KR100731442B1 - Heat sink and plasma display device comprising the same - Google Patents

Abstract

The present invention relates to a heat sink and a plasma display device having the same, wherein the heat sink includes a base in contact with a semiconductor element and a plurality of heat dissipation fins formed in an upright direction with respect to the base. Form an area for blocking external contact with respect to the outside of the heat dissipation fins, and relatively short length of the heat dissipation fins to block external contact or to install a heat dissipation plate on the upper end of the heat dissipation fins to block external contact. A panel, a chassis supporting a rear surface of the panel, a plurality of circuit boards electrically connected to the rear surface of the chassis, semiconductor devices provided on the circuit board, and heat dissipation heat generated by the semiconductor devices. Plasma display with heat dissipation means The heat dissipation means may include a heat sink in which the base is in surface contact with one side of the semiconductor element, and the heat sink has the characteristics of the heat sinks described above to generate heat from a plurality of driving circuit chips. While maintaining the heat dissipation performance to release the effect is effective in preventing safety accidents occurring during the work.

COF, FPC, Heat Sink, Heat Sink

Description

Heat sink and plasma display device comprising the same

1 is a plan view of a COF with a heat sink according to the prior art.

2 is a side view of FIG. 1;

3 is a front view of FIG. 1;

4 is a cross-sectional view of a plasma display panel with a heat sink according to the prior art.

5 is a perspective view of a plasma display device according to the present invention;

6 is a front view of a heat sink with a heat sink according to the present invention.

7 is a cross-sectional view of a plasma display panel with a heat sink according to the present invention.

<Description of Symbols for Main Parts of Drawings>

10; Plasma display device 20; Plasma display panel

31,31 '; Driver circuit chip 32; FPC

40; Chassis base 62,64; PCB

80; Heat sink 81; Base

82; Heat sink fins 83; Heat dissipation plate

The present invention relates to a heat sink, and more particularly, to a heat sink and a plasma display device having the same, which are suitable for maintaining heat dissipation performance while improving working conditions and efficiency.

In general, a plasma display device is an apparatus for displaying an image on a plasma display panel using plasma generated by gas discharge. In the plasma display apparatus, an electrode printed on a plasma display panel is electrically connected to a driving circuit through a flexible printed circuit (FPC), and the signal is controlled by the driving circuit so that the FPC selectively forms wall voltages on the pixels of the panel. As a result, an IC for applying the address voltage is formed.

The voltage application structure using the FPC and IC is largely divided into COB and COF depending on the presence of a printed circuit board (PCB). At this time, COB is a case where the IC is mounted on the PCB, COF is a case where the IC is directly mounted on the film constituting the FPC, not the PCB. Unlike COB, dual COF has the advantage of simple structure and low price because PCB is excluded.

1 to 3, in the general COF 1, the IC 3 is mounted on one side of the FPC 2, and the heat sink is positioned at a position corresponding to the IC 3 on the other side. (4) is provided and configured to dissipate high heat generated in the IC.

The heat sink 4 is configured to protrude from the base 5 and a plurality of heat dissipation fins 6 aligned in a vertical direction with respect to the base.

4 is a partial cross-sectional view of the heat sink for heat dissipation of the PCB installed in the chassis base, as shown in FIG. 4, on the rear surface of the chassis base 8 supporting the plasma display panel 7. The heat sink 4 is provided on the upper surface of the driving chip 3 'provided on the circuit board 9 to be installed.

As such, in the related art, the heat sink 4 is provided in order to minimize the influence of heat generated from the IC 3 or the driving chip 3 ', and the heat dissipation fins 6 of the heat sink 4 have sharp ends. Since the protrusion is formed upward in the furnace, a case of injuring a worker is often caused during work, thereby lowering workability.

In particular, since the plasma display apparatus includes a plurality of heat sinks to form a module, there is a demand for structural improvement of a heat sink that reduces work efficiency.

The object of the present invention devised in view of such a problem is to minimize the trauma of the worker during the operation due to the heat sink fin of the heat sink is installed to reduce the heat generation of the IC or the driving chip.

Another object of the present invention is to achieve the above object and to maintain a stable heat generation performance of the heat sink.

