KR100641430B1 - 반송시스템의 반송위치 정렬 방법 - Google Patents

반송시스템의 반송위치 정렬 방법 Download PDF

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Publication number
KR100641430B1
KR100641430B1 KR1020057009369A KR20057009369A KR100641430B1 KR 100641430 B1 KR100641430 B1 KR 100641430B1 KR 1020057009369 A KR1020057009369 A KR 1020057009369A KR 20057009369 A KR20057009369 A KR 20057009369A KR 100641430 B1 KR100641430 B1 KR 100641430B1
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KR
South Korea
Prior art keywords
conveyance
pick
conveying
position coordinates
alignment
Prior art date
Application number
KR1020057009369A
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English (en)
Korean (ko)
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KR20050086778A (ko
Inventor
모토히로 구마가이
게이스케 곤도
Original Assignee
동경 엘렉트론 주식회사
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Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20050086778A publication Critical patent/KR20050086778A/ko
Application granted granted Critical
Publication of KR100641430B1 publication Critical patent/KR100641430B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020057009369A 2002-11-27 2003-11-27 반송시스템의 반송위치 정렬 방법 KR100641430B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002344693A JP4239572B2 (ja) 2002-11-27 2002-11-27 搬送システムの搬送位置合わせ方法及び処理システム
JPJP-P-2002-00344693 2002-11-27

Publications (2)

Publication Number Publication Date
KR20050086778A KR20050086778A (ko) 2005-08-30
KR100641430B1 true KR100641430B1 (ko) 2006-11-01

Family

ID=32375962

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057009369A KR100641430B1 (ko) 2002-11-27 2003-11-27 반송시스템의 반송위치 정렬 방법

Country Status (5)

Country Link
US (1) US7129147B2 (fr)
JP (1) JP4239572B2 (fr)
KR (1) KR100641430B1 (fr)
CN (1) CN100336634C (fr)
WO (1) WO2004048048A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置
JP4468159B2 (ja) * 2004-12-24 2010-05-26 東京エレクトロン株式会社 基板処理装置及びその搬送位置合わせ方法
US7361920B2 (en) 2004-12-24 2008-04-22 Tokyo Electron Limited Substrate processing apparatus and transfer positioning method thereof
JP4841183B2 (ja) * 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
JP4925650B2 (ja) * 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
JP2007251090A (ja) 2006-03-20 2007-09-27 Tokyo Electron Ltd 真空処理装置の搬送位置合わせ方法、真空処理装置及びコンピュータ記憶媒体
US20070259457A1 (en) * 2006-05-04 2007-11-08 Texas Instruments Optical endpoint detection of planarization
JP5030542B2 (ja) * 2006-11-10 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
JP2008173744A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム
US8185242B2 (en) * 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
JP5675416B2 (ja) * 2011-02-17 2015-02-25 東京エレクトロン株式会社 被処理体の搬送方法及び被処理体処理装置
JP2013045817A (ja) * 2011-08-23 2013-03-04 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
JP5854741B2 (ja) * 2011-10-04 2016-02-09 株式会社アルバック 基板処理装置
JP6094148B2 (ja) * 2012-10-29 2017-03-15 東京エレクトロン株式会社 基板処理装置
JP6422695B2 (ja) * 2014-07-18 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN106449466A (zh) * 2015-08-11 2017-02-22 中微半导体设备(上海)有限公司 一种基片处理系统
US10707107B2 (en) 2015-12-16 2020-07-07 Kla-Tencor Corporation Adaptive alignment methods and systems
JP6779636B2 (ja) * 2016-03-11 2020-11-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6298109B2 (ja) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 基板処理装置及びアライメント方法
JP7097691B2 (ja) * 2017-12-06 2022-07-08 東京エレクトロン株式会社 ティーチング方法
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
JP7367439B2 (ja) * 2019-10-03 2023-10-24 株式会社ニデック 眼鏡レンズ周縁加工システムおよび眼鏡レンズ周縁加工プログラム
US11759954B2 (en) * 2020-03-17 2023-09-19 Applied Materials, Inc. Calibration of an electronics processing system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
JPH0917809A (ja) * 1995-06-30 1997-01-17 Sumitomo Kinzoku Electro Device:Kk 半導体セラミックパッケージの製造方法と装置
US6432744B1 (en) * 1997-11-20 2002-08-13 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
US6730541B2 (en) * 1997-11-20 2004-05-04 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
JPH11207668A (ja) * 1998-01-20 1999-08-03 Sankyo Seiki Mfg Co Ltd ロボットのティーチング方法
US6068954A (en) * 1998-09-01 2000-05-30 Micron Technology, Inc. Semiconductor wafer alignment methods
JP4674705B2 (ja) * 1998-10-27 2011-04-20 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び搬送システム
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
JP2001202123A (ja) * 2000-01-18 2001-07-27 Sony Corp 搬送ロボットの教示方法
JP4576694B2 (ja) * 2000-10-11 2010-11-10 東京エレクトロン株式会社 被処理体の処理システムの搬送位置合わせ方法及び被処理体の処理システム
US6716723B2 (en) * 2002-06-05 2004-04-06 Intel Corporation Wafer cutting using laser marking

Also Published As

Publication number Publication date
CN1717302A (zh) 2006-01-04
JP2004174669A (ja) 2004-06-24
US20050255609A1 (en) 2005-11-17
US7129147B2 (en) 2006-10-31
WO2004048048A1 (fr) 2004-06-10
CN100336634C (zh) 2007-09-12
JP4239572B2 (ja) 2009-03-18
KR20050086778A (ko) 2005-08-30

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