KR20060098461A - Structure for heat dissipation of integrated circuit chip of plasma display module, and plasma display module comprising the same - Google Patents

Abstract

The present invention provides an integrated circuit chip heat dissipation structure of a plasma display module capable of effectively dissipating heat generated from an integrated circuit chip by mounting a heat dissipation plate having a folding shape on a cover plate, and a plasma display module having the same. In order to achieve the above object, the present invention provides a chassis comprising a chassis bent portion and a chassis base, an integrated circuit chip mounted in contact with the chassis bent portion and connected to a signal transmission means, and the integrated circuit. An integrated circuit chip heat dissipation structure of a plasma display module including a cover plate installed on the chassis bent portion facing the chip, and a heat dissipation plate mounted on the cover plate and having a folding shape, and a plasma display module having the same do.

In addition, to achieve the above object, the present invention provides a chassis comprising a reinforcement and a chassis base, an integrated circuit chip mounted in contact with the reinforcement and connected to the signal transmission means, and facing the integrated circuit chip. An integrated circuit chip heat dissipation structure of a plasma display module including a cover plate installed on a reinforcement member and a heat dissipation plate mounted on the cover plate and having a folding shape, and a plasma display module having the same.

Description

Structure for heat dissipation of plasma display module and plasma display module having same hereinafter {Structure for heat dissipation of integrated circuit chip of plasma display module, and plasma display module comprising the same}

1 is a cross-sectional view of an example of a plasma display module used in a conventional plasma display device.

2 is a schematic exploded perspective view of a plasma display module including an integrated circuit chip heat dissipation structure according to an embodiment of the present invention.

3 is an exploded perspective view illustrating an enlarged portion of the chassis bent portion of FIG. 2.

4 is a schematic enlarged cross-sectional view taken along line IV-IV of FIG. 3.

5 is a schematic enlarged cross-sectional view showing a cross section of a stiffener portion according to a variant of the embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

210, 310: chassis 211, 311: chassis base

212: chassis bend 220: circuit board

221 and 321: address electrode buffer circuit board 222: X electrode driving circuit board

223: Y electrode driving circuit board 224: power supply board

225: logic control boards 228, 328: circuit elements

229 and 329: connectors 230 and 330: signal transmission means

240, 340: integrated circuit chip 250, 350: cover plate

260: double-sided adhesive means 270: panel heat radiation sheet

280, 380: chip heat dissipation sheet 290, 390: heat dissipation plate

291, 391 rivet 312 reinforcement

The present invention relates to a heat dissipation structure of an integrated circuit chip of a plasma display module, and more particularly, by mounting a heat dissipation plate having a folded shape on a cover plate, a plasma display capable of effectively dissipating heat generated from an integrated circuit chip. An integrated circuit chip heat dissipation structure of a module and a plasma display module having the same are provided.

Recently, a plasma display panel (PDP), which is drawing attention as a replacement for a conventional cathode ray tube display device, is discharged after a discharge gas is filled between two substrates on which a plurality of electrodes are formed. The phosphor formed in a predetermined pattern is excited by the ultraviolet rays generated thereby to emit visible light, thereby obtaining a desired image.

1 is a cross-sectional view of an example of a plasma display module used in a conventional plasma display device.

As shown in FIG. 1, the plasma display module 100 typically includes a plasma display panel 110, a plurality of circuit boards 120 on which circuits driving the plasma display panel 110 are arranged, and the plasma display panel. And a chassis 130 for supporting the panel 110 and the circuit board 120.

The plasma display panel 110 and the chassis 130 are coupled to each other by the double-sided adhesive means 140 attached to the rear surface of the plasma display panel 110.

The panel heat dissipation sheet 150 is installed between the plasma display panel 110 and the chassis 130, and heat generated during operation of the plasma display panel 110 may be discharged to the chassis 130. It is supposed to be.

The chassis 130 includes a chassis base 131 and a reinforcement 132.

