KR100651819B1 - Exposing apparatus - Google Patents

Abstract

An exposure apparatus is disclosed. The disclosed exposure apparatus includes a frame; A die set provided on one side of the frame such that an upper die and a lower die respectively provided with adsorption portions for vacuum suction of a pair of masks each having a mark having a predetermined pattern formed thereon; Elevating means installed on one side of the frame and capable of elevating the upper die; And a plurality of mask alignment CDs installed on the die set in a vertical state with respect to the mask so as to detect an alignment state of the mark of the mask. According to the present invention, there is an advantage that can improve the exposure uniformity (uniformity).

Description

Exposing apparatus

1 is a partial cross-sectional view schematically showing the configuration of a die set provided in a conventional exposure apparatus.

2 is a schematic front view showing a configuration of an exposure apparatus according to the present invention.

3A is a schematic plan view of the adsorption portion of the die set of FIG.

3B is a cross-sectional view taken along the line III-III of FIG. 3A;

<Description of the symbols for the main parts of the drawings>

110.Frame 111.Bracket

112. Support Bracket 113. Guide Post

120.mask 121.top mask

122.Submask 130.Die Set

131. Upper Die 132. Lower Die

133. Vacuum suction part 133a. Vacuum groove

133b. Contact surface 133c. Non-contact surface

134. Vacuum input port 140. Mask alignment CD

150. Z-axis servo motor 151. Screw shaft

160. Stage

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus, and more particularly, to an exposure apparatus having an improved structure in order to facilitate mask mounting on a die set and to improve uniformity of exposure during exposure.

BACKGROUND ART Semiconductor devices generally applied to computers and various electronic products, liquid crystal display devices (LCDs), plasma display devices (PDPs), circuit boards (PCBs) on which electronic components are mounted, filters, and thin films, which are emerging as image display devices. Photolithography is used to form fine patterns in the production of components and the like using technology. In such photolithography, an exposure apparatus is essentially used to transfer a pattern of a reticle or a mask to a photosensitive film formed on a substrate. In order to form a semiconductor device, a liquid crystal display device, or the like, an exposure process is repeatedly performed by using a reticle having these patterns formed in an exposure apparatus to form a predetermined pattern, for example, a circuit pattern, on an element material such as a wafer or a substrate for a liquid crystal display device. Will be performed.

The exposure method by the exposure apparatus is classified into a manual exposure for forming a pattern by forming a polyester film on the upper and lower surfaces of the object to be exposed, and a semi-automatic method for fixing the mask to a fixed mask frame for exposure. In the mask device of the exposure apparatus, the pattern matching of the upper and lower surfaces is performed prior to the operation by using an adhesive or a fixing device on the mask in order to proceed with the continuous operation. Is set. Once the mask has been set, the upper and lower pattern matching is inconsistent and the mask frame is separated from the die set to perform the matching once again.

In the conventional exposure apparatus provided with the die set, although not shown in the drawings, a die set consisting of an upper die and a lower die so as to be liftable, a Z-axis servo motor provided so that the upper die of the die set is liftable, Timing belts rotatably installed on the Z-axis servo motor, and a plurality of CD cameras installed on an upper side of the die set to detect an alignment between the exposed material and the mask placed between the upper die and the lower die. It includes a mask align ccd, which is a camera.

1 is a schematic cross-sectional view showing a die set provided in such a conventional exposure apparatus.

Referring to the drawings, the die set 10 is installed so that the upper die 11 and the lower die 12 are opposed to each other, and the upper and lower masks are disposed on the surface where the upper die 11 and the lower die 12 face each other. A mask 20 made of 21 and 22 is installed, and a multi-stage vacuum groove 13 is formed on opposite surfaces of the upper and lower dies 11 and 12. On the other hand, reference numeral S, which is not described, indicates a contact surface of the mask 20 and the die set 10.

In the exposure apparatus configured as described above, the exposure degree depends on the structure of the die set 10 shown in FIG. In the conventional exposure apparatus, the vacuum groove 13 of the die set 10, which absorbs and fixes the mask 20 in the form of a multistage, is difficult to process, and the mask 20 and the die set 10 after processing are The degree of surface roughness of the contact surface S in direct contact was not good. Due to such a problem when the die set 10 is processed, the warp (torsion) phenomenon occurs in the upper die 11 and the lower die 12, and the vacuum pressure of the mask 20 is also significantly lowered. Accordingly, the adsorption force of the mask 20 is low, the dropout or flow of these masks 20 occurs, and the exposure uniformity in the exposure area during exposure decreases, which causes product defects during etching.

