CA2301315A1 - Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated - Google Patents
Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated Download PDFInfo
- Publication number
- CA2301315A1 CA2301315A1 CA002301315A CA2301315A CA2301315A1 CA 2301315 A1 CA2301315 A1 CA 2301315A1 CA 002301315 A CA002301315 A CA 002301315A CA 2301315 A CA2301315 A CA 2301315A CA 2301315 A1 CA2301315 A1 CA 2301315A1
- Authority
- CA
- Canada
- Prior art keywords
- items
- treated
- conveyance
- clamps
- shields
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000009713 electroplating Methods 0.000 claims abstract description 53
- 238000001465 metallisation Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000011888 foil Substances 0.000 claims abstract description 16
- 230000005684 electric field Effects 0.000 claims abstract description 8
- 238000009826 distribution Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 description 31
- 229920003023 plastic Polymers 0.000 description 31
- 239000000463 material Substances 0.000 description 30
- 239000003792 electrolyte Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000779 depleting effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- -1 poly(ethylene trichlorofluoroethylene) Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 1
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Control Of Metal Rolling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19736352A DE19736352C1 (de) | 1997-08-21 | 1997-08-21 | Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen |
| DE19736352.0 | 1997-08-21 | ||
| PCT/DE1998/002503 WO1999010568A2 (de) | 1997-08-21 | 1998-08-19 | Vorrichtung und verfahren zum vergleichmässigen der dicke von metallschichten an elektrischen kontaktierstellen auf behandlungsgut |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2301315A1 true CA2301315A1 (en) | 1999-03-04 |
Family
ID=7839698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002301315A Abandoned CA2301315A1 (en) | 1997-08-21 | 1998-08-19 | Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US6319383B1 (enExample) |
| EP (1) | EP1007766B1 (enExample) |
| JP (1) | JP4194238B2 (enExample) |
| KR (2) | KR100535198B1 (enExample) |
| CN (1) | CN1158412C (enExample) |
| AT (1) | ATE217036T1 (enExample) |
| BR (1) | BR9811978A (enExample) |
| CA (1) | CA2301315A1 (enExample) |
| DE (2) | DE19736352C1 (enExample) |
| TW (1) | TW420727B (enExample) |
| WO (1) | WO1999010568A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8567590B2 (en) | 2005-05-25 | 2013-10-29 | Atotech Deutschland Gmbh | Method, clip and device for transporting an article to be treated in an electrolytic system |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10215463C1 (de) * | 2002-03-28 | 2003-07-24 | Atotech Deutschland Gmbh | Durchlaufanlage und Verfahren zum elektrolytischen Metallisieren von Werkstück |
| DE10340888B3 (de) | 2003-09-04 | 2005-04-21 | Atotech Deutschland Gmbh | Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung |
| US20060037865A1 (en) * | 2004-08-19 | 2006-02-23 | Rucker Michael H | Methods and apparatus for fabricating gas turbine engines |
| JP4700406B2 (ja) * | 2005-05-13 | 2011-06-15 | 日本メクトロン株式会社 | シート状製品のめっき方法 |
| US20060286024A1 (en) * | 2005-06-15 | 2006-12-21 | Baker R Terry K | Synthesis and cleaving of carbon nanochips |
| US6979229B1 (en) * | 2005-06-24 | 2005-12-27 | Sunpex Technology Co., Ltd. | Electrical connector assembly for a vehicle |
| DE102005039100A1 (de) * | 2005-08-09 | 2007-02-15 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung |
| CN101343771B (zh) * | 2007-07-13 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | 电镀装置 |
| DE102009057466A1 (de) * | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen |
| NL2005480C2 (nl) | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
| DE102012206800B3 (de) * | 2012-04-25 | 2013-09-05 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück |
| DE102012019389B4 (de) * | 2012-10-02 | 2018-03-29 | Atotech Deutschland Gmbh | Haltevorrichtung für eine Ware und Behandlungsverfahren |
| US9362440B2 (en) * | 2012-10-04 | 2016-06-07 | International Business Machines Corporation | 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels |
| CN104805490A (zh) * | 2015-04-29 | 2015-07-29 | 广汽吉奥汽车有限公司 | 一种电镀单体零件、端部电镀结构及电镀方法 |
| JP6469168B2 (ja) * | 2017-05-22 | 2019-02-13 | 丸仲工業株式会社 | 水平搬送メッキ処理装置における板状被処理物のクランプ治具 |
| JP6893849B2 (ja) * | 2017-08-16 | 2021-06-23 | 住友電気工業株式会社 | プリント配線板用めっき装置及び金属製治具 |
| JP2021183587A (ja) | 2020-05-22 | 2021-12-02 | 武田薬品工業株式会社 | 複素環化合物 |
| CN215925114U (zh) * | 2021-01-30 | 2022-03-01 | 厦门海辰新能源科技有限公司 | 导电夹及镀膜机 |
| EP4206364A1 (en) | 2022-01-03 | 2023-07-05 | Atotech Deutschland GmbH & Co. KG | Device for gripping a workpiece, method of manufacturing the device, and conveying system and apparatus for electrochemical surface treatment comprising at least one such device |
