JP3489992B2 - Substrate processing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for processing substrates such as glass substrates for liquid crystal displays, glass substrates for color filters, substrates for photomasks, ceramic substrates for thermal heads, printed boards and semiconductor wafers. In particular, the present invention relates to a substrate processing apparatus having a processing chamber that accommodates a substrate therein and processes the substrate with a processing liquid.

[0002]

2. Description of the Related Art As a device for processing a substrate with a processing liquid such as an etching liquid or a developing liquid, the substrate is housed in a processing chamber, and a processing liquid is sprayed from a spray nozzle onto a stopped or transported substrate. There is an apparatus for processing a substrate by injecting. In this apparatus, after the substrate is stored in the processing chamber and the processing liquid is supplied to the substrate for a predetermined period of time to perform the substrate processing, the processing liquid injection from the spray nozzle is stopped and the processed substrate is processed from the processing chamber. The next new board is carried in. When the processing liquid is sprayed from the spray nozzle, the mist of the processing liquid is scattered in the processing chamber, so that the substrate processing is performed with the substrate loading / unloading opening of the processing chamber closed.

In the substrate treatment with the treatment liquid as described above, the timing of starting the treatment is extremely important, and if it becomes non-uniform, unevenness of treatment occurs on the substrate surface. However, in the above-mentioned device, when the valve is closed to stop the injection of the processing liquid from the spray nozzle and the next new substrate is being carried in, it remains in the pipe between the spray nozzle and the valve. The processing liquid in the form of droplets drops on the substrate being loaded. When the droplets of the processing liquid drop onto the substrate before the processing liquid is ejected from the spray nozzles in this manner, large processing unevenness occurs on the processed substrate.

In order to suppress the processing unevenness of the substrate, when the substrate is loaded into the processing chamber, before the injection of the processing liquid from the spray nozzle, the slit is extended in the direction orthogonal to the substrate transport direction, and the substrate is previously processed. There is an apparatus provided with an inlet liquid curtain that blows out the processing liquid in layers. In this way, if the processing liquid is uniformly deposited on the substrate when the substrate is carried in, even if a droplet of the processing liquid drops from the spray nozzle, a large processing unevenness does not occur on the substrate.

[0005]

However, when the processing liquid is preliminarily deposited on the substrate by the inlet liquid curtain, large processing unevenness due to the drop of the processing liquid droplets from the spray nozzle can be suppressed, but until the completion of loading. For a long time, the same processing liquid remains in a state where the fresh processing liquid is not supplied onto the substrate, resulting in uneven processing. This may be due to the non-uniformity of the surface condition of the substrate or the uncertainty of the behavior of the processing liquid, but in any case, the same processing liquid remaining on the substrate for a long time leads to uneven processing. .

As a method of solving this, it is possible to inject the processing liquid from the spray nozzle in addition to blowing the processing liquid through the inlet liquid curtain at the time of loading the substrate. In this case, the loading opening of the processing chamber is set. Since the processing liquid is sprayed from the spray nozzle in the opened state, the mist of the processing liquid may be scattered outside the processing chamber. If the mist of the processing liquid is scattered outside the processing chamber, it may contaminate the inside of the clean room in which the device is installed or adversely affect other devices.

An object of the present invention is to provide a substrate processing apparatus which supplies a processing liquid to a substrate in a processing chamber to process the substrate, and which has less unevenness in processing of the processed substrate.

[0008]

A substrate processing apparatus according to a first aspect includes a processing chamber, a transfer means, a first processing liquid supply means, and a second processing liquid supply means. The processing chamber is a chamber for accommodating a substrate therein, in which the substrate is processed with a processing liquid. The transfer means carries the substrate in and out of the processing chamber. The first processing liquid supply means is provided in the processing chamber and extends in a direction intersecting the substrate transport direction. The second processing liquid supply means is provided inside the processing chamber and extends in the direction along the substrate transport direction. Both of the first and second processing liquid supply means supply the processing liquid to the substrate carried into the processing chamber. Then, in this substrate processing apparatus, the flow of the processing liquid supplied from the first processing liquid supply unit (hereinafter referred to as the first processing liquid flow) and the flow of the processing liquid supplied from the second processing liquid supply unit ( Less than,
This is called the second processing liquid flow. And) on the substrate that is loaded into the processing chamber. And
Furthermore, the first and second processing liquid supply means are processing chambers.
For the substrate that is loaded into the board, the processing liquid is
Flow out diagonally.

Here, a second processing liquid supply means is provided in addition to the conventionally installed first processing liquid supply means, and the first processing liquid flow and the second processing liquid flow are provided on the upper surface of the substrate being loaded. And exchange. Therefore, on the substrate that is carried in, the phenomenon that the processing liquid piled up on the substrate by the first processing liquid flow is caused to flow by the second processing liquid flow and the same processing liquid remains on the substrate is reduced. As a result, it is possible to prevent uneven processing from occurring on the processed substrate.

The first and second processing liquid supply means preliminarily supply the processing liquid to the loaded substrate, and the loading port is open even while the substrate is being loaded. Even in the state, it is desirable to supply the treatment liquid to the extent that the treatment liquid does not flow out of the treatment chamber.

