KR100620556B1 - White light-emitting diode structure and manufacturing method thereof for to use fluorescence material - Google Patents

White light-emitting diode structure and manufacturing method thereof for to use fluorescence material Download PDF

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KR100620556B1
KR100620556B1 KR1020040005261A KR20040005261A KR100620556B1 KR 100620556 B1 KR100620556 B1 KR 100620556B1 KR 1020040005261 A KR1020040005261 A KR 1020040005261A KR 20040005261 A KR20040005261 A KR 20040005261A KR 100620556 B1 KR100620556 B1 KR 100620556B1
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light emitting
emitting diode
fluorescent agent
emitting device
white light
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KR20040016916A (en
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전경남
임관
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광전자 주식회사
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    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F19/00—Complete banking systems; Coded card-freed arrangements adapted for dispensing or receiving monies or the like and posting such transactions to existing accounts, e.g. automatic teller machines
    • G07F19/20—Automatic teller machines [ATMs]
    • G07F19/205—Housing aspects of ATMs
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
    • E05B65/00—Locks or fastenings for special use
    • E05B65/0075—Locks or fastenings for special use for safes, strongrooms, vaults, fire-resisting cabinets or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S902/00—Electronic funds transfer
    • Y10S902/08—Terminal* with means permitting deposit or withdrawal, e.g. ATM

Abstract

본 발명은 형광제를 이용한 백색 발광 다이오드에 관한 것으로서, BASE구조물과 형광제 그리고 빛을 발광하는 발광 다이오드 칩을 이용하여 발광 소자에서 발산된 빛을 발광 다이오드 칩의 밑면, 밑면과 측면, 측면에 배치시킨 형광제와 접착제의 혼합물, 또는 형광제를 도포하거나 매개체를 통해 부착시킨 형태로 구성시켜 형광제와의 빛의 혼합이 이루어지도록 하여 백색의 빛을 발산하며 이 형광물질의 농도 조절에 의해 색상과 밝기가 조정이 가능하도록 하게 하는 형광제를 이용한 백색 발광 다이오드를 제공한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a white light emitting diode using a fluorescent agent, wherein light emitted from a light emitting device using a base structure, a fluorescent agent, and a light emitting diode chip emitting light is disposed on the bottom, bottom, side, and side surfaces of the light emitting diode chip. It is composed of a mixture of the fluorescent agent and adhesive, or coated with a fluorescent agent or attached through a medium to allow the light to be mixed with the fluorescent agent to emit white light and to adjust the concentration of the fluorescent material. Provided is a white light emitting diode using a fluorescent agent that enables brightness to be adjusted.

발광 다이오드, 형광제, 접착제, BASE구조물Light Emitting Diode, Fluorescent Agent, Adhesive, BASE Structure

Description

형광제를 이용한 백색 발광 다이오드의 구조 및 제조방법 {White light-emitting diode structure and manufacturing method thereof for to use fluorescence material} White light-emitting diode structure and manufacturing method using for fluorescence material             

도 1은 종래 기술의 백색 발광 다이오드를 개략적으로 도시한 사시도이다.1 is a perspective view schematically showing a white light emitting diode of the prior art.

도 2는 본 발명에 따른 백색 발광 다이오드를 도시한 사시도이다.2 is a perspective view showing a white light emitting diode according to the present invention.

도 3는 본 발명에 따른 백색 발광 다이오드를 도시한 발광 부위 확대도이다.Figure 3 is an enlarged view of the light emitting portion showing a white light emitting diode according to the present invention.

도 4은 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이다.4 is a perspective view showing another embodiment of a white light emitting diode according to the present invention.

도 5는 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이다.5 is a perspective view showing another embodiment of a white light emitting diode according to the present invention.

도 6는 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이다.6 is a perspective view showing another embodiment of a white light emitting diode according to the present invention.

도 7은 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이다.7 is a perspective view showing another embodiment of a white light emitting diode according to the present invention.

