KR100337893B1 - Plasma display panel assembly - Google Patents

Abstract

A plasma display panel assembly is disclosed. The present invention provides a front substrate having a common substrate and a scan electrode formed thereon, a front panel having a dielectric layer filling the electrodes, a protective layer formed on the dielectric layer, and a rear substrate having an address electrode formed to be orthogonal to the common and scan electrodes. A rear panel having a partition wall disposed between the address electrodes, a red, green and blue phosphor layer applied inside the partition wall, a chassis attached to and supporting the front panel and the rear panel; The circuit board includes a heat sink installed at the rear surface to transmit an electrical signal to the panel, and to cool the heat of the electronic components generated during driving, and a heat sink connected to the heat sink and one end coupled to the chassis.

Description

Plasma display panel assembly

TECHNICAL FIELD The present invention relates to a plasma display panel assembly, and more particularly, to a plasma display panel assembly having an improved structure such that a heat sink is directly connected to a chassis.

In the plasma display panel, electrodes are formed on opposite surfaces of two transparent glasses, and a discharge gas is injected therebetween, and the image is generated using light emitted by ultraviolet rays generated in a discharge space by applying a predetermined power. It refers to an image display device that implements. Plasma display panels can be manufactured with a thin thickness of several centimeters or less, have a large screen, and are attracting attention as next-generation image display devices in view of wide viewing angles of 150 ° or more.

The plasma display panel may be divided into a process of manufacturing a front panel, a process of manufacturing a back panel, and a process of coupling the front and back panels to each other and modularizing them.

The process of manufacturing the front panel includes forming a common and scan electrode by forming an ITO film on a transparent glass substrate, forming a bus electrode on the common and scan electrodes to reduce line resistance, and embedding the electrodes. The first dielectric layer may be divided into a step of forming a protective film layer made of a magnesium oxide film.

The process of manufacturing the back panel corresponds to a process of forming an address electrode in a form orthogonal to the common and scan electrodes on a transparent glass substrate, a process of forming a second dielectric layer on the upper surface thereof, and an address electrode on the second dielectric. And forming a partition by applying a partition material to a portion to be formed, and applying a red, green, and blue phosphor layer inside the partition.

The front and back panels completed by the above-mentioned process apply a sealant along their edges and are bonded to each other with the front and back panels aligned. Subsequently, the inside of the panel is evacuated and then the discharge gas is encapsulated. Next, the chassis is coupled to the rear surface of the panel, and the printed circuit board is mounted on the chassis so as to transmit electrical signals to the panel, and completed through a predetermined inspection process.

The plasma display panel assembly completed through such a process requires a higher driving voltage than other image display devices in order to excite phosphors. In this case, since high power consumption is applied to electronic components installed on a circuit board, such as a field effect transistor (FET), a heat sink is attached to dissipate heat generated therefrom. Indispensable Therefore, in order to secure mechanical reliability of the plasma display panel assembly, it may be said that efficient installation of heat dissipation means such as a heat sink for quickly dissipating heat generated from electronic components such as FETs is required.

The present invention has been made to solve the above problems, and provides a plasma display panel assembly having an improved structure so that the auxiliary heat dissipation member is installed in the heat sink to effectively discharge heat generated from the electronic components of the circuit board. The purpose is.

1 is a partial ablation perspective view illustrating a conventional plasma display panel;

2 is an exploded perspective view schematically showing a plasma display panel assembly according to an embodiment of the present invention;

3 is an enlarged perspective view showing a part of the portion of FIG. 2.