The heat sink according to the present invention for achieving the above object is a heat sink comprising a base in contact with the semiconductor element, and a plurality of heat dissipation fins formed in an upright direction with respect to the base, to block external contact with the heat dissipation fins It is characterized by forming an area to be.

In one example, the length of the heat sink fin is formed to be relatively short to block external contact, it is preferable that the length of the heat sink fin is formed relatively short at least 1/4 length or less.

As another example, the heat dissipation plate is installed on the upper end of the heat dissipation fins to block external contact, and the heat dissipation plate is preferably installed to completely cover the upper end of the heat dissipation fins.

In addition, the plasma display device according to the present invention includes a plasma display panel, a chassis supporting a rear surface of the panel, a plurality of circuit boards electrically connected to the rear surface of the chassis, a semiconductor element provided on the circuit board, And a heat dissipation means for dissipating heat generated from the semiconductor element, wherein the heat dissipation means has a heat sink installed at one side of the semiconductor element in surface contact with the heat sink. Is characterized by having the above-described heat sinks.

Hereinafter, preferred embodiments of the present invention as described above will be described in more detail with reference to the accompanying drawings.

5 is a perspective view illustrating a plasma display device 10 according to the present invention, in which the plasma display device 10 includes a chassis base 40 on which the plasma panel 20 and the plasma panel 20 are supported, and the chassis base 40. The driving circuit unit 60 is formed on the rear surface of the chassis base 40, which is opposite to the surface on which the plasma panel 20 is mounted.

The plasma panel 20 includes a front panel 22 and a rear panel 24, and emits a phosphor layer using ultraviolet rays generated when a gas filled therein is discharged, thereby realizing an image. In more detail, the plasma panel 20 is formed by the front panel 22 and the rear panel 24 and is a discharge cell (not shown) which is a space in which discharge is generated, and is discharged in the discharge cell to cause discharge. Gas, a phosphor applied to a surface of the discharge cell, and electrodes (not shown) to which a voltage is applied are provided, and a discharge is generated in the discharge cell by a direct current or an alternating voltage applied between the electrodes and is discharged from the discharge gas. The emitted ultraviolet light excites the phosphor to emit visible light, thereby realizing an image.

The chassis base 40 is formed of a metal material having a predetermined thickness, and is generally made of an aluminum alloy having excellent thermal conductivity. Recently, as one way to reduce the thickness of the plasma display device, the use of a steel sheet having a higher strength than aluminum has been considered. In the case of using a steel sheet, a steel sheet having a thickness thinner than that of aluminum metal can be used. The chassis base 40 supports the plasma panel 20 while releasing heat conducted from the plasma panel 20 to prevent the temperature of the plasma panel 20 from rising above an appropriate level, and the plasma panel 20 ) Is prevented from being deformed by heat or broken by external impact.

The chassis base 40 is supported by the plasma panel 20 is bonded to the front surface by an adhesive member 28 such as a double-sided tape, the adhesive member 28 is bonded between the plasma panel 20 and The heat dissipation plate 26 is provided in the unheated area so that heat generated from the plasma panel 20 can be quickly transferred to the chassis base 40. The heat dissipation plate 26 is attached to the rear surface of the plasma panel 20, and the chassis base 40 is directly contacted with the heat dissipation plate 26 or spaced at predetermined intervals according to the type of the plasma display device. .

As the thickness of the chassis base 40 becomes thinner, a reinforcing member 42 is installed to reinforce the strength of the chassis base 40. An IC 31 is reinforced on one surface of the reinforcing member 42. A signal transmission means 32 may be formed to be insulated from the member 42 and electrically connect the integrated circuit chip 31 and the electrode of the plasma panel 20.

The chassis base 40 has a plurality of press holes (not shown) through which a plurality of bosses 50 for fixing the circuit board 60 of the driving circuit part are press-fitted. The press-fitting hole is formed at a predetermined position of the chassis base 40 according to the mounting position of the circuit board 62. The boss 50 is positioned in the rear direction of the chassis base in a substantially cylindrical shape, and a screw groove 50a is formed at one side thereof. Therefore, the screw 52 which fixes the circuit board 62 of the drive circuit part 62 is fastened to the screw groove 50a of the boss 50.

Details of the heat sink according to the present invention applied to the plasma display apparatus will be described with reference to FIGS. 6 and 7.