Further , both processing liquid supply means slant the processing liquid.
When the processing solution simply flows down to the substrate as it flows out
Compared with the above, the flow of the processing liquid on the substrate becomes faster. to this
As a result, the flow of processing liquid on the substrate that is loaded is large.
As a result, the processing unevenness of the substrate after the processing becomes smaller.
Further, the first processing liquid flow from the first processing liquid supply means is the substrate.
The processing solution flows out of the processing chamber as it flows upstream in the transfer direction.
You can more reliably suppress the problem of spillage
It

Both processing liquid supply means are processed through slits.
Since the processing liquid flows out, the processing liquid flows out in layers and is applied to the substrate.
Hit Therefore, the processing liquid is almost uniformly supplied to the substrate.
And the treatment liquid becomes a mist due to collision with the substrate.
It can be suppressed.

A substrate processing apparatus according to a second aspect is a processing chamber.
Member, a transfer means, a first processing liquid supply means, and a second processing means.
And a fluid supply means. The processing chamber is inside
The substrate is housed in the substrate, and the substrate is treated with the treatment liquid. Carrying
The transfer means carries the substrate in and out of the processing chamber. First process
The liquid supply means is provided inside the processing chamber and transfers the substrate.
It extends in the direction intersecting the direction and is loaded into the processing chamber.
A processing liquid is supplied to the incoming substrate. Second treatment liquid supply
The means is provided in the processing chamber and is arranged in the substrate transfer direction.
A substrate extending in the direction along which it is introduced into the processing chamber.
Supply the processing liquid to the plate. And the processing chamber
On the substrate loaded into the first processing liquid supply means
Of the processing liquid supplied from the second processing liquid supply means
The flow of the processing liquid to be supplied intersects, and the first processing liquid supply
The steps are for the substrates loaded into the processing chamber,
The processing liquid flows out obliquely from the slit. Also, the second
The processing liquid supply means has a cylindrical member having a plurality of holes formed therein.
The substrate being loaded into the processing chamber.
Then, the processing liquid flows out from the hole.

Here, the same as above, on the substrate.
The phenomenon that the processing solution remains behind is reduced, which allows
It is possible to suppress unevenness in processing on the substrate. Also,
1 Since the processing liquid supply means flows the processing liquid in an oblique direction,
Compared to the case of simply letting the processing liquid flow down onto the substrate,
The flow of the processing liquid becomes faster. By this, it will be carried in.
Flow of the processing liquid on the substrate
Substrate unevenness is reduced. In addition, the first treatment liquid supply
The first processing liquid flow from the supply means flows upstream in the substrate transfer direction.
That the processing liquid flows out of the processing chamber.
Can be suppressed more reliably. Furthermore, the second treatment liquid
The supply means is not a slit but a cylinder with multiple holes formed.
The structure with slits is used because
The manufacturing cost is lower than that of manufacturing.

A substrate processing apparatus according to a third aspect of the present invention is the first aspect.
Or the apparatus according to 2, wherein the apparatus is loaded into the processing chamber.
The substrate stored in a predetermined position in the processing chamber.
And then supply the third processing liquid from above the substrate.
Means are further provided.

Here, the processing chamber after the loading is completed
The third treatment liquid is supplied to the substrate accommodated in a predetermined position inside the substrate.
Substrate processing is performed by supplying the processing liquid from the supply means. This
The third processing liquid supply means supplies the processing liquid from above the substrate.
That is, the processing liquid supply port is provided above the substrate.
Therefore, even when loading a substrate that has not been supplied with processing liquid,
Drops of the processing liquid may drop on the upper surface.
Even when the treatment liquid drops fall, the first and second treatments are performed.
Since the processing liquid is deposited on the substrate by the liquid supply means,
Almost no processing unevenness occurs.

A substrate processing apparatus according to a fourth aspect is a processing chamber.
Member, a transfer means, a first processing liquid supply means, and a second processing means.
And a fluid supply means. The processing chamber is inside
The substrate is housed in the substrate, and the substrate is treated with the treatment liquid. Carrying
The transfer means carries the substrate in and out of the processing chamber. First process
The liquid supply means is provided near the carry-in port in the processing chamber.
And extends in the direction intersecting the substrate transfer direction,
The processing liquid is supplied to the substrate carried into the substrate. First
2 The processing liquid supply means is provided in the processing chamber and
Extends along the plate transport direction and loads it into the processing chamber
The processing liquid is supplied to the substrate to be processed. Third treatment liquid
The supply means is carried into the processing chamber
-Above the board with respect to the board housed in the predetermined position
Supply processing liquid from. Then carry it into the processing chamber
On the substrate to be transferred, the first processing liquid supply means supplies it.
The flow of the processing liquid to be supplied and the supply from the second processing liquid supply means.
And the flow of the treatment liquid. In this case, the same as above
In addition, the phenomenon that the same processing liquid stays on the substrate is reduced.
As a result, unevenness in processing can occur on the processed substrate.
Can be suppressed.

A substrate processing apparatus according to a fifth aspect is a processing chamber.
Member, a transfer means, a first processing liquid supply means, and a second processing means.
It is provided with a physical liquid supply means and a third processing liquid supply means.
The processing chamber contains a substrate inside and is filled with processing liquid.
To process the substrate. The transfer means is the substrate in the processing chamber.
Carry in and out. The first processing liquid supply means is a processing chamber
Is provided inside, extends in the direction intersecting the substrate transfer direction, and
The processing liquid is supplied to the substrate that is loaded into the processing chamber.
To pay. The second processing liquid supply means is installed in the processing chamber.
And extends in the direction along the substrate transport direction,
The processing liquid is supplied to the substrate loaded into the bar.
The third processing liquid supply means is carried into the processing chamber and processed.
With respect to the substrate housed at a predetermined position in the processing chamber,
The processing liquid is supplied from above the substrate. And processing chan
Supplying the third processing liquid on the substrate loaded into the bar
First and second processing liquid supply hands before supplying the processing liquid by means
The processing liquid is supplied from the stage, and is supplied from the first processing liquid supply means.
Flow of the processing liquid to be generated and the second processing liquid supply means
And the flow of the processing liquid.