| CN114703533B (zh) * | 2022-04-06 | 2023-08-29 | 天津市津荣天晟金属表面处理有限公司 | 微型断路器动触头局部镀厚银生产线 |
| JP2023180832A (ja) * | 2022-06-10 | 2023-12-21 | 株式会社Ｓｃｒｅｅｎホールディングス | めっき装置およびめっき方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2248718A (en) * | 1939-04-01 | 1941-07-08 | Pittsburgh Plate Glass Co | Connector clip |
| US2339996A (en) * | 1941-08-11 | 1944-01-25 | Grace Dehnert Kight | Breaker point |
| DE2512762C3 (de) | 1975-03-22 | 1978-05-11 | Chrom-Schmitt Kg, 7570 Baden-Baden | Vorrichtung zum Fuhren von Werkstücken in galvanischen Metallisierungs-, insbesondere Verchromungsanlagen |
| US4085997A (en) * | 1977-03-30 | 1978-04-25 | The Boeing Company | Anodize clamp |
| DE3027751A1 (de) * | 1980-07-22 | 1982-02-18 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum galvanischen metallisieren von substraten |
| US4385967A (en) | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
| DE3612220A1 (de) | 1986-04-11 | 1987-10-15 | Schering Ag | Haltezange |
| DE3624481A1 (de) * | 1986-07-19 | 1988-01-28 | Schering Ag | Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden |
| US4755271A (en) | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| DE3726571C1 (en) * | 1987-08-10 | 1989-03-23 | Siemens Ag | Screening and positioning frame |
| US4879007B1 (en) * | 1988-12-12 | 1999-05-25 | Process Automation Int L Ltd | Shield for plating bath |
| DE4005209A1 (de) * | 1990-02-20 | 1991-08-22 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage |
| DE4106733A1 (de) | 1991-03-02 | 1992-09-03 | Schering Ag | Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii) |
| EP0578699B1 (de) | 1991-04-12 | 1995-07-12 | Siemens Aktiengesellschaft | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten |
| DE9309768U1 (de) * | 1993-07-01 | 1993-11-04 | Metzka GmbH, 90596 Schwanstetten | Kontaktiereinrichtung für ein Leiterplattengestell einer Galvanikanlage |
| DE19539868C1 (de) * | 1995-10-26 | 1997-02-20 | Lea Ronal Gmbh | Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung |
| DE19612555C2 (de) | 1996-03-29 | 1998-03-19 | Atotech Deutschland Gmbh | Verfahren zur selektiven elektrochemischen Behandlung von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens |
| AU2882197A (en) * | 1996-05-30 | 1998-01-05 | M + B Plating Racks, Inc. | Holding clamp for electroplating articles in a bath |
| US6132583A (en) * | 1997-05-16 | 2000-10-17 | Technic, Inc. | Shielding method and apparatus for use in electroplating process |
| US5985123A (en) * | 1997-07-09 | 1999-11-16 | Koon; Kam Kwan | Continuous vertical plating system and method of plating |
| DE29721741U1 (de) | 1997-12-09 | 1998-03-05 | Strecker, Günther, 74080 Heilbronn | Klammerartige Haltevorrichtung für Tauchgalvanisierung |
-
1997
- 1997-08-21 DE DE19736352A patent/DE19736352C1/de not_active Expired - Fee Related
-
1998
- 1998-08-03 TW TW087112726A patent/TW420727B/zh not_active IP Right Cessation
- 1998-08-19 CA CA002301315A patent/CA2301315A1/en not_active Abandoned
- 1998-08-19 BR BR9811978-8A patent/BR9811978A/pt not_active Application Discontinuation
- 1998-08-19 JP JP2000507870A patent/JP4194238B2/ja not_active Expired - Lifetime
- 1998-08-19 AT AT98951219T patent/ATE217036T1/de not_active IP Right Cessation
- 1998-08-19 CN CNB988082500A patent/CN1158412C/zh not_active Expired - Lifetime
- 1998-08-19 WO PCT/DE1998/002503 patent/WO1999010568A2/de not_active Ceased
- 1998-08-19 KR KR10-2000-7001776A patent/KR100535198B1/ko not_active Expired - Lifetime
- 1998-08-19 EP EP98951219A patent/EP1007766B1/de not_active Expired - Lifetime
- 1998-08-19 US US09/485,785 patent/US6319383B1/en not_active Expired - Fee Related
- 1998-08-19 DE DE59803992T patent/DE59803992D1/de not_active Expired - Lifetime
-
1999
- 1999-07-13 US US09/762,759 patent/US6887113B1/en not_active Expired - Lifetime
- 1999-07-13 KR KR1020017001804A patent/KR100626130B1/ko not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8567590B2 (en) | 2005-05-25 | 2013-10-29 | Atotech Deutschland Gmbh | Method, clip and device for transporting an article to be treated in an electrolytic system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1158412C (zh) | 2004-07-21 |
| KR100535198B1 (ko) | 2005-12-08 |
| TW420727B (en) | 2001-02-01 |
| WO1999010568A3 (de) | 1999-08-19 |
| KR20010023152A (ko) | 2001-03-26 |
| DE59803992D1 (de) | 2002-06-06 |
| CN1267341A (zh) | 2000-09-20 |
| US6887113B1 (en) | 2005-05-03 |
| JP2001514333A (ja) | 2001-09-11 |
| KR100626130B1 (ko) | 2006-09-20 |
| EP1007766B1 (de) | 2002-05-02 |
| JP4194238B2 (ja) | 2008-12-10 |
| KR20010072416A (ko) | 2001-07-31 |
| ATE217036T1 (de) | 2002-05-15 |
| EP1007766A2 (de) | 2000-06-14 |
| BR9811978A (pt) | 2000-08-15 |
| WO1999010568A2 (de) | 1999-03-04 |
| DE19736352C1 (de) | 1998-12-10 |
| US6319383B1 (en) | 2001-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |