KR20080038572A - Plasma display device - Google Patents

Abstract

A plasma display device is provided to effectively cool the device by transferring the heat generated in a plasma display module through heat transfer and heat radiation. A plasma display device includes a panel assembly(201), a drive circuit unit(207) attached to a rear surface of the chassis base, and a tape carrier package(208) connecting each terminal of the panel assembly with a drive circuit unit. The tape carrier package is covered by a cover plate(210), and a set case(214) is disposed on the rear surface of the chassis base to enclose the chassis base. A heat sink(260) is interposed between the cover plate and the set case. The heat sink thermally contacts the cover plate and the set case.

Description

Plasma display device

1 is a cross-sectional view showing a portion of a conventional plasma display device;

2 is an exploded perspective view illustrating a plasma display device according to an embodiment of the present invention;

3 is a cross-sectional view of a portion of the plasma display device of FIG. 2;

4 is a partially enlarged cross-sectional view schematically showing a heat transfer relationship in the heat dissipating material of FIG. 3;

5 is a graph of the heat radiation performance according to the type of heat radiation structure,

6 is a partially separated perspective view illustrating a portion of a plasma display device according to another embodiment of the present invention.

<Brief description of symbols for the main parts of the drawings>

200 ... plasma display 201 ... panel assembly

204 Chassis base 207 Drive circuit

208 tape carrier package 210 cover plate

214 ... Set case 221 ... Drive IC

222 wiring ... 223 film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device having a heat dissipation material for effectively dissipating heat generated from a plasma display panel assembly.

In general, a plasma display device forms respective discharge electrodes on opposite surfaces of a plurality of substrates, and emits light by ultraviolet rays generated in the discharge space by applying a predetermined power in a state in which discharge gas is injected into the discharge spaces between the substrates. The flat display device implements an image using the light.

The plasma display device manufactures and combines a front panel and a rear panel, respectively, assembles a chassis base on the rear surface of the panel assembly, mounts a driving circuit unit on the chassis base so as to mutually transmit electrical signals, and predetermined This is accomplished by going through the inspection process and then mounting on the case.

Referring to FIG. 1, a conventional plasma display apparatus 100 includes a front panel 101, a panel assembly 101 having a back panel 103 coupled thereto, and an adhesive to a rear side of the panel assembly 101. A tape interposed between the chassis base 104 coupled by the member 105, the cover plate 106 provided at upper and lower ends of the chassis base 104, and the chassis base 104 and the cover plate 106. The carrier package (tape carrier package) 107 is included. The tape carrier package 107 includes a driving IC 108 and a flexible film 109 in which wirings connected to the driving IC 108 are arranged.

In the conventional plasma display apparatus 100 having the above structure, heat generated during driving is discharged through the chassis base 104 via the adhesive member 105 which serves as a heat conducting medium from the panel assembly 101. Done.

In addition, the plasma display apparatus 100 may be generated not only from the heat generated from the panel assembly 101 but also from the driving IC 108 of the tape carrier package 107. The heat generated from the driving IC 108 is also discharged to the outside through the end 104a of the chassis base 104 and the cover plate 106.

However, the conventional plasma display apparatus 100 has the following problems.

During driving, considerable heat is generated from the driving IC 108. If the heat is not sufficiently released, the driving IC 108 generates heat above a proper temperature, thereby causing damage to the driving IC 108. Done.

In order to prevent this phenomenon, the chassis base 104 is in contact with one side of the conventional tape carrier package 108 and the cover plate 106 is pressed at a predetermined pressure on the other side.

However, there is a problem that heat generation is further increased while performing a single scan due to cost reduction, etc., and cooling efficiency is further reduced while using a chassis of a low cost material.

In addition, the recent trend of the plasma display device is to go to full HD quality, the load of the tape carrier package is gradually increasing, and thus more effective cooling is required.

On the other hand, the conventional module manufacturers are covering the set case to the module at a suitable interval so that there is no interference between the set case and the module, in this manner there is a limit to the heat dissipation because only allow the heat dissipation by convection at spaced intervals.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a plasma display device having an improved structure through a heat dissipating material that radiates heat by simultaneously conducting heat conduction and heat radiation between a cover plate connected to a chassis base and a set case. There is a purpose.

Another object of the present invention is to provide a plasma display device having an improved structure through a heat dissipating material that radiates heat by simultaneously conducting heat conduction and heat radiation between a driving circuit portion on a chassis base and a set case.

In order to achieve the above object, a plasma display device according to an aspect of the present invention,

Panel assembly;

A chassis base for supporting the panel assembly;

A driving circuit unit attached to a rear surface of the chassis base;

A tape carrier package connecting each terminal of the panel assembly to a driving circuit unit;

A cover plate covering the tape carrier package;

A set case disposed on a rear surface of the chassis base and surrounding the chassis base; And

It includes a heat dissipating material interposed between the cover plate and the set case.

Here, the heat dissipation material is in thermal contact with the cover plate and the set case.

The heat dissipation member has flexibility.

The heat dissipating material is a hollow cylindrical shape.

The heat dissipating material includes a heat conducting layer and a heat radiating layer.

The thermal conductive layer includes a metal thin plate layer, and the thermal radiation layer includes a ceramic layer.

The ceramic layer is formed inside the metal thin layer.

The heat dissipation member extends along the length direction of the cover plate.

Optionally, the heat dissipation extends intermittently along the longitudinal direction of the cover plate.

Plasma display device according to another aspect of the present invention,

Panel assembly;

A chassis base for supporting the panel assembly;

A driving circuit unit attached to a rear surface of the chassis base;

A set case disposed on a rear surface of the chassis base and surrounding the chassis base; And

And a heat dissipation member interposed between the driving circuit unit and the set case.

Here, the heat dissipation member is in thermal contact with the driving circuit portion and the set case.

The heat dissipation member has flexibility, and the heat dissipation member has a hollow cylindrical shape.

The heat dissipating material includes a heat conducting layer and a heat radiating layer.

The thermal conductive layer includes a metal thin plate layer, and the thermal radiation layer includes a ceramic layer.

The ceramic layer is formed inside the metal thin layer.

Hereinafter, a plasma display device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 illustrates a plasma display device 200 according to an embodiment of the present invention.

Referring to the drawings, the plasma display device 200 includes a panel assembly 201 having a front panel 202 and a rear panel 203 disposed to face the front panel 202.

The front panel 202 includes a discharge sustaining electrode pair, a front dielectric layer filling the discharge sustaining electrode pair, and a protective film layer coated on a surface of the front dielectric layer. The back panel 203 includes an address electrode disposed in a direction crossing the discharge sustaining electrode pair, and a back dielectric layer filling the address electrode. The front and back panels 202 and 203 are provided with partition walls for limiting discharge space and preventing cross talk, and red, green, and blue phosphor layers applied to the inside of the partition walls, respectively.

The chassis base 204 is disposed behind the panel assembly 201. The chassis base 204 is coupled to the panel assembly 201 by an adhesive member. The adhesive member includes a heat dissipation sheet 205 interposed in the center of the outer surface of the rear panel 203 and a double-sided tape 206 interposed at the outer edge of the rear panel 203. The heat dissipation sheet 205 may discharge heat generated from the panel assembly 201 to the outside.

The driving circuit portion 207 is provided on the rear surface of the chassis base 204. A plurality of electronic components are mounted on the drive circuit unit 207, and a tape carrier package 208 is attached. The tape carrier package 208 is connected between each electrode terminal of the panel assembly 201 and the driving circuit portion 207 to transmit an electrical signal.

The filter assembly 212 is installed in front of the panel assembly 201. The filter assembly 212 is installed to block reflection of electromagnetic waves generated from the panel assembly 201, infrared rays, neon light emission, or external light during driving.

