KR100427852B1 - 유도및다중정전결합된플라즈마반응기 - Google Patents
유도및다중정전결합된플라즈마반응기 Download PDFInfo
- Publication number
- KR100427852B1 KR100427852B1 KR1019960014361A KR19960014361A KR100427852B1 KR 100427852 B1 KR100427852 B1 KR 100427852B1 KR 1019960014361 A KR1019960014361 A KR 1019960014361A KR 19960014361 A KR19960014361 A KR 19960014361A KR 100427852 B1 KR100427852 B1 KR 100427852B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrodes
- chamber
- power
- induction coil
- capacitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/436,513 | 1995-05-08 | ||
| US08/436,513 US5710486A (en) | 1995-05-08 | 1995-05-08 | Inductively and multi-capacitively coupled plasma reactor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960043009A KR960043009A (ko) | 1996-12-21 |
| KR100427852B1 true KR100427852B1 (ko) | 2004-09-01 |
Family
ID=23732717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960014361A Expired - Fee Related KR100427852B1 (ko) | 1995-05-08 | 1996-05-03 | 유도및다중정전결합된플라즈마반응기 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US5710486A (enExample) |
| EP (1) | EP0742577A3 (enExample) |
| JP (1) | JP3814012B2 (enExample) |
| KR (1) | KR100427852B1 (enExample) |
| TW (1) | TW302592B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101007822B1 (ko) | 2003-07-14 | 2011-01-13 | 주성엔지니어링(주) | 혼합형 플라즈마 발생 장치 |
| KR20170028145A (ko) * | 2015-09-03 | 2017-03-13 | 에이피시스템 주식회사 | 기판 처리 장치 |
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| US2223399A (en) * | 1935-10-14 | 1940-12-03 | Ets Claude Paz & Silva | Supply of electric discharge tubes excited inductively |
| EP0403234A3 (en) * | 1989-06-14 | 1992-10-21 | LUCAS INDUSTRIES public limited company | Servo mechanisms for rotary shafts |
| DE3923661A1 (de) * | 1989-07-18 | 1991-01-24 | Leybold Ag | Schaltungsanordnung fuer die anpassung der impedanz einer plasmastrecke an einen hochfrequenzgenerator |
| JP2928555B2 (ja) * | 1989-09-20 | 1999-08-03 | 株式会社日立製作所 | プラズマ処理装置 |
| DE3942964A1 (de) * | 1989-12-23 | 1991-06-27 | Leybold Ag | Einrichtung fuer die erzeugung eines plasmas |
| JP3381916B2 (ja) * | 1990-01-04 | 2003-03-04 | マトソン テクノロジー,インコーポレイテッド | 低周波誘導型高周波プラズマ反応装置 |
| JPH0521193A (ja) * | 1991-07-09 | 1993-01-29 | Nippon Steel Corp | 高周波プラズマ装置 |
| US5231334A (en) * | 1992-04-15 | 1993-07-27 | Texas Instruments Incorporated | Plasma source and method of manufacturing |
| US5241245A (en) * | 1992-05-06 | 1993-08-31 | International Business Machines Corporation | Optimized helical resonator for plasma processing |
| DE69531880T2 (de) * | 1994-04-28 | 2004-09-09 | Applied Materials, Inc., Santa Clara | Verfahren zum Betreiben eines CVD-Reaktors hoher Plasma-Dichte mit kombinierter induktiver und kapazitiver Einkopplung |
| US5783101A (en) * | 1994-09-16 | 1998-07-21 | Applied Materials, Inc. | High etch rate residue free metal etch process with low frequency high power inductive coupled plasma |
| US5753044A (en) * | 1995-02-15 | 1998-05-19 | Applied Materials, Inc. | RF plasma reactor with hybrid conductor and multi-radius dome ceiling |
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1995
- 1995-05-08 US US08/436,513 patent/US5710486A/en not_active Expired - Lifetime
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1996
- 1996-05-03 KR KR1019960014361A patent/KR100427852B1/ko not_active Expired - Fee Related
- 1996-05-07 EP EP96107209A patent/EP0742577A3/en not_active Withdrawn
- 1996-05-08 JP JP11378296A patent/JP3814012B2/ja not_active Expired - Fee Related
- 1996-06-15 TW TW085107241A patent/TW302592B/zh active
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1997
- 1997-08-07 US US08/908,533 patent/US6020686A/en not_active Expired - Lifetime
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| EP0359153A2 (en) * | 1988-09-15 | 1990-03-21 | Lam Research Corporation | Split-phase driver for plasma etch system |
| EP0641013A2 (en) * | 1993-08-27 | 1995-03-01 | Applied Materials, Inc. | High density plasma CVD and etching reactor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101007822B1 (ko) | 2003-07-14 | 2011-01-13 | 주성엔지니어링(주) | 혼합형 플라즈마 발생 장치 |
| KR20170028145A (ko) * | 2015-09-03 | 2017-03-13 | 에이피시스템 주식회사 | 기판 처리 장치 |
| KR101939277B1 (ko) * | 2015-09-03 | 2019-01-18 | 에이피시스템 주식회사 | 기판 처리 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0742577A2 (en) | 1996-11-13 |
| JP3814012B2 (ja) | 2006-08-23 |
| US5710486A (en) | 1998-01-20 |
| US6020686A (en) | 2000-02-01 |
| EP0742577A3 (en) | 1999-01-13 |
| JPH0974089A (ja) | 1997-03-18 |
| KR960043009A (ko) | 1996-12-21 |
| TW302592B (enExample) | 1997-04-11 |
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