FIG. 6 illustrates a heat sink 80 installed for heat dissipation of the IC 31 installed in the FPC 32. Compared to FIG. 3, a heat dissipation fin formed upright with respect to the base 81 of the heat sink 80. The length L2 of 82 is formed at least 1/4 shorter than the length L1 of the heat radiation fin 6 of the conventional heat sink. The length (L2) of the heat dissipation fin may be formed according to the working conditions or design specifications of the product rather than a numerically limited meaning, the embodiment of the present invention is the same heat dissipation by a length of 1/4 or more shorter than the conventional heat dissipation fins To illustrate the performance can be demonstrated.

As such, when the length of the heat sink fins 82 of the heat sink is short, the operator's hand does not come into contact with the heat sink fins 82 during the operation.

In addition, in the present invention, the heat dissipation plate 83 may be installed at the upper end of the heat dissipation fin 82 of the heat sink to completely cover the heat dissipation fins 82.

When the heat dissipation plate 83 is installed at the upper end of the heat dissipation fins 82 as described above, the end of the pointed heat dissipation fins 82 is completely blocked, so that the worker can perform the work without being aware of the heat dissipation fins. If the heat dissipation plate 83 is installed in this way it will not be necessary to form a short length of the heat dissipation fins.

FIG. 7 illustrates a heat sink 80 applied to a driving chip 31 'installed on circuit boards 62 and 64. In this case, the heat sink 80 has the same structure as that of the IC 31 and has the same effect. Will be harvested.

As shown in Table 1, the results of measuring the difference in temperature change in order to check the heat dissipation performance as compared with the conventional heat sink as the shape of the heat sink 80 according to the present invention as shown in Table 1 below.

At this time, the temperature measurement position was three COF located on the upper side of the scan drive board, three COF located on the upper side of the power supply board.

Table 1

  Measuring position  Heatsink   2 lines on / off   When the video works   Power supply board  Without heatsink  48.7  52.2  Conventional Heatsink  44.7  46.1  The present invention heat sink  46.4  50.2   Scan drive board upper side  Without heatsink  48.2  52.7  Conventional Heatsink  45.6  50.3  The present invention heat sink  46.4  50.6

As such, the temperature was measured at a total of six locations, and the measurement position was selected in consideration of the fact that the heat sinks located on the upper side of each board generate the most heat, and the heat sink according to the present invention has a heat dissipation plate ( The heat sink in the case where 83) is not covered, ie, when the length L2 of the heat radiation fin 82 is short, was made into an experiment object.

The measurement results show that the heat sink according to the present invention has an average temperature of about 2 to 3 ° C. higher than that of the conventional heat sink, but the actual heat dissipation effect does not appear to have a large difference.

This will be said that the difference in the actual heat dissipation performance is not great even if the length of the heat dissipation fin is formed relatively short, as in the heat sink according to the present invention, and if the heat dissipation plate 83 is installed, This improves heat dissipation performance.

As described above, the heat sink and the plasma display device using the same according to the present invention have an effect of preventing safety accidents occurring during operation while maintaining heat dissipation performance for dissipating heat generated from a plurality of driving circuit chips.

The present invention is not limited to the specific preferred embodiments described above, and any person skilled in the art to which the present invention pertains can make various modifications without departing from the gist of the present invention as claimed in the following claims. Of course, such changes are within the scope of the claims of the present invention.

Claims (6)

delete delete delete A heat sink comprising a base in contact with a semiconductor element and a plurality of heat dissipation fins formed in an upright direction with respect to the base, Heat sink, characterized in that configured to block the external contact by installing a heat radiation plate on the upper end of the heat radiation fins. The method of claim 4, wherein The heat dissipation plate is a heat sink, characterized in that installed in the form to completely cover the upper end of the heat dissipation fins. A plasma display panel, a chassis supporting a rear surface of the panel, a plurality of circuit boards electrically connected to the rear surface of the chassis, semiconductor devices provided on the circuit board, and heat generated from the semiconductor devices In the plasma display device having a heat radiation means for The heat dissipation means may include a heat sink in which a base is in surface contact with one side of the semiconductor element, and the heat sink corresponds to any one of claims 4 and 5. .

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