JP3814012B2 - 誘導的かつ多容量的に結合されたプラズマリアクタ - Google Patents

誘導的かつ多容量的に結合されたプラズマリアクタ Download PDF

Info

Publication number
JP3814012B2
JP3814012B2 JP11378296A JP11378296A JP3814012B2 JP 3814012 B2 JP3814012 B2 JP 3814012B2 JP 11378296 A JP11378296 A JP 11378296A JP 11378296 A JP11378296 A JP 11378296A JP 3814012 B2 JP3814012 B2 JP 3814012B2
Authority
JP
Japan
Prior art keywords
high frequency
plasma reactor
induction coil
pair
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11378296A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0974089A (ja
Inventor
ヤー ヤン
ハナワ ヒロジ
シャオビン マ ダイアナ
ジャーヤオ イエン ジェラルド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JPH0974089A publication Critical patent/JPH0974089A/ja
Application granted granted Critical
Publication of JP3814012B2 publication Critical patent/JP3814012B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/32091Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Chemical Vapour Deposition (AREA)
JP11378296A 1995-05-08 1996-05-08 誘導的かつ多容量的に結合されたプラズマリアクタ Expired - Fee Related JP3814012B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/436513 1995-05-08
US08/436,513 US5710486A (en) 1995-05-08 1995-05-08 Inductively and multi-capacitively coupled plasma reactor

Publications (2)

Publication Number Publication Date
JPH0974089A JPH0974089A (ja) 1997-03-18
JP3814012B2 true JP3814012B2 (ja) 2006-08-23

Family

ID=23732717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11378296A Expired - Fee Related JP3814012B2 (ja) 1995-05-08 1996-05-08 誘導的かつ多容量的に結合されたプラズマリアクタ

Country Status (5)

Country Link
US (2) US5710486A (enExample)
EP (1) EP0742577A3 (enExample)
JP (1) JP3814012B2 (enExample)
KR (1) KR100427852B1 (enExample)
TW (1) TW302592B (enExample)

