KR100387548B1 - 열잉크젯프린트헤드장치용구동헤드및그제조방법 - Google Patents

열잉크젯프린트헤드장치용구동헤드및그제조방법 Download PDF

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Publication number
KR100387548B1
KR100387548B1 KR1019960062069A KR19960062069A KR100387548B1 KR 100387548 B1 KR100387548 B1 KR 100387548B1 KR 1019960062069 A KR1019960062069 A KR 1019960062069A KR 19960062069 A KR19960062069 A KR 19960062069A KR 100387548 B1 KR100387548 B1 KR 100387548B1
Authority
KR
South Korea
Prior art keywords
layer
transistor
drive head
resistor
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960062069A
Other languages
English (en)
Korean (ko)
Inventor
도밍고 에이 피거레도
Original Assignee
휴렛-팩커드 컴퍼니(델라웨어주법인)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 휴렛-팩커드 컴퍼니(델라웨어주법인) filed Critical 휴렛-팩커드 컴퍼니(델라웨어주법인)
Application granted granted Critical
Publication of KR100387548B1 publication Critical patent/KR100387548B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H10D84/817—Combinations of field-effect devices and resistors only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
KR1019960062069A 1995-12-06 1996-12-05 열잉크젯프린트헤드장치용구동헤드및그제조방법 Expired - Fee Related KR100387548B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/568,209 1995-12-06
US08/568,209 US6758552B1 (en) 1995-12-06 1995-12-06 Integrated thin-film drive head for thermal ink-jet printer

Publications (1)

Publication Number Publication Date
KR100387548B1 true KR100387548B1 (ko) 2003-09-19

Family

ID=24270369

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960062069A Expired - Fee Related KR100387548B1 (ko) 1995-12-06 1996-12-05 열잉크젯프린트헤드장치용구동헤드및그제조방법

Country Status (5)