도 8, 9, 10, 11, 12, 13, 14, 15는 본 발명에 따른 백색 발광 다이오드의 적용 Package에 따른 실시예 다른 구조를 도시한 사시도이다.8, 9, 10, 11, 12, 13, 14, and 15 are perspective views illustrating another structure according to an application package of a white light emitting diode according to the present invention.

** 도면의 주요부분에 대한 부호의 설명 **** Explanation of symbols for main parts of drawings **

100 : 종래기술의 발광 소자 101 : 종래기술의 코팅수지100: light emitting device of the prior art 101: coating resin of the prior art

102 : 종래기술의 발광 다이오드 칩 105, 106 : 종래기술의 리드102: prior art light emitting diode chip 105, 106: prior art lead

201, 301, 501 : BASE구조물 202, 402, 502 : 접착제201, 301, 501: BASE structure 202, 402, 502: adhesive

203, 303, 503 : 발광 다이오드 칩 204, 304, 504 : 금속선203, 303, 503: LED chip 204, 304, 504: metal wire

205, 305, 505 : 외부 몰드재 206, 406, 506 : 형광제205, 305, 505: external mold material 206, 406, 506: fluorescent agent

본 발영은 형광제를 이용한 백색 발광 다이오드에 관한 것으로서, BASE구조물과 형광제, 그리고 빛을 발광하는 발광 다이오드 칩을 이용하여 발광 다이오드 칩에서 발산된 빛을 발광 다이오드 칩의 밑면, 밑면과 측면, 측면에 배치시킨 형광제와 접착제의 혼합물, 또는 형광제를 도포하거나 매개체를 통해 부착시킨 형태로 구성시켜 형광제와의 빛의 혼합이 이루어지도록 하여 백색의 빛을 발산하며 이 형광물질의 농도 조절에 의해 색상과 밝기가 조정이 가능하도록 하게 하는 형광제를 이용한 백색 발광 다이오드와 그 제조방법에 관한 것이다.The present invention relates to a white light emitting diode using a fluorescent agent. The light emitted from the light emitting diode chip using a base structure, a fluorescent agent, and a light emitting diode chip emitting light is used for the bottom, bottom, side, and side surfaces of the LED chip. It is composed of a mixture of a fluorescent agent and an adhesive placed in the form, or coated with a fluorescent agent or attached through a medium to mix the light with the fluorescent agent to emit white light and by controlling the concentration of the fluorescent material The present invention relates to a white light emitting diode using a fluorescent agent that allows color and brightness to be adjusted, and a method of manufacturing the same.

종래의 기술은 도1에서 보는 바와 같이 발광 소자(100)은 리드(105, 106)를 구비한 발광 다이오드로 마운트·리드(105)의 컵부(105a) 위에 발광 다이오드 칩(102)가 설치되고 컵부(105a)내에 발광 다이오드 칩(102)를 감싸도록 소정의 형광제를 포함한 코팅수지(101)가 충전된 후에 수지 몰드되어 구성된다.As shown in FIG. 1, the light emitting device 100 is a light emitting diode having leads 105 and 106, and a light emitting diode chip 102 is installed on the cup portion 105a of the mount lead 105. The coating resin 101 containing the predetermined fluorescent substance is filled in the 105a to enclose the light emitting diode chip 102, and then resin molded.

상기와 같이 구성된 발광 다이오드에 있어서는, 발광 다이오드 칩(102)에 의해 발광된 광의 일부가 코팅수지(101)에 함제된 형광제를 통하여 LED광과 다른 파장의 형광을 발생시킴으로써, 형광제가 발생하는 형광과 형광제에서 변화되지 않는 LED광이 혼색되어 출력된다. In the light emitting diode configured as described above, a part of the light emitted by the light emitting diode chip 102 generates fluorescence of a different wavelength from the LED light through a fluorescent agent contained in the coating resin 101, whereby the fluorescent agent is generated. LED light that does not change with the fluorescent material is mixed and output.

