KR100730134B1 - Chassis for display module and plasma display apparatus comprising the same - Google Patents

Abstract

An object of the present invention is to provide a chassis for a display device having a structure in which heat generated from a mounting element of a signal transmission member can move upwardly with external air, and a plasma display device having the same. In order to achieve the present invention, there is provided an apparatus comprising: a chassis base configured to support at least one circuit board for driving a display panel embodying an image; And a first bent portion extending in a first direction from the chassis base and a second bent portion extending in a second direction from the first bent portion, supporting the signal transmission member having the mounting element mounted at the center thereof. The present invention provides a chassis for a display apparatus having at least one heat dissipation hole formed across at least two of a chassis base, a first bent portion, and a second bent portion, and a plasma display apparatus having the same.

Description

Chassis for display device and plasma display device having same {Chassis for display module and plasma display apparatus comprising the same}

1 is a schematic cross-sectional view of a plasma display device including a heat dissipation structure of a mounting device of a conventional display panel.

2 is a schematic perspective view of a chassis and a plasma display device having the same according to a first embodiment of the present invention.

3 is an exploded perspective view illustrating an example of the plasma display panel of FIG. 2.

4 is an exploded perspective view illustrating an enlarged portion A of FIG. 2.

FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4.

FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 4.

7 is a perspective view illustrating a modification of FIG. 2.

8A and 8B are perspective views showing manufacturing steps of a chassis for a display device according to a first embodiment of the present invention, respectively.

FIG. 9 is a schematic perspective view of a chassis and a plasma display device having the same according to a second embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: plasma display device 110: plasma display panel

140, 240: chassis for display devices 141, 241: chassis base

150: chassis bent portion 151, 251: first bent portion

152 and 252: second bent portion 157: heat dissipation hole

160: circuit portion 161: circuit board

170: signal transmission member 172: mounting element

180: cover plate 191: first corner

192: second corner 250: element support member

A: internal space

The present invention relates to a chassis for a display device and a plasma display device having the same, and more particularly, to a display device having an improved structure such that heat generated from a mounting element mounted on a signal transmission member can be smoothly discharged to the outside. A chassis and a plasma display device having the chassis are provided.

In recent years, the plasma display apparatus, which has been attracting attention as a substitute for the conventional cathode ray tube display apparatus, is discharged after a discharge gas is filled between two substrates on which a plurality of electrodes are formed. A phosphor formed in a pattern is excited to emit visible light, thereby obtaining a desired image.

The conventional plasma display device illustrated in FIG. 1 includes a display panel 20 for implementing an image, a chassis 40 supporting the display panel 20, and a rear panel mounted to the rear of the chassis to drive the display panel. The circuit unit 50 and a signal transmission member 70 connecting the display panel and the circuit unit are provided.

The display panel 20 includes a front panel 21 and a rear panel 22. In this case, the back panel 22 is attached to the chassis 40 by the double-sided tape 33 so that the display panel is supported by the chassis 40.

The chassis has a chassis base 42 on which circuit parts 50 for driving a display panel are mounted. The circuit portion includes at least one circuit board, which circuit board is uniformly spaced apart from the chassis base 42.

The display panel 20 and the circuit unit 50 are connected by the signal transmission member 70. Recently, a Tape Carrier Package (TCP) has been used as the signal transmission member 70. The TCP is in the form of a tape, in which at least one mounting element 72 is mounted. The signal transmission member 70 has a clearance between the rear surface of the chassis base 42 and similar to the clearance between the circuit portion and the chassis base 42.

On the other hand, when the plasma display panel 20 is driven, a large amount of heat is generated from the mounting element 72. In order to discharge heat generated from the mounting element 72 to the outside, the mounting element 72 is seated on the chassis bent portion 45 bent from the chassis base. As a result, the heat from the mounting element 72 comes into contact with the outside air through the chassis 40 so that the outside air becomes high temperature, and the outside air that has become high temperature is moved upward by using the natural convection phenomenon, thereby causing a plasma display. Emitted out of the device.

