KR100379823B1 - 반도체집적회로장치의제조방법 - Google Patents

반도체집적회로장치의제조방법 Download PDF

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Publication number
KR100379823B1
KR100379823B1 KR1019940009859A KR19940009859A KR100379823B1 KR 100379823 B1 KR100379823 B1 KR 100379823B1 KR 1019940009859 A KR1019940009859 A KR 1019940009859A KR 19940009859 A KR19940009859 A KR 19940009859A KR 100379823 B1 KR100379823 B1 KR 100379823B1
Authority
KR
South Korea
Prior art keywords
ball
semiconductor chip
metal
substrate
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940009859A
Other languages
English (en)
Korean (ko)
Other versions
KR940027134A (ko
Inventor
스와모또오
다까하시히로유끼
니시우마마사히꼬
가마다지요시
Original Assignee
히다치초엘에스아이 엔지니어링가부시키가이샤
가부시끼가이샤 히다치 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치초엘에스아이 엔지니어링가부시키가이샤, 가부시끼가이샤 히다치 세이사꾸쇼 filed Critical 히다치초엘에스아이 엔지니어링가부시키가이샤
Publication of KR940027134A publication Critical patent/KR940027134A/ko
Application granted granted Critical
Publication of KR100379823B1 publication Critical patent/KR100379823B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core

Landscapes

  • Wire Bonding (AREA)
KR1019940009859A 1993-05-19 1994-05-06 반도체집적회로장치의제조방법 Expired - Fee Related KR100379823B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5116266A JPH06333982A (ja) 1993-05-19 1993-05-19 半導体集積回路装置の製造方法
JP93-116266 1993-05-19

Publications (2)

Publication Number Publication Date
KR940027134A KR940027134A (ko) 1994-12-10
KR100379823B1 true KR100379823B1 (ko) 2003-06-02

Family

ID=14682838

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940009859A Expired - Fee Related KR100379823B1 (ko) 1993-05-19 1994-05-06 반도체집적회로장치의제조방법

Country Status (3)

Country Link
JP (1) JPH06333982A (cg-RX-API-DMAC7.html)
KR (1) KR100379823B1 (cg-RX-API-DMAC7.html)
TW (1) TW259894B (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH118270A (ja) * 1997-06-16 1999-01-12 Tokai Rika Co Ltd 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法
JP3994262B2 (ja) 1999-10-04 2007-10-17 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP2002270630A (ja) * 2001-03-13 2002-09-20 Ngk Spark Plug Co Ltd 平坦化装置及びヘッド
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
JP4641551B2 (ja) * 2008-06-13 2011-03-02 富士通株式会社 半導体装置の製造方法
JP5971987B2 (ja) * 2012-03-02 2016-08-17 新日本無線株式会社 半導体装置の製造方法
JP2013030789A (ja) * 2012-09-10 2013-02-07 Seiko Epson Corp 実装構造体及び実装構造体の製造方法
JP6407102B2 (ja) * 2014-07-30 2018-10-17 太陽誘電株式会社 弾性波デバイス及びその製造方法

Also Published As

Publication number Publication date
KR940027134A (ko) 1994-12-10
JPH06333982A (ja) 1994-12-02
TW259894B (cg-RX-API-DMAC7.html) 1995-10-11

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