그러나 위에 설명한 발광 다이오드는 기존의 발광 다이오드 제조공정에 별도로 형광제를 포함한 코팅수지를 도포한 뒤 청색의 발광 다이오드 칩이 백색의 빛을 발광하도록 하였으나 이는 형광재질의 형광제를 발광 소자 위에 도포하는 공정을 필수적으로 추가해야 하며, 또한 배합물의 미세한 도포량 차이와 혹은 도포된 배합물 형상의 차이에 의하여 광효율이 저하되는 단점을 가지고 있었다.However, the above-described light emitting diode was coated with a coating resin containing a fluorescent agent separately in the conventional light emitting diode manufacturing process so that the blue LED chip emits white light, but this is a process of applying a fluorescent material fluorescent material on the light emitting device. It must be added to the essential, and also had a disadvantage in that the light efficiency is lowered by the difference in the fine coating amount of the formulation or the difference in the shape of the applied formulation.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 종래의 백색 발광 다이오드가 청색 발광 소자 윗면에 형광물질을 도포하는 구조를 가지고 있어서 광효율이 저하되고 공정이 추가되는 문제점을 극복하고, 광원이 되는 발광 소자에서 발광되는 빛이 내부로 굴절되는 원리를 이용하여 발광소자의 밑면 또는 측면에 형광제를 배치시켜 발광소자와 형광제간의 빛의 혼합에 의하여 백색의 빛을 발광하는 조합형 백색 발광 다이오드구조와 그 제조방법을 제공하는데 그 목적이 있다.
The present invention has been made to solve the above problems, the conventional white light emitting diode has a structure to apply a fluorescent material on the upper surface of the blue light emitting device to overcome the problem that the light efficiency is lowered and the process is added, Combination type white light emitting diode structure that emits white light by mixing light between light emitting device and fluorescent agent by placing fluorescent material on the bottom or side of light emitting device by using the principle that light emitted from light emitting device is refracted to inside And to provide a method of manufacturing the object.

상기와 같은 목적을 달성하기 위하여 본 발명은 광원이 되는 발광 소자에서 발광되는 빛이 내부로 굴절되는 원리를 이용하여 발광 소자의 밑면 또는 측면에 형광제를 배치시킨 구조를 가지는 백색 발광 다이오드의 구조와 제조방법에 있어서,In order to achieve the above object, the present invention provides a structure of a white light emitting diode having a structure in which a fluorescent agent is disposed on the bottom or side of the light emitting device by using the principle that the light emitted from the light emitting device serving as the light source is refracted therein; In the manufacturing method,

BASE구조물과, 형광제, 발광 다이오드 칩, 외부 몰드재로 구성되며, 상기 형광제는 접착제와 혼합하여 발광 소자의 밑면 또는 측면에 배치시키고, 상기 형광제(형광 성질의 물질)와 발광 소자에서 반사되어지는 빛을 혼합하여 백색의 빛을 발산하도록 하는 것을 특징으로 하여 이루어지는 백색 발광 다이오드의 구조가 제공되고,It is composed of a base structure, a fluorescent agent, a light emitting diode chip, an external mold material, the fluorescent agent is mixed with an adhesive and placed on the bottom or side of the light emitting device, and reflected from the fluorescent material (fluorescent material) and the light emitting device Provided is a structure of a white light emitting diode, characterized in that to mix the light to be emitted to white light,

BASE구조물에 발광 소자를 부착하기 위한 접착제와 형광제를 혼합하여 도포한 후 발광 소자에 배치시키는 단계와, 전극을 연결하기 위한 금속선을 연결하는 단계와, 투광성 재질의 외부 몰드재를 이용하여 구조를 완성하는 단계를 포함하여 이루어지는 백색 발광 다이오드 제조방법이 제공된다.Mixing and applying an adhesive and a fluorescent agent for attaching the light emitting device to the BASE structure, and then placing the light emitting device on the light emitting device, connecting a metal wire for connecting the electrodes, and using an external mold material made of a light transmissive material. Provided is a method of manufacturing a white light emitting diode comprising the step of completing.

