KR100546476B1 - 와이어본딩 장치에서의 볼 형성 장치 - Google Patents

와이어본딩 장치에서의 볼 형성 장치 Download PDF

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Publication number
KR100546476B1
KR100546476B1 KR1020040016365A KR20040016365A KR100546476B1 KR 100546476 B1 KR100546476 B1 KR 100546476B1 KR 1020040016365 A KR1020040016365 A KR 1020040016365A KR 20040016365 A KR20040016365 A KR 20040016365A KR 100546476 B1 KR100546476 B1 KR 100546476B1
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KR
South Korea
Prior art keywords
circuit
current
command pulse
voltage
discharge
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Expired - Fee Related
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KR1020040016365A
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English (en)
Korean (ko)
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KR20040090408A (ko
Inventor
다카하시쿠니유키
사사쿠라가즈마사
Original Assignee
가부시키가이샤 신가와
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Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20040090408A publication Critical patent/KR20040090408A/ko
Application granted granted Critical
Publication of KR100546476B1 publication Critical patent/KR100546476B1/ko
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    • H10W72/0711—
    • H10W72/071—
    • H10W72/01551—
    • H10W72/07511—

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  • Wire Bonding (AREA)
KR1020040016365A 2003-04-16 2004-03-11 와이어본딩 장치에서의 볼 형성 장치 Expired - Fee Related KR100546476B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00111616 2003-04-16
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Publications (2)

Publication Number Publication Date
KR20040090408A KR20040090408A (ko) 2004-10-22
KR100546476B1 true KR100546476B1 (ko) 2006-01-26

Family

ID=33472112

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Application Number Title Priority Date Filing Date
KR1020040016365A Expired - Fee Related KR100546476B1 (ko) 2003-04-16 2004-03-11 와이어본딩 장치에서의 볼 형성 장치

Country Status (3)

Country Link
JP (1) JP3813134B2 (cg-RX-API-DMAC10.html)
KR (1) KR100546476B1 (cg-RX-API-DMAC10.html)
TW (1) TW200428544A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118362A (ko) * 2014-02-13 2016-10-11 가부시키가이샤 신가와 볼 형성 장치, 와이어 본딩 장치 및 볼 형성 방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (ja) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 ワイヤボンダーにおけるボール形成装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160118362A (ko) * 2014-02-13 2016-10-11 가부시키가이샤 신가와 볼 형성 장치, 와이어 본딩 장치 및 볼 형성 방법
KR101897074B1 (ko) * 2014-02-13 2018-09-10 가부시키가이샤 신가와 볼 형성 장치, 와이어 본딩 장치 및 볼 형성 방법

Also Published As

Publication number Publication date
JP3813134B2 (ja) 2006-08-23
TW200428544A (en) 2004-12-16
KR20040090408A (ko) 2004-10-22
JP2004319756A (ja) 2004-11-11
TWI309866B (cg-RX-API-DMAC10.html) 2009-05-11

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