Country Link
US (1) US6758552B1 (enExample)
EP (1) EP0778139B1 (enExample)
JP (1) JP4332227B2 (enExample)
KR (1) KR100387548B1 (enExample)
DE (1) DE69606508T2 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11105286A (ja) * 1997-07-03 1999-04-20 Lexmark Internatl Inc 離間した別個の平面に位置する加熱要素導体を有するプリントヘッド
AUPP653998A0 (en) 1998-10-16 1998-11-05 Silverbrook Research Pty Ltd Micromechanical device and method (ij46B)
AUPP654398A0 (en) 1998-10-16 1998-11-05 Silverbrook Research Pty Ltd Micromechanical device and method (ij46g)
AUPP654598A0 (en) 1998-10-16 1998-11-05 Silverbrook Research Pty Ltd Micromechanical device and method (ij46h)
US5980025A (en) * 1997-11-21 1999-11-09 Xerox Corporation Thermal inkjet printhead with increased resistance control and method for making the printhead
US6742873B1 (en) 2001-04-16 2004-06-01 Silverbrook Research Pty Ltd Inkjet printhead construction
US7028474B2 (en) 1998-10-16 2006-04-18 Silverbook Research Pty Ltd Micro-electromechanical actuator with control logic circuitry
US7419250B2 (en) 1999-10-15 2008-09-02 Silverbrook Research Pty Ltd Micro-electromechanical liquid ejection device
US7815291B2 (en) 1998-10-16 2010-10-19 Silverbrook Research Pty Ltd Printhead integrated circuit with low drive transistor to nozzle area ratio
AU1139100A (en) 1998-10-16 2000-05-08 Silverbrook Research Pty Limited Improvements relating to inkjet printers
US6994424B2 (en) 1998-10-16 2006-02-07 Silverbrook Research Pty Ltd Printhead assembly incorporating an array of printhead chips on an ink distribution structure
US6863378B2 (en) 1998-10-16 2005-03-08 Silverbrook Research Pty Ltd Inkjet printer having enclosed actuators
US7677686B2 (en) 1998-10-16 2010-03-16 Silverbrook Research Pty Ltd High nozzle density printhead ejecting low drop volumes
US7216956B2 (en) 1998-10-16 2007-05-15 Silverbrook Research Pty Ltd Printhead assembly with power and ground connections along single edge
US7182431B2 (en) 1999-10-19 2007-02-27 Silverbrook Research Pty Ltd Nozzle arrangement
US6132032A (en) * 1999-08-13 2000-10-17 Hewlett-Packard Company Thin-film print head for thermal ink-jet printers
JP2002052725A (ja) 2000-08-07 2002-02-19 Sony Corp プリンタ、プリンタヘッド及びプリンタヘッドの製造方法
US6465856B2 (en) * 2001-03-19 2002-10-15 Xerox Corporation Micro-fabricated shielded conductors
US6504226B1 (en) * 2001-12-20 2003-01-07 Stmicroelectronics, Inc. Thin-film transistor used as heating element for microreaction chamber
KR20040079509A (ko) * 2003-03-07 2004-09-16 삼성전자주식회사 저항 소자를 구비하는 반도체 장치 및 그 제조 방법
GB0500114D0 (en) * 2005-01-06 2005-02-09 Koninkl Philips Electronics Nv Inkjet print head
GB0500111D0 (en) * 2005-01-06 2005-02-09 Koninkl Philips Electronics Nv Inkjet print head
EP1720177B1 (en) * 2005-02-17 2012-01-11 Zakrytoe Aktsionernoe Obshchestvo "Elox-Prom" Electrical hermetic penetrant structure
JP5145636B2 (ja) * 2005-12-27 2013-02-20 富士ゼロックス株式会社 液滴吐出ヘッド及び液滴吐出装置
US20100231655A1 (en) * 2007-11-24 2010-09-16 Hewlett-Packard Developement Company, L.P. Inkjet-printing device printhead die having edge protection layer for heating resistor
US8333459B2 (en) 2008-04-29 2012-12-18 Hewlett-Packard Development Company, L.P. Printing device
EP2515337B1 (en) * 2008-12-24 2016-02-24 Semiconductor Energy Laboratory Co., Ltd. Driver circuit and semiconductor device
US8816436B2 (en) * 2012-05-16 2014-08-26 International Business Machines Corporation Method and structure for forming fin resistors
JP6380890B2 (ja) * 2013-08-12 2018-08-29 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 インクジェットプリンタヘッド及びその製造方法、並びにインクジェットプリンタヘッドを搭載した描画装置
JP6322448B2 (ja) * 2014-03-12 2018-05-09 エスアイアイ・プリンテック株式会社 液体噴射ヘッドの製造方法、液体噴射ヘッド、及び液体噴射装置
EP3962793A4 (en) * 2019-04-29 2023-01-04 Hewlett-Packard Development Company, L.P. CORROSION TOLERANT MICROELECTRO-MECHANICAL FLUID EJECTION DEVICE
CN113211985B (zh) * 2020-01-21 2022-10-14 国际联合科技股份有限公司 热气泡喷墨头装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3700852A (en) 1970-10-09 1972-10-24 Displaytek Corp Thermal display module