상기와 같이 본 발명은 광원이 되는 발광 소자에서 발광되는 빛이 내부로 굴절되는 원리를 이용하여 발광 소자의 밑면 또는 측면에 형광제를 배치시켜 발광 소자와 형광제간의 빛의 혼합에 의하여 백색의 빛을 발광하는 조합형 백색 발광 다이오드의 구조와 그 제조방법을 제공하는 것을 특징으로 하고 있다.As described above, the present invention uses a principle that light emitted from a light emitting device serving as a light source is refracted therein, thereby placing a fluorescent agent on the bottom or side of the light emitting device, thereby mixing white light by mixing light between the light emitting device and the fluorescent agent. It is characterized by providing a structure and a method of manufacturing the combination type white light emitting diode to emit light.

이하 본 발명에 따른 백색 발광 다이오드의 구조를 도면을 참조하여 상세하 게 설명한다. Hereinafter, a structure of a white light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 백색 발광 다이오드를 도시한 사시도를 나타낸 것으로, 도 2를 참조하여 본 발명의 구성을 상세하게 설명하면,2 is a perspective view showing a white light emitting diode according to the present invention. Referring to FIG. 2, the configuration of the present invention will be described in detail.

본 발명은 BASE구조물(201)과 발광 다이오드 칩(203), 형광제(206), 외부 몰드재(205), 접착제(202), 금속선(204)로 구성되어 있다.The present invention comprises a base structure 201, a light emitting diode chip 203, a fluorescent agent 206, an external mold material 205, an adhesive 202, and a metal wire 204.

상기와 같이 구성된 백색 발광 다이오드를 제조하는 방법을 도면을 참조하여 더욱 상세하게 설명한다.A method of manufacturing a white light emitting diode configured as described above will be described in more detail with reference to the drawings.

도 2는 본 발명에 따른 백색 발광 다이오드를 도시한 사시도 나타낸 것으로, 도 2를 참조하여 제조방법을 더욱 상세하게 설명하면,2 is a perspective view showing a white light emitting diode according to the present invention. Referring to FIG. 2, the manufacturing method will be described in more detail.

본 발명의 발광장치는 BASE구조물(201)에 발광 다이오드 칩(203)을 부착하기 위한 접착제(202)와 형광제(206)를 분리 또는 혼합하여 도포한 후 전극을 연결하기 위한 금속선(204)를 연결한 후 투광성 재질의 외부 몰드재(205)를 이용하여 그 구조를 완성시킬 수 있다.In the light emitting device of the present invention, the adhesive 202 for attaching the light emitting diode chip 203 and the fluorescent agent 206 are separated or mixed and applied to the base structure 201, and then the metal wire 204 for connecting the electrodes is applied. After the connection, the structure may be completed by using the external mold material 205 of the light transmissive material.

도 4은 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이고, 도 5는 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도로서, 도 4과 도 5를 참조하여 제조방법에 있어서 본 발명의 다른 실시예를 상세하게 설명하면,4 is a perspective view showing another embodiment of a white light emitting diode according to the present invention, Figure 5 is a perspective view showing another embodiment of a white light emitting diode according to the present invention, with reference to Figures 4 and 5 In another embodiment of the present invention in detail,

도 4과 도 5에 의해서 BASE구조물(301)발광 다이오드 칩(303)을 부착하기 위 한 접착제(402)와 형광제(406)를 분리 또는 혼합물(307)을 도포한 후 전극을 연결하기 위한 금속선(304)을 연결한 후 투광성 재질의 외부 몰드재(305)를 이용하여 그 구조를 완성시킬 수 있다.4 and 5, the adhesive 402 and the fluorescent agent 406 for attaching the light emitting diode chip 303 to the BASE structure 301 are separated or coated with a mixture 307, and then a metal wire for connecting the electrodes. After connecting 304, the structure may be completed by using an external mold material 305 of a light transmissive material.