The circuit board 120 and the plasma display panel 110 are electrically connected by the signal transmitting means 160. The signal transmission means 160 has a plurality of conductors extending in the longitudinal direction of the signal transmission means 160, and at least some of the conductors pass through the integrated circuit chip 170.

The integrated circuit chip 170 is installed on the reinforcement 132, the cover plate 180 for fixing and protecting the signal transmission means 160 and the integrated circuit chip 170 is coupled to the reinforcement 132 do.

Bolts 190 are used to couple the cover plate 180 and the reinforcement 132. To this end, the reinforcement 132 has holes 133 having female threads formed therein at predetermined intervals. In the cover plate 180, a through hole 181 through which the bolt 190 passes is formed at each fastening portion at a predetermined interval. Accordingly, the assembling member mounts the cover plate 180 to the reinforcing material 132 by passing the bolt 190 through the through hole 181 and engaging the hole 133 having the female thread formed therein.

When the plasma display panel 110 is driven, a large amount of heat is generated from the integrated circuit chip 170. A portion of the heat generated from the integrated circuit chip 170 is transferred to the cover plate 180, and the remaining heat is supplied to the reinforcing material ( 132 and then to the chassis base 131.

Heat generated from the integrated circuit chip 170 and transferred to the cover plate 180 is discharged by convective heat transfer to air contacting the cover plate 180. The conventional integrated circuit chip heat dissipation structure as described above is a cover plate. Since the heat dissipation area of the 180 is limited, there is a problem that heat generated in the integrated circuit chip 170 is not effectively discharged.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and a main object of the present invention is to effectively dissipate heat generated in an integrated circuit chip by mounting a heat radiating plate having a folding shape on a cover plate. An integrated circuit chip heat dissipation structure of a plasma display module and a plasma display module having the same are provided.

In order to achieve the above and other objects, the present invention provides a chassis comprising a chassis bent portion and a chassis base, an integrated circuit chip mounted in contact with the chassis bent portion and connected to the signal transmission means; A heat dissipation structure of a plasma display module includes a cover plate installed at the bent portion of the chassis so as to face the integrated circuit chip, and a heat dissipation plate mounted on the cover plate and having a folding shape.

Here, the chassis bent portion is preferably formed at the edge of the chassis.

Here, the signal transmission means may be a tape carrier package.

Here, a chip heat dissipation sheet may be further provided between the integrated circuit chip and the cover plate.

Here, the heat dissipation plate is preferably installed at the end of the cover plate.

Here, the cross section of the heat dissipation plate may have a zigzag shape.

Here, the cross section of the heat dissipation plate may have a meandering shape.

Here, the heat dissipation plate may be a plurality.

Here, the heat dissipation plate is preferably made of a thermally conductive material.

Here, the thermally conductive material may be copper.

Here, the plasma display module may have an integrated circuit chip heat dissipation structure as described above.

In addition, the object of the present invention as described above, the chassis comprising a reinforcement and the chassis base, an integrated circuit chip mounted in contact with the reinforcement and connected to the signal transmission means, and installed in the reinforcement to face the integrated circuit chip It is achieved by providing a heat dissipation structure of the integrated circuit chip of the plasma display module including a cover plate and a heat dissipation plate mounted on the cover plate and having a folding shape.

Here, the reinforcing material is preferably formed at the edge of the chassis.

Here, the signal transmission means may be a tape carrier package.

Here, a chip heat dissipation sheet may be further provided between the integrated circuit chip and the cover plate.

Here, the heat dissipation plate is preferably installed at the end of the cover plate.

Here, the cross section of the heat dissipation plate may have a zigzag shape.

Here, the cross section of the heat dissipation plate may have a meandering shape.

Here, the heat dissipation plate may be a plurality.

Here, the heat dissipation plate is preferably made of a thermally conductive material.

Here, the thermally conductive material may be copper.

Here, the plasma display module may have an integrated circuit chip heat dissipation structure as described above.

Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings.