Here, the same as above, on the substrate.
The phenomenon that the processing solution remains behind is reduced, which allows
It is possible to suppress unevenness in processing on the substrate. Also, carry
Completed and placed in the processing chamber
For supplying the processing liquid from the third processing liquid supply means to the substrate
Substrate processing is performed. This third processing liquid supply means is
The processing liquid is supplied from above the plate, that is, the processing liquid is processed above the substrate.
It does not supply processing liquid because it has a supply port for processing liquid.
Droplets of the processing liquid drop onto the top surface of the substrate even when the substrate is loaded.
However, there is a possibility that such processing liquid droplets may drop.
Even when
Almost no processing unevenness occurs because the processing liquid is filled in
Yes.

According to a sixth aspect of the substrate processing apparatus, there is provided a processing chamber.
Member, a transfer means, a first processing liquid supply means, and a second processing means.
It is provided with a physical liquid supply means and a third processing liquid supply means.
The processing chamber contains a substrate inside and is filled with processing liquid.
To process the substrate. The transfer means is the substrate in the processing chamber.
Carry in and out. The first processing liquid supply means is a processing chamber
Is provided inside, extends in the direction intersecting the substrate transfer direction, and
The processing liquid is supplied to the substrate that is loaded into the processing chamber.
To pay. The second processing liquid supply means is installed in the processing chamber.
And extends in the direction along the substrate transport direction,
The processing liquid is supplied to the substrate loaded into the bar.
The third processing liquid supply means is carried into the processing chamber and processed.
With respect to the substrate housed at a predetermined position in the processing chamber,
The processing liquid is supplied from above the substrate. And the first and the first
2 The processing liquid supply means supplies the third processing liquid in the processing chamber.
Of the substrate housed in the position when it is being processed by the feeding means
It is located outside the upper space and is carried into the processing chamber.
On the incoming substrate, from the first processing liquid supply means
Flow of processing liquid supplied and supply from second processing liquid supply means
And the flow of the treatment liquid to be processed intersects.

Here, the same as above, on the substrate.
The phenomenon that the processing solution remains behind is reduced, which allows
It is possible to suppress unevenness in processing on the substrate. Also,
The first and second treatments are performed during the substrate treatment by the treatment liquid supply means.
Drop of processing liquid from the liquid supply means onto the substrate
Is avoided.

That is, when the carry-in is completed, the first and second
It is not necessary to supply the processing liquid from the processing liquid supply means.
It is possible that some liquid droplets may drop even if the supply of physical fluid is stopped.
To be This droplet is used for substrate processing by the third processing liquid supply means.
If it falls on the substrate, uneven processing may occur in that part.
However, here, the first and second processing liquid supply means are used as a base.
Since it is placed outside the space above the board,
The processing liquid droplets do not fall onto the substrate during substrate processing.
Yes.

The second processing liquid is supplied with a predetermined flow rate.
Substrates to be carried in if the processing liquid is made to flow out obliquely from the means.
Even if the second processing liquid supply means is removed from the space above the
The processing liquid can be supplied to the substrate inside.

A substrate processing apparatus according to a seventh aspect is the first aspect.
In any of the devices from 1 to 6, the transfer means transfers the substrate.
The substrate is loaded into the processing chamber in the tilted state.
This inclination of the substrate is such that the surface orthogonal to the substrate transport direction and the substrate
The line of intersection is inclined with respect to the horizontal plane. Well
Also, the second processing liquid supply means is loaded in an inclined state.
The processing liquid is supplied from the top of the substrate.

Processing with the substrate tilted as described above
When loading into the chamber, if it is the first processing liquid supply means
If the processing liquid is being supplied to the substrate being loaded from the
The processing liquid deposited on the plate may flow down from the substrate being loaded.
I will With this, the processing liquid is preliminarily added to the substrate when the substrate is loaded.
A large processing space due to the drop of processing liquid droplets all over the top.
The purpose of preventing the occurrence of la is not achieved.

Here, in addition to the first processing liquid supply means,
The processing liquid is supplied from the top of the substrate that is loaded in an inclined state.
A second processing liquid supply means for supplying the second processing liquid is provided. For this reason
There is always processing liquid on the incoming substrate.
Therefore, it is possible to prevent uneven processing due to the drop of processing liquid droplets.
Wear. In addition, the processing liquid is always on the substrate that is loaded.
Flow, the same processing liquid remains on the substrate.
Is less likely to occur, resulting in uneven processing on the processed substrate.
It is possible to effectively suppress the interruption.