However, according to the conventional chassis structure, heat generated from the mounting element 72 is not effectively discharged to the outside through the chassis 40. This is because a part of the heat generated from the mounting device is discharged into the internal space A of the chassis bent portion 42, and the heat H moving upward from the internal space A of the chassis bent portion 42 is This is because it is blocked by the chassis bent portion 45 and cannot move upward. For this reason, the heat dissipation efficiency of the said mounting element 72 falls, and the performance and lifetime of a mounting element fall. Accordingly, there is a need to more effectively dissipate heat generated in the mounting device.

Meanwhile, instead of the chassis bent portion, a separate reinforcing member coupled to the chassis may allow the mounting element to be seated. In this case, however, the same problem may occur.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has a structure for a display device chassis and a plasma having the structure in which heat generated from the mounting element of the signal transmission member can move upward with the outside air. It is an object to provide a display device.

In order to achieve the above and other objects, a chassis for a display device according to a preferred embodiment of the present invention is: formed in the transverse direction while supporting at least one circuit board for driving a display panel for implementing an image Chassis base; And a first bent part extending in a first direction from the chassis base and a second bent part extending in a second direction from the first bent part to support a signal transmission member having the mounting element mounted at a central portion thereof. And at least one heat dissipation hole formed across at least two of the chassis base, the first bent portion, and the second bent portion.

The chassis bent portion may be formed at an edge of the chassis.

On the other hand, the first bent portion is bent extending in the longitudinal direction from the chassis base, the second bent portion may be extended in the transverse direction from the first bent portion, in this case, the chassis base from the second bent portion It may further include a third bent portion is bent in the direction extending.

In addition, the chassis bent portion is preferably disposed at least on the lower edge of the chassis base, the second bent portion is preferably extended extending bent downward from the first bent portion.

In this case, the mounting device may be seated on the second bent portion.

On the other hand, the chassis is preferably formed by pressing a metal raw material.

Preferably, the signal transmission member is a tape carrier package (TCP).

Preferably, the display panel is a plasma display panel that implements an image of plasma discharge.

On the other hand, the display device according to another aspect of the present invention comprises: a plasma display panel for implementing an image; A chassis supporting the plasma display panel; A circuit unit installed at a rear of the chassis with a clearance therein to drive the plasma display panel; An electrical signal is transmitted between the plasma display panel and the circuit unit, and includes at least one signal transmission member including at least one mounting element, and the chassis member includes: a circuit unit for implementing a display panel that implements an image. A supporting chassis base; And a chassis bent portion including a first bent portion bent rearward from the chassis base and a second bent portion extended from the first bent portion to support a signal transmission member having the mounting element mounted at the center thereof. And at least one heat dissipation hole formed across at least two of the chassis base, the first bent portion, and the second bent portion.

The chassis bent portion may be formed at an edge of the chassis. In this case, the chassis bent portion may further include a third bent portion which is bent from the second bent portion in one of left, right, top, and downward directions.

Preferably, the second bent portion is bent downward from the first bent portion to extend.

The plasma display panel and the chassis base has a predetermined clearance, and the heat dissipation hole may be formed over at least the chassis base and the first bent portion.

On the other hand, the plasma display panel comprises: a front substrate; A rear substrate disposed to be spaced apart from the front substrate to form a discharge space between the front substrate and the front substrate; A partition wall disposed between the front substrate and the rear substrate to partition discharge cells together with the front substrate and the rear substrate; A pair of sustain electrode pairs extending in one direction and extending in a direction crossing the sustain electrode pairs for each of the discharge cells; It may be provided with a phosphor layer disposed in the discharge spaces.

In this case, the signal transmission member is preferably a tape carrier package (TCP) provided with an address driver IC.

In addition, the plasma display panel may be driven by a single scan method.

 Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings. Herein, although the present invention describes a plasma display device that implements an image using plasma discharge as an example of the display device, the present invention is not limited thereto, and a high temperature heat is generated by a signal transmission member supported by a chassis. If the display device is included in the present invention.

FIG. 2 is a schematic perspective view of an embodiment of a chassis and a plasma display device having the same according to the first embodiment of the present invention. FIG. 3 is an exploded perspective view showing an example of the plasma display panel of FIG. 2 is an exploded perspective view illustrating an enlarged portion of the chassis bent portion of FIG. 2, and FIG. 5 is a cross-sectional view taken along line V-V of FIG. 4, and FIG. 6 is a cross-sectional view taken along line VI-VI.

