KR100648492B1 - 본딩 장치 - Google Patents

본딩 장치 Download PDF

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Publication number
KR100648492B1
KR100648492B1 KR1020050039663A KR20050039663A KR100648492B1 KR 100648492 B1 KR100648492 B1 KR 100648492B1 KR 1020050039663 A KR1020050039663 A KR 1020050039663A KR 20050039663 A KR20050039663 A KR 20050039663A KR 100648492 B1 KR100648492 B1 KR 100648492B1
Authority
KR
South Korea
Prior art keywords
motor
axis
bonding head
mover
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050039663A
Other languages
English (en)
Korean (ko)
Other versions
KR20060047805A (ko
Inventor
오사무 가쿠타니
도오루 마에다
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20060047805A publication Critical patent/KR20060047805A/ko
Application granted granted Critical
Publication of KR100648492B1 publication Critical patent/KR100648492B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0247—Driving means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Machine Tool Units (AREA)
KR1020050039663A 2004-06-10 2005-05-12 본딩 장치 Expired - Fee Related KR100648492B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004172895A JP2005353839A (ja) 2004-06-10 2004-06-10 ボンディング装置
JPJP-P-2004-00172895 2004-06-10

Publications (2)

Publication Number Publication Date
KR20060047805A KR20060047805A (ko) 2006-05-18
KR100648492B1 true KR100648492B1 (ko) 2006-11-27

Family

ID=35459461

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050039663A Expired - Fee Related KR100648492B1 (ko) 2004-06-10 2005-05-12 본딩 장치

Country Status (4)

Country Link
US (1) US20050274771A1 (https=)
JP (1) JP2005353839A (https=)
KR (1) KR100648492B1 (https=)
TW (1) TW200603298A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
CN103624192B (zh) * 2013-11-07 2015-09-02 深圳市综科邦达机电设备有限公司 焊线机
CN103612036B (zh) * 2013-11-13 2015-06-17 深圳市综科邦达机电设备有限公司 焊线机
KR102622020B1 (ko) * 2021-02-22 2024-01-08 가부시키가이샤 신가와 와이어 본딩 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH636740A5 (fr) * 1980-05-19 1983-06-15 Far Fab Assortiments Reunies Dispositif pour l'alignement d'une piece et d'un substrat.
JPH1110467A (ja) * 1997-06-18 1999-01-19 Yaskawa Electric Corp Ｘｙテーブル
JP3454234B2 (ja) * 1999-09-27 2003-10-06 日産自動車株式会社 分割コアモータ
JP4018057B2 (ja) * 2003-03-31 2007-12-05 株式会社新川 ボンディング装置

Also Published As

Publication number Publication date
TW200603298A (en) 2006-01-16
US20050274771A1 (en) 2005-12-15
KR20060047805A (ko) 2006-05-18
JP2005353839A (ja) 2005-12-22

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