KR100542671B1 - Semiconductor package and its manufacturing method - Google Patents

Abstract

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a semiconductor package and a method of manufacturing the same, and the object of the present invention is to simplify the number of components and the number of manufacturing steps and to use the same as a multichip module.

To this end, the present invention includes a resin layer having a plurality of recesses formed in a matrix shape, and mounting a semiconductor chip on each recess, and then forming a circuit pattern with conductive ink by screen printing. One end is directly connected to the semiconductor chip. In addition, one multichip module may be implemented through an encapsulation process and a conductive ball fusion process, or a plurality of semiconductor packages may be implemented through a sawing process.

Description

Semiconductor package and its manufacturing method

1 is a cross-sectional view showing a conventional semiconductor package.

2A to 2C are cross-sectional views showing a semiconductor package according to the present invention.

3A to 3F are explanatory views showing a method of manufacturing a semiconductor package according to the present invention.

-Description of the main symbols in the drawings-

101, 102, 103; Semiconductor package according to the present invention

One; Semiconductor chips 1a and 1b; First and second surfaces of the semiconductor chip

2; Input / output pad 10; Circuit board

11; Resin layers 11a and 11b; First side and second side of the resin layer

12; Circuit pattern 12a; Bond Finger

12b; Ball Land 13; Cover Coat

14; Groove 20; Encapsulant

30; Conductive ball 40; Mask

50; Blade

The present invention relates to a semiconductor package and a method of manufacturing the same, and when described in more detail, it is possible to simplify the number of components and manufacturing processes, and also to use the semiconductor package and its manufacture as a multi chip module (MCM). It is about a method.

Recently, semiconductor packages are becoming smaller and thinner, such as chip scale semiconductor packages, micro ball grid array semiconductor packages, and ultra thin semiconductor packages.

Here, the ultra-thin semiconductor package generally refers to a semiconductor package having a very thin through-hole having a predetermined size through-hole formed in the circuit board, a semiconductor chip located inside the through-hole, and conductive balls arranged on one surface of the circuit board.

Of these semiconductor packages, a conventional ultra-thin semiconductor package 100 'is shown in FIG.

As shown, a plurality of electronic circuits are integrated and have a first surface (lower surface) 1a and a second surface (upper surface) 1b, and a plurality of input / output pads 2 on the second surface 1b. Is formed in the center of the semiconductor chip 1, the circuit board 10 is formed with a through hole 15 so that the semiconductor chip 1 is located at the outer periphery of the semiconductor chip 1 Is located.

The circuit board 10 has a resin layer 11 having a first surface (lower surface) 11a and a second surface (upper surface) 11b as a base layer, and a plurality of bonds are formed on the second surface 11b. A circuit pattern 12 formed of a finger 12a and a ball land 12b is formed. The plurality of bond fingers 12a and the ball lands 12b are opened, and the circuit pattern 12 is covered by the cover coat 13. have. In addition, a through hole 15 is formed in the center, and the semiconductor chip 1 is positioned in the through hole 15 as described above. Here, the first surface 1a of the semiconductor chip 1 and the first surface 11a of the circuit board 10 are the same plane.

The input / output pads 2 of the semiconductor chip 1 and the bond fingers 12a of the circuit board 10 are connected to each other by electrical connection means 60 such as conductive wires so as to be electrically connected.

The encapsulant 20 is enclosed in the semiconductor chip 1, the connecting means 60, and a part of the circuit board 10 positioned inside the through hole 15 of the circuit board 10, wherein the semiconductor chip ( The first surface 1a of 1) is exposed to the encapsulant 20 outside.

A plurality of conductive balls 30 are fused to the ball lands 12b of the circuit board 10 so as to be mounted on the motherboard later.

The manufacturing method of the semiconductor package 100 'as described above will be briefly described as follows.

1. A circuit board providing step, wherein a plurality of bond fingers 12a and borland are formed on a second surface 11b of a resin layer 11 having a first surface 11a and a second surface 11b as a base layer. A circuit pattern 12 having a 12b is formed, and the resin layer 11 and the circuit pattern 12 are coated with the cover coat 13 with the bond fingers 12a and the borland 12b open. In the center, a circuit board 10 having through holes 15 formed thereon is provided.

Here, the circuit pattern 12 formed on the circuit board 10 is formed by a complex method such as photomasking, chemical etching, plating, etc. as is well known.

