KR100344092B1 - Cover structure of semiconductor equipment - Google Patents

Abstract

The present invention relates to a lid structure of a semiconductor device, wherein an opening is formed on the upper surface of the container 20 and the container 10 is hinged to be openable and closed, and a handle 28 is provided on the upper surface thereof and a reinforcing plate 26a on the lower surface thereof. The formed cover 26 and the upper surface of the one end 22 of the container 20 to support the upper surface of the cover 26 when the cover 26 is opened so that the cover 26 maintains a predetermined inclination angle. One side of the reinforcement plate 26a so that the formed stopper 30 and the cover 26 when the cover 26 is opened may flow along the inclined bottom surface of the cover 26 to flow into the container 20. A guide 26b integrally formed to be in contact with the slant; A blocking member 24 extending downwardly above the vessel 20 is provided to block the gas convection towards the lid 26 to reduce the amount of solution agglomerated on the bottom surface of the lid 26. Even if the evaporated strong acid or strong alkaline solution aggregates on the lower surface of the lid, the lid is not removed from the vessel during the cleaning or maintenance of the vessel, and the aggregated liquid is introduced back into the vessel.

Description

Cover Structure of Semiconductor Equipment

The present invention relates to a cover structure of a semiconductor device.

In particular, in the cover structure of a semiconductor device filled with a solution harmful to the human body, such as a strong acid or strong alkali, the solution agglomerated on the lower surface of the cover due to evaporation or other reasons so that even if the container is opened, it does not flow out to the outside and flows back into the equipment. Thus, the present invention relates to a cover structure of a semiconductor device configured to prevent burns of equipment operators and prevent contamination / corrosion of equipment by the leakage of a solution due to opening of the cover.

A manufacturing process of the lead frame manufactured by the etching method will be described briefly as follows. First, the shape of the etch lead frame is CAD-designed, and then the photoresist is formed on the film using SLPP (Super Laser Photo Plotter). Then, it is produced in a master pattern (working pattern) and a working pattern (working pattern) is in close contact with the material during exposure to recognize the product shape.

Thereafter, a pretreatment step of cleaning the surface of the metal is performed in order to coat the raw material, and this pretreatment step is performed by a procedure such as degreasing → hot water washing → washing water → pickling → washing → brush → pure water washing. In this way, the lead frame after the pretreatment is coated with a photo-resist (photo-resist), a photosensitive material on the metal surface.

Typically the photoresist is a water soluble casein (protein) type and is coated by dipping to a thickness of at least about 7 μm on at least one side of the metal. Then, the etching mask is in close contact with the coated raw material and the product shape is formed by photochemical reaction with photoresist using ultraviolet rays.

Then, a developing process of forming a shape using hot water for a portion that is not exposed other than the portion (product shape) exposed during exposure is performed. Explaining the detailed process of the developing process, the developing process is classified into developing → Cr treatment → rinse → water cut → post-baking.

The lead frame material thus prepared is processed using a ferric chloride (FeCl ₃ ) solution to etch the exposed metal surface during development to process the product shape. Thus, the photoresist cured film remaining on the surface of the processed product shape is removed by using an alkali detergent, and the detailed step of stripping is stripping → water washing → washing → pure washing → drying procedure.

Then, high purity silver (Ag) is partially plated on the inner lead leading end of the lead frame or the upper surface of the die pad which are electrically connected to each other by the bonding pads and the bonding wires of the semiconductor chip. The detailed process of such plating is electrolytic degreasing → rinse → activation → Ag plating → back strip → rinse → drying.

Thereafter, internal lead taping and downset processes and visual and inspection are performed, then packaged and supplied to the consumer.

As described above, the lead frame manufactured through the above process is repeatedly subjected to a chemical reaction by strong acid or strong alkali to form a desired pattern, and water or acid such as hot water washing, washing water, pure water washing and pickling between processes. It is washed by the solution and then dried.

Apparatuses applied to each of these processes are provided with a lid to facilitate the cleaning of the inside of the container, particularly at the upper end of the container such as a tank, except for process equipment such as exposure and development.

