KR100683153B1 - 장력 방지 구조 - Google Patents
장력 방지 구조 Download PDFInfo
- Publication number
- KR100683153B1 KR100683153B1 KR1020030100220A KR20030100220A KR100683153B1 KR 100683153 B1 KR100683153 B1 KR 100683153B1 KR 1020030100220 A KR1020030100220 A KR 1020030100220A KR 20030100220 A KR20030100220 A KR 20030100220A KR 100683153 B1 KR100683153 B1 KR 100683153B1
- Authority
- KR
- South Korea
- Prior art keywords
- tension
- tcp
- cof
- tape
- sprocket holes
- Prior art date
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Wire Bonding (AREA)
- Packages (AREA)
Abstract
Description
Claims (2)
- 소정 피치 간격으로 상단 및 하단에 각각 형성되는 다수의 제1 및 제2 스프로켓 구멍을 갖는 테이프 캐리어 패키지/칩 온 필름 테이프;상기 테이프 캐리어 패키지/칩 온 필름 테이프의 다수의 제1 또는 제2 스프로켓 구멍의 양쪽에 형성되어 상기 다수의 제1 또는 제2 스프로켓 구멍에 가해지는 장력을 차단하기 위한 지지대를 포함하는 것을 특징으로 하는 장력 방지 구조.
- 제 1 항에 있어서, 상기 지지대는 각각 주석, 알루미늄, 유리 직물, 유리 섬유, 테플론, 폴리에틸렌, 폴리 에스테르, 면, 나일론, 열가소성 수지, 납, 구리, 철, 우레탄, 폴리 우레탄, 실리콘, 폴리이미드, 폴리스티렌, 폴리카보네이트 및 아크릴로니트릴 부타디엔 스트렌 수지로 구성된 그룹으로부터 선택되는 어느 하나로 이루어지는 것을 특징으로 장력 방지 구조.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030100220A KR100683153B1 (ko) | 2003-12-30 | 2003-12-30 | 장력 방지 구조 |
JP2004378301A JP2005197716A (ja) | 2003-12-30 | 2004-12-27 | テンション防止構造 |
US11/023,926 US20050139975A1 (en) | 2003-12-30 | 2004-12-28 | Tension resistant structure |
TW093141055A TWI280219B (en) | 2003-12-30 | 2004-12-29 | Tension resistant structure |
CNA2004100942112A CN1670584A (zh) | 2003-12-30 | 2004-12-30 | 张力防止结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030100220A KR100683153B1 (ko) | 2003-12-30 | 2003-12-30 | 장력 방지 구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050070551A KR20050070551A (ko) | 2005-07-07 |
KR100683153B1 true KR100683153B1 (ko) | 2007-02-15 |
Family
ID=34698749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030100220A KR100683153B1 (ko) | 2003-12-30 | 2003-12-30 | 장력 방지 구조 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050139975A1 (ko) |
JP (1) | JP2005197716A (ko) |
KR (1) | KR100683153B1 (ko) |
CN (1) | CN1670584A (ko) |
TW (1) | TWI280219B (ko) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06236905A (ja) * | 1993-02-08 | 1994-08-23 | Furukawa Electric Co Ltd:The | テープキャリア |
KR20000047836A (ko) * | 1998-12-01 | 2000-07-25 | 마찌다 가쯔히꼬 | 반도체장치와 그의 제조방법 및 동 반도체장치의 제조에사용되는 보강용 테이프 |
KR20010043486A (ko) * | 1999-03-11 | 2001-05-25 | 야스카와 히데아키 | 가요성 배선 기판, 필름 캐리어, 테이프형 반도체장치,반도체장치 및 그 제조방법, 회로기판 및 전자기기 |
JP2002299385A (ja) | 2001-03-29 | 2002-10-11 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープ及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1443555A3 (en) * | 1997-01-23 | 2005-02-23 | Seiko Epson Corporation | Semiconductor device and method of manufacturing the same |
US6502783B1 (en) * | 2000-08-15 | 2003-01-07 | Micron Technology, Inc. | Carrier tape recycling apparatus and method of recycling carrier tape |
US6919513B2 (en) * | 2002-07-24 | 2005-07-19 | Samsung Electronics Co., Ltd. | Film carrier tape for semiconductor package and manufacturing method thereof |
-
2003
- 2003-12-30 KR KR1020030100220A patent/KR100683153B1/ko active IP Right Grant
-
2004
- 2004-12-27 JP JP2004378301A patent/JP2005197716A/ja active Pending
- 2004-12-28 US US11/023,926 patent/US20050139975A1/en not_active Abandoned
- 2004-12-29 TW TW093141055A patent/TWI280219B/zh active
- 2004-12-30 CN CNA2004100942112A patent/CN1670584A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06236905A (ja) * | 1993-02-08 | 1994-08-23 | Furukawa Electric Co Ltd:The | テープキャリア |
KR20000047836A (ko) * | 1998-12-01 | 2000-07-25 | 마찌다 가쯔히꼬 | 반도체장치와 그의 제조방법 및 동 반도체장치의 제조에사용되는 보강용 테이프 |
KR20010043486A (ko) * | 1999-03-11 | 2001-05-25 | 야스카와 히데아키 | 가요성 배선 기판, 필름 캐리어, 테이프형 반도체장치,반도체장치 및 그 제조방법, 회로기판 및 전자기기 |
JP2002299385A (ja) | 2001-03-29 | 2002-10-11 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープ及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
1020010043486 * |
Also Published As
Publication number | Publication date |
---|---|
CN1670584A (zh) | 2005-09-21 |
US20050139975A1 (en) | 2005-06-30 |
JP2005197716A (ja) | 2005-07-21 |
TWI280219B (en) | 2007-05-01 |
KR20050070551A (ko) | 2005-07-07 |
TW200521054A (en) | 2005-07-01 |
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