<Brief description of symbols for the main parts of the drawings>

10 ... plasma display panel 11 ... front panel

12 ... Rear panel 13 ... Front board

14 ... common electrode 15 ... back electrode

16 bus electrode 18 first dielectric layer

19 ... back board 20 ... chassis

100 ... address electrode 110 ... second dielectric layer

120 bulkhead 130 phosphor layer

200 ... circuit board 210 ... heat sink

220 ... FET 230 ... Secondary heat sink

Plasma display panel assembly according to an aspect of the present invention to achieve the above object,

A front panel having a front substrate, a common and scan electrode formed on the substrate, a dielectric layer filling the electrode, and a protective film layer formed on the dielectric layer;

A rear panel having a rear substrate, an address electrode formed to be orthogonal to the electrodes, a partition wall disposed between the electrodes, and a red, green, and blue phosphor layer applied inside the partition wall; And

A chassis attached to one side to which the front and rear panels are coupled to support the chassis; And

A heat sink installed at a rear surface of the chassis to transfer electrical signals to the panel, and to cool heat of electronic components generated during driving; and an auxiliary heat radiating member connected to the heat sink and having one end coupled to the chassis. Circuit board having a; characterized in that it comprises a.

In addition, the auxiliary heat dissipation member is integrally extended from both lower ends of the heat sink, characterized in that the end is fixed to the chassis through the through hole formed corresponding to the substrate.

Hereinafter, a plasma display panel assembly according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In the plasma display panel 10 of FIG. 1, the panel 10 includes a front panel 11 and a rear panel 12 coupled to the front panel 11.

The front panel 11 is provided with a transparent front substrate 13. The lower surface of the substrate 13 is alternately formed with a common electrode 14 in the form of a strip of ITO film and a scan electrode 15. One side edge of the lower surface of the common and scan electrodes 14 and 15 is provided with a bus electrode 16 made of a metal material for narrowing the width thereof to reduce the line resistance thereof. The common and scan electrodes 14 and 15 and the bus electrode 16 are embedded by the first dielectric layer 17. On the bottom surface of the first dielectric layer 17, a protective film layer 18 made of a magnesium oxide film is formed.

The rear panel 12 is provided to face the front panel 11 so that the rear substrate 19 is provided. On the upper surface of the rear substrate 19, a strip-shaped address electrode 100 is formed to be orthogonal to the common and scan electrodes 14 and 15. The address electrode 100 is buried by the second dielectric layer 110. The partition wall 120 is disposed on the upper surface of the second dielectric layer 110 in a direction parallel to the address electrode 100 to partition the discharge space and prevent cross talk. The phosphor layer 130 of red, green, and blue is formed inside the partition wall 120.

The manufacturing process of the plasma display panel assembly having such a structure can be classified into three types. That is, the front panel 11 may be classified into a process of manufacturing the front panel 11, a process of manufacturing the rear panel 12, and a process of combining the front and rear panels 11 and 12 into a modular process.

The process of manufacturing the front panel 11 is as follows.

First, a front substrate 13 made of transparent glass is provided. A transparent conductive film made of an ITO film is formed on the top surface of the front substrate 13 to form a plurality of common and scan electrodes 14 and 15. Subsequently, masking is performed using a photo mask, which is then developed and etched to form common and scan electrodes 14 and 15 in the form of a strip.

On the lower surface of the common and scan electrodes 14 and 15, a bus electrode 16 made of metal is formed along one edge. Subsequently, the common and scan electrodes 14 and 15 and the bus electrode 16 are embedded to form a first dielectric layer 17 for controlling a discharge current. Next, a protective film layer 18 made of, for example, magnesium oxide is formed to protect the discharge voltage and the lifetime of the plasma display panel 10.

The process of manufacturing the back panel 12 is as follows.

First, a back substrate 19 made of transparent glass is prepared. Subsequently, a transparent conductive film is formed on the upper surface of the back substrate 19 by printing or sputtering. When the transparent conductive film is applied, the address electrode 100 in a form orthogonal to the common and scan electrodes 14 and 15 is patterned.

When the address electrode 100 is formed, a second dielectric layer 110 filling the electrode 100 is formed on the upper surface thereof. Subsequently, the partition wall material is coated on the upper surface of the second dielectric layer 110 between the address electrodes 100 and the partition wall 120 is formed by sand blasting. Next, red, green, and blue phosphor layers are respectively applied to the inside of the partition wall 120.