As shown in FIG. 2, the chassis 140 according to the first embodiment of the present invention may include a chassis base 141 and a chassis bent portion 150. The chassis base 141 supports at least one circuit board 161 for driving a display panel such as a plasma display panel 110 that implements an image and is formed to be perpendicular to the y-axis in the horizontal direction, that is, in FIG. 2. .

3 illustrates an example of an AC plasma display panel having a surface discharge type 3 electrode structure among plasma display panels. However, the present invention is not limited thereto, and a display device including a signal transmitting member mounted with a mounting element for generating high heat, as described below, belongs to the present invention. Referring to FIG. 3, the plasma display panel 110 includes a front panel 120, a rear panel 130 facing and coupled to the front panel 120, a partition 134, and a sustain electrode pair 122. , Address electrodes 132, and phosphor layer 136.

In more detail, the front panel 120 is formed on the front substrate 121 disposed at the front and the rear surface of the front substrate 121, and the X electrode 123 and the Y electrode 124 for each discharge cell. Sustain electrode pairs 122 formed of a pair of? The X electrode 123 and the Y electrode 124 constituting the sustain electrode pair 122 serve as a common electrode and a scan electrode, and are spaced apart from each other by a discharge gap. The X electrode 123 may include an X transparent electrode 123a and an X bus electrode 123b formed to be connected thereto. Likewise, the Y electrode 124 is also formed to be connected to the Y transparent electrode 124a. It may be formed to have a Y bus electrode 124b.

In addition, the rear panel 130 is disposed on the rear of the front substrate 121, the rear substrate 131 to form a discharge space 135 between the front substrate 121 and the rear substrate, Address electrodes 132 are formed on the front surface of the substrate 131 and extend in a direction crossing the sustain electrode pairs 122. In this case, the phosphor layer 136 is formed in the discharge spaces 135.

The sustain electrode pairs 122 may be covered by the front dielectric layer 125. In this case, the passivation layer 126 may be formed on the rear surface of the front dielectric layer 125. In addition, the address electrodes 132 may be covered by the rear dielectric layer 133. In this case, the partition wall 134 may be formed on the rear dielectric layer 133.

2, the chassis 140 is disposed behind the plasma display panel 110, and the display panel 110 and the chassis are coupled by an adhesive member, for example, a double-sided tape. In addition, although not shown, a heat dissipation means for a panel, which is a heat conducting medium, may be provided between the display panel 110 and the chassis 140.

The circuit unit 160 is disposed on the rear surface of the chassis 140. The circuit unit 160 may include a plurality of circuit boards 161 such as a logic board, a power board, and a logic buffer board. Function to drive.

The circuit unit 160 transmits an electrical signal to the plasma display panel 110 through the signal transmission member 170. The signal transmission member 170 may be a flexible circuit board such as a tape carrier package (TCP), a chip on film (COF), or the like. In this case, the signal transmission member 170 may be packaged by mounting at least one mounting element 172 on each of the tape-shaped wiring units 171.

For example, when TCP is used as the signal transmission member 170, the wiring unit 171 is usually formed by laminating a film layer, a copper foil layer made of copper, and an SR (solder resist) coating layer. 172 is mounted on the wiring portion 171. The TCP has flexibility in that it is made of a tape, and since a plurality of driving circuit elements can be mounted, there is an advantage in that the size of the circuit unit can be reduced.

The signal transmission member 170 may be shielded by the cover plate 180.

On the other hand, between the circuit board 161 constituting the circuit unit 160 and the chassis base 141 has a predetermined clearance of 6mm or more, for example, in order to satisfy safety standards such as UL standards. Accordingly, the signal transmission member 170 connected to the circuit board 161 should also have a certain clearance from the chassis base 141. Therefore, if there is no support means for supporting the signal transmission member 170, the signal transmission member 170 is easily shaken, thereby easily causing damage to external shock, and generates noise on the screen. Therefore, a component for supporting the signal transmission member 170 to the chassis 140 is required.

