KR100535198B1 - 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 - Google Patents

처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 Download PDF

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Publication number
KR100535198B1
KR100535198B1 KR10-2000-7001776A KR20007001776A KR100535198B1 KR 100535198 B1 KR100535198 B1 KR 100535198B1 KR 20007001776 A KR20007001776 A KR 20007001776A KR 100535198 B1 KR100535198 B1 KR 100535198B1
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KR
South Korea
Prior art keywords
article
clamp
treated
shield
screen
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR10-2000-7001776A
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English (en)
Korean (ko)
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KR20010023152A (ko
Inventor
코프로렌즈
랑하인리히페터
슈나이더라인하르트
Original Assignee
아토테크 도이칠란드 게엠베하
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Publication of KR20010023152A publication Critical patent/KR20010023152A/ko
Application granted granted Critical
Publication of KR100535198B1 publication Critical patent/KR100535198B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
  • Control Of Metal Rolling (AREA)
KR10-2000-7001776A 1997-08-21 1998-08-19 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법 Expired - Lifetime KR100535198B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19736352A DE19736352C1 (de) 1997-08-21 1997-08-21 Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
DE19736352.0 1997-08-21
PCT/DE1998/002503 WO1999010568A2 (de) 1997-08-21 1998-08-19 Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut

Publications (2)

Publication Number Publication Date
KR20010023152A KR20010023152A (ko) 2001-03-26
KR100535198B1 true KR100535198B1 (ko) 2005-12-08

Family

ID=7839698

Family Applications (2)

Application Number Title Priority Date Filing Date
KR10-2000-7001776A Expired - Lifetime KR100535198B1 (ko) 1997-08-21 1998-08-19 처리할 물품상의 전기적 접촉점상의 금속층의 두께를 균일화하기 위한 장치 및 방법
KR1020017001804A Expired - Lifetime KR100626130B1 (ko) 1997-08-21 1999-07-13 전기화학 처리 장치 및 전해 처리되는 인쇄기판재료로의 전류 공급 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020017001804A Expired - Lifetime KR100626130B1 (ko) 1997-08-21 1999-07-13 전기화학 처리 장치 및 전해 처리되는 인쇄기판재료로의 전류 공급 방법

Country Status (11)

Country Link
US (2) US6319383B1 (enExample)
EP (1) EP1007766B1 (enExample)
JP (1) JP4194238B2 (enExample)
KR (2) KR100535198B1 (enExample)
CN (1) CN1158412C (enExample)
AT (1) ATE217036T1 (enExample)
BR (1) BR9811978A (enExample)
CA (1) CA2301315A1 (enExample)
DE (2) DE19736352C1 (enExample)
TW (1) TW420727B (enExample)
WO (1) WO1999010568A2 (enExample)

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DE10215463C1 (de) * 2002-03-28 2003-07-24 Atotech Deutschland Gmbh Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück
DE10340888B3 (de) 2003-09-04 2005-04-21 Atotech Deutschland Gmbh Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung
US20060037865A1 (en) * 2004-08-19 2006-02-23 Rucker Michael H Methods and apparatus for fabricating gas turbine engines
JP4700406B2 (ja) * 2005-05-13 2011-06-15 日本メクトロン株式会社 シート状製品のめっき方法
DE102005024102A1 (de) * 2005-05-25 2006-11-30 Atotech Deutschland Gmbh Verfahren, Klammer und Vorrichtung zum Transport eines Behandlungsgutes in einer Elektrolyseanlage
US20060286024A1 (en) * 2005-06-15 2006-12-21 Baker R Terry K Synthesis and cleaving of carbon nanochips
US6979229B1 (en) * 2005-06-24 2005-12-27 Sunpex Technology Co., Ltd. Electrical connector assembly for a vehicle
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
CN101343771B (zh) * 2007-07-13 2010-10-06 富葵精密组件(深圳)有限公司 电镀装置
DE102009057466A1 (de) * 2009-12-03 2011-06-09 Hübel, Egon, Dipl.-Ing. (FH) Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen
NL2005480C2 (nl) 2010-10-07 2012-04-11 Meco Equip Eng Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat.
DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
DE102012019389B4 (de) * 2012-10-02 2018-03-29 Atotech Deutschland Gmbh Haltevorrichtung für eine Ware und Behandlungsverfahren
US9362440B2 (en) * 2012-10-04 2016-06-07 International Business Machines Corporation 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels
CN104805490A (zh) * 2015-04-29 2015-07-29 广汽吉奥汽车有限公司 一种电镀单体零件、端部电镀结构及电镀方法
JP6469168B2 (ja) * 2017-05-22 2019-02-13 丸仲工業株式会社 水平搬送メッキ処理装置における板状被処理物のクランプ治具
JP6893849B2 (ja) * 2017-08-16 2021-06-23 住友電気工業株式会社 プリント配線板用めっき装置及び金属製治具
JP2021183587A (ja) 2020-05-22 2021-12-02 武田薬品工業株式会社 複素環化合物
CN215925114U (zh) * 2021-01-30 2022-03-01 厦门海辰新能源科技有限公司 导电夹及镀膜机
EP4206364A1 (en) 2022-01-03 2023-07-05 Atotech Deutschland GmbH & Co. KG Device for gripping a workpiece, method of manufacturing the device, and conveying system and apparatus for electrochemical surface treatment comprising at least one such device
CN114703533B (zh) * 2022-04-06 2023-08-29 天津市津荣天晟金属表面处理有限公司 微型断路器动触头局部镀厚银生产线
JP2023180832A (ja) * 2022-06-10 2023-12-21 株式会社Ｓｃｒｅｅｎホールディングス めっき装置およびめっき方法

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US2248718A (en) * 1939-04-01 1941-07-08 Pittsburgh Plate Glass Co Connector clip
US2339996A (en) * 1941-08-11 1944-01-25 Grace Dehnert Kight Breaker point
DE2512762C3 (de) 1975-03-22 1978-05-11 Chrom-Schmitt Kg, 7570 Baden-Baden Vorrichtung zum Fuhren von Werkstücken in galvanischen Metallisierungs-, insbesondere Verchromungsanlagen
US4085997A (en) * 1977-03-30 1978-04-25 The Boeing Company Anodize clamp
DE3027751A1 (de) * 1980-07-22 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum galvanischen metallisieren von substraten
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DE4005209A1 (de) * 1990-02-20 1991-08-22 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage
DE4106733A1 (de) 1991-03-02 1992-09-03 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)
EP0578699B1 (de) 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
DE9309768U1 (de) * 1993-07-01 1993-11-04 Metzka GmbH, 90596 Schwanstetten Kontaktiereinrichtung für ein Leiterplattengestell einer Galvanikanlage
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Also Published As

Publication number Publication date
CN1158412C (zh) 2004-07-21
TW420727B (en) 2001-02-01
WO1999010568A3 (de) 1999-08-19
KR20010023152A (ko) 2001-03-26
DE59803992D1 (de) 2002-06-06
CN1267341A (zh) 2000-09-20
CA2301315A1 (en) 1999-03-04
US6887113B1 (en) 2005-05-03
JP2001514333A (ja) 2001-09-11
KR100626130B1 (ko) 2006-09-20
EP1007766B1 (de) 2002-05-02
JP4194238B2 (ja) 2008-12-10
KR20010072416A (ko) 2001-07-31
ATE217036T1 (de) 2002-05-15
EP1007766A2 (de) 2000-06-14
BR9811978A (pt) 2000-08-15
WO1999010568A2 (de) 1999-03-04
DE19736352C1 (de) 1998-12-10
US6319383B1 (en) 2001-11-20

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