The substrate processing apparatus according to claim 8 is a processing chamber.
Member, a transfer means, a first processing liquid supply means, and a second processing means.
It is provided with a physical liquid supply means and a third processing liquid supply means.
The processing chamber contains a substrate inside and is filled with processing liquid.
To process the substrate. The transfer means is the substrate in the processing chamber.
Carry in and out. The first processing liquid supply means is a processing chamber
Is provided inside, extends in the direction intersecting the substrate transfer direction, and
The processing liquid is supplied to the substrate that is loaded into the processing chamber.
To pay. The second processing liquid supply means is installed in the processing chamber.
And extends in the direction along the substrate transport direction,
The processing liquid is supplied to the substrate loaded into the bar.
The third processing liquid supply means is carried into the processing chamber and processed.
With respect to the substrate housed at a predetermined position in the processing chamber,
The processing liquid is supplied from above the substrate. And processing chan
Supplying the first processing liquid on the substrate loaded into the bar
Flow of processing liquid supplied from the means and second processing liquid supply means
Intersects with the flow of processing liquid supplied from. In addition, the third place
The liquid supply means is a spray that sprays the processing liquid onto the substrate.
It has a nozzle and a processing chamber for loading and unloading substrates.
And an opening / closing means for opening / closing the opening.
It Further, the transfer means, the opening / closing means, and the first processing liquid supply
Supplying means, second processing liquid supplying means, and third processing liquid supplying means
Which is a control means for controlling the
1st and 2nd in the state which opened the opening for carrying in
While supplying the processing liquid from the processing liquid supply means,
The substrate is loaded into the bar, the substrate is loaded and the substrate is processed.
First and second processing after being housed at a predetermined position in the chamber
The supply of the processing liquid from the liquid supply means was stopped and the opening was closed.
Control for injecting the treatment liquid from the third treatment liquid supply means in the state
Means are further provided.

Here, the same as above, on the substrate.
The phenomenon that the processing solution remains behind is reduced, which allows
It is possible to suppress unevenness in processing on the substrate. Also, the basis
When loading the plate into the processing chamber, the first and second
The processing liquid is placed on the substrate by the processing liquid supply means and sprayed.
-Suppresses processing unevenness caused by the dropping of processing liquid from the nozzle.
Also, when the processing liquid is jetted onto the substrate by the third processing liquid supply means.
The process liquid is sprayed with the opening closed.
The liquid becomes a mist and leaks out of the processing chamber.
Can be suppressed.

A substrate processing apparatus according to a ninth aspect is the first aspect.
In the device according to any one of 1 to 8,
The feeding means has a length along the direction orthogonal to the substrate transport direction.
Supply the processing liquid over a longer range than the second processing liquid
The supply means has a length longer than the length along the substrate transfer direction.
Supply processing liquid over the enclosure.

A substrate processing apparatus according to claim 10 is the following:
The apparatus according to any one of 1 to 9, wherein the second treatment liquid
The supply means is provided near the side surface inside the processing chamber.
It

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <Overall Configuration of Apparatus> FIG. 1 shows a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 includes a glass substrate W for a liquid crystal display.
An apparatus for performing an etching process on a thin film formed above, which mainly includes an inlet conveyor chamber 2, an etching process chamber (processing chamber) 3, a water washing process chamber 4, and a dry carry-out chamber 5, and each chamber 2.
5 to 5, a transport roller (transport means) 6 is provided. In the space below each of the chambers 2 to 5, a chemical liquid tank or pipe for supplying a chemical liquid to the etching treatment chamber 3, a pure water tank or pipe for supplying pure water to the washing treatment chamber 4, a high pressure air / exhaust pipe, Various pipes for drainage and drainage, control devices, electrical wiring, etc. are arranged.

<Outline of Operation of Apparatus> When the substrate W having a thin film formed on its surface is carried to the substrate processing apparatus 1, the substrate W is first carried into the inlet conveyor chamber 2. After that, the substrate W is moved to the etching processing chamber 3 by the transport roller 6. In the etching processing chamber 3, a chemical solution (processing solution) for etching is sprayed onto the substrate W, and a thin film on the surface of the substrate is etched by a predetermined thickness. The substrate W thus etched is then sent to the water washing processing chamber 4 to wash away the chemical liquid adhering to the substrate W. Then, the substrate W that has been washed with water
Are carried out after the drying process by air blowing is performed in the dry carrying-out chamber 5.

In this case, the substrate W has each chamber 2 to 2.
In step 5, the sheet is processed into a predetermined inclined state and transported (see FIG. 2). The inclination of the substrate W is such that the line of intersection between the substrate W and the plane orthogonal to the substrate transport direction (the direction from left to right in FIG. 1) is inclined with respect to the horizontal plane H by an angle θ1 (FIG. 2 and the angle θ1 in FIG. 8). Angle θ1
Is set to 5 ° to 10 ° in consideration of the efficiency of the etching process.

<Details of Etching Treatment Chamber> In the etching treatment chamber 3, as shown in FIG.
Mainly, an inlet liquid curtain (first treatment liquid supply means) 31 / slit curtain (second treatment liquid supply means) 32 for spraying the chemical liquid onto the substrate W in a layered manner at the time of carrying in the substrate, an upper spray nozzle (first 3 treatment liquid supply means)
33a / lower spray nozzle 33b, position sensors 34 and 35 used when the substrate W is swung along the substrate transport direction by the transport roller 6, and an optical reflection type EPS (end point. Sensor) 36 is arranged. Further, the etching process chamber 3 is provided with a carry-in port for carrying in the substrate W from the entrance conveyor chamber 2, a carry-in shutter 3 a for opening and closing the carry-in port, and a substrate W for the washing process chamber 4.
There is provided a carry-out port for carrying out the paper and a carry-out shutter 3b for opening and closing the carry-out port.

The inlet liquid curtain 31 is provided in the vicinity of the carry-in port in the etching processing chamber 3 and extends in the direction orthogonal to the substrate carrying direction (the direction from left to right in FIG. 1) (FIG. 2). reference). However, for a horizontal plane,
Like the transport roller 6 and the substrate W, they are fixed in a state inclined by an angle θ1. The inlet liquid curtain 31 blows the chemical liquid obliquely in layers on the substrate W which is carried in from the slits, and the angle θ2 of the blowing (see FIG. 7).
Is set to about 20 ° with respect to the surface of the substrate W. The length of the slit of the inlet liquid curtain 31 is longer than the length (width of the substrate W) along the direction orthogonal to the transport direction of the substrate W (see FIG. 5).

