KR100682641B1 - 반도체 디바이스의 제조 공정에 대한 특성화 데이터를 발생시키기 위한 명령어를 수록한 컴퓨터 판독가능한 매체 및 상기 특성화 데이터를 발생시키기 위한 시스템 - Google Patents

반도체 디바이스의 제조 공정에 대한 특성화 데이터를 발생시키기 위한 명령어를 수록한 컴퓨터 판독가능한 매체 및 상기 특성화 데이터를 발생시키기 위한 시스템 Download PDF

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KR100682641B1
KR100682641B1 KR1020027001836A KR20027001836A KR100682641B1 KR 100682641 B1 KR100682641 B1 KR 100682641B1 KR 1020027001836 A KR1020027001836 A KR 1020027001836A KR 20027001836 A KR20027001836 A KR 20027001836A KR 100682641 B1 KR100682641 B1 KR 100682641B1
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data set
semiconductor devices
data
measurement results
values
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KR20020018202A (ko
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푸탐게리진
쳉제니퍼멩-츄
선친-양
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020027001836A 1999-08-10 2000-03-13 반도체 디바이스의 제조 공정에 대한 특성화 데이터를 발생시키기 위한 명령어를 수록한 컴퓨터 판독가능한 매체 및 상기 특성화 데이터를 발생시키기 위한 시스템 Expired - Fee Related KR100682641B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/371,498 US6319737B1 (en) 1999-08-10 1999-08-10 Method and apparatus for characterizing a semiconductor device
US09/371,498 1999-08-10

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Publication Number Publication Date
KR20020018202A KR20020018202A (ko) 2002-03-07
KR100682641B1 true KR100682641B1 (ko) 2007-02-15

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KR1020027001836A Expired - Fee Related KR100682641B1 (ko) 1999-08-10 2000-03-13 반도체 디바이스의 제조 공정에 대한 특성화 데이터를 발생시키기 위한 명령어를 수록한 컴퓨터 판독가능한 매체 및 상기 특성화 데이터를 발생시키기 위한 시스템

Country Status (5)

Country Link
US (1) US6319737B1 (enExample)
EP (1) EP1208591A1 (enExample)
JP (1) JP2003506900A (enExample)
KR (1) KR100682641B1 (enExample)
WO (1) WO2001011680A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150140358A (ko) * 2013-04-07 2015-12-15 케이엘에이-텐코 코포레이션 인라인 수율 모니터링을 위한 임계 파라메트릭 전기 테스트 파라미터의 자동 결정을 위한 시스템 및 방법
WO2022075804A1 (ko) * 2020-10-08 2022-04-14 고려대학교 산학협력단 트랩 사이트 정보의 판별 기능을 갖는 반도체 소자의 검사 방법 및 반도체 소자의 검사 장치