Families Citing this family (124)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6514376B1 (en) 1991-06-27 2003-02-04 Applied Materials Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US6238588B1 (en) 1991-06-27 2001-05-29 Applied Materials, Inc. High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process
US6063233A (en) * 1991-06-27 2000-05-16 Applied Materials, Inc. Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna
US6074512A (en) 1991-06-27 2000-06-13 Applied Materials, Inc. Inductively coupled RF plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners
US6165311A (en) * 1991-06-27 2000-12-26 Applied Materials, Inc. Inductively coupled RF plasma reactor having an overhead solenoidal antenna
US6077384A (en) 1994-08-11 2000-06-20 Applied Materials, Inc. Plasma reactor having an inductive antenna coupling power through a parallel plate electrode
US6024826A (en) * 1996-05-13 2000-02-15 Applied Materials, Inc. Plasma reactor with heated source of a polymer-hardening precursor material
US6036877A (en) 1991-06-27 2000-03-14 Applied Materials, Inc. Plasma reactor with heated source of a polymer-hardening precursor material
US6090303A (en) * 1991-06-27 2000-07-18 Applied Materials, Inc. Process for etching oxides in an electromagnetically coupled planar plasma apparatus
US6488807B1 (en) 1991-06-27 2002-12-03 Applied Materials, Inc. Magnetic confinement in a plasma reactor having an RF bias electrode
US5477975A (en) * 1993-10-15 1995-12-26 Applied Materials Inc Plasma etch apparatus with heated scavenging surfaces
US5777289A (en) 1995-02-15 1998-07-07 Applied Materials, Inc. RF plasma reactor with hybrid conductor and multi-radius dome ceiling
US6270617B1 (en) 1995-02-15 2001-08-07 Applied Materials, Inc. RF plasma reactor with hybrid conductor and multi-radius dome ceiling
TW279240B (en) 1995-08-30 1996-06-21 Applied Materials Inc Parallel-plate icp source/rf bias electrode head
US6036878A (en) 1996-02-02 2000-03-14 Applied Materials, Inc. Low density high frequency process for a parallel-plate electrode plasma reactor having an inductive antenna
US6054013A (en) * 1996-02-02 2000-04-25 Applied Materials, Inc. Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density
WO1997033300A1 (en) * 1996-03-06 1997-09-12 Mattson Technology, Inc. Icp reactor having a conically-shaped plasma-generating section
US5976993A (en) * 1996-03-28 1999-11-02 Applied Materials, Inc. Method for reducing the intrinsic stress of high density plasma films
US6440221B2 (en) 1996-05-13 2002-08-27 Applied Materials, Inc. Process chamber having improved temperature control
TW403959B (en) 1996-11-27 2000-09-01 Hitachi Ltd Plasma treatment device
JPH10172792A (ja) * 1996-12-05 1998-06-26 Tokyo Electron Ltd プラズマ処理装置
US5982100A (en) * 1997-07-28 1999-11-09 Pars, Inc. Inductively coupled plasma reactor
US6132551A (en) * 1997-09-20 2000-10-17 Applied Materials, Inc. Inductive RF plasma reactor with overhead coil and conductive laminated RF window beneath the overhead coil
JP3357280B2 (ja) * 1997-11-27 2002-12-16 東京応化工業株式会社 プラズマ処理装置
US6043607A (en) * 1997-12-16 2000-03-28 Applied Materials, Inc. Apparatus for exciting a plasma in a semiconductor wafer processing system using a complex RF waveform
US6395128B2 (en) 1998-02-19 2002-05-28 Micron Technology, Inc. RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
US6112697A (en) 1998-02-19 2000-09-05 Micron Technology, Inc. RF powered plasma enhanced chemical vapor deposition reactor and methods
JP3567736B2 (ja) * 1998-05-25 2004-09-22 株式会社日立製作所 プラズマ処理装置
US6589437B1 (en) 1999-03-05 2003-07-08 Applied Materials, Inc. Active species control with time-modulated plasma
JP4852189B2 (ja) * 1999-03-09 2012-01-11 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
US6388382B1 (en) * 1999-03-09 2002-05-14 Hitachi, Ltd. Plasma processing apparatus and method
US6474258B2 (en) 1999-03-26 2002-11-05 Tokyo Electron Limited Apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
US6237526B1 (en) 1999-03-26 2001-05-29 Tokyo Electron Limited Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
JP2000331993A (ja) 1999-05-19 2000-11-30 Mitsubishi Electric Corp プラズマ処理装置
US6232236B1 (en) 1999-08-03 2001-05-15 Applied Materials, Inc. Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
JP2001052894A (ja) * 1999-08-04 2001-02-23 Ulvac Japan Ltd 誘導結合高周波プラズマ源
US6447636B1 (en) 2000-02-16 2002-09-10 Applied Materials, Inc. Plasma reactor with dynamic RF inductive and capacitive coupling control
US7196283B2 (en) 2000-03-17 2007-03-27 Applied Materials, Inc. Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
US6528751B1 (en) 2000-03-17 2003-03-04 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma
US8617351B2 (en) * 2002-07-09 2013-12-31 Applied Materials, Inc. Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction
US6894245B2 (en) * 2000-03-17 2005-05-17 Applied Materials, Inc. Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US7030335B2 (en) * 2000-03-17 2006-04-18 Applied Materials, Inc. Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
US7141757B2 (en) * 2000-03-17 2006-11-28 Applied Materials, Inc. Plasma reactor with overhead RF source power electrode having a resonance that is virtually pressure independent
US6900596B2 (en) * 2002-07-09 2005-05-31 Applied Materials, Inc. Capacitively coupled plasma reactor with uniform radial distribution of plasma
US20070048882A1 (en) * 2000-03-17 2007-03-01 Applied Materials, Inc. Method to reduce plasma-induced charging damage
US8048806B2 (en) * 2000-03-17 2011-11-01 Applied Materials, Inc. Methods to avoid unstable plasma states during a process transition
US7220937B2 (en) 2000-03-17 2007-05-22 Applied Materials, Inc. Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination
US6507155B1 (en) 2000-04-06 2003-01-14 Applied Materials Inc. Inductively coupled plasma source with controllable power deposition
US6401652B1 (en) 2000-05-04 2002-06-11 Applied Materials, Inc. Plasma reactor inductive coil antenna with flat surface facing the plasma
US6414648B1 (en) 2000-07-06 2002-07-02 Applied Materials, Inc. Plasma reactor having a symmetric parallel conductor coil antenna
US6685798B1 (en) 2000-07-06 2004-02-03 Applied Materials, Inc Plasma reactor having a symmetrical parallel conductor coil antenna
US6694915B1 (en) * 2000-07-06 2004-02-24 Applied Materials, Inc Plasma reactor having a symmetrical parallel conductor coil antenna
US6409933B1 (en) 2000-07-06 2002-06-25 Applied Materials, Inc. Plasma reactor having a symmetric parallel conductor coil antenna
JP2004506307A (ja) * 2000-08-17 2004-02-26 東京エレクトロン株式会社 Rf駆動電極のための密結合整合構造
US6446572B1 (en) 2000-08-18 2002-09-10 Tokyo Electron Limited Embedded plasma source for plasma density improvement
US6562684B1 (en) 2000-08-30 2003-05-13 Micron Technology, Inc. Methods of forming dielectric materials
US6494998B1 (en) 2000-08-30 2002-12-17 Tokyo Electron Limited Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma using an internal inductive element