In addition, when the plasma display panel 110 is driven, a lot of heat is generated from the mounting elements 172 mounted on the signal transmission member 170, and this heat degrades the display performance of the plasma display panel 110. In the case of driving for a long time, the reliability of the circuit unit 160 is reduced. Therefore, there is a need for a component capable of dissipating heat generated from the mounting element 172 to the outside.

Therefore, the chassis 140 is in contact with the mounting element 172 of the signal transmission member 170 to smoothly receive heat generated from the mounting element 172 and support the signal transmission member 170. Has a chassis bend 150. The chassis bent part 150 is bent from the chassis base 140 and includes a first bent part 151 and a second bent part 152.

4 is an enlarged perspective view of part A of FIG. 2, FIG. 5 is a cross-sectional view taken along the line VV of FIG. 4, and FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 4.

The chassis bent portion 150 will be described in detail with reference to FIGS. 4 to 6, and the first bent portion 151 is formed to be bent and extended in the first direction from the chassis base 141. 152 is bent and extended in the second direction from the first bent portion 151. That is, as shown in FIG. 4, the first bent portion 151 may be bent from the chassis base 141 in the longitudinal direction (y-axis direction) to extend to the same height as the circuit board. In this case, the first bent portion 151 may be formed to be parallel to the y-axis, otherwise it is not shown, but may be formed to be inclined at a constant angle with the y-axis, and alternatively at a constant angle with the y-axis Inclined portion bends may extend in a zigzag fashion.

In addition, the second bent portion 152 is formed to be bent and extended from the first bent portion 151 in the lateral direction (x-axis direction or z-axis direction) so as to be formed parallel to the circuit board.

Therefore, as shown in FIGS. 4 and 5, the signal transmission member 170 is connected to the circuit board 161 along the second bent portion 152, and in this case, the signal transmission member 170 The mounting element 172 may be seated on the second bent portion 152. In this case, a transmission medium 156 such as thermal grease may be interposed between the mounting element 172 and the second bent portion 152.

In addition, the cover plate 180 may be positioned outside the mounting element 172. The cover plate 180 passes through the mounting bolt 183 through the mounting hole 185 to be coupled to the female screw of the mounting hole 155 so that the cover plate 180 is the second bent portion of the chassis bent portion 150. 152 may be mounted. In this case, a heat conductive medium 186 may be interposed between the mounting element 172 and the cover plate 180.

In this case, in particular, as shown in FIGS. 4 and 6, the chassis 140 has at least one heat dissipation hole 157. Accordingly, the air in the internal space A of the first bent portion 151 and the second bent portion 152 receives heat from the chassis bent portion 150 to become a high temperature, and the high temperature air is the heat radiating hole. It may be discharged to the outside of the chassis bent portion 150 through the 157.

In particular, the heat dissipation hole 157 is formed across at least two of the chassis base 141, the first bent portion 151, and the second bent portion 152. That is, the heat dissipation hole 157 is formed across the chassis base 141 and the first bent portion 151, or is formed across the first bent portion 151 and the second bent portion 152, or FIG. As shown in FIG. 6, the chassis base 141 is formed across the first bent portion 151 and the second bent portion 152. Therefore, in particular, as shown in FIG. 6, the cross-sectional area of the heat dissipation hole 157 is increased so that the internal air H located in the internal space A of the chassis bent portion 150 is not stagnant and the heat dissipation hole ( By being discharged to the outside through the 157, the heat from the mounting element 172 seated on the chassis bent portion 150 is radiated smoothly, and as a result, the performance of the mounting element is excellent, and its life is extended.

In particular, the chassis bent portion 150 is disposed at least on the lower edge of the chassis base 141, the second bent portion 152 is bent downward (-z direction) from the first bent portion 151 Can be extended. In this case, the heat dissipation hole 157 is formed across at least two of the chassis base 141, the first bent portion 151, and the second bent portion 152. Therefore, the heat dissipation hole 157 is located above the inner space A of the chassis bent portion 150. Therefore, the hot air rises and the cold air descends, so that the hot air in the chassis A internal space A rises and passes through the heat radiation hole located at the upper side of the chassis bend. It can be released to the outside smoothly.