The slit curtain 32 is provided near the side surface inside the etching processing chamber 3 and extends in the same direction as the substrate transport direction. This slit curtain 3
2 is the uppermost portion of the substrate W that is loaded in an inclined state (see FIG.
The chemical solution is obliquely blown out in a layered manner from the slit to the side end portion on the other side of the substrate W). The angle of this balloon is also
It is set to about 20 ° with respect to the surface of the substrate W, and is set to an angle θ3 of about 25 to 30 ° when viewed from the horizontal plane H. The length of the slit of the slit curtain 32 is longer than the length along the transport direction of the substrate W (see FIG. 5).

Then, as shown in FIG. 5, the flow of the chemical liquid supplied from the inlet liquid curtain 31 (hereinafter referred to as the first chemical liquid flow F
1 ) And the flow of the chemical liquid supplied from the slit curtain 32 (hereinafter referred to as the second chemical liquid flow F2) intersect with each other on the surface of the substrate W loaded into the etching processing chamber 3, the inlet liquid curtain 31 and the slit curtain. It is provided adjacent to 32.

Further, as shown in FIG. 6, the inlet liquid curtain 31 and the slit curtain 32 are arranged at positions apart from the upper space of the substrate W accommodated at the predetermined position S in the etching processing chamber 3.

The upper spray nozzle 33a and the lower spray nozzle 33b are, as shown in FIG.
A plurality of the substrates W are arranged at equal intervals in the width direction of the substrate W. Also, each spray nozzle 3
After the substrate W is loaded into the predetermined position S, the reference numerals 3a and 33b eject the chemical liquid substantially uniformly onto the substrate W while reciprocatingly rotating about the longitudinal direction by a predetermined angle. The end of etching is automatically detected by the EPS 36 in the etching processing chamber 3, but until then, the substrate W is at the predetermined position S at both position sensors 34, 35.
While swinging by reciprocating between them, the chemical liquid is injected from both spray nozzles 33a and 33b.

<Chemical Solution Piping System of Etching Processing Chamber> FIG. 3 shows a piping diagram of a chemical solution used in the etching processing chamber 3. A chemical liquid tank 64 arranged below the etching chamber 3 is appropriately supplemented with a chemical liquid from a chemical liquid replenishing pipe (not shown), and an overflow pipe (not shown) is installed. Therefore, the liquid level of the chemical liquid tank 64 is kept substantially constant.

A chemical liquid supply pipe extends from the chemical liquid tank 64 to the inlet liquid curtain 31, the slit curtain 32, and the spray nozzles 33a and 33b through a pump 65 and a filter 66. In these pipes, an inlet liquid curtain valve 61 which is an automatic valve for connecting and disconnecting the chemical liquid to the inlet liquid curtain 31, a slit curtain valve 62 which is an automatic valve for connecting and disconnecting the chemical liquid to the slit curtain 32, A spray nozzle valve 63, which is an automatic valve that connects and disconnects the chemical liquid supply to both spray nozzles 33a and 33b, is installed.

Inlet liquid curtain 31, slit curtain 3
2, or the chemical liquid blown into the etching treatment chamber 3 from the spray nozzles 33a and 33b is returned from the lower portion of the etching treatment chamber 3 to the chemical liquid tank 64 through the return pipe, and the chemical liquid is circulated by the operation of the pump 65.

<Details of Other Chambers> The water washing chamber 4 mainly includes an upper washing spray 41, a lower washing spray 42, and position sensors 43, 4.
4 are arranged. Upper and lower cleaning spray 41,
42 sprays pure water onto the substrate W. The position sensors 43 and 44 are used for the substrate W in the washing processing chamber 4.
It is an optical fiber sensor that detects the position of the substrate in the substrate transport direction. When the substrate W, which has been subjected to the etching treatment with the chemical liquid in the etching treatment chamber 3 and the chemical liquid is adhered thereto, is sent to the water washing treatment chamber 4 by the transport roller 6, the substrate W is kept at both position sensors 43, 44 for a predetermined time. Repeated swinging back and forth between
At this time, pure water is sprayed onto the substrate W from the upper and lower cleaning sprays 41 and 42. The pure water comes into contact with and collides with the substrate W to wash away the chemical liquid adhering to the substrate W from the substrate W. Pure water contaminated by cleaning the substrate W and mixing with the chemical liquid is discharged from the lower portion of the water washing processing chamber 4.

The dry carry-out chamber 5 is provided with upper and lower air knives 51 and 52 for injecting dry air onto the substrate W. In the dry carry-out chamber 5, the pure water remaining on the substrate W after the washing process in the washing process chamber 4 is blown off by the dry air jetted from both air knives 51 and 52 to dry the substrate W.

The carrying roller 6 is arranged so as to be orthogonal to the carrying direction of the substrate W, and has a roller shaft 70 rotatably supported on the side walls of the chambers 2 to 5 (see FIG. 2). Side rollers 90 are provided between the transport rollers 6 in the substrate transport direction. The side roller 90 has a shaft in a direction orthogonal to the roller shaft 70 of the transport roller 6, and has a support member 91 that is in contact with the side surface of the substrate W. The substrate W is conveyed while being held by the conveyance rollers 6 in an inclined state.
At this time, the support member 91 suppresses the movement of the substrate W in the direction intersecting the substrate transport direction.

<Control of Etching Processing Chamber> Next, control of substrate processing in the etching processing chamber 3 will be described. FIG. 4 shows a control system of the etching processing chamber 3. Signals from the position sensors 34 and 35 and the EPS 36 are input to the control unit 37 that controls the processing of the substrate W in the etching processing chamber 3.
In addition, a signal from the main controller 1a that controls the entire substrate processing apparatus 1 is also input. Based on these input signals, the controller 37 controls the transport roller 6 in the etching processing chamber 3, the carry-in shutter 3a, the carry-out shutter 3b, the inlet liquid curtain valve 61, and the slit curtain valve 6.
2. Issues a command to the spray nozzle valve 63 and the like. The control unit 37 controls as follows.

When loading the substrate W into the etching processing chamber 3, the loading shutter 3a is opened and the transport roller 6 is driven to load the substrate W. At this time, the inlet liquid curtain valve 61 and the slit curtain valve 62 are simultaneously opened, and the inlet liquid curtain 31 is opened.
Further, the layered chemical liquid is sprayed onto the substrate W carried in from the slit curtain 32.

A predetermined position S of the etching processing chamber 3
When the loading of the substrate W into the substrate is completed, the loading and unloading shutters 3a and 3b are closed. Then, after preventing the internal atmosphere from flowing out from the etching processing chamber 3 to the other chambers in this way, the inlet liquid curtain valve 61 and the slit curtain valve 62 are closed,
The spray nozzle valve 63 is opened. As a result, the chemical liquid is sprayed from both spray nozzles 33a and 33b onto both surfaces of the substrate W, and the etching process of the substrate W is started. During the etching process by the spray nozzles 33a and 33b, as described above, the spray nozzles 33a and 33b reciprocally rotate by a predetermined angle, and the substrate W moves at the predetermined position S at both position sensors 34 ,.
It can be reciprocated between 35.

When the end of etching is detected by the EPS 36, the spray nozzle valve 63 is closed in response to the signal. Then, the processed substrate W is carried out to the water washing processing chamber 4 by the carrying roller 6.

<Characteristics of Apparatus> [1] In this apparatus, as described above, the inlet liquid curtain 31 is used when the substrate W is carried into the etching processing chamber 3.
Further, the slit curtain 32 fills the chemical liquid on the substrate W, and suppresses the processing unevenness due to the chemical liquid falling from the spray nozzles 33a and 33b. Also, spray nozzle 3
When the chemicals are sprayed onto the substrate W by the liquids 3a and 33b, the chemicals are sprayed with the shutters 3a and 3b closed, so that the chemicals in the form of mist are prevented from leaking out of the etching processing chamber 3.

[2] In this apparatus, the slit curtain 32 is provided in addition to the inlet liquid curtain 31 which has been conventionally installed, and the first chemical liquid flow F1 and the second chemical liquid flow F2 are provided on the upper surface of the substrate W which is carried in. And exchange. Therefore, on the substrate W which is carried in, the first chemical liquid flow F1
Causes the chemical liquid deposited on the substrate W to flow by the second chemical liquid flow F2 (see the arrow indicating the flow on the substrate W in FIG. 5).
The phenomenon that the same chemical solution remains on the substrate W is reduced. This suppresses the occurrence of processing unevenness on the processed substrate W.

[3] In this apparatus, since the substrate W is loaded into the etching processing chamber 3 in a tilted state,
If the chemical liquid is sprayed from the inlet liquid curtain 31 onto the substrate W being loaded, the chemical liquid once deposited on the substrate W will flow down from the substrate W being loaded. With this,
The purpose of preventing the occurrence of large processing unevenness due to the drop of the droplets of the chemical liquid from the spray nozzle 33a by preliminarily depositing the chemical liquid on the entire substrate W when the substrate W is carried in cannot be achieved.

However, in this apparatus, the inlet liquid curtain 31
In addition to this, a slit curtain 32 for supplying a chemical solution from the uppermost part of the substrate W which is loaded in an inclined state is provided.
For this reason, the chemical liquid always exists on the substrate W that is carried in (see FIG. 5), and it is possible to prevent uneven processing due to the drop of the chemical liquid droplets from the spray nozzle 33 a. Further, since the flow of the chemical liquid as shown in FIG. 5 always exists on the substrate W which is carried in, the phenomenon that the same chemical liquid stays on the substrate W is lessened, and the processed substrate W is less likely to have uneven processing. to have.

[4] In the present apparatus, the inlet liquid curtain 31 and the slit curtain 32 blow the chemical liquid in an oblique direction (see FIGS. 7 and 8), and the substrate is more easily discharged than the substrate W. The flow of the chemical solution on W becomes faster. As a result, the flow rate of the chemical liquid on the substrate W that has been carried in is increased, and the unevenness in the processing of the processed substrate W is further reduced. Further, since the angle of the chemical liquid blown out from the inlet liquid curtain 31 is set to about 20 ° with respect to the surface of the substrate W, the first chemical liquid flow from the inlet liquid curtain 31 is set at a normal substrate transport speed. The phenomenon that F1 flows to the upstream side in the substrate transport direction (left side in FIG. 1) and the chemical solution flows from the etching processing chamber 3 to the entrance conveyor chamber 2 along the substrate W does not occur.