US3852563A (en) 1974-02-01 1974-12-03 Hewlett Packard Co Thermal printing head
US3973106A (en) 1974-11-15 1976-08-03 Hewlett-Packard Company Thin film thermal print head
JPS5299786A (en) * 1976-02-18 1977-08-22 Agency Of Ind Science & Technol Mos integrated circuit
US4429321A (en) * 1980-10-23 1984-01-31 Canon Kabushiki Kaisha Liquid jet recording device
US4490728A (en) 1981-08-14 1984-12-25 Hewlett-Packard Company Thermal ink jet printer
JPS58153672A (ja) 1982-03-10 1983-09-12 Nippon Telegr & Teleph Corp <Ntt> 薄膜トランジスタ回路を内蔵する記録ヘツド
US4514741A (en) 1982-11-22 1985-04-30 Hewlett-Packard Company Thermal ink jet printer utilizing a printhead resistor having a central cold spot
US4616408A (en) 1982-11-24 1986-10-14 Hewlett-Packard Company Inversely processed resistance heater
US4528574A (en) 1983-03-28 1985-07-09 Hewlett-Packard Company Apparatus for reducing erosion due to cavitation in ink jet printers
US4513298A (en) 1983-05-25 1985-04-23 Hewlett-Packard Company Thermal ink jet printhead
US4535343A (en) 1983-10-31 1985-08-13 Hewlett-Packard Company Thermal ink jet printhead with self-passivating elements
JPS60116452A (ja) 1983-11-30 1985-06-22 Canon Inc インクジェットヘッド
US4716423A (en) 1985-11-22 1987-12-29 Hewlett-Packard Company Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture
US4719477A (en) 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
JPH0737146B2 (ja) 1986-03-06 1995-04-26 ソニー株式会社 薄膜サ−マルヘツド
JPS62242552A (ja) 1986-04-15 1987-10-23 Sony Corp 薄膜サ−マルヘツド
US4922265A (en) 1986-04-28 1990-05-01 Hewlett-Packard Company Ink jet printhead with self-aligned orifice plate and method of manufacture
US4862197A (en) 1986-08-28 1989-08-29 Hewlett-Packard Co. Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby
US4695853A (en) 1986-12-12 1987-09-22 Hewlett-Packard Company Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture
US4931813A (en) 1987-09-21 1990-06-05 Hewlett-Packard Company Ink jet head incorporating a thick unpassivated TaAl resistor
US4809428A (en) 1987-12-10 1989-03-07 Hewlett-Packard Company Thin film device for an ink jet printhead and process for the manufacturing same
US4847630A (en) 1987-12-17 1989-07-11 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
US5008689A (en) 1988-03-16 1991-04-16 Hewlett-Packard Company Plastic substrate for thermal ink jet printer
US4927505A (en) 1988-07-05 1990-05-22 Motorola Inc. Metallization scheme providing adhesion and barrier properties
EP0378439B1 (en) * 1989-01-13 1995-01-04 Canon Kabushiki Kaisha Recording head
US4965611A (en) 1989-03-22 1990-10-23 Hewlett-Packard Company Amorphous diffusion barrier for thermal ink jet print heads
US5010355A (en) 1989-12-26 1991-04-23 Xerox Corporation Ink jet printhead having ionic passivation of electrical circuitry
US5081473A (en) * 1990-07-26 1992-01-14 Xerox Corporation Temperature control transducer and MOS driver for thermal ink jet printing chips
JPH04110161A (ja) 1990-08-30 1992-04-10 Ricoh Co Ltd サーマルヘッド用発熱抵抗体およびそれを用いたサーマルヘッド
US5229785A (en) 1990-11-08 1993-07-20 Hewlett-Packard Company Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate
US5122812A (en) 1991-01-03 1992-06-16 Hewlett-Packard Company Thermal inkjet printhead having driver circuitry thereon and method for making the same
US5159353A (en) 1991-07-02 1992-10-27 Hewlett-Packard Company Thermal inkjet printhead structure and method for making the same
ATE144194T1 (de) 1991-08-01 1996-11-15 Canon Kk Aufzeichnungskopfherstellungsverfahren
US5420627A (en) 1992-04-02 1995-05-30 Hewlett-Packard Company Inkjet printhead

Also Published As

Publication number Publication date
DE69606508T2 (de) 2000-10-12
JPH09174844A (ja) 1997-07-08
US6758552B1 (en) 2004-07-06
DE69606508D1 (de) 2000-03-09
EP0778139B1 (en) 2000-02-02
JP4332227B2 (ja) 2009-09-16
EP0778139A1 (en) 1997-06-11

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