, and the etching liquid which flows from the inside of the processing tank 62 to the inner bottom part of the processing tank 62 carries out the drain pipe 84 from the inside of the processing tank 62. It is being discharged through.

As an etching processing apparatus having the structure shown in FIG. 6, first, in the first processing tank 44 of the spray type etching processing unit 40, it is formed on the surface of the substrate W like the apparatus shown in FIG. 1. The metal film is etched mainly in the film thickness direction with the etching solution. When the etching process in the 1st processing tank 44 is complete | finished, after the attitude | position is changed from the horizontal posture to the inclined posture by the conveyance roller 50b, the board | substrate W is removed from the 1st processing tank 44. FIG. It is carried out through the carrying-out opening 48, and is conveyed to the liquid flow type etching process part 42.

When the substrate W is brought into the second processing tank 62 of the liquid flow etching treatment part 42, the etching liquid supply part 76 is supported by the conveying roller 64 while supporting the substrate W in an inclined position and reciprocating in the horizontal direction. ) Is supplied to the short side of the upper surface of the surface of the substrate W in the oblique direction. As a result, the etching liquid flows from the upper short side portion to the lower short side portion on the surface of the substrate W, and the etching solution flows on the surface of the substrate W, so that the metal film mainly depends on the film surface as in the case of immersion treatment. Is called in the direction. When the etching process in the fluid etching process part 42 is complete | finished, the board | substrate W is carried out from the 2nd process tank 62, and is conveyed to the next water washing process part (not shown).

In addition, in the embodiment shown in FIG. 6, in the 1st process tank 44 of the spray type etching process part 40, etching liquid is applied to the surface of the board | substrate W, supporting the board | substrate W in a horizontal position, and reciprocating in a horizontal direction. The substrate W is changed from the horizontal posture to the inclined posture, and the substrate is taken out from the first processing tank 44, and the substrate W is inclined to the liquid flow etching processing section 42. In the first processing tank 44 of the spray type etching treatment unit 40, the etching solution is sprayed onto the surface of the substrate W while supporting the substrate W in an inclined position and reciprocating in the horizontal direction. The process may be carried out, and the board | substrate W may be unloaded from the inside of the 1st process tank 44 in the inclined attitude | position, and conveyed to the liquid flow type etching process part 42 may be sufficient. In addition, the structure of the conveyance roller 64 which supports and conveys the board | substrate W in the inclined attitude | position in the 2nd process tank 62 of the liquid flow type etching process part 42, and the difference of the surface of the board | substrate W supported by the inclined attitude | position The structure of the etching liquid supply part 76 which supplies an etching liquid to a side short side is not limited to the thing of an example of illustration. For example, instead of the pipe-shaped discharge nozzle 78 and the liquid receiving plate 80, a nozzle having a discharge port of a long slit shape perpendicular to the ground of FIG. 8 is used, and the liquid is discharged in the form of a curtain to form the substrate W. FIG. It is good also as a structure for supplying to the upper side short side of this, What is necessary is just to supply liquid so that a liquid may flow in a laminar flow form with respect to a board | substrate.

1 and 6, the etching treatment is performed while the substrate W is reciprocated (swayed) in the respective treatment tanks 14, 28, 44, and 62, respectively. However, this invention is applicable also to the apparatus of the structure which is etched, conveying continuously to one direction toward the board | substrate W. As shown in FIG.

According to the etching process method of the board | substrate of each invention of Claim 1 and Claim 3, even if a board | substrate enlarges, it is not necessary to enlarge a process tank to that extent, for this reason, the increase of the usage-amount of etching liquid can be suppressed, and a large capacity It is not necessary to use a pump or to increase the strength of the treatment tank, and the management of the etching liquid which is a dangerous substance is not so troublesome. In addition, as in the case of the immersion treatment, a metal film of granular or film form on the surface of the substrate, between metal wiring patterns, or the like, or the substrate is a glass substrate, as in the etching treatment method of the invention according to claim 4, and the glass In the case where the metal film formed on the surface of the substrate is a laminated film of two or more kinds of metals or alloys, there is no occurrence of an etching failure in which an undesired portion is formed in the upper metal layer.

In the etching treatment method of the invention according to claim 2, in the second step, the temperature of the substrate can be kept uniform over the entire surface, and therefore, the entire surface of the substrate can be uniformly treated.

When the etching treatment apparatus of the substrate of each invention of Claim 5 and Claim 7 is used, the method of each invention of Claim 1 and Claim 3 can be performed suitably, and the said effect can be acquired.