[5] In this apparatus, the spray nozzle 33
During the processing of the substrate W by a, 33b, the inlet liquid curtain 3
1 and the slit curtain 32 do not cause the liquid drops of the chemical solution to drop onto the substrate W. That is, as shown in FIG. 6, since the inlet liquid curtain 31 and the slit curtain 32 are arranged outside the space above the predetermined position S where the substrate W is located, liquid drops of the chemical liquid from these curtains 31 and 32 are generated. It does not fall onto the substrate W during the processing of the substrate W by the spray nozzles 33a and 33b.

<Other Embodiments> [A] Instead of the slit curtain 32 which blows out the chemical solution in layers in the above embodiment, a plurality of small holes 13 as shown in FIG.
Pipe (second processing liquid supply means) 132 on which 2a is formed
Can also be used.

The pipe 132 is a cylindrical member and has a plurality of small holes 132a formed in the longitudinal direction. Small hole 1
The liquid 32a is formed so that the chemical liquids blown from the liquids 32a reach the uppermost portion of the substrate W which is carried in in an inclined state. Here, the pipe 132 is opened in an obliquely lower portion on the substrate W side in the cross section. Here, the pipe 132
Since the simple and inexpensive structure in which the small hole 132a is formed is adopted, the manufacturing cost of the device can be kept low.

[B] Instead of the layered slit curtain 32 for spraying the chemical solution in the above embodiment, as shown in FIG. 10, a spray nozzle (second processing liquid supply means) 232 equivalent to the spray nozzle 33a may be used. it can.

In this case, in order to prevent the chemical solution sprayed from the nozzle 232a of the spray nozzle 232 from becoming mist, the spray nozzle 232 is arranged at a height position closer to the substrate W than the spray nozzle 33a. It is desirable to devise to slow down the injection speed of the chemical liquid from the spray nozzle 232.

[C] In the above embodiment, the inlet liquid curtain valve 61 and the slit curtain valve 62 are separately provided, but the inlet liquid curtain 31 and the slit curtain 32 are connected by one automatic valve. The chemical solution may be intermittently supplied.

[0061]

According to the present invention, in the processing chamber
A substrate processing apparatus that supplies a processing liquid to a substrate to process the substrate.
In addition, it is possible to reduce uneven processing of the processed substrate.
Wear.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of an etching processing chamber.

FIG. 3 is a chemical liquid piping diagram of an etching processing chamber.

FIG. 4 is a control system diagram of an etching processing chamber.

FIG. 5 is an operation diagram of substrate loading into an etching processing chamber.

FIG. 6 is a layout view of etching processing chambers at predetermined positions.

7 is a sectional view taken along the line VII-VII in FIG.

8 is a sectional view taken along the line VIII-VIII in FIG.

FIG. 9 is a diagram illustrating a substrate loading operation into an etching processing chamber according to another embodiment.

FIG. 10 is an operation diagram of substrate loading into an etching processing chamber according to another embodiment.

[Explanation of symbols]

1 Substrate processing equipment 3 Etching processing chamber (processing chamber) 3a Carry-in shutter (opening / closing means) 6 Conveying rollers (conveying means) 31 Inlet liquid curtain (first processing liquid supply means) 32 slit curtain (second processing liquid supply means) 33a Spray nozzle (third processing liquid supply means) 132 pipe (cylindrical member) 132a Small hole (hole) F1 first chemical flow F2 Second chemical flow H horizontal plane S predetermined position W board

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-9-270408 (JP, A) JP-A-9-267079 (JP, A) JP-A-9-283477 (JP, A) JP-A-9- 276773 (JP, A) JP 9-213668 (JP, A) JP 9-171986 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21 / 304,21 / 306,21 / 308 B08B 3/02 C23F 1/00-1/46

Claims (10)