도 6는 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도이고, 도 7은 본 발명에 따른 백색 발광 다이오드의 다른 실시예를 도시한 사시도로서, 도 6와 도 7을 참조하여 제조방법에 있어서 본 발명의 또 다른 실시예를 상세하게 설명하면,6 is a perspective view showing another embodiment of a white light emitting diode according to the present invention, Figure 7 is a perspective view showing another embodiment of a white light emitting diode according to the present invention, with reference to Figures 6 and 7 Referring to another embodiment of the present invention in detail

도 6와 도 7에서 보는 바와 같이 발광 소자 칩을 BASE구조물(501)에 부착시키기 위한 접착제(502)와 형광제(506)를 분리 또는 혼합물(607)을 배치시킨 후 발광 다이오드 칩(503)을 삽입하여 발광 소자의 밑면과 측면을 덮어준 후 전극을 연결하기 위한 금속선(504)를 연결한 후 투광성 재질의 외부 몰드재(505)를 이용하여 그 구조를 완성시킬 수 있으며, 형광제와 접착제를 분리 적용시 형광제는 도포하거나 매개체를 통해서 부착할 수 있다.As shown in FIG. 6 and FIG. 7, the adhesive 502 and the fluorescent agent 506 for attaching the light emitting device chip to the BASE structure 501 are separated or the mixture 607 is disposed, and then the light emitting diode chip 503 is removed. After inserting to cover the bottom and side of the light emitting device, and then connect the metal wire 504 for connecting the electrode, the structure can be completed by using the external mold material 505 of the light-transmissive material, fluorescent and adhesive In a separate application, the fluorescent agent may be applied or attached via a medium.

상기와 같은 제조방법으로 제조된 백색 발광 다이오드의 동작원리를 더욱 상세하게 설명한다.The operation principle of the white light emitting diode manufactured by the above manufacturing method will be described in more detail.

도 3은 본 발명에 따른 백색 발광 다이오드를 도시한 발광 부위 확대도로써, 도 3을 참조하여 동작원리를 상세하게 설명하면, 3 is an enlarged view of a light emitting part showing a white light emitting diode according to the present invention. Referring to FIG.

발광 소자의 활성층(211)에서 발생된 빛은 발광 소자와 발광 소자를 보호하 고 외부형태를 구현하는 몰드재(213) 사이의 굴절률의 차이가 커서 내부반사율이 커지게 되어 발광 소자의 위부분인 몰드재 방향보다는 이면인 투과율이 큰 투명기판(212) 방향으로 굴절이 되므로 BASE구조물과 발광 소자 사이에 형광물질(214)을 도포하거나 매개체를 이용하여 얇게 밑면 또는 측면에 배치시킴으로써, 발광 소자에서 발생된 빛이 형광제를 거치면서 LED광과 다른 파장의 형광을 발생시킴으로써 원하는 파장의 빛을 얻을 수가 있다.The light generated from the active layer 211 of the light emitting device has a large difference in refractive index between the light emitting device and the mold material 213 which protects the light emitting device and implements an external shape, so that the internal reflectivity is increased. Since the light is refracted in the direction of the transparent substrate 212 having a larger transmittance than the mold material direction, the fluorescent material 214 is applied between the base structure and the light emitting device, or is disposed on the bottom or side by using a medium to generate a light emitting device. When the light passes through the fluorescent agent and generates fluorescence of a wavelength different from that of the LED light, light of a desired wavelength can be obtained.

또한, 이렇게 함으로써 발광 소자에서 발생된 빛을 발광 소자의 상단부에서 형광물질과의 파장변화에 의해서 발산시키는 광보다 발광효율이 높고 형광제의 형광재질 농도 조정으로 효과적인 색온도 조정을 할 수 있다.In addition, the light emitting efficiency is higher than the light emitted from the light emitting device by the wavelength change with the fluorescent material at the upper end of the light emitting device, and the color temperature of the fluorescent material can be effectively adjusted by adjusting the concentration of the fluorescent material.

따라서, 이러한 원리를 이용함으로써 본 발명에 의해서 청색계열의 발광 소자를 이용하여 편리하게 백색 발광 다이오드를 제조할 수 있으며,Therefore, by using this principle, a white light emitting diode can be conveniently manufactured using a blue light emitting device according to the present invention.