As shown in FIG. 1, the lid 14 is mounted on the stepped surface 12 formed in the upper end opening of the container 10. Typically, the material is subjected to a desired plating, etching and peeling while passing through a container filled with strong acid or strong alkali, and the solution temperature at this time is about 40 to 80 ° C. higher than room temperature.

Thus, such a solution not only chemically acts on the material but also evaporates, and the vaporized gas agglomerates on the lower surface of the cover 14. The liquid L aggregated on the lower surface of the cover 14 lifts the handle 16 formed on the upper surface of the cover 14 when the equipment operator cleans or maintains the container 10. In case of opening), there is a serious safety problem that leaks to the outside to contaminate or corrode the exterior of the equipment or contaminate the bottom of the factory, as well as causing burns on the exposed skin of the equipment operator.

Accordingly, an object of the present invention is to provide a cover structure of a semiconductor device configured such that even if the equipment operator opens the container for maintenance or cleaning of the container, no strong acid or strong alkali coagulating liquid leaks to the outside of the cover.

1 is a cross-sectional view schematically showing a cover structure of a semiconductor device according to the prior art.

2 is a cross-sectional view schematically showing a cover structure of a semiconductor device according to an embodiment of the present invention.

`` Explanation of symbols for main parts of drawings ''

20 container 24 blocking member

26 cover 26a reinforcement plate

26b: Guide 28: handle

30: stopper

The object of the present invention described above, the container 20 is filled with a strong acid or strong alkali solution and the opening is formed in the upper surface, and hinged fixedly open and close to at least one end portion 22 extending from the container 10, the upper surface The handle 28 is installed and the cover 26 having a reinforcing plate 26a is formed on the lower surface thereof, and the cover 26 supports the upper surface of the cover 26 when the cover 26 is opened around the hinge portion. The stopper 30 formed on the upper surface of one end 22 of the container 20 to maintain the inclination angle, and the solution agglomerated on the lower surface of the cover 26 when the cover 26 is opened, the lower surface of the cover 26 is inclined. The guide 26b formed to be integrally inclined in contact with one side of the reinforcing plate 26a so as to flow down and flow into the container 20 and the gas convexed to the cover 26 side are blocked and aggregated on the lower surface of the cover 26. Blocking member 24 extending downward from one end 22 of vessel 20 to reduce the amount of solution. A cover structure of a semiconductor device, characterized in that is compared may be achieved by providing.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to Figure 2, the cover 26 structure of the semiconductor device of the present invention, the cover of the strong acid or strong alkali liquid (L) agglomerated on the lower surface of the cover 26 due to evaporation or other reasons under temperature conditions higher than room temperature The lower side of one side of the lid 26 is hinged to the top opening of the container 20 so that the container 26 may fall or flow back into the container 20 without leaking to the outside when the 26 is opened.

The apparatus to which the lid 26 structure of the present invention is applied is provided by the lid 26 in washing, rinsing and drying apparatuses as well as apparatuses for performing processes such as plating, etching and peeling using a strong acid or strong alkali solution. Please note that any such circumstances may apply.

As shown in Fig. 2, the container 20 of the present invention has a shape with a constant volume so that strong acid or strong alkali can be filled, and an opening is formed in an upper end thereof. Unlike the opening of the prior art, the shape of the opening does not have a step, and a part of the upper edge extends 22 inward so that one end of the cover 26 can be hinged.

The lid 26 is hinged to one end 22 extending into the opening as described above, and the other end opposite to the hinged one end H is mounted on the other end of the opening. Has a structure. A handle 28 for opening and closing is mounted on an upper surface of the cover 26, and a reinforcement plate 26a is provided on the lower surface to reinforce the cover 26.

The lid 26 structure is designed to contaminate / corrode the floor of the factory or the exterior of the equipment or to the equipment operator since the lid 26 is not detached from the vessel 20 during maintenance or cleaning of the vessel 20 by the equipment operator. The problem of the prior art, such as an image, is solved.