JP2002237486A (ja) * 2001-02-08 2002-08-23 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法
WO2002084698A1 (en) * 2001-04-13 2002-10-24 Applied Materials, Inc. Inductively coupled plasma source with controllable power distribution
US20020170678A1 (en) * 2001-05-18 2002-11-21 Toshio Hayashi Plasma processing apparatus
US7513971B2 (en) * 2002-03-18 2009-04-07 Applied Materials, Inc. Flat style coil for improved precision etch uniformity
TWI283899B (en) * 2002-07-09 2007-07-11 Applied Materials Inc Capacitively coupled plasma reactor with magnetic plasma control
US8057468B2 (en) 2002-12-17 2011-11-15 Bovie Medical Corporation Method to generate a plasma stream for performing electrosurgery
US7212078B2 (en) * 2003-02-25 2007-05-01 Tokyo Electron Limited Method and assembly for providing impedance matching network and network assembly
US7795153B2 (en) * 2003-05-16 2010-09-14 Applied Materials, Inc. Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of selected chamber parameters
US7910013B2 (en) 2003-05-16 2011-03-22 Applied Materials, Inc. Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
US7452824B2 (en) * 2003-05-16 2008-11-18 Applied Materials, Inc. Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters
US7470626B2 (en) * 2003-05-16 2008-12-30 Applied Materials, Inc. Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure
US7901952B2 (en) * 2003-05-16 2011-03-08 Applied Materials, Inc. Plasma reactor control by translating desired values of M plasma parameters to values of N chamber parameters
US7247218B2 (en) * 2003-05-16 2007-07-24 Applied Materials, Inc. Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power
JP3868925B2 (ja) * 2003-05-29 2007-01-17 株式会社日立製作所 プラズマ処理装置
KR101007822B1 (ko) * 2003-07-14 2011-01-13 주성엔지니어링(주) 혼합형 플라즈마 발생 장치
US7771562B2 (en) * 2003-11-19 2010-08-10 Tokyo Electron Limited Etch system with integrated inductive coupling
KR101033123B1 (ko) * 2004-06-30 2011-05-11 엘지디스플레이 주식회사 액정표시장치의 제조를 위한 챔버형 장치
EP1855833B1 (en) * 2005-03-11 2020-02-26 PerkinElmer, Inc. Plasma devices and method of using them
US7359177B2 (en) 2005-05-10 2008-04-15 Applied Materials, Inc. Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output
US7342361B2 (en) * 2005-05-11 2008-03-11 Dublin City University Plasma source
IES20050301A2 (en) * 2005-05-11 2006-11-15 Univ Dublin City Plasma source
KR100689848B1 (ko) * 2005-07-22 2007-03-08 삼성전자주식회사 기판처리장치
KR101149332B1 (ko) * 2005-07-29 2012-05-23 주성엔지니어링(주) 플라즈마 식각 장치
US8043471B2 (en) * 2006-03-31 2011-10-25 Tokyo Electron Limited Plasma processing apparatus
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
CN104821269B (zh) * 2006-05-22 2017-05-10 吉恩株式会社 感应耦合等离子体反应器
US7879184B2 (en) * 2006-06-20 2011-02-01 Lam Research Corporation Apparatuses, systems and methods for rapid cleaning of plasma confinement rings with minimal erosion of other chamber parts
US7837826B2 (en) * 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
TW200830941A (en) * 2007-01-15 2008-07-16 Jehara Corp Plasma generating apparatus
US8435379B2 (en) 2007-05-08 2013-05-07 Applied Materials, Inc. Substrate cleaning chamber and cleaning and conditioning methods
JP5611039B2 (ja) * 2008-06-11 2014-10-22 株式会社アルバック スパッタリング装置
JP5391659B2 (ja) * 2008-11-18 2014-01-15 東京エレクトロン株式会社 プラズマ処理装置
US7994724B2 (en) * 2009-03-27 2011-08-09 Ecole Polytechnique Inductive plasma applicator
US9649143B2 (en) * 2009-09-23 2017-05-16 Bovie Medical Corporation Electrosurgical system to generate a pulsed plasma stream and method thereof
US20110097901A1 (en) * 2009-10-26 2011-04-28 Applied Materials, Inc. Dual mode inductively coupled plasma reactor with adjustable phase coil assembly
US8795265B2 (en) 2010-01-28 2014-08-05 Bovie Medical Corporation Electrosurgical apparatus to generate a dual plasma stream and method thereof
US8597462B2 (en) 2010-05-21 2013-12-03 Lam Research Corporation Movable chamber liner plasma confinement screen combination for plasma processing apparatuses
US9793126B2 (en) 2010-08-04 2017-10-17 Lam Research Corporation Ion to neutral control for wafer processing with dual plasma source reactor
US9117767B2 (en) 2011-07-21 2015-08-25 Lam Research Corporation Negative ion control for dielectric etch
US10595365B2 (en) * 2010-10-19 2020-03-17 Applied Materials, Inc. Chamber lid heater ring assembly
US9387269B2 (en) 2011-01-28 2016-07-12 Bovie Medical Corporation Cold plasma jet hand sanitizer
KR101730061B1 (ko) 2011-02-15 2017-04-25 후지 덴키 가부시키가이샤 방사성 물질을 수반하는 수지 감용 처리 장치 및 그 동작 방법
TW201316375A (zh) 2011-10-05 2013-04-16 Intevac Inc 電感/電容複合式電漿供應源及具有其腔室之系統
US8808561B2 (en) * 2011-11-15 2014-08-19 Lam Research Coporation Inert-dominant pulsing in plasma processing systems
KR101314666B1 (ko) * 2011-11-28 2013-10-04 최대규 하이브리드 플라즈마 반응기
US9245761B2 (en) 2013-04-05 2016-01-26 Lam Research Corporation Internal plasma grid for semiconductor fabrication
KR101517489B1 (ko) * 2013-04-25 2015-05-07 피에스케이 주식회사 플라즈마 발생 장치 및 그 제어 방법, 그리고 플라즈마 발생 장치를 포함하는 기판 처리 장치
US9147581B2 (en) 2013-07-11 2015-09-29 Lam Research Corporation Dual chamber plasma etcher with ion accelerator
KR101939277B1 (ko) * 2015-09-03 2019-01-18 에이피시스템 주식회사 기판 처리 장치
US11129665B2 (en) 2015-12-02 2021-09-28 Apyx Medical Corporation Mixing cold plasma beam jets with atmopshere
GB201603581D0 (en) * 2016-03-01 2016-04-13 Spts Technologies Ltd Plasma processing apparatus
JP6446418B2 (ja) * 2016-09-13 2018-12-26 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム
US10918433B2 (en) 2016-09-27 2021-02-16 Apyx Medical Corporation Devices, systems and methods for enhancing physiological effectiveness of medical cold plasma discharges
US20180277340A1 (en) * 2017-03-24 2018-09-27 Yang Yang Plasma reactor with electron beam of secondary electrons
US20180274100A1 (en) 2017-03-24 2018-09-27 Applied Materials, Inc. Alternating between deposition and treatment of diamond-like carbon
CN107256822B (zh) * 2017-07-27 2019-08-23 北京北方华创微电子装备有限公司 上电极组件及反应腔室
WO2020059174A1 (ja) * 2018-09-20 2020-03-26 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
CN111565505B (zh) * 2019-02-13 2023-04-21 中微半导体设备(上海)股份有限公司 一种icp设备及其线圈驱动电路、控制方法
CN110289235B (zh) * 2019-07-09 2021-07-09 北京北方华创微电子装备有限公司 开盖装置和半导体加工设备
EP3999466A1 (en) 2019-08-07 2022-05-25 Qorvo US, Inc. Anti-stiction enhancement of ruthenium contact
US11348784B2 (en) 2019-08-12 2022-05-31 Beijing E-Town Semiconductor Technology Co., Ltd Enhanced ignition in inductively coupled plasmas for workpiece processing
US10950428B1 (en) * 2019-08-30 2021-03-16 Mattson Technology, Inc. Method for processing a workpiece
WO2021108297A1 (en) 2019-11-27 2021-06-03 Applied Materials, Inc. Dual plasma pre-clean for selective gap fill
WO2021108294A2 (en) 2019-11-27 2021-06-03 Applied Materials, Inc. Processing chamber with multiple plasma units
TWI829156B (zh) * 2021-05-25 2024-01-11 大陸商北京屹唐半導體科技股份有限公司 電漿源陣列、電漿處理設備、電漿處理系統以及用於在電漿處理設備中加工工件的方法
US11776788B2 (en) * 2021-06-28 2023-10-03 Applied Materials, Inc. Pulsed voltage boost for substrate processing