형광제와 접착제를 혼합사용시 기존의 백색 발광 다이오드 제조공정시에 추가되는 형광제 도포공정을 줄임으로써 제조원가를 절감할 수 있다.When the fluorescent agent and the adhesive are used in combination, manufacturing cost can be reduced by reducing the fluorescent agent coating process added during the existing white light emitting diode manufacturing process.

도8, 9, 10, 11, 12, 13, 14, 15는 본 발명에 따른 백색발광 다이오드의 적용 Package에 따른 실시예 다른 구조를 도시한 사시도이다. 8, 9, 10, 11, 12, 13, 14, and 15 are perspective views showing another structure of an embodiment according to an application package of a white light emitting diode according to the present invention.

이상의 실시예들은 본 발명을 설명하기 위한 것으로, 본 발명의 범위는 상기 실시예들에 한정되지 않으며, 첨부된 청구 범위에 의거하여 정의되는 본 발명의 범주내에 당업자들에 의하여 변형 또는 수정될 수 있다. 예를 들면, 본 발명의 실시 예에 구체적으로 나타난 각 구성의 요소의 형상 및 구조는 변형하여 실시할 수 있는 것이다.The above embodiments are only for explaining the present invention, and the scope of the present invention is not limited to the above embodiments, and may be modified or modified by those skilled in the art within the scope of the present invention defined by the appended claims. . For example, the shape and structure of the elements of each component specifically shown in the embodiment of the present invention can be modified.

본 발명에 의한 형광제를 이용한 백색 발광 다이오드는 발광 소자에서 이면으로 굴절되어진 빛과 발광 소자와 발광 소자의 밑면에 배치된 형광제를 이용하여 발광 소자에서 발산된 빛과 발광 소자의 밑면 또는 측면에 배치된 형광제 사이에서 혼합된 빛이 발광됨으로써 발광효율이 높으며 형광 접착제의 형광재질 농도 조정으로 효과적인 색온도 조정이 가능하며 접착제와 형광제를 혼합 사용시 종래의 기술에서 설명한 형광제 도포의 공정이 줄어들므로 제조원가가 절감되는 효과가 있고,The white light emitting diode using the fluorescent agent according to the present invention is a light that is refracted to the back of the light emitting device and the light emitted from the light emitting device and the bottom or side of the light emitting device by using a fluorescent agent disposed on the bottom of the light emitting device. The luminous efficiency is increased by emitting light mixed between the disposed fluorescent agents, and the color temperature of the fluorescent adhesive can be adjusted effectively by adjusting the concentration of fluorescent material of the fluorescent adhesive. Has the effect of reducing manufacturing costs,

또한, 본 발명에 의해서 청색계열의 발광 소자를 이용하여 편리하게 백색 발광 다이오드를 제조할 수 있는 효과가 있다.In addition, according to the present invention, there is an effect that a white light emitting diode can be conveniently manufactured using a blue light emitting device.

Claims (7)

