TWI309866B - - Google Patents

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Publication number
TWI309866B
TWI309866B TW093103740A TW93103740A TWI309866B TW I309866 B TWI309866 B TW I309866B TW 093103740 A TW093103740 A TW 093103740A TW 93103740 A TW93103740 A TW 93103740A TW I309866 B TWI309866 B TW I309866B
Authority
TW
Taiwan
Prior art keywords
circuit
current
voltage
discharge
transformer
Prior art date
Application number
TW093103740A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428544A (en
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200428544A publication Critical patent/TW200428544A/zh
Application granted granted Critical
Publication of TWI309866B publication Critical patent/TWI309866B/zh

Links

Classifications

    • H10W72/0711—
    • H10W72/071—
    • H10W72/01551—
    • H10W72/07511—

Landscapes

  • Wire Bonding (AREA)
TW093103740A 2003-04-16 2004-02-17 Ball forming device for wire-bonding device TW200428544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003111616A JP3813134B2 (ja) 2003-04-16 2003-04-16 ワイヤボンディング装置におけるボール形成装置

Publications (2)

Publication Number Publication Date
TW200428544A TW200428544A (en) 2004-12-16
TWI309866B true TWI309866B (cg-RX-API-DMAC10.html) 2009-05-11

Family

ID=33472112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093103740A TW200428544A (en) 2003-04-16 2004-02-17 Ball forming device for wire-bonding device

Country Status (3)

Country Link
JP (1) JP3813134B2 (cg-RX-API-DMAC10.html)
KR (1) KR100546476B1 (cg-RX-API-DMAC10.html)
TW (1) TW200428544A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP5069631B2 (ja) * 2008-07-31 2012-11-07 株式会社フォーエム技術研究所 ワイヤボンダーにおけるボール形成装置
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法

Also Published As

Publication number Publication date
JP3813134B2 (ja) 2006-08-23
TW200428544A (en) 2004-12-16
KR20040090408A (ko) 2004-10-22
JP2004319756A (ja) 2004-11-11
KR100546476B1 (ko) 2006-01-26

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