FIG. 2 is a schematic exploded perspective view of an embodiment of a plasma display module including an integrated circuit chip heat dissipation structure according to an exemplary embodiment of the present invention, FIG. 3 is an exploded perspective view illustrating an enlarged portion of the chassis bent portion of FIG. Is a schematic enlarged cross-sectional view taken along line IV-IV of FIG. 3.

As shown in FIG. 2, the plasma display module 200 according to an embodiment of the present invention includes a plasma display panel 201, a chassis 210, a circuit board 220, and a signal transmitting means 230 for implementing an image. , Integrated circuit chip 240, cover plate 250, double-sided adhesive means 260, panel heat dissipation sheet 270, chip heat dissipation sheet 280, and heat dissipation plate 290.

The plasma display panel 201 is mounted on the front of the chassis 210, and the combination of the plasma display panel 201 and the chassis 210 is attached to the rear surface of the plasma display panel 201. 260, the double-sided tape is used as the double-sided adhesive means 260.

A panel heat dissipation sheet 270 having excellent thermal conductivity is interposed between the plasma display panel 201 and the chassis 210, and heat generated during operation of the plasma display panel 201 is transferred to the chassis 210. ) Can be released.

The chassis 210 is made of aluminum and includes a chassis base 211 and a chassis bent portion 212.

The chassis base 211 is positioned at the center of the chassis 210, and a boss 215 is pressed into the chassis base 211.

The chassis bent portion 212 is positioned at the edge of the chassis 210, and is bent to a height similar to that of the circuit board 220.

The circuit board 220 includes an address electrode buffer circuit board 221, an X electrode driving circuit board 222, a Y electrode driving circuit board 223, a power supply board 224, and a logic control board 225. A plurality of circuit elements 228 are arranged.

The circuit board 220 is mounted to the chassis base 211 by the boss 215 and the bolt 216.

The connector 229 is disposed on the address electrode buffer circuit board 221 of the circuit board 220 for electrical connection with the signal transmission means 230.

The signal transmitting means 230 for transmitting an address signal passes on the chassis bent portion 212, and one end of the signal transmitting means 230 is connected to a connector 229 mounted on the address electrode buffer circuit board 221. The other end is connected to the plasma display panel 201 through the chassis bent portion 212.

The signal transmitting means 230 uses a connection line called a tape carrier package (TCP).

The integrated circuit chip 240 is installed on the chassis bent portion 212, is connected to the signal transmission means 230, and serves to control the electrical signal.

A thermal grease is interposed between the integrated circuit chip 240 and the chassis bent portion 212.

The cover plate 250 is mounted to the chassis bent portion 212, and protects the signal transmission means 230 and the integrated circuit chip 240, and discharges heat generated from the integrated circuit chip 240. Function

The chip heat dissipation sheet 280 is interposed between the integrated circuit chip 240 and the cover plate 250. The chip heat dissipation sheet 280 functions to discharge heat generated from the integrated circuit chip 240 to the cover plate 250.

In the present embodiment, the chip heat dissipation sheet 280 is limited to the integrated circuit chip 240, but the present invention is not limited thereto. That is, the cover plate mounting structure of the present invention does not include a chip heat dissipation sheet, so that the integrated circuit chip may directly contact the cover plate.

On the other hand, the heat dissipation plate 290 is mounted at the end of the cover plate 250.

The heat dissipation plate 290 has a zigzag-shaped structure in cross section, and has a folding shape.

Since the heat dissipation plate 290 has a folding shape, the heat dissipation plate 290 has a wide surface area compared to the space occupied. Therefore, the heat dissipation plate 290 has a large surface area in contact with the air, thereby increasing the efficiency of convective heat transfer.

On the other hand, the heat dissipation plate 290 is easy to process and is made of copper excellent in thermal conductivity. Accordingly, the heat dissipation plate 290 is formed in a folded shape by bending the plate member made of copper.

The heat dissipation plate 290 is made of copper, but the present invention is not limited thereto. That is, the heat dissipation plate of the present invention is not particularly limited as long as the heat dissipation plate is made of a heat conductive material, and therefore, a heat conductive synthetic resin may be used as the material of the heat dissipation plate.