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US6606582B1 (en) * 2000-03-27 2003-08-12 Seh America, Inc. Universal system, method and computer program product for collecting and processing process data including particle measurement data
JP2003022378A (ja) * 2001-07-06 2003-01-24 Mitsubishi Electric Corp 半導体設計資産流通システム
US6773932B2 (en) * 2001-11-30 2004-08-10 Seh America, Inc. System and method for collecting, storing, and displaying process data including particle measurement data
US6823228B2 (en) * 2002-02-21 2004-11-23 International Business Machines Corporation Fabricator capacity analysis
US20030171897A1 (en) * 2002-02-28 2003-09-11 John Bieda Product performance integrated database apparatus and method
DE10210712A1 (de) * 2002-03-12 2003-10-02 Deutsche Telekom Ag Verfahren zur Übertragung von Messdaten von einem Messrechner zu einem Steuerrechner eines Messsystems
US7047442B2 (en) * 2002-04-23 2006-05-16 Agilent Technologies, Inc. Electronic test program that can distinguish results
US6898545B2 (en) * 2002-06-28 2005-05-24 Agilent Technologies Inc Semiconductor test data analysis system
US6845278B2 (en) 2002-08-07 2005-01-18 Kimberly-Clark Worldwide, Inc. Product attribute data mining in connection with a web converting manufacturing process
US7168853B2 (en) * 2003-01-10 2007-01-30 International Business Machines Corporation Digital measuring system and method for integrated circuit chip operating parameters
US7020859B2 (en) * 2003-06-02 2006-03-28 Lsi Logic Corporation Process skew results for integrated circuits
US7155361B2 (en) * 2005-02-24 2006-12-26 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor test management system and method
US20080126001A1 (en) * 2006-09-01 2008-05-29 Murray David W Equipment testing system and method having scaleable test line limits
US9087164B2 (en) 2008-01-26 2015-07-21 National Semiconductor Corporation Visualization of tradeoffs between circuit designs
US7966588B1 (en) 2008-01-26 2011-06-21 National Semiconductor Corporation Optimization of electrical circuits
US8712741B2 (en) 2010-06-28 2014-04-29 National Semiconductor Corporation Power supply architecture system designer
JP2012099603A (ja) * 2010-11-01 2012-05-24 Elpida Memory Inc ウェハテスト装置、ウェハテスト方法およびプログラム
US10001800B1 (en) 2015-09-10 2018-06-19 Apple Inc. Systems and methods for determining temperatures of integrated circuits
JP7546418B2 (ja) * 2020-09-09 2024-09-06 東京エレクトロン株式会社 基板処理方法および基板処理装置
CN118425776B (zh) * 2024-05-09 2024-11-08 江苏欧力特能源科技有限公司 一种磷酸铁锂电池用循环寿命测试系统

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JP3099932B2 (ja) 1993-12-14 2000-10-16 株式会社東芝 インテリジェントテストラインシステム
US5563095A (en) * 1994-12-01 1996-10-08 Frey; Jeffrey Method for manufacturing semiconductor devices
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JP3757482B2 (ja) * 1996-08-09 2006-03-22 ソニー株式会社 半導体装置の製造方法
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JPH11150047A (ja) * 1997-11-17 1999-06-02 Matsushita Electron Corp 半導体装置の製造方法
JP3204204B2 (ja) * 1997-11-21 2001-09-04 日本電気株式会社 論理ｌｓｉの製造プロセス診断システム、方法及び記録媒体
US5866437A (en) 1997-12-05 1999-02-02 Advanced Micro Devices, Inc. Dynamic process window control using simulated wet data from current and previous layer data
US6171945B1 (en) * 1998-10-22 2001-01-09 Applied Materials, Inc. CVD nanoporous silica low dielectric constant films

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150140358A (ko) * 2013-04-07 2015-12-15 케이엘에이-텐코 코포레이션 인라인 수율 모니터링을 위한 임계 파라메트릭 전기 테스트 파라미터의 자동 결정을 위한 시스템 및 방법
KR102258942B1 (ko) 2013-04-07 2021-06-02 케이엘에이 코포레이션 인라인 수율 모니터링을 위한 임계 파라메트릭 전기 테스트 파라미터의 자동 결정을 위한 시스템 및 방법
WO2022075804A1 (ko) * 2020-10-08 2022-04-14 고려대학교 산학협력단 트랩 사이트 정보의 판별 기능을 갖는 반도체 소자의 검사 방법 및 반도체 소자의 검사 장치
KR20220047068A (ko) * 2020-10-08 2022-04-15 고려대학교 산학협력단 트랩 사이트 정보의 판별 기능을 갖는 반도체 소자의 검사 방법 및 반도체 소자의 검사 장치
KR102442512B1 (ko) * 2020-10-08 2022-09-13 고려대학교 산학협력단 트랩 사이트 정보의 판별 기능을 갖는 반도체 소자의 검사 방법 및 반도체 소자의 검사 장치

Also Published As

Publication number Publication date
US6319737B1 (en) 2001-11-20
JP2003506900A (ja) 2003-02-18
EP1208591A1 (en) 2002-05-29
KR20020018202A (ko) 2002-03-07
WO2001011680A1 (en) 2001-02-15

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