JP3814012B2 - 誘導的かつ多容量的に結合されたプラズマリアクタ - Google Patents
誘導的かつ多容量的に結合されたプラズマリアクタ Download PDFInfo
- Publication number
- JP3814012B2 JP3814012B2 JP11378296A JP11378296A JP3814012B2 JP 3814012 B2 JP3814012 B2 JP 3814012B2 JP 11378296 A JP11378296 A JP 11378296A JP 11378296 A JP11378296 A JP 11378296A JP 3814012 B2 JP3814012 B2 JP 3814012B2
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- plasma reactor
- induction coil
- pair
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/436513 | 1995-05-08 | ||
| US08/436,513 US5710486A (en) | 1995-05-08 | 1995-05-08 | Inductively and multi-capacitively coupled plasma reactor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0974089A JPH0974089A (ja) | 1997-03-18 |
| JP3814012B2 true JP3814012B2 (ja) | 2006-08-23 |
Family
ID=23732717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11378296A Expired - Fee Related JP3814012B2 (ja) | 1995-05-08 | 1996-05-08 | 誘導的かつ多容量的に結合されたプラズマリアクタ |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US5710486A (enExample) |
| EP (1) | EP0742577A3 (enExample) |
| JP (1) | JP3814012B2 (enExample) |
| KR (1) | KR100427852B1 (enExample) |
| TW (1) | TW302592B (enExample) |
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| JP2928555B2 (ja) * | 1989-09-20 | 1999-08-03 | 株式会社日立製作所 | プラズマ処理装置 |
| DE3942964A1 (de) * | 1989-12-23 | 1991-06-27 | Leybold Ag | Einrichtung fuer die erzeugung eines plasmas |
| WO1991010341A1 (en) * | 1990-01-04 | 1991-07-11 | Savas Stephen E | A low frequency inductive rf plasma reactor |
| JPH0521193A (ja) * | 1991-07-09 | 1993-01-29 | Nippon Steel Corp | 高周波プラズマ装置 |
| US5231334A (en) * | 1992-04-15 | 1993-07-27 | Texas Instruments Incorporated | Plasma source and method of manufacturing |
| US5241245A (en) * | 1992-05-06 | 1993-08-31 | International Business Machines Corporation | Optimized helical resonator for plasma processing |
| US5614055A (en) * | 1993-08-27 | 1997-03-25 | Applied Materials, Inc. | High density plasma CVD and etching reactor |
| EP0680072B1 (en) * | 1994-04-28 | 2003-10-08 | Applied Materials, Inc. | A method of operating a high density plasma CVD reactor with combined inductive and capacitive coupling |
| US5783101A (en) * | 1994-09-16 | 1998-07-21 | Applied Materials, Inc. | High etch rate residue free metal etch process with low frequency high power inductive coupled plasma |
| US5753044A (en) * | 1995-02-15 | 1998-05-19 | Applied Materials, Inc. | RF plasma reactor with hybrid conductor and multi-radius dome ceiling |
-
1995
- 1995-05-08 US US08/436,513 patent/US5710486A/en not_active Expired - Lifetime
-
1996
- 1996-05-03 KR KR1019960014361A patent/KR100427852B1/ko not_active Expired - Fee Related
- 1996-05-07 EP EP96107209A patent/EP0742577A3/en not_active Withdrawn
- 1996-05-08 JP JP11378296A patent/JP3814012B2/ja not_active Expired - Fee Related
- 1996-06-15 TW TW085107241A patent/TW302592B/zh active
-
1997
- 1997-08-07 US US08/908,533 patent/US6020686A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TW302592B (enExample) | 1997-04-11 |
| EP0742577A2 (en) | 1996-11-13 |
| US6020686A (en) | 2000-02-01 |
| KR100427852B1 (ko) | 2004-09-01 |
| JPH0974089A (ja) | 1997-03-18 |
| EP0742577A3 (en) | 1999-01-13 |
| US5710486A (en) | 1998-01-20 |
| KR960043009A (ko) | 1996-12-21 |
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