(57) [Claims] 1. A processing chamber for accommodating a substrate therein and processing the substrate with a processing liquid; a transfer means for loading and unloading the substrate into and from the processing chamber; and a transfer chamber provided in the processing chamber and intersecting the substrate transfer direction. A first processing liquid supply unit that extends in a direction of a predetermined direction and supplies a processing liquid to the substrate that is loaded into the processing chamber; and a first processing liquid supply unit that is provided in the processing chamber and extends in a direction along the substrate transport direction. A substrate processing apparatus comprising: a second processing liquid supply means for supplying a processing liquid to a substrate carried into a chamber, the substrate being carried into the processing chamber;
Wherein the first processing liquid processing liquid flow and is fellowship supplied from the stream and the second processing liquid supply means of the treatment liquid supplied from the supply means, said first and second processing liquid supplying means, said processing Chamber
For the substrate that is loaded into the board, the processing liquid is
A substrate processing apparatus that obliquely flows out . 2. A substrate is housed inside and is treated with a processing liquid.
A processing chamber for processing Transfer means for transferring the substrate in and out of the processing chamber, It is installed in the processing chamber and intersects the substrate transfer direction.
And is carried into the processing chamber.
First processing liquid supply means for supplying the processing liquid to the substrate, Provided inside the processing chamber, along the substrate transfer direction
The substrate that extends in the vertical direction and is loaded into the processing chamber.
Second processing liquid supply means for supplying the processing liquid to the plate,
A substrate processing apparatus having: On the substrate loaded into the processing chamber,
A flow of the processing liquid supplied from the first processing liquid supply means,
A flow of the processing liquid supplied from the second processing liquid supply means,
Intersect, The first processing liquid supply means carries in the processing chamber.
The processing solution is slanted from the slit to the incoming substrate.
Outflow to The second processing liquid supply means has a cylindrical shape with a plurality of holes formed therein.
It has members and is carried into the processing chamber.
Substrate processing, in which the processing liquid flows out from the holes to the substrate
Processing equipment. 3. The processing carried into the processing chamber
For the substrate stored in the predetermined position in the chamber,
A third processing liquid supply means for supplying the processing liquid from above the plate is provided.
The substrate processing apparatus according to claim 1, further comprising: 4. A substrate is housed inside and treated with a processing liquid.
A processing chamber for processing Transfer means for transferring the substrate in and out of the processing chamber, It is installed near the loading port in the processing chamber
It extends in the direction intersecting the feeding direction and is carried into the processing chamber.
First processing liquid for supplying the processing liquid to the incoming substrate
Supply means, Provided inside the processing chamber, along the substrate transfer direction
The substrate that extends in the vertical direction and is loaded into the processing chamber.
Second processing liquid supply means for supplying the processing liquid to the plate,
A substrate processing apparatus having: On the substrate loaded into the processing chamber,
A flow of the processing liquid supplied from the first processing liquid supply means,
A flow of the processing liquid supplied from the second processing liquid supply means,
Substrate processing equipment that intersects. 5. A substrate is housed inside and treated with a processing liquid.
A processing chamber for processing Transfer means for transferring the substrate in and out of the processing chamber, It is installed in the processing chamber and intersects the substrate transfer direction.
And is carried into the processing chamber.
First processing liquid supply means for supplying the processing liquid to the substrate, Provided inside the processing chamber, along the substrate transfer direction
The substrate that extends in the vertical direction and is loaded into the processing chamber.
Second processing liquid supply means for supplying the processing liquid to the plate, Inside the processing chamber after being loaded into the processing chamber
From the top of the board to the board stored in the predetermined position
A substrate provided with a third processing liquid supply means for supplying a processing liquid
A processing device, On the substrate loaded into the processing chamber,
Before the processing liquid is supplied by the third processing liquid supply means,
The treatment liquid is supplied from the first and second treatment liquid supply means,
The flow of the processing liquid supplied from the first processing liquid supply means and the above
The flow of the processing liquid supplied from the second processing liquid supply means intersects.
A substrate processing device. 6. A substrate is housed inside and treated with a processing liquid.
A processing chamber for processing Transfer means for transferring the substrate in and out of the processing chamber, It is installed in the processing chamber and intersects the substrate transfer direction.
And is carried into the processing chamber.
First processing liquid supply means for supplying the processing liquid to the substrate, Provided inside the processing chamber, along the substrate transfer direction
The substrate that extends in the vertical direction and is loaded into the processing chamber.
Second processing liquid supply means for supplying the processing liquid to the plate, Inside the processing chamber after being loaded into the processing chamber
From the top of the board to the board stored in the predetermined position
A substrate provided with a third processing liquid supply means for supplying a processing liquid
A processing device, The first and second processing liquid supply means are the processing chamber.
When the third treatment liquid supply means in the
Is located outside the space above the substrate housed in
, On the substrate loaded into the processing chamber,
A flow of the processing liquid supplied from the first processing liquid supply means,
A flow of the processing liquid supplied from the second processing liquid supply means,
Substrate processing equipment that intersects. 7. The transfer means is orthogonal to the substrate transfer direction.
Board so that the line of intersection between the plane and the board is inclined with respect to the horizontal plane
Load the substrate into the processing chamber while tilting the
Then The second processing liquid supply means is loaded in an inclined state.
7. The processing liquid is supplied from the top of the substrate, according to claim 1.
The substrate processing apparatus according to any one of claims. 8. A substrate is housed inside and treated with a processing liquid.
A processing chamber for processing Transfer means for transferring the substrate in and out of the processing chamber, It is installed in the processing chamber and intersects the substrate transfer direction.
And is carried into the processing chamber.
First processing liquid supply means for supplying the processing liquid to the substrate, Provided inside the processing chamber, along the substrate transfer direction
The substrate that extends in the vertical direction and is loaded into the processing chamber.
Second processing liquid supply means for supplying the processing liquid to the plate, Inside the processing chamber after being loaded into the processing chamber
From the top of the board to the board stored in the predetermined position
A substrate provided with a third processing liquid supply means for supplying a processing liquid
A processing device, On the substrate loaded into the processing chamber,
A flow of the processing liquid supplied from the first processing liquid supply means,
A flow of the processing liquid supplied from the second processing liquid supply means,
Intersect, The third processing liquid supply means sprays the processing liquid onto the substrate.
Has a spray nozzle to The processing chamber has an opening for loading and unloading a substrate.
And an opening and closing means for opening and closing the opening, The transfer means, the opening / closing means, the first processing liquid supply hand
Stage, the second processing liquid supply means, and the third processing liquid supply
Control means for controlling the means, the opening / closing means
In the state where the opening for loading the substrate is opened
The processing liquid is supplied from the first and second processing liquid supply means.
While loading the substrate into the processing chamber,
The loaded substrate is placed in a predetermined position in the processing chamber.
After being processed, the processing liquid from the first and second processing liquid supply means
Of the third treatment liquid while the supply of water is stopped and the opening is closed.
A control means for injecting the treatment liquid from the supply means is further provided.
And substrate processing equipment. 9. The first processing liquid supply means is a substrate transfer method.
Over a range longer than the length along the direction orthogonal to
Supply the processing liquid, The second processing liquid supply means has a length along the substrate transfer direction.
The process liquid is supplied over a range longer than
9. The substrate processing apparatus according to any one of 1 to 8. 10. The second processing liquid supply means is the processing chamber.
1 to 9, which is provided in the vicinity of the side surface in the chamber.
The substrate processing apparatus according to any one of 1.