The heat dissipation plate 290 in this embodiment is formed by bending a plate of copper, but the present invention is not limited thereto. That is, the heat dissipation plate of the present invention may be manufactured by a method such as die casting, and when the material of the heat dissipation plate is made of synthetic resin, it may also be manufactured by injection molding or the like.

The heat dissipation plate 290 of the present embodiment is mounted at the end of the cover plate 250 in the direction in which the circuit board 220 is installed, but the present invention is not limited thereto. That is, the heat dissipation plate of the present invention may be installed at one end of the cover plate 250 that is located in the direction of the plasma display panel 201, and may be disposed not only at the end of the cover plate 250 but also at the middle of the cover plate 250. Can be installed. In addition, the heat dissipation plate of the present invention may be formed at the end and the middle portion of the cover plate 250 at the same time. However, in installing the heat dissipation plate of the present invention, since the short circuit with the circuit board 220 may occur, the heat dissipation plate may be installed at a predetermined distance from the circuit board 220 such that the heat dissipation plate does not contact the circuit board 220 or the like. shall.

In the present exemplary embodiment, one heat dissipation plate 290 is provided per cover plate 250, but the present invention is not limited thereto. That is, the cover plate of the present invention may include a plurality of heat dissipation plates for each cover plate.

In addition, although the shape of the heat dissipation plate 290 of this embodiment extends by the length L of the cover plate 250 is formed integrally, the present invention is not limited thereto. That is, the heat dissipation plate of the present invention may be formed shorter than the length (L) of the cover plate 250 to be mounted only on a portion of the cover plate 250, if necessary, divided into several for convenience of the mounting process Can be formed.

In the present embodiment, the heat dissipation plate 290 has a fold-shaped shape whose cross section is zigzag-shaped, but the present invention is not limited thereto. That is, the heat dissipation plate of the present invention may have a meandering shape, a concave-convex shape, or the like, but the shape of the heat dissipation plate is limited to the shape of the heat dissipation plate as long as the shape of the heat dissipation plate is increased in the contact area with air while occupying a narrow space. none.

In addition, the heat dissipation plate 290 is mounted to the end of the cover plate 250 using a rivet joint using a rivet 291, the present invention is not limited thereto. That is, as a means for mounting the heat dissipation plate of the present invention to the cover plate, screws, soldering, welding, thoroughbred non-penetrating tox (TOX ^® ) and solvent evaporation adhesive having excellent thermal conductivity may be used. If it can be easily delivered to the mounting means is not particularly limited.

Hereinafter, the operation of the plasma display module 200 including the integrated circuit chip heat dissipation structure according to the present embodiment and the discharge path of heat generated from the integrated circuit chip 240 will be described.

When the user operates the plasma display module 200, the circuit board 220 is driven to apply a voltage to the plasma display panel 201.

When a voltage is applied to the plasma display panel 201, address discharge and sustain discharge occur, and the energy level of the discharged gas excited during sustain discharge is lowered to emit ultraviolet rays. The ultraviolet rays excite the phosphors of the phosphor layer applied in the discharge cell. The energy level of the excited phosphors is lowered to emit visible light, and the emitted visible light is emitted to form an image that can be recognized by a user.

At this time, a large amount of heat is generated from the integrated circuit chip 240 installed on the chassis bent portion 212, part of the generated heat is transferred through the chassis bent portion 212, the other part of the heat radiation chip It is delivered to the cover plate 250 via the sheet 280.

Some of the heat generated in the integrated circuit chip 240 and transferred to the cover plate 250 is directly discharged by convective heat transfer to air in contact with the cover plate 250, and the other part of the heat is transferred to the heat dissipation plate 290. do.