광원이 되는 발광 소자에서 발광되는 빛이 내부로 굴절되는 원리를 이용하여 발광 소자의 밑면, 밑면과 측면, 측면에 형광제를 배치시킨 구조를 가지는 백색 발광 다이오드의 구조에 있어서,In the structure of a white light emitting diode having a structure in which a fluorescent agent is disposed on the bottom, bottom, side, and side surfaces of the light emitting device by using the principle that the light emitted from the light emitting device serving as the light source is refracted therein, BASE구조물과, 형광제, 발광 다이오드 칩, 외부 몰드재로 구성되며, 상기 형광제는 접착제와 혼합하여 발광 소자의 밑면 또는 측면에 배치시키고, 상기 형광제(형광 성질의 물질)와 발광 소자에서 반사되어지는 빛을 혼합하여 백색의 빛을 발산하도록 하는 것을 특징으로 하여 이루어지는 형광제를 이용한 백색 발광 다이오드 구조.It is composed of a base structure, a fluorescent agent, a light emitting diode chip, an external mold material, the fluorescent agent is mixed with an adhesive and placed on the bottom or side of the light emitting device, and reflected from the fluorescent material (fluorescent material) and the light emitting device A white light emitting diode structure using a fluorescent agent, characterized in that to mix the light to emit white light. 삭제delete 제 1항에 있어서,The method of claim 1, 상기 형광제와 접착제를 분리 도포하여 발광 소자의 밑면 또는 측면에 배치시키는 것을 더 포함하여 이루어지는 형광제를 이용한 백색 발광 다이오드 구조.The white light-emitting diode structure using a fluorescent agent further comprising the separate coating of the fluorescent agent and the adhesive and disposed on the bottom or side of the light emitting device. 제 1항에 있어서,The method of claim 1, 상기 형광제를 배치 매개체를 이용하여 발광 소자의 밑면 또는 측면에 배치시키는 것을 더 포함하여 이루어지는 형광제를 이용한 백색 발광 다이오드 구조.A white light emitting diode structure using a fluorescent agent further comprises disposing the fluorescent agent on the bottom or side surface of the light emitting device using a placement medium. 광원이 되는 발광 소자에서 발광되는 빛이 내부로 굴절되는 원리를 이용하여 발광 소자의 밑면, 밑면과 측면, 측면에 형광제를 배치시킨 구조를 가지는 백색 발광 다이오드를 제조하는 방법에 있어서,In the method of manufacturing a white light emitting diode having a structure in which a fluorescent agent is disposed on the bottom, bottom, side, and side surfaces of the light emitting device by using the principle that the light emitted from the light emitting device as a light source is refracted therein, (a) BASE구조물에 발광 소자를 부착하기 위한 접착제와 형광제를 혼합하여 도포한 후 발광 소자의 밑면 또는 측면에 배치시키는 단계와;(a) mixing and applying an adhesive and a fluorescent agent for attaching the light emitting device to the BASE structure, and then placing the adhesive on the bottom or side of the light emitting device; (b) 전극을 연결하기 위한 금속선을 연결하는 단계와;(b) connecting metal wires for connecting the electrodes; (c) 투광성 재질의 외부 몰드재를 이용하여 구조를 완성하는 단계; 를 포함하여 이루어지는 형광제를 이용한 백색 발광 다이오드 제조방법.(c) completing the structure using an external mold material made of a light transmitting material; White light emitting diode manufacturing method using a fluorescent agent comprising a. 제 5항에 있어서, The method of claim 5, 상기 (a)단계는 형광제와 접착제를 분리 도포하여 발광 소자의 밑면, 밑면과 측면, 측면에 배치시키는 단계; 를 더 포함하여 이루어지는 형광제를 이용한 백색 발광 다이오드 제조방법.The step (a) is to separate and apply a fluorescent agent and an adhesive to place on the bottom, bottom and side, side of the light emitting device; White light emitting diode manufacturing method using a fluorescent agent further comprises. 제 5항에 있어서,The method of claim 5, 상기 (a)단계는 배치 매개체를 이용하여 상기 형광제를 발광 소자의 밑면, 밑면과 측면, 측면에 배치시키는 단계; 를 더 포함하여 이루어지는 형광제를 이용한 백색 발광 다이오드 제조방법.Step (a) is a step of placing the fluorescent agent on the bottom, bottom and side, side surfaces of the light emitting device using a placement medium; White light emitting diode manufacturing method using a fluorescent agent further comprises.
KR1020040005261A 2004-01-28 2004-01-28 White light-emitting diode structure and manufacturing method thereof for to use fluorescence material KR100620556B1 (en)

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Publication number Priority date Publication date Assignee Title
US9917231B2 (en) 2014-11-10 2018-03-13 Samsung Electronics Co., Ltd. Fluoride phosphor and light emitting device, and methods of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9917231B2 (en) 2014-11-10 2018-03-13 Samsung Electronics Co., Ltd. Fluoride phosphor and light emitting device, and methods of manufacturing the same

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