2. A semiconductor chip providing step, comprising: a semiconductor chip 1 having a first surface 1a and a second surface 1b, and having a plurality of input / output pads 2 formed on the second surface 1b; It is located in the through hole 15 of (10). At this time, the closing member is bonded to the first surface 11a of the circuit board 10 so as to close the through hole 15, and the semiconductor chip 1 is placed on the closing member. Of course, the first surfaces 1a and 11a of the semiconductor chip 1 are bonded to the closure member.

3. In the electrical connection step, the input / output pad 2 of the semiconductor chip 1 and the bond finger 12a of the circuit board 10 are mutually connected by the electrical connection means 60, for example, gold wire, aluminum wire, or the like. To be connected.

4. In the encapsulation step, the semiconductor package material is placed in a mold or the like, and epoxy molding compound (Epoxy) is formed in a predetermined region of the semiconductor chip 1, the connecting means 60, and the circuit board 10 in the through hole 15. It is encapsulated with an encapsulant 20 such as a molding compound). In addition, the semiconductor package material may be encapsulated by a glove top using a dispenser.

5. As an input / output terminal forming step, the conductive ball 30 is fused to the ball land 12b of the circuit board 10 to form an input / output terminal.

However, according to the conventional semiconductor package and its manufacturing method, the circuit board, which is a component of the semiconductor package, is manufactured through a process such as photomasking, chemical etching, and various platings, so that the structure and manufacturing method thereof are complicated and expensive. There is a disadvantage of being.

In other words, in the process of manufacturing a semiconductor package, a circuit board manufactured by a separate process is used. As this circuit board is manufactured by a complicated process as is well known, the price is high, and therefore, the price of the semiconductor package is high. There is a problem.

In addition, since electrically conductive wires are generally used to electrically connect the semiconductor chip and the circuit board, there is a problem that the electrical signal path is increased and the electrical resistance is increased.

In addition, the height of the encapsulant should be somewhat higher due to the loop height of the conductive wire, but it is difficult to control the height of the encapsulant because it must be smaller than the height of the conductive ball.

Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and to provide a semiconductor package and a method of manufacturing the same, the components and the manufacturing process is simple and low cost.

In addition, another object of the present invention is to provide a semiconductor package that can be used as a multi-chip module and a method of manufacturing the same.

In order to achieve the above object, the semiconductor package according to the present invention includes a semiconductor chip having a first surface and a second surface, and a plurality of input / output pads formed on the second surface; It has a first surface and a second surface, the second surface includes a resin layer formed with a recess portion of a predetermined depth so that the semiconductor chip is located, and the ball land of a predetermined size radially outside the groove portion, A circuit board formed of a circuit pattern connected to the input / output pad of the semiconductor chip; An encapsulant for encapsulating a region around the recess of the semiconductor chip and the circuit board; It characterized in that it comprises a plurality of conductive balls fused to the ball land of the circuit pattern of the circuit board.

In the circuit board, the depth of the recess is preferably equal to the height of the semiconductor chip.

The circuit pattern of the circuit board may be conductive ink. In addition, the circuit board may be a copper thin film circuit pattern, the circuit pattern and the input and output pads of the semiconductor chip may be connected by a conductive ink.

The circuit board is preferably coated with a cover coat with the borland open to the outside.

The encapsulant may be encapsulated in the entire second surface of the circuit board with the borland open to the outside.

In addition, according to the method for manufacturing a semiconductor package according to the present invention in order to achieve the above object is a substantially rectangular plate shape having a first surface and a second surface, the second surface has a plurality of rows of grooves having a predetermined depth and width Providing a resin layer having a superheat and formed in a matrix; Each recess portion of the resin layer has a first surface and a second surface and a semiconductor chip having a plurality of input / output pads is mounted on the second surface, so that the first surface of the semiconductor chip is bonded to the bottom surface of the recess portion. Making a step; Forming a circuit pattern on a second surface of the resin layer on the outer circumference of the recess, wherein one end of the circuit pattern is connected to an input / output pad of the semiconductor chip and the other end is formed of a ball land on the second surface of the resin layer; ; Encapsulating the recess, the semiconductor chip, etc. with an encapsulant to protect it from the external environment; It characterized in that it comprises a step of fusion bonding the conductive ball to each of the ball land of the resin layer.

The circuit pattern forming step is preferably formed by screen printing using a conductive ink.

The method may further include coating a cover coat on the second surface of the resin layer so that the ball land of the circuit pattern is opened to the outside after the circuit pattern forming step.

After the conductive ball fusion step, the step of sawing the resin layer in a plurality of horizontal and vertical directions may be further included in the singulation of a single semiconductor package.