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2223399A (en) * 1935-10-14 1940-12-03 Ets Claude Paz & Silva Supply of electric discharge tubes excited inductively
US4871421A (en) * 1988-09-15 1989-10-03 Lam Research Corporation Split-phase driver for plasma etch system
EP0403234A3 (en) * 1989-06-14 1992-10-21 LUCAS INDUSTRIES public limited company Servo mechanisms for rotary shafts
DE3923661A1 (de) * 1989-07-18 1991-01-24 Leybold Ag Schaltungsanordnung fuer die anpassung der impedanz einer plasmastrecke an einen hochfrequenzgenerator
JP2928555B2 (ja) * 1989-09-20 1999-08-03 株式会社日立製作所 プラズマ処理装置
DE3942964A1 (de) * 1989-12-23 1991-06-27 Leybold Ag Einrichtung fuer die erzeugung eines plasmas
WO1991010341A1 (en) * 1990-01-04 1991-07-11 Savas Stephen E A low frequency inductive rf plasma reactor
JPH0521193A (ja) * 1991-07-09 1993-01-29 Nippon Steel Corp 高周波プラズマ装置
US5231334A (en) * 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5241245A (en) * 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5614055A (en) * 1993-08-27 1997-03-25 Applied Materials, Inc. High density plasma CVD and etching reactor
EP0680072B1 (en) * 1994-04-28 2003-10-08 Applied Materials, Inc. A method of operating a high density plasma CVD reactor with combined inductive and capacitive coupling
US5783101A (en) * 1994-09-16 1998-07-21 Applied Materials, Inc. High etch rate residue free metal etch process with low frequency high power inductive coupled plasma
US5753044A (en) * 1995-02-15 1998-05-19 Applied Materials, Inc. RF plasma reactor with hybrid conductor and multi-radius dome ceiling