The front and rear panels 11 and 12 completed as described above are completed with a plasma display panel assembly through a modularization process. That is, a sealant is applied along the edges of the front and rear panels 11 and 12, and the panels 11 and 12 are aligned. Then, it is coupled using fastening means on both sides.

Next, an exhaust device is connected through the exhaust hole formed in the rear substrate 12 to evacuate the inside of the panel 10. When the exhaust is completed, a discharge gas made of a mixed gas such as neon (Ne) and xenon (Xe) is injected and enclosed between the partition walls 120.

Subsequently, as shown in FIG. 2, the chassis 20 is coupled to the rear surface of the panel 10. The chassis 20 includes a plurality of electronic components to transfer electrical signals to the panel 10. The mounted circuit board 200 is installed.

Finally, the plasma display panel assembly is completed through a predetermined inspection process.

In this case, the heat sink 210 is installed in the circuit board 200 to quickly discharge heat generated from an electronic component such as FET due to the high voltage applied to the plasma display panel 10.

According to a feature of the invention, the heat sink 210 is provided with an auxiliary heat dissipation member 230 in order to facilitate the release of heat.

In more detail, as shown in FIG.

Referring to the drawings, the heat sink 210 is installed on the circuit board 200 to release heat generated while the panel 10 is operating. The heat sink 210 has a rectangular heat dissipation fin 211 formed of a plurality of flakes from one end surface. In addition, a plurality of FETs 220 that generate a relatively large amount of heat is attached to the rear surface of the heat sink 210.

In this case, an auxiliary heat dissipation member 230 is formed at the lower end of the heat sink 210 from the sink 210. The auxiliary heat dissipation member 230 extends integrally with a predetermined width and length from both lower ends of the heat sink 210. In addition, the auxiliary heat dissipation member 230 penetrates through a through hole formed corresponding to the size of the auxiliary heat dissipation member 230 on the substrate 200, and an end thereof is fixed to the surface of the chassis 20.

In the plasma display panel assembly having the structure as described above, when a predetermined driving voltage is applied to the panel 10 to generate an image, a large amount of heat is generated during the driving of the electronic device installed in the substrate 200.

In particular, heat generated from components such as the FET 220 installed on one side wall of the heat sink 210 must be quickly discharged to the outside to ensure mechanical reliability. By the outside air is first introduced into the contact with the surface of the heat radiation (휜) 211 is made to heat exchange.

In addition, the auxiliary heat dissipation member 230 is coupled to the chassis 20 made of a metal material through the substrate 200 at the lower end of the heat sink 210, so that heat generated from the FET 220 is conducted therethrough. Cooling is achieved smoothly.

As described above, in the plasma display panel assembly of the present invention, an auxiliary heat dissipation member is installed at one side of the heat sink to rapidly discharge heat generated from electronic components installed on the substrate of the panel to the outside, and is coupled to the chassis. As a result, heat can be quickly discharged to the outside through the heat sink and the auxiliary heat radiating member, thereby ensuring mechanical reliability.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (2)

A front panel having a front substrate, a common and scan electrode formed on the substrate, a dielectric layer filling the electrode, and a protective film layer formed on the dielectric layer; A rear panel having a rear substrate, an address electrode formed to be orthogonal to the electrodes, a partition wall disposed between the electrodes, and a red, green, and blue phosphor layer applied inside the partition wall; And A chassis attached to one side to which the front and rear panels are coupled to support the chassis; And A heat sink installed at a rear surface of the chassis to transfer electrical signals to the panel, and to cool heat of electronic components generated during driving; and an auxiliary heat radiating member connected to the heat sink and having one end coupled to the chassis. Plasma display panel assembly comprising a; circuit board having a. The method of claim 1, The auxiliary heat dissipation member is integrally extended from both lower end portions of the heat sink, the plasma display panel assembly, characterized in that the end is fixed to the chassis through the through hole formed corresponding to the substrate.