In addition, the method for manufacturing a semiconductor package according to the present invention in order to achieve the above object is a substantially rectangular plate shape having a first surface and a second surface, the second surface grooves having a predetermined depth and width in a plurality of rows and columns Providing a circuit board having a resin layer having a matrix shape, and having circuit patterns having a plurality of bond fingers and ball lands formed on the second circumferential edge of each recess; Each recess of the circuit board has a semiconductor chip having a first surface and a second surface and a plurality of input / output pads are formed on the second surface, and the first surface of the semiconductor chip is bonded to the bottom surface of the recess. Performing a step; Interconnecting the input / output pads of the semiconductor chip and the bond fingers of the circuit board by screen printing using conductive ink; Encapsulating the recess, the semiconductor chip, etc. with an encapsulant to protect it from the external environment; It characterized in that it comprises a step of fusion bonding the conductive ball to each of the ball land of the resin layer.

After the conductive ball fusion step, the step of singulating the circuit board in a plurality of horizontal and vertical directions may be further included in the singular semiconductor package.

According to the semiconductor package and the manufacturing method according to the present invention as described above, instead of the conventional manufacturing method (photomasking, etching, plating, etc.) of a complicated circuit board, a circuit directly connected to the semiconductor chip during the manufacturing process of the semiconductor package By providing the substrate, the total number of processes can be reduced and the cost can be reduced.

In addition, in the completed semiconductor package, the circuit pattern of the circuit board is directly connected to the semiconductor chip instead of the conventional conductive wire, so that its components are reduced and its electrical resistance is reduced, thereby improving electrical performance.

In addition, by directly connecting the circuit board and the semiconductor chip by the conductive ink, the loop height thereof is small, and the height of the encapsulant can be easily controlled.

In addition, a plurality of grooves may be formed in one circuit board or resin layer, and the grooves may be manufactured with semiconductor chips mounted on each of the grooves, and thus may be used as a multi-chip module.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

2A to 2C are cross-sectional views showing semiconductor packages 101, 102 and 103 according to the present invention.

As shown, a semiconductor chip 1 having a first surface 1a (lower surface) and a second surface 1b (upper surface) and having a plurality of input / output pads 2 formed on the second surface 1b is formed. It is provided.

In addition, the first surface 11a (lower surface) and the second surface 11b (upper surface) have a recessed portion 14 having a predetermined depth so that the semiconductor chip 1 can be positioned on the second surface 11b. ) Is provided with a resin layer 11, the circuit pattern 10 including a plurality of ball lands (12b) is provided on the second surface (11b) of the outer side of the groove portion (14) It consists of:

The semiconductor chip 1 has a first surface 1a adhered to the bottom surface of the recess 14 of the circuit board 10 with an adhesive or a double-sided adhesive tape, and the thickness of the semiconductor chip 1 is It is preferable to form similar to the depth of the groove portion (14).

As is well known, the thickness of the semiconductor chip 1 may be preferably based on a back grinding method of a wafer. In addition, by adjusting the depth of the groove 14 itself to match the thickness of the semiconductor chip 1 or through the entire groove 14, the first surface (1a) and the circuit board of the semiconductor chip 1 The first surface 11a of (10) may be the same surface.

In addition, although the width of the recess 14 will be described below, the width of the recess 14 is preferably similar to that of the semiconductor chip 1.

Meanwhile, the circuit pattern 12 of the circuit board 10 may be formed of a conductive ink, in which case the conductive ink is directly connected to the input / output pad 2 of the semiconductor chip 1 (FIG. 2A). And FIG. 2C)

In addition, the circuit pattern 12 of the circuit board 10 may be formed of a conventional copper thin film, and in this case, the circuit pattern 12 may be formed on the input / output pad 2 of the semiconductor chip 1 by conductive ink. (See Figure 2b).

In addition, the circuit board 10 is coated with a cover coat 13 made of a polymer resin so that the second surface 11b of the circuit board 10 is opened so that the borland 12b is opened outwardly (FIGS. 2A and 2B). Reference)

Subsequently, the area around the recess 14 of the semiconductor chip 1 and the circuit board 10 is sealed with the encapsulant 20 so as to be protected from the external environment. The encapsulant 20 may be a conventional epoxy molding compound, a liquid glove top, or the like.

The encapsulant 20 may also serve as a cover coat as shown in FIG. 2C. That is, the encapsulant 20 encapsulates not only the recess 14 and the semiconductor chip 1 of the circuit board 10 but also the entire second surface 11b of the circuit board 10 except for the borland 12b. It is also possible to omit the use of the cover coat 13.