Also Published As

Publication number Publication date
TW302592B (enExample) 1997-04-11
EP0742577A2 (en) 1996-11-13
US6020686A (en) 2000-02-01
KR100427852B1 (ko) 2004-09-01
JPH0974089A (ja) 1997-03-18
EP0742577A3 (en) 1999-01-13
US5710486A (en) 1998-01-20
KR960043009A (ko) 1996-12-21

Similar Documents

Publication Publication Date Title
JP3814012B2 (ja) 誘導的かつ多容量的に結合されたプラズマリアクタ
US5944902A (en) Plasma source for HDP-CVD chamber
US6679981B1 (en) Inductive plasma loop enhancing magnetron sputtering
US5907221A (en) Inductively coupled plasma reactor with an inductive coil antenna having independent loops
US6042700A (en) Adjustment of deposition uniformity in an inductively coupled plasma source
US6164241A (en) Multiple coil antenna for inductively-coupled plasma generation systems
US5965034A (en) High frequency plasma process wherein the plasma is executed by an inductive structure in which the phase and anti-phase portion of the capacitive currents between the inductive structure and the plasma are balanced
US6228229B1 (en) Method and apparatus for generating a plasma
US7426900B2 (en) Integrated electrostatic inductive coupling for plasma processing
US20040256217A1 (en) Coils for generating a plasma and for sputtering
US5865937A (en) Broad-band adjustable power ratio phase-inverting plasma reactor
US7771562B2 (en) Etch system with integrated inductive coupling
JPH09199486A (ja) マイクロ波プラズマリアクタ
US20130168232A1 (en) Coils for generating a plasma and for sputtering
US6225744B1 (en) Plasma process apparatus for integrated circuit fabrication having dome-shaped induction coil
KR20010112958A (ko) 고밀도 플라즈마 반응기
JPH1083987A (ja) ハイブリッドコンダクターとマルチラジアスドーム天井を有する高周波プラズマリアクター
KR100391063B1 (ko) 유도결합으로 보강된 축전결합형 플라즈마 발생장치 및플라즈마 발생방법
US20030037879A1 (en) Top gas feed lid for semiconductor processing chamber
KR101040541B1 (ko) 플라즈마 발생용 하이브리드 안테나
KR100295430B1 (ko) 멀티전극을 이용한 반도체 장치 제조설비
KR100364636B1 (ko) 상호유도작용에 의한 전력공급이 가능하도록 한유도결합형 플라즈마 발생장치

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050204

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060328

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060410

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060509

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060602

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090609

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100609

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110609

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110609

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120609

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120609

Year of fee payment: 6

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

LAPS Cancellation because of no payment of annual fees