However, if the operator opens the cover 26 forcibly or if the hinge portion H is loose and the cover 26 is opened suddenly, the liquid L condensed on the lower surface of the cover 26 is less than the prior art. Small amounts can be produced that can leak out and cause the aforementioned problems.

Therefore, it is preferable to prevent the leakage of the gas to some extent by coating the hinge (H) with a sealing material to prevent the cover (26) from being opened suddenly and to eliminate the gap of the hinge (H).

In addition, when the cover 26 is completely opened, the lower surface of the cover 26 is exposed, and thus, the hands of the operator due to the carelessness of the equipment operator do not completely drop the condensed liquid on the lower surface of the cover 26. Touching the lower surface of the cover 26 causes burns to the hands.

Therefore, in the present invention, the cover 26 is pivoted about the hinge H to provide a stopper 30 at the top of the container 20 so as to be inclinedly supported so that the liquid L aggregated on the lower surface of the cover 26. In addition to continuously flowing down the inclined surface along the inclined surface of the cover 26, as well as to prevent the operator from inadvertent contact of the hand with the lower surface of the cover 26. Here, the height and position of the stopper 30 may be variously modified as desired.

In addition, a guide 26b is provided on the lower surface of the lid 26 so that the liquid L flowing down along the inclination of the lid 26 quickly falls into the container 20 when the lid 26 is opened. The guide 26b is provided on one side of the cover 26 in the same direction in which the hinge H is installed, and as shown in FIG. 2, one side of the reinforcing plate 26a formed at one end of the cover 26. It is integrally formed to be inclined in contact with.

The strong acid or strong alkali solution filled in the vessel 20 is evaporated as described above to convex the interior of the vessel 20 or to agglomerate on the bottom surface of the lid 26. Mainly, the liquid L agglomerated on the lower surface of the lid 26 falls off when the volume (weight) increases and merges with the solution in the container 20, but when the volume is small, the liquid L is lowered by the surface tension of the liquid L. It will continue to remain.

The problem arises in the prior art when these liquids L are agglomerated and open the lid 26. In the present invention, it is preferable to reduce the amount of the liquid L that is agglomerated on the lower surface of the lid 26. Do.

Accordingly, in the present invention, the container 20 is raised to block the gas convex in the direction of the cover 26 by rising along the inner wall of the container 20 so as to reduce the amount of liquid L aggregated on the lower surface of the cover 26. A blocking member 24 is provided on the inner wall of the).

The blocking member 24 is preferably formed to extend downward from the extended end 22 of the top opening of the container 20. Since the cover 26 of the present invention is eccentric to one side, the above-described blocking member 24 is formed only on one side, but the present invention is not limited thereto, and the blocking member 24 may be formed by the cover 26 to block the desired convection. Various modifications may be made depending on the structure.

As described above, according to the structure of the present invention, even when the strong acid or strong alkali solution evaporated on the lower surface of the cover, the cover is not separated from the container during cleaning or maintenance, so that the condensed liquid flows back into the container. There is an effect that can solve the problems such as the image of the equipment operator that occurred in the past.

Claims (1)

A container 20 filled with a strong acid or strong alkali solution and having an opening formed in an upper surface thereof; A cover 26 which is hinged and fixed to an extended at least one end 22 of the container 10, a handle 28 is installed on an upper surface thereof, and a reinforcement plate 26a is formed on a lower surface thereof; When the lid 26 is opened around the hinge portion, the lid 26 supports an upper surface of the lid 26 so that the lid 26 maintains a predetermined inclination angle to the upper surface of one end 22 of the container 20. A stopper 30 formed; When the cover 26 is opened, the solution agglomerated on the lower surface of the cover 26 flows along the inclined lower surface of the cover 26 to be in contact with one side of the reinforcing plate 26a to flow into the container 20. A guide 26b integrally formed obliquely; And Blocking member extending downward from one end 22 of the vessel 20 to block the gas convection toward the lid 26 to reduce the amount of solution agglomerated on the lower surface of the lid 26 ( 24) The cover structure of the semiconductor equipment, characterized in that it comprises a.