In this case, when the display panel is a plasma display panel, one end of each of the wiring parts 171 of the signal transmission members 170 is provided to the plasma display panel 110 via the lower edge of the chassis 140. The electrodes 132 (refer to FIG. 3) are connected to each other, and the other end thereof is connected to an address driver (not shown) of the circuit unit 160. Therefore, the signal transmission member is preferably a tape carrier package (TCP) provided with an address driver IC.

In particular, as shown in FIG. 7, when the plasma display apparatus is driven by a high definition (HD) single scan method, the plasma display device is connected between the address driver (not shown) and the address electrodes 132 (see FIG. 3). Further, more heat is generated in the devices mounted on the signal transmission member 170 disposed along the lower edge of the chassis. Therefore, the present invention is more preferably a plasma display device having a plasma display panel driven by a high definition (HD) single scan method.

The present invention is particularly effective when press working the chassis. That is, as shown in FIG. 8A, in order to manufacture the chassis base 141 and the chassis bent portion 150 bent from the chassis base 141 with the chassis 140 raw material, such as aluminum, at least to the chassis raw material. One heat dissipation hole 157 is formed. Although not shown for this purpose, the chassis raw material may be seated on a die and then pressed with a punch.

Subsequently, as shown in FIG. 8B, the first corner 191 and the first bent portions 151 and the first portion between the chassis base 141 and the first bent portion 151 of the chassis raw material as a press mold. The second corner 192 between the two bent portions 152 is bent.

In this case, the one end portion 157a parallel to the first edge 191 or the second edge 192 of the heat dissipation hole 157 may have the first edge 191 or the second edge ( 192) and a certain amount of play (K). If the corners 191 and 192 and the heat dissipation hole end 157a do not have more than a predetermined distance K, stress concentration is generated at the heat dissipation hole end 157a during the bending operation. This is because the first bent portion 151 or the second bent portion 152 is bent without being flattened by the heat dissipation hole, or cracking occurs from the heat dissipation hole 157.

In this case, the heat dissipation hole 157 is not formed over at least two of the chassis base 141, the first bent portion 151, and the second bent portion 152, and the first bent portion ( It may be formed between the first edge 191 and the second edge 192 of the 151. In this case, however, in order for the heat dissipation hole to have a constant convective area, the heat dissipation hole must be elongated in the longitudinal direction parallel to the first edge or the second edge. The length of the longitudinal direction should be formed below a certain limit because will fall. Therefore, if a heat dissipation hole is formed between the first edge 191 and the second edge 192 of the first bent portion 151, the heat transfer cross-sectional area is dropped.

In contrast, in the present invention, as shown in FIG. 8B, the heat dissipation hole 157 is formed over at least one of the first edge 191 and the second edge 192. Therefore, the heat dissipation hole 157 may be formed long in the vertical direction to the longitudinal direction of the chassis bent portion 150, it is possible to maximize the convection phenomenon while minimizing the damage of the heat transfer cross-sectional area.

In addition, the plasma display panel 110 and the chassis base 141 are spaced apart by the distance of the double-sided tape 115 (see FIG. 6). Therefore, if the heat dissipation hole 157 is formed over the chassis base 141 and formed inside the double-sided tape 115, the convection of the space formed between the plasma display panel 110 and the chassis base 141 is included. The heat dissipation hole can also maximize convection cooling.

 Meanwhile, as shown in FIGS. 2 to 8B, the chassis bent portion 150 extends not only the first bent portion 151 and the second bent portion 152 but also the second bent portion 152 to extend the chassis base. A third bent portion 153 bent in the direction (141) may be further provided. As a result, the strength of the chassis bent portion 150 is increased, thereby improving the overall rigidity of the chassis 140, and the signal transmitting member 170 from the plasma display panel 110 may be formed by the second bent portion. Along with 152 may be guided along the third bent portion 153. In this case, the mounting element 172 may be seated on the second bent portion 152, or alternatively, may be seated on the third bent portion 173.

Hereinafter, referring to FIGS. 2 to 4, a process of operating the plasma display apparatus 100 including the chassis 140 according to the first embodiment and a path of dissipation of heat generated by the mounting element 172 will be described. Take a look.