Heat transmitted to the heat dissipation plate 290 is released by convective heat transfer to the air in contact with the heat dissipation plate 290, the shape of the heat dissipation plate 290 of the present embodiment has a fold-shaped shape having a zigzag cross section Therefore, the contact area between the heat dissipation plate 290 and the air is increased, thereby significantly improving the heat transfer rate due to convection. As a result, the heat generated from the integrated circuit chip 240 can be effectively discharged, thereby not only stably maintaining the performance of the integrated circuit chip 240, but also increasing the life of the integrated circuit chip 240. It becomes possible.

Therefore, the plasma display module having the integrated circuit chip heat dissipation structure according to the embodiment of the present invention forms a heat dissipation plate having a folded shape having a zigzag cross section, and attaching the heat dissipation plate to the end of the cover plate. By mounting, heat generated in the integrated circuit chip can be effectively released.

Hereinafter, one modification of the embodiment of the present invention will be described with reference to FIG. 5, but the description will be mainly focused on matters different from the above embodiment.

5 is a schematic enlarged cross-sectional view illustrating an enlarged portion of a stiffener according to a modified example of the embodiment of the present invention.

Integrated circuit chip heat dissipation structure of the plasma display module according to an embodiment of the present invention is the chassis 310, the address electrode buffer circuit board 321, the signal transmission means 330, the integrated circuit chip 340 and the cover plate And a heat dissipation plate 390.

The chassis 310 includes a chassis base 311 and a reinforcement 312.

An address electrode buffer circuit board 321 is mounted to the chassis base 311 by a boss 315 and a bolt 316, and a circuit element 328 and a connector 329 are disposed on the address electrode buffer circuit board 321. Is placed.

The reinforcing material 312 is mounted at the edge of the chassis 310, and is formed at a height similar to that of the address electrode buffer circuit board 321.

In the above-described embodiment of the present invention, the chassis bent portion 212 complements the rigidity of the chassis 210, and the integrated circuit chip 240 is installed in the chassis bent portion 212, but one variation of the embodiment of the present invention In the example, the reinforcement 312 complements the rigidity of the chassis 310, and the integrated circuit chip 340 is installed in the reinforcement 312.

On the reinforcing material 312, a signal transmitting means 330 for transmitting an address signal passes. One end of the signal transmitting means 330 is connected to a connector 329 mounted on the address electrode buffer circuit board 321. The other end is connected to a plasma display panel (not shown) through the reinforcing material 312.

The signal transmitting means 330 is a tape carrier package is used.

The integrated circuit chip 340 is installed on the reinforcement 312, is connected to the signal transmission means 330, and serves to control the electrical signal.

A thermal grease is interposed between the integrated circuit chip 340 and the reinforcement 312.

The cover plate 350 is mounted to the reinforcement 312, and a chip heat dissipation sheet 380 is interposed between the integrated circuit chip 340 and the cover plate 350.

Meanwhile, the heat dissipation plate 390 is mounted at the end of the cover plate 350.

The heat dissipation plate 390 has a meandering cross section, has a folding shape, and the material is made of copper.

Accordingly, the heat dissipation plate 390 is formed in a folded shape by bending a plate made of copper.

The heat dissipation plate 390 is mounted to the end of the cover plate 350 using a rivet joint using a rivet 391.

The function of the integrated circuit chip heat dissipation structure of the plasma display module according to the modified embodiment of the present invention is as follows.

When the plasma display module is driven in the same manner as the above-described embodiment of the present invention, a large amount of heat is generated from the integrated circuit chip 340 installed on the reinforcement 312, and a part of the generated heat is generated by the reinforcement 312. The heat is transferred through the other part, and the heat is transferred to the cover plate 350 via the chip heat dissipation sheet 380.

Part of the heat generated in the integrated circuit chip 340 and transferred to the cover plate 350 is directly discharged by convective heat transfer to air in contact with the cover plate 350, and the other part of heat is radiated in a foldable shape. Delivered to plate 390.