Conductive balls 30, such as solder balls, are welded to the ball lands 12b of the circuit patterns 12 of the circuit board 10 so that they can be mounted on the motherboard later.

Accordingly, the semiconductor chip 1 and the motherboard exchange electrical signals through the circuit pattern 12 formed by the conductive ink and the conductive balls 30, thereby shortening the electrical signal path and reducing the electrical resistance. In the semiconductor package 102 shown in FIG. 2B, the input / output pad 2 of the semiconductor chip 1 is connected to the circuit pattern 12 formed of a copper thin film through the conductive ink CI, and thus the electrical path is It is formed through the conductive ink (CI), the circuit pattern 12 formed of a copper thin film and the conductive ball (30).

3A to 3F are explanatory views showing a method of manufacturing a semiconductor package according to the present invention.

1.A step of providing a resin layer, which is a substantially rectangular plate shape having a first surface 11a (lower surface) and a second surface 11b (upper surface), wherein the recessed portion has a predetermined depth and width on the second surface 11b. 14 provides a resin layer 11 having a plurality of rows and columns and formed in a matrix form (see Fig. 3A).

2. In the semiconductor chip mounting step, each recess 14 of the resin layer 11 has a first surface 1a and a second surface 1b and a plurality of input / output pads on the second surface 1b. The semiconductor chip 1 in which (2) was formed is mounted. At this time, the first surface 1a of the semiconductor chip 1 is adhered to the bottom surface of the recess by adhesive or double-sided adhesive tape or the like (see FIG. 3B).

3. In the circuit pattern forming step, a circuit pattern (not shown) is formed on the second surface 11b of the recess 14 of the resin layer 11 on the outer circumference, and one end of the circuit pattern is formed on the semiconductor chip. The other end is connected to the input / output pad of (1) and the other end allows the borland to be formed on the second surface 11b of the resin layer 11 (see FIGS. 3C and 3D).

In this case, the circuit pattern forming step is formed by screen printing using a conductive ink, the screen printing method will be described briefly as follows.

First, a mask 40 is formed through and designed in the form of a circuit pattern, and the mask 40 is brought into close contact with the mask 40 in a state aligned with the second surface 11b of the resin layer 11. Subsequently, the conductive ink is sprayed onto the mask 40 or the conductive ink is sprinkled and the conductive ink is pushed to one side with the blade 50 on the mask 40. Then, the conductive ink is formed on the second surface 11b of the resin layer 11 along the shape of the circuit pattern formed through the mask 40. Then, the mask 40 is removed and the conductive ink is cured.

On the other hand, the width of the semiconductor chip 1 and the width of the recess 14 formed in the resin layer 11 is preferably formed similarly. That is, since the conductive ink used in the circuit pattern forming step has a very high viscosity liquid type, the conductive ink may be broken by gravity when the distance between the semiconductor chip 1 and the sidewall of the recess 14 becomes far. Because there is.

After the circuit pattern forming step as described above may be coated with a cover coat made of a polymer resin to protect the circuit pattern from the external environment. At this time, the ball land of the circuit pattern to be opened to the outside.

4. In the encapsulation step, the encapsulation portion 14 and the semiconductor chip 1 of the resin layer 11 are encapsulated using an encapsulant 20 such as an epoxy molding compound or a glove top to protect the external environment. (See Figure 3e)

Here, the encapsulation step may be formed on the entire second surface 11b of the resin layer 11 when the cover coat 13 is not coated. At this time, the ball land 12b of the circuit pattern 12 is opened to the outside.

5. Conductive ball fusion step, in which the conductive ball 30 such as solder balls are fused to each of the ball lands 12b opened toward the outside of the circuit pattern 12 of the resin layer 11 to be mounted on the motherboard. (Fig. 3f)

The semiconductor package as described above has a plurality of semiconductor chips 1 mounted on one resin layer 11, which means that the semiconductor package 1 may be used as a multi-chip module. That is, by mounting a plurality of semiconductor chips 1 having the same or different functions in the one resin layer 11, a highly functional multi-chip module can be obtained.

After the fusion step of the conductive balls 30 is completed as described above, the separated semiconductor packages may be obtained by sawing the resin layer 11 in a plurality of horizontal and vertical directions.

In the manufacturing method, the semiconductor chip 1 and the circuit pattern 12 are directly connected during the process of forming the circuit pattern 12, but a conventional circuit board 10 may be used. That is, the circuit pattern 12 having the bond finger 12a and the ball land 12b includes a circuit board 10 formed of a copper thin film, and the bond finger 12a of the semiconductor chip 1 and the circuit pattern 12 is provided. ) Can be connected to each other by the screen printing method using a conductive ink.