When the user operates the plasma display apparatus 100, the circuit unit 160 is driven to apply a voltage to the plasma display panel 110.

When a voltage is applied to the plasma display panel 110, address discharge and sustain discharge occur, and the energy level of the discharged gas excited during sustain discharge is lowered to emit ultraviolet rays. The ultraviolet rays excite the phosphor of the phosphor layer 136 applied in the discharge cell, and the visible light is emitted as the energy level of the excited phosphor is lowered, and the emitted visible light is emitted to form an image that can be recognized by the user. Done.

At this time, a large amount of heat is generated from the mounting element 172 installed in the second bent portion 152 of the chassis bent portion, a portion of the generated heat is transferred to the cover plate 180 via the heat transfer medium 186 The remaining heat is transferred to the second bent portion 152.

Heat generated in the mounting element 172 and transferred to the cover plate 180 is directly discharged by convective heat transfer to air contacting the cover plate 180.

In addition, a portion of the heat generated by the mounting element 172 and transferred to the second bent portion 152 is transferred to the chassis base 141 via the first bent portion 151, and the remaining heat is transferred to the second bent portion ( 152 and the air contacting the surface of the first bent portion 151 are directly released by the convective heat transfer action.

The air that has received heat in contact with the surfaces of the second bent portion 152 and the first bent portion 151 continuously transmits heat to air having a low temperature while surrounding the first bent edge 191 (FIG. 8b) and the low temperature air may be introduced through the heat dissipation hole 157 formed through the second edge 192 (see FIG. 8b), and the high temperature air may be discharged. Is performed.

On the other hand, as shown in Figure 9, instead of the chassis bent portion 150, a member separate from the chassis base may be used. Therefore, the display device chassis 240 according to the second embodiment of the present invention includes the element support member 250 together with the chassis base 241. In this case, the same reference numerals as those of FIG. 2 among the reference numerals shown in FIG. 5 show the same members having the same functions, and thus detailed description thereof will be omitted.

The element support member 250 is coupled to the chassis base 241 so as to support the signal transmission member 170 on which the mounting element 172 is mounted. The element support member 250 is a first bent longitudinally from the chassis base 241. A bent portion 251 and a second bent portion 252 which is bent in a transverse direction from the first bent portion 251 is provided. In this case, the heat dissipation hole 257 is formed across the first bent portion 251 and the second bent portion 252. On the other hand, in order to couple the element support member 250 to the chassis base 241 may be further provided with a coupling portion 254 in contact with the chassis base 241.

The element support member 250 has the same function as the chassis bent portion 150 provided in the chassis 140 for the display device according to the first embodiment of the present invention. That is, the element support member 250 is in contact with the mounting element 172 of the signal transmission member 170 that electrically connects the circuit unit 160 provided on the chassis base 241 and the plasma display panel 110. The heat radiation from the mounting element is achieved. In addition, the element support member 250 may serve to reinforce the strength of the chassis base 241.

On the other hand, the cover plate 180 may be located outside the mounting element 172. The cover plate 180 passes through the mounting bolt 183 through the mounting hole 185 to be coupled to the female screw of the mounting hole 255 so that the cover plate 180 is the second bent portion of the chassis support member 170. 252 may be mounted. In this case, a heat conductive medium 186 may be interposed between the mounting element 172 and the cover plate 180.

In this case, the heat dissipation hole 257 may be formed to smoothly discharge heat from the mounting element 172 to the outside, which is the same as the heat dissipation hole 157 in the first embodiment of the present invention. Description is omitted.

On the other hand, the element support member 250 may be formed on the edge of the chassis. The element supporting member 250 is disposed at least at the lower edge of the chassis base 241, and the second bent portion 252 is formed to be bent downwardly (-z direction) from the first bent portion 251. Can be. In this case, when the display panel is a plasma display panel, the signal transmission member may electrically connect the address driver and the address electrodes. Meanwhile, the mounting device may be seated on the second bent portion 252.