The heat transferred to the heat dissipation plate 390 is released by convective heat transfer to air in contact with the heat dissipation plate 390. The shape of the heat dissipation plate 390 of the present embodiment is a fold-shaped shape having a meandering cross section. Therefore, the contact area between the heat dissipation plate 390 and the air is increased, thereby significantly improving the heat transfer rate due to convection. As a result, the heat generated from the integrated circuit chip 340 can be effectively discharged, thereby not only stably maintaining the performance of the integrated circuit chip 340, but also increasing the life of the integrated circuit chip 340. It becomes possible.

Accordingly, the plasma display module having the integrated circuit chip heat dissipation structure according to one embodiment of the present invention forms a heat dissipation plate having a fold-shaped shape whose cross section is meandering, and the heat dissipation plate of the cover plate. By mounting at the end, heat generated in the integrated circuit chip can be effectively released.

As described above, according to the present invention, by attaching a heat radiation plate having a folding shape to the cover plate, there is an effect that can effectively release the heat generated from the integrated circuit chip of the plasma display module.

 That is, according to the present invention, by having a zigzag or meandering heat dissipation plate in cross section and attaching the heat dissipation plate to the cover plate, the heat generated from the integrated circuit chip is efficiently released into the air contacting the heat dissipation plate. can do. As a result, the performance of the integrated circuit chip is stably maintained, and the lifespan of the integrated circuit chip is increased.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (22)

A chassis comprising a chassis bend and a chassis base; An integrated circuit chip mounted in contact with the chassis bent portion and connected to the signal transmission means; A cover plate mounted to the chassis bent portion so as to face the integrated circuit chip; And And a heat dissipation plate mounted on the cover plate, the heat dissipation plate having a foldable shape. The method of claim 1, The chassis bending portion is formed on the edge of the chassis integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 1, The signal transmitting means is a heat dissipation structure of the integrated circuit chip of the plasma display module, characterized in that the tape carrier package. The method of claim 1, And a heat dissipation sheet between the integrated circuit chip and the cover plate. The method of claim 1, And the heat dissipation plate is installed at an end portion of the cover plate. The method of claim 1, An end surface of the heat dissipation plate has a zigzag shape, the integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 1, An end surface of the heat dissipation plate has a meandering shape, the integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 1, The heat dissipation plate of the integrated circuit chip of the plasma display module, characterized in that the plurality of heat dissipation plates. The method of claim 1, The heat dissipation plate is a heat dissipation structure of the integrated circuit chip of the plasma display module, characterized in that made of a thermally conductive material. The method of claim 9, The thermally conductive material is an integrated circuit chip heat dissipation structure of the plasma display module, characterized in that the copper. A plasma display module having an integrated circuit chip heat dissipation structure according to any one of claims 1 to 10. A chassis comprising a stiffener and a chassis base; An integrated circuit chip mounted in contact with the reinforcement and connected to the signal transmission means; A cover plate installed on the reinforcement to face the integrated circuit chip; And And a heat dissipation plate mounted on the cover plate, the heat dissipation plate having a foldable shape. The method of claim 12, The reinforcing member is formed on the edge of the chassis integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 12, The signal transmitting means is a heat dissipation structure of the integrated circuit chip of the plasma display module, characterized in that the tape carrier package. The method of claim 12, And a heat dissipation sheet between the integrated circuit chip and the cover plate. The method of claim 12, And the heat dissipation plate is installed at an end portion of the cover plate. The method of claim 12, An end surface of the heat dissipation plate has a zigzag shape, the integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 12, An end surface of the heat dissipation plate has a meandering shape, the integrated circuit chip heat dissipation structure of the plasma display module. The method of claim 12, The heat dissipation plate of the integrated circuit chip of the plasma display module, characterized in that the plurality of heat dissipation plates. The method of claim 12, The heat dissipation plate is a heat dissipation structure of the integrated circuit chip of the plasma display module, characterized in that made of a thermally conductive material. The method of claim 20, The thermally conductive material is an integrated circuit chip heat dissipation structure of the plasma display module, characterized in that the copper. A plasma display module having an integrated circuit chip heat dissipation structure according to any one of claims 12 to 21.

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