JP2003506900A - 半導体装置を特徴付けるための方法および装置 - Google Patents
半導体装置を特徴付けるための方法および装置Info
- Publication number
- JP2003506900A JP2003506900A JP2001516240A JP2001516240A JP2003506900A JP 2003506900 A JP2003506900 A JP 2003506900A JP 2001516240 A JP2001516240 A JP 2001516240A JP 2001516240 A JP2001516240 A JP 2001516240A JP 2003506900 A JP2003506900 A JP 2003506900A
- Authority
- JP
- Japan
- Prior art keywords
- data
- data set
- semiconductor device
- characterization
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000012360 testing method Methods 0.000 claims abstract description 122
- 238000012512 characterization method Methods 0.000 claims abstract description 105
- 238000004519 manufacturing process Methods 0.000 claims abstract description 54
- 238000013461 design Methods 0.000 claims abstract description 40
- 238000005259 measurement Methods 0.000 claims abstract description 40
- 235000012431 wafers Nutrition 0.000 claims description 51
- 230000008569 process Effects 0.000 claims description 13
- 230000007704 transition Effects 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 description 48
- 238000010586 diagram Methods 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000012937 correction Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000007405 data analysis Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000013523 data management Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000007619 statistical method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/371,498 | 1999-08-10 | ||
| US09/371,498 US6319737B1 (en) | 1999-08-10 | 1999-08-10 | Method and apparatus for characterizing a semiconductor device |
| PCT/US2000/006598 WO2001011680A1 (en) | 1999-08-10 | 2000-03-13 | Method and apparatus for characterizing a semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003506900A true JP2003506900A (ja) | 2003-02-18 |
| JP2003506900A5 JP2003506900A5 (enExample) | 2007-04-05 |
Family
ID=23464208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001516240A Pending JP2003506900A (ja) | 1999-08-10 | 2000-03-13 | 半導体装置を特徴付けるための方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6319737B1 (enExample) |
| EP (1) | EP1208591A1 (enExample) |
| JP (1) | JP2003506900A (enExample) |
| KR (1) | KR100682641B1 (enExample) |
| WO (1) | WO2001011680A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7113919B1 (en) * | 2000-02-29 | 2006-09-26 | Chemdomain, Inc. | System and method for configuring products over a communications network |
| US6606582B1 (en) * | 2000-03-27 | 2003-08-12 | Seh America, Inc. | Universal system, method and computer program product for collecting and processing process data including particle measurement data |
| JP2003022378A (ja) * | 2001-07-06 | 2003-01-24 | Mitsubishi Electric Corp | 半導体設計資産流通システム |
| US6773932B2 (en) * | 2001-11-30 | 2004-08-10 | Seh America, Inc. | System and method for collecting, storing, and displaying process data including particle measurement data |
| US6823228B2 (en) * | 2002-02-21 | 2004-11-23 | International Business Machines Corporation | Fabricator capacity analysis |
| US20030171897A1 (en) * | 2002-02-28 | 2003-09-11 | John Bieda | Product performance integrated database apparatus and method |
| DE10210712A1 (de) * | 2002-03-12 | 2003-10-02 | Deutsche Telekom Ag | Verfahren zur Übertragung von Messdaten von einem Messrechner zu einem Steuerrechner eines Messsystems |
| US7047442B2 (en) * | 2002-04-23 | 2006-05-16 | Agilent Technologies, Inc. | Electronic test program that can distinguish results |
| US6898545B2 (en) * | 2002-06-28 | 2005-05-24 | Agilent Technologies Inc | Semiconductor test data analysis system |
| US6845278B2 (en) | 2002-08-07 | 2005-01-18 | Kimberly-Clark Worldwide, Inc. | Product attribute data mining in connection with a web converting manufacturing process |
| US7168853B2 (en) * | 2003-01-10 | 2007-01-30 | International Business Machines Corporation | Digital measuring system and method for integrated circuit chip operating parameters |
| US7020859B2 (en) * | 2003-06-02 | 2006-03-28 | Lsi Logic Corporation | Process skew results for integrated circuits |
| US7155361B2 (en) * | 2005-02-24 | 2006-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor test management system and method |
| US20080126001A1 (en) * | 2006-09-01 | 2008-05-29 | Murray David W | Equipment testing system and method having scaleable test line limits |