As described above, although the present invention has been described with reference to the above embodiments, the present invention is not limited thereto, and various modified embodiments may be possible without departing from the scope and spirit of the present invention.

Therefore, according to the semiconductor package and the manufacturing method thereof according to the present invention, instead of the manufacturing method (photomasking, etching, plating, etc.) of a complicated circuit board as in the prior art, a semiconductor substrate is directly connected to the semiconductor chip during the manufacturing process of the semiconductor package. As a result, the overall number of processes is reduced and the cost can be reduced.

In addition, in the completed semiconductor package, the circuit pattern of the circuit board is directly connected to the semiconductor chip instead of the conductive wire as in the related art, thereby reducing the components thereof and reducing the electrical resistance, thereby improving the electrical performance.

In addition, by directly connecting the circuit board and the semiconductor chip by the conductive ink, the loop height thereof is small, and the height of the encapsulant can be easily controlled.

In addition, a plurality of grooves may be formed in one circuit board or resin layer, and the grooves may be manufactured with semiconductor chips mounted on each of the grooves, and thus may be used as a multi-chip module.

Claims (12)

delete A semiconductor chip having a first surface and a second surface and having a plurality of input / output pads formed thereon; It has a first surface and a second surface, the second surface includes a resin layer formed with a recess portion of a predetermined depth so that the semiconductor chip is located, and the ball land of a predetermined size radially outside the groove portion, A circuit board formed of a circuit pattern connected to the input / output pad of the semiconductor chip; An encapsulant for encapsulating a region around the recess of the semiconductor chip and the circuit board; It includes a plurality of conductive balls fused to the ball land of the circuit pattern of the circuit board, The circuit board is a semiconductor package, characterized in that the depth of the groove portion is equal to the height of the semiconductor chip. The semiconductor package of claim 2, wherein the circuit pattern of the circuit board is conductive ink. The semiconductor package of claim 2, wherein the circuit board is formed of a copper thin film, and the circuit pattern and the input / output pad of the semiconductor chip are connected by conductive ink. The semiconductor package of claim 2, wherein the circuit board is coated with a cover coat so that the ball land is opened outward. The semiconductor package of claim 2, wherein the encapsulant is encapsulated in the entire second surface of the circuit board so that the borland is opened outward. delete Providing a resin layer formed in a substantially rectangular plate shape having a first surface and a second surface, wherein the groove portion having a predetermined depth and width has a plurality of rows and columns and formed in a matrix form; Each recess portion of the resin layer has a first surface and a second surface and a semiconductor chip having a plurality of input / output pads is mounted on the second surface, so that the first surface of the semiconductor chip is bonded to the bottom surface of the recess portion. To do that, Forming a circuit pattern on a second surface of the resin layer on the outer circumference of the recess, wherein one end of the circuit pattern is connected to an input / output pad of the semiconductor chip and the other end is formed of a ball land on the second surface of the resin layer; , Encapsulating the recess, the semiconductor chip, etc. with an encapsulant to protect it from the external environment; Fusing each conductive ball to the ball land of the resin layer, The circuit pattern forming step is a method of manufacturing a semiconductor package, characterized in that formed by screen printing using a conductive ink. The method of claim 8, further comprising coating a cover coat on the second surface of the resin layer after the circuit pattern forming step so that the ball land of the circuit pattern is opened outward. The method of claim 8, further comprising singulating the resin layer in a plurality of horizontal and vertical directions after the conductive ball fusion step to singulate the individual semiconductor packages. delete A substantially rectangular plate shape having a first surface and a second surface, wherein the second surface is provided with a resin layer formed in a matrix form with a plurality of rows and columns of groove portions having a predetermined depth and width, and the outer periphery of each groove portion. Providing a circuit board having a circuit pattern having a plurality of bond fingers and ball lands formed on a second surface thereof; Each recess of the circuit board has a semiconductor chip having a first surface and a second surface and a plurality of input / output pads are formed on the second surface, and the first surface of the semiconductor chip is bonded to the bottom surface of the recess. To do that, Interconnecting the input / output pads of the semiconductor chip and the bond fingers of the circuit board by screen printing using conductive ink; Encapsulating the recess, the semiconductor chip, etc. with an encapsulant to protect it from the external environment; Fusing each conductive ball to the ball land of the resin layer, And a step of singulating the circuit board in a plurality of horizontal and vertical directions after the conductive ball fusion step to singulate the individual semiconductor packages.

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