As described above, according to the present invention, the heat dissipation hole is formed long over at least one edge of the chassis bent portion or the element support member for mounting the mounting element, thereby increasing the size of the heat dissipation hole. Therefore, the air heated by receiving the heat generated from the mounting device can be smoothly discharged to the outside through the heat dissipation hole, thereby improving the convective heat transfer effect, thereby improving the heat dissipation performance and life of the mounting device.

Further, according to the present invention, the heat dissipation hole is formed long over at least one edge of the chassis bent portion or element support member for mounting the mounting element, so that the heat radiation hole is formed short in the longitudinal direction of the chassis bent portion or element support member, As a result, the strength of the chassis bend or element support member is maintained, and as a result, the chassis base can be sufficiently reinforced.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (20)

A chassis base configured to support at least one circuit board for driving a display panel embodying an image; And Supporting a signal transmission member mounting the mounting element in the center portion, and having a first bend extending in the first direction from the chassis base and a second bend extending in the second direction from the first bent portion In having a chassis bent part, And at least one heat dissipation hole formed to pass through at least two of the chassis base, the first bent portion, and the second bent portion. The method of claim 1, And the chassis bent portion is formed at an edge of the chassis base. The method of claim 1, The chassis base is formed in the transverse direction, The first bent portion is formed extending in the longitudinal direction from the chassis base, And the second bent portion extends in a lateral direction from the first bent portion. The method of claim 3, wherein The chassis bending portion further comprises a third bending portion bent extending from the second bending portion in the direction of the chassis base. The method of claim 3, wherein And the chassis bent portion is disposed at least at a lower edge of the chassis base, and the second bent portion extends downwardly from the first bent portion. The method of claim 1, The mounting device is a chassis for a display device, characterized in that seated on the second bent portion. The method of claim 1, The heat dissipation hole is formed over the chassis base, the first bent portion, and the second bent portion chassis for a display device. The method according to any one of claims 1 to 7, The chassis bent portion, the display device chassis, characterized in that formed by pressing a metal raw material. The method according to any one of claims 1 to 7, The signal transmission member chassis for a display device, characterized in that the TCP (tape carrier package). The method according to any one of claims 1 to 7, The display panel is a chassis for a display device, characterized in that the plasma display panel for implementing an image using a plasma discharge. A plasma display panel for implementing an image; A chassis supporting the plasma display panel; A circuit unit installed at a rear of the chassis with a clearance therein to drive the plasma display panel; The electronic device is configured to transfer an electrical signal between the plasma display panel and the circuit unit, and includes at least one signal transmission member including at least one mounting element. The chassis includes: a chassis base for supporting a circuit portion for implementing a display panel for implementing an image; And a chassis bent portion including a first bent portion bent rearward from the chassis base and a second bent portion extended from the first bent portion to support a signal transmission member having a mounting element mounted at a central portion thereof. And at least one heat dissipation hole formed to pass through at least two of the chassis base, the first bent portion, and the second bent portion. The method of claim 11, And the chassis bent portion is formed at an edge of the chassis. The method of claim 12, And the chassis bent portion further comprises a third bent portion which is bent and extends in one of left, right, top and bottom directions from the second bent portion. The method of claim 12, And the second bent portion is bent downward from the first bent portion to extend. The method of claim 11, It has a certain clearance between the plasma display panel and the chassis base, The heat dissipation hole is formed over at least the chassis base and the first bent portion. The method of claim 11, The heat dissipation hole is formed over the chassis base, the first bent portion, and the second bent portion plasma display apparatus. The method of claim 11, The plasma display panel comprises: a front substrate; A rear substrate disposed to be spaced apart from the front substrate to form a discharge space between the front substrate and the front substrate; A partition wall disposed between the front substrate and the rear substrate to partition discharge cells together with the front substrate and the rear substrate; A pair of sustain electrode pairs extending in one direction and extending in a direction crossing the sustain electrode pairs for each of the discharge cells; And a phosphor layer disposed in the discharge spaces. The method of claim 17, And the signal transmission member is a tape carrier package (TCP) provided with an address driver IC. The method of claim 17, The plasma display panel is driven in a single scan method. The method according to any one of claims 11 to 19, And said chassis is formed by pressing a metal raw material.

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