| US7966588B1 (en) | 2008-01-26 | 2011-06-21 | National Semiconductor Corporation | Optimization of electrical circuits |
| US9087164B2 (en) | 2008-01-26 | 2015-07-21 | National Semiconductor Corporation | Visualization of tradeoffs between circuit designs |
| US8712741B2 (en) | 2010-06-28 | 2014-04-29 | National Semiconductor Corporation | Power supply architecture system designer |
| JP2012099603A (ja) * | 2010-11-01 | 2012-05-24 | Elpida Memory Inc | ウェハテスト装置、ウェハテスト方法およびプログラム |
| US20140303912A1 (en) * | 2013-04-07 | 2014-10-09 | Kla-Tencor Corporation | System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring |
| US10001800B1 (en) | 2015-09-10 | 2018-06-19 | Apple Inc. | Systems and methods for determining temperatures of integrated circuits |
| JP7546418B2 (ja) * | 2020-09-09 | 2024-09-06 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| KR102442512B1 (ko) * | 2020-10-08 | 2022-09-13 | 고려대학교 산학협력단 | 트랩 사이트 정보의 판별 기능을 갖는 반도체 소자의 검사 방법 및 반도체 소자의 검사 장치 |
| CN118425776B (zh) * | 2024-05-09 | 2024-11-08 | 江苏欧力特能源科技有限公司 | 一种磷酸铁锂电池用循环寿命测试系统 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997013158A1 (en) * | 1995-10-06 | 1997-04-10 | Advanced Micro Devices, Inc. | Wafer defect management system |
| JPH1056048A (ja) * | 1996-08-09 | 1998-02-24 | Sony Corp | 半導体装置の製造方法 |
| US5726920A (en) * | 1995-09-29 | 1998-03-10 | Advanced Micro Devices, Inc. | Watchdog system having data differentiating means for use in monitoring of semiconductor wafer testing line |
| JPH10214870A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | 半導体装置の製造方法 |
| JPH11150047A (ja) * | 1997-11-17 | 1999-06-02 | Matsushita Electron Corp | 半導体装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5270222A (en) * | 1990-12-31 | 1993-12-14 | Texas Instruments Incorporated | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
| JP3099932B2 (ja) | 1993-12-14 | 2000-10-16 | 株式会社東芝 | インテリジェントテストラインシステム |
| US5563095A (en) * | 1994-12-01 | 1996-10-08 | Frey; Jeffrey | Method for manufacturing semiconductor devices |
| US6013536A (en) * | 1997-04-22 | 2000-01-11 | Vlsi Technology, Inc. | Apparatus for automated pillar layout and method for implementing same |
| US6162715A (en) * | 1997-06-30 | 2000-12-19 | Applied Materials, Inc. | Method of forming gate electrode connection structure by in situ chemical vapor deposition of tungsten and tungsten nitride |
| JP3204204B2 (ja) * | 1997-11-21 | 2001-09-04 | 日本電気株式会社 | 論理ｌｓｉの製造プロセス診断システム、方法及び記録媒体 |
| US5866437A (en) | 1997-12-05 | 1999-02-02 | Advanced Micro Devices, Inc. | Dynamic process window control using simulated wet data from current and previous layer data |
| US6171945B1 (en) * | 1998-10-22 | 2001-01-09 | Applied Materials, Inc. | CVD nanoporous silica low dielectric constant films |
-
1999
- 1999-08-10 US US09/371,498 patent/US6319737B1/en not_active Expired - Lifetime
-
2000
- 2000-03-13 KR KR1020027001836A patent/KR100682641B1/ko not_active Expired - Fee Related
- 2000-03-13 JP JP2001516240A patent/JP2003506900A/ja active Pending
- 2000-03-13 EP EP00916313A patent/EP1208591A1/en not_active Withdrawn
- 2000-03-13 WO PCT/US2000/006598 patent/WO2001011680A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5726920A (en) * | 1995-09-29 | 1998-03-10 | Advanced Micro Devices, Inc. | Watchdog system having data differentiating means for use in monitoring of semiconductor wafer testing line |
| WO1997013158A1 (en) * | 1995-10-06 | 1997-04-10 | Advanced Micro Devices, Inc. | Wafer defect management system |
| JPH1056048A (ja) * | 1996-08-09 | 1998-02-24 | Sony Corp | 半導体装置の製造方法 |
| JPH10214870A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | 半導体装置の製造方法 |
| JPH11150047A (ja) * | 1997-11-17 | 1999-06-02 | Matsushita Electron Corp | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100682641B1 (ko) | 2007-02-15 |
| EP1208591A1 (en) | 2002-05-29 |
| WO2001011680A1 (en) | 2001-02-15 |
| KR20020018202A (ko) | 2002-03-07 |
| US6319737B1 (en) | 2001-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070126 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070126 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110222 |
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| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110224 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110719 |