In the driving method of the exposure apparatus, the Z-axis servo motor and the upper die 11 are indirectly driven indirectly connected by a timing belt. In other words, a timing belt is attached to each of the connecting shafts installed on the Z-axis servo motor and the upper die 11 to lift the upper die 11. Therefore, even when the Z-axis servo motor operates correctly when the Z-axis of the upper die 11 is moved, a flow occurs in the timing belt. Accordingly, the degree of repetition due to the Z axis error of the upper die 11 is reduced, and at the same time, the degree of alignment of the upper and lower masks 21 and 22 is adversely affected.

In addition, since the fixing method of the mask alignment CD is fixed to the mask 20 in a horizontal form, the initial setting of the mark of the mask and the mask alignment CD is difficult and the degree of the mask alignment is also worsened. In addition, the mask alignment CD is flown due to the flow and error generated by the timing belt while the exposure apparatus is in operation, and the quality of the exposed product (material) is reduced.

Referring back to FIG. 1, when machining into the contact surface S in direct contact with the mask 20, surface roughness is generated up to 0.5 mm based on the entire die set 10, and surface roughness is measured for each part to be measured. different. In addition, due to the bending of the die set 10 during processing, the exposure position is different in the exposure area, so that the difference in the post-exposure resolution is severe.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is easy to mount a mask on a die set, and can improve the uniformity of exposure during exposure, and an exposure apparatus that can improve the degree of alignment of the mask. The purpose is to provide.

An exposure apparatus of the present invention for achieving the above object, the frame; A die set provided on one side of the frame such that an upper die and a lower die respectively provided with adsorption portions for vacuum suction of a pair of masks each having a mark having a predetermined pattern formed thereon; Elevating means installed on one side of the frame and capable of elevating the upper die; And a plurality of mask alignment CDs installed on the die set in a vertical state with respect to the mask so as to detect an alignment state of the mark of the mask.

In the present invention, the suction portion, a plurality of vacuum grooves in the form of slots are formed at the four edges in order to suck the mask in a vacuum, the surface of the vacuum groove is formed a contact surface so that the mask can directly contact The non-contact surface is formed to be spaced apart from the vacuum groove by a predetermined distance so as not to be in contact with the mask at all four edges of the contact surface.

In the present invention, the elevating means, at least one Z-axis servo motor installed on at least one side of the frame, the rotary shaft of the Z-axis servo motor and the upper die directly connected to the drive according to the Z-axis servo motor And a connecting member for allowing the upper die to be elevated.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic diagram showing the configuration of an exposure apparatus according to the present invention.

Referring to the drawings, the exposure apparatus according to the present invention includes a frame 110 and a pair of masks 120, ie, an upper mask 121, on which a mark of a predetermined pattern is formed on one side of the frame 110. And a die set 130 provided with an upper die 131 and a lower die 132 facing each other and vacuum absorbing the lower mask 122, respectively, and installed on one side of the frame 110 and lifting the upper die 131. And a plurality of mask alignment CDs 140 installed in a vertical state on the top of the die set 130 to detect an alignment state of the upper mask 121 and the lower mask 122. It is composed. As shown in FIG. 2, a plurality of mask alignment CDs 140 are installed in a vertical shape on a support bracket 112 fastened to one side of the bracket 111. In other words, the mask aligned CD 140 is installed in a state perpendicular to the mask 120.

Although not shown in FIG. 1, a material to be exposed is disposed between the upper mask 121 and the lower mask 122, and the exposure is performed according to the pattern of the upper mask 121 and the lower mask 122. In addition, the upper die 131 and the lower die 132 are provided with a vacuum suction part 133 so that the upper mask 121 and the lower mask 122 are vacuum-adsorbed and supported on one surface thereof. In FIG. 2, a guide post 133 is installed at an upper side of the frame 110 and one side of the bracket 111 to guide sliding when the upper die 131 is elevated. The lower die 132 is supported by the stage 160 installed below the frame 110 at the bottom of the lower die 132.

The elevating means directly connects the plurality of Z-axis servo motors 150 installed on one side and the other side of the frame 110, and the rotary shaft of the Z-axis servo motor 150 and the upper die 131, respectively. By the drive of the Z-axis servo motor 150 is made of a connecting member to the upper die 131 is lifted. One end of the connection member is installed on a rotation shaft of the Z-axis servo motor 150, and the other end includes a screw shaft 151 installed at one side of the bracket 111 of the upper die 131.

3A schematically illustrates a plan view of the vacuum adsorption unit 133 of the upper die 131 and the lower die 132, and FIG. 3B is a cross-sectional view of the upper die 131 and the lower die 132.

Referring to the drawings, the upper mask 121 and the lower mask 122 are respectively attached to the vacuum adsorption part 133 provided on one surface of the upper mask 121 and the lower mask 122, respectively. A plurality of vacuum grooves 133a are formed in a slot shape at substantially rectangular four edges for vacuum adsorption.