In the etching apparatus of the invention according to claim 6, in the second processing tank, the temperature of the substrate can be kept uniform over the entire surface, and therefore, the entire surface of the substrate can be etched uniformly.

In the etching apparatus of the eighth aspect of the present invention, the cross-section (cross-section of a portion to be a metal wiring) of two or more kinds of metals or alloys formed on a glass substrate can be trapezoidal as desired.

Claims (8)

In the etching processing method of the board | substrate which supplies an etching liquid to the surface of a board | substrate, and etches the metal film formed in the surface of a board | substrate in a predetermined pattern, A first step of ejecting the etchant toward the surface of the substrate and etching the metal film in the film thickness direction; After the etching according to the first step, the etching solution is supplied to the surface of the substrate, the etching liquid is accumulated on the entire surface of the substrate, and the second process of etching the metal film in the direction along the surface is more than the film thickness direction. The etching process method of the board | substrate characterized by the above-mentioned. The method of claim 1, In said 2nd process, the board | substrate which supports and moves the board | substrate with which the etching liquid was accumulated on the whole surface by the several conveyance roller arranged in parallel, and heats the said conveying roller to the temperature equivalent to the etching liquid accumulated on the said board | substrate. Etching treatment method. In the etching processing method of the substrate which supplies an etching liquid to the surface of a board | substrate, and etching the metal film formed in the surface of a board | substrate in a predetermined pattern, A first step of ejecting the etchant toward the surface of the substrate and etching the metal film in the film thickness direction; After etching by the first process, the etching liquid is supplied to the short side of the upper side of the surface of the substrate supported in the inclined attitude in the inclined direction, and the etching liquid is lowered from the upper short side to the surface of the substrate. And a second step of causing the metal film to flow down to the short side and etching the metal film in a direction along the surface thereof more than the film thickness direction. The method according to any one of claims 1 to 3, The substrate is a glass substrate, the metal film formed on the surface of the glass substrate is a laminated film of two or more kinds of metals or alloys, and the etching solution used in the first step and the etching solution used in the second step have the same composition. The etching process method of the board | substrate which is a chemical liquid. In the etching processing apparatus of the board | substrate which supplies an etching liquid to the surface of a board | substrate, and etches the metal film formed in the surface of a board | substrate in a predetermined pattern, A first treatment tank; Substrate transport means disposed in the first processing tank to support and transport the substrate; A spray nozzle disposed above the substrate transport path of the substrate transport means, and spraying the etching liquid toward the surface of the substrate conveyed by the substrate transport means; A second treatment tank addressed to the first treatment tank; Substrate supporting means disposed in the second processing tank and supporting the substrate; And a discharge nozzle for supplying etching liquid to the surface of the substrate carried out from the first processing tank and brought into the second processing tank and supported by the substrate supporting means, thereby stacking the etching liquid on the entire surface of the substrate. An apparatus for etching processing of a substrate. The method of claim 5, An apparatus for etching a substrate, the substrate carrying means comprising a plurality of conveying rollers arranged in parallel with each other, wherein the conveying rollers are heated to a temperature equivalent to that of the etching liquid accumulated on the substrate. In the etching processing apparatus of the board | substrate which supplies an etching liquid to the surface of a board | substrate, and etches the metal film formed in the surface of a board | substrate in a predetermined pattern, A first treatment tank; Substrate transport means disposed in the first processing tank to support and transport the substrate; A spray nozzle disposed above the substrate transport path of the substrate transport means, and spraying the etching liquid toward the surface of the substrate conveyed by the substrate transport means; A second treatment tank addressed to the first treatment tank; Substrate inclination support means disposed in the second processing tank to support the substrate by tilting it; Etching liquid is supplied to the short side of the upper side in the inclination direction of the surface of the board | substrate carried out from the said 1st processing tank, carried in the said 2nd processing tank, and supported by the said substrate inclination support means in the inclined attitude | position. And an ejection nozzle for causing the etching liquid to flow from the upper short side to the lower short side on the surface of the substrate. The method according to any one of claims 5 to 7, The substrate is a glass substrate, and the metal film formed on the surface of the glass substrate is a laminated film of two or more kinds of metals or alloys, and is supplied to the surface of the substrate from the etching liquid and the discharge nozzle ejected from the spray nozzle toward the surface of the substrate. The etching process apparatus of the board | substrate whose etching liquid is a chemical liquid of the same composition.

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