KR100612773B1 - 저 누화 볼 그리드 어레이 저항망 - Google Patents

저 누화 볼 그리드 어레이 저항망 Download PDF

Info

Publication number
KR100612773B1
KR100612773B1 KR1019990031023A KR19990031023A KR100612773B1 KR 100612773 B1 KR100612773 B1 KR 100612773B1 KR 1019990031023 A KR1019990031023 A KR 1019990031023A KR 19990031023 A KR19990031023 A KR 19990031023A KR 100612773 B1 KR100612773 B1 KR 100612773B1
Authority
KR
South Korea
Prior art keywords
common
resistors
conductors
substrate
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019990031023A
Other languages
English (en)
Korean (ko)
Other versions
KR20000016980A (ko
Inventor
테리알. 블룸
리차드오. 쿠퍼
데이비드엘. 풀
Original Assignee
시티에스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시티에스 코포레이션 filed Critical 시티에스 코포레이션
Publication of KR20000016980A publication Critical patent/KR20000016980A/ko
Application granted granted Critical
Publication of KR100612773B1 publication Critical patent/KR100612773B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Attenuators (AREA)
KR1019990031023A 1998-08-10 1999-07-29 저 누화 볼 그리드 어레이 저항망 Expired - Fee Related KR100612773B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9/132081 1998-08-10
US09/132,081 US5977863A (en) 1998-08-10 1998-08-10 Low cross talk ball grid array resistor network
US09/132081 1998-08-10

Publications (2)

Publication Number Publication Date
KR20000016980A KR20000016980A (ko) 2000-03-25
KR100612773B1 true KR100612773B1 (ko) 2006-08-18

Family

ID=22452375

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019990031023A Expired - Fee Related KR100612773B1 (ko) 1998-08-10 1999-07-29 저 누화 볼 그리드 어레이 저항망

Country Status (6)

Country Link
US (1) US5977863A (enExample)
EP (1) EP0980079B1 (enExample)
JP (1) JP2000124015A (enExample)
KR (1) KR100612773B1 (enExample)
DE (1) DE69935051T2 (enExample)
TW (1) TW432398B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6326677B1 (en) 1998-09-04 2001-12-04 Cts Corporation Ball grid array resistor network
US6194979B1 (en) * 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
US6246312B1 (en) 2000-07-20 2001-06-12 Cts Corporation Ball grid array resistor terminator network
US6576489B2 (en) * 2001-05-07 2003-06-10 Applied Materials, Inc. Methods of forming microstructure devices
US6577225B1 (en) 2002-04-30 2003-06-10 Cts Corporation Array resistor network
US6972391B2 (en) * 2002-11-21 2005-12-06 Hadco Santa Clara, Inc. Laser trimming of annular passive components
US7297896B2 (en) * 2002-11-21 2007-11-20 Hadco Santa Clara, Inc. Laser trimming of resistors
AU2003291150A1 (en) * 2002-11-21 2004-06-18 Sanmina-Sci Corporation Laser trimming of resistors
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
US6882266B2 (en) * 2003-01-07 2005-04-19 Cts Corporation Ball grid array resistor network having a ground plane
US7180186B2 (en) * 2003-07-31 2007-02-20 Cts Corporation Ball grid array package
US6946733B2 (en) * 2003-08-13 2005-09-20 Cts Corporation Ball grid array package having testing capability after mounting
US20050062587A1 (en) * 2003-09-24 2005-03-24 Wei-Chun Yang Method and structure of a substrate with built-in via hole resistors
US7342804B2 (en) * 2004-08-09 2008-03-11 Cts Corporation Ball grid array resistor capacitor network
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
JP2007150201A (ja) * 2005-11-30 2007-06-14 Toshiba Corp チップ抵抗器
US7940148B2 (en) * 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7646255B2 (en) * 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
US20090236134A1 (en) * 2008-03-20 2009-09-24 Knecht Thomas A Low frequency ball grid array resonator
KR20160052283A (ko) * 2014-11-04 2016-05-12 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
KR101670140B1 (ko) * 2014-12-15 2016-10-27 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661450A (en) * 1995-11-21 1997-08-26 Sun Microsystems, Inc. Low inductance termination resistor arrays
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
US4300115A (en) * 1980-06-02 1981-11-10 The United States Of America As Represented By The Secretary Of The Army Multilayer via resistors
US4658234A (en) * 1984-06-06 1987-04-14 Alps Electric Co., Ltd. Resistor network
JPH0331046Y2 (enExample) * 1985-03-01 1991-07-01
US4945399A (en) * 1986-09-30 1990-07-31 International Business Machines Corporation Electronic package with integrated distributed decoupling capacitors
DE69117374T2 (de) * 1990-07-25 1996-08-01 Matsushita Electric Ind Co Ltd SiC-Dünnschichtthermistor und Verfahren und Herstellungsverfahren.
JP2637662B2 (ja) * 1992-02-25 1997-08-06 ローム株式会社 チップ型複合電子部品の製造方法及びチップ型ネットワーク抵抗器の製造方法
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
KR0130030B1 (ko) * 1994-08-25 1998-10-01 김광호 반도체 메모리 장치의 컬럼 리던던시 회로 및 그 방법
US5557502A (en) * 1995-03-02 1996-09-17 Intel Corporation Structure of a thermally and electrically enhanced plastic ball grid array package
WO1997030461A1 (en) * 1996-02-15 1997-08-21 Bourns, Inc. Resistor network in ball grid array package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661450A (en) * 1995-11-21 1997-08-26 Sun Microsystems, Inc. Low inductance termination resistor arrays
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier

Also Published As

Publication number Publication date
DE69935051D1 (de) 2007-03-22
TW432398B (en) 2001-05-01
EP0980079B1 (en) 2007-02-07
US5977863A (en) 1999-11-02
JP2000124015A (ja) 2000-04-28
EP0980079A3 (en) 2002-01-02
KR20000016980A (ko) 2000-03-25
EP0980079A2 (en) 2000-02-16
DE69935051T2 (de) 2007-11-15

Similar Documents

Publication Publication Date Title
KR100612773B1 (ko) 저 누화 볼 그리드 어레이 저항망
US6005777A (en) Ball grid array capacitor
US6326677B1 (en) Ball grid array resistor network
EP0423821B1 (en) Surface-mount network device
US5635761A (en) Internal resistor termination in multi-chip module environments
US6256877B1 (en) Method for transforming a substrate with edge contacts into a ball grid array
US5780776A (en) Multilayer circuit board unit
JP2559954B2 (ja) 階段状多層相互接続装置
US6246312B1 (en) Ball grid array resistor terminator network
US6097277A (en) Resistor network with solder sphere connector
JPH0629452A (ja) 集積回路パッケージ及びその製造方法
US7412923B2 (en) Stencil device for accurately applying solder paste to a printed circuit board
US6153447A (en) LSI package and manufacturing method thereof
US5384433A (en) Printed circuit structure including power, decoupling and signal termination
JP2004111967A (ja) 低抵抗高密度信号線をする電子パッケージおよびその製造方法
US6577225B1 (en) Array resistor network
US7084501B2 (en) Interconnecting component
US8324727B2 (en) Low profile discrete electronic components and applications of same
WO1997030461A1 (en) Resistor network in ball grid array package
US5990421A (en) Built in board resistors
JPH05102621A (ja) 導電パターン
US7820490B2 (en) Method for LTCC circuitry
JPH03280496A (ja) 多層基板の電子部品実装構造及びその実装方法
JP2000252779A (ja) Ｒｃフィルタ
JP3337368B2 (ja) 中継基板

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20090803

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100809

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100809

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000