The surface on which the vacuum grooves 133a are formed has a contact surface 133b so that the upper mask 121 and the lower mask 122 can be directly contacted and adsorbed, and a predetermined distance from the vacuum groove 133a. The non-contact surface 133c, which is spaced apart from the contact surface 133b at a predetermined height at a predetermined height with the contact surface 133b to prevent contact with the upper mask 121 and the lower mask 122, is formed. Is formed. In FIG. 3A, each of the vacuum grooves 133a is formed so that the vacuum input port part 134 is connected to the vacuum groove 133a.

The operation of the exposure apparatus according to the present invention configured as described above will be described. The operation of the general exposure apparatus is omitted here, and only the features of the present invention will be described.

The Z-axis servo motor 150 does not raise or lower the upper die 131 of the die set 130 by a timing belt provided in a conventional exposure apparatus. The servo motor 150 and the upper die 131 were directly connected. That is, when the Z-axis servo motor 150 is operated, a direct driving method in which the rotational force of the Z-axis servo motor 150 is directly transmitted to the upper die 131 is adopted. Therefore, the positional error of the upper mask 121 does not occur during the repetitive movement as compared with the conventional indirect driving method by the timing belt. This allows the position of the upper die 131 to be kept constant, whereby the position of the upper mask 121 can be in a constant position, so that the exposure position is constant.

In addition, since the mask alignment CD 140 is installed in the bracket 111 on the upper portion of the die set 130 with respect to the mask 120, the mask alignment CD 140 is a predetermined pattern of the upper and lower masks 121 and 122. The initial setting of the wah is easy and the alignment degree is constant according to the Z-axis position of the upper die 131. In other words, since the upper die 131 is driven by a direct drive method, there is no error due to repetitive motion, and since the mask alignment CD 140 is installed vertically, the upper and lower masks 121 and 122 are disposed. Since the setting with the mark can be made simply, the exposure quality, that is, the exposure resolution, is improved.

In addition, a plurality of slot-shaped vacuum grooves 133a are formed in the upper and lower dies 131 and the vacuum adsorption portions 133 of the lower die 132 to form upper and lower masks 121 and 122. The vacuum pressure was improved to 1 atmosphere, for example. The contact surface 133b and the non-contact surface 133c are formed at the edges of the vacuum groove 133a, respectively, so that the surface roughness of the upper and lower masks 121 and 122 and the contact surface can be processed within a maximum of 0.0020 mm, for example. Therefore, there is no difference in surface roughness according to the degree of processing of the die set 130, and there is no flow of these masks 120 in contact with the upper and lower masks 121 and 122 and the contact surface 133b.

According to the present invention, the Z-axis repeatability of the upper die 131 may be stably driven within a maximum of 0.005 mm, and stability of the mask alignment CD 140 may be improved while driving the upper die 131. The initial setup is also simplified.

The exposure apparatus according to the present invention can be applied to any case of manufacturing an etching product in a reel to reel state using an etching in-line equipment.

As described above, the exposure apparatus according to the present invention has the following effects.

First, since the elevating motion of the upper die of the die set is driven in the direct drive method with respect to the Z-axis servo motor, it is possible to drive stably with little error due to repetitive motion.

Second, by forming a plurality of slots in the vacuum suction portion of the die set for supporting the mask to improve the vacuum pressure of the mask to effectively absorb and support the mask, the contact surface of the mask in the vacuum suction portion Of course, by forming the non-contact surface, there is no difference in surface roughness according to the degree of processing of the die set, and the flow of the mask does not occur when the mask is absorbed.

Third, since the mask alignment CD is installed vertically with respect to the mask, the mask alignment CD can be stably operated while driving the upper die, and the initial setting can be simplified.

Therefore, the exposure uniformity after exposure is improved as well as the exposure resolution can be improved.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (3)

frame; A die set provided on one side of the frame such that an upper die and a lower die each provided with adsorption portions for vacuum suction of a pair of masks each having a predetermined pattern of marks formed thereon; Lifting means installed on one side of the frame to enable lifting of the upper die; And And a plurality of mask alignment CDs installed on the die set in a vertical state with respect to the mask to detect an alignment state of marks of the mask. The suction part is provided with a plurality of vacuum grooves having a slot shape at all four edges to vacuum-adsorb the mask, and the surface on which the vacuum groove is formed has a contact surface for direct contact with the mask, and four edges of the contact surface. And a non-contact surface disposed at a portion spaced apart from the vacuum groove by a predetermined distance so as not to contact the mask. delete The method of claim 1, The lifting means, At least one Z-axis servo motor installed on one side of the frame, And a connecting member which directly connects the rotary shaft of the Z-axis servo motor with the upper die so that the upper die is raised and lowered according to the driving of the Z-axis servo motor.

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