To this end, an anti-reflection film is attached to the filter assembly 212 to prevent visibility deterioration due to reflection of external light on a transparent substrate, and electromagnetic shielding to effectively block electromagnetic waves generated while driving the panel assembly 201. A layer is formed, and a selective wavelength absorption film is provided in order to shield unnecessary light emission of near infrared rays by plasma of an inert gas used for neon light emission and screen light emission.

The panel assembly 201, chassis base 204, and filter assembly 212 are housed in a case 215. The case 215 includes a front cabinet 213 installed at the front of the filter assembly 212 and a set case 214 at the rear of the chassis base 204. A plurality of vent holes 214a are formed at upper and lower ends of the set case 214.

On the other hand, the filter holder 218 is provided on the back of the filter assembly 212. The filter holder 218 includes a press portion 216 for pressing the filter assembly 212 against the front cabinet 213 and a fixing portion 217 bent backward from the press portion 216. . A plurality of fastening holes 271a are formed in the fixing part 217.

And, the filter mounting portion 219 is provided on the rear surface of the front cabinet 213. The fixing unit 217 is disposed to face the filter mounting unit 219, and the filter assembly 212 is fixed to the front cabinet 213 by coupling the 200.

Here, the heat dissipating material 260 is provided between the cover plate 210 and the set case 214 covering the tape carrier package 208 to quickly discharge heat generated from the tape carrier package 208 during operation. Is installed.

More details will be described in detail with reference to FIGS. 3 and 4.

3 is a partially enlarged view of the plasma display device 200 of FIG. 2, and FIG. 4 is a partially enlarged view for explaining a heat transfer relationship in the heat dissipation material of FIG. 3.

Referring to FIG. 3, a chassis base 204 is disposed behind the panel assembly 201. The heat dissipation sheet 205 and the double-sided tape 206 are interposed between the panel assembly 201 and the chassis base 204 at the center and the edge, respectively. The chassis base 204 is disposed to be spaced apart from the heat dissipation sheet 205 by a predetermined interval.

The chassis base 204 is preferably made of a metal having excellent thermal conductivity, such as an aluminum alloy, and an end portion 204a is bent in an “L” shape in a direction opposite to the direction in which the panel assembly 201 is installed. The driving circuit unit 207 is provided behind the chassis base 204.

At this time, the tape carrier package 208 for electrically connecting the terminal formed in the panel assembly 201 and the connector 207a provided in the driving circuit portion 207 between the driving circuit portion 207 and the panel assembly 201. Is installed. One end of the tape carrier package 208 is connected to the electrode terminal in the panel assembly 201 and the other end is connected to the connector 207a. The tape carrier package 208 may include a driving IC 221, a wiring portion 223 electrically connected to each lead of the driving IC 221, and a film 222 having flexibility to fill the wiring portion 223. ) Is included.

The tape carrier package 208 is disposed between the end 204a of the chassis base 204 and the cover plate 210 disposed behind the end 204a. That is, the tape carrier package 208 passes between the end portion 204a of the chassis base 204 and the cover plate 210 while one end is connected to the panel assembly 201, and the other end of the tape carrier package 208 is connected to the panel assembly 201. It is connected to the connector 207a. The cover plate 210 prevents the tape carrier package 208 from external impact and at the same time performs a heat dissipation function.

Here, a short circuit prevention means 209 is provided between the end portion 204a of the chassis base 204 and the tape carrier package 208 to prevent a short circuit due to damage of the tape carrier package 208.

The short circuit prevention means 209 includes a strip-shaped insulating plate 224 attached along the outer surface of the end 204a of the chassis base 204 corresponding to the tape carrier package 208. The insulation plate 224 is in the form of a material having insulation and flexibility, such as a film. In addition, the insulation plate 224 may be provided with one strip along the longitudinal direction of the chassis base 204.

In addition, the insulating plate 224 is further formed with a heat conductive medium 225 corresponding to the driving IC (221). The outer surface of the driving IC 221 is in direct contact with the surface of the thermal conductive medium 225.

In the space between the hinge plate and the cover plate 210 and the set case 214, the heat dissipating material 260 is resumed. The heat dissipation member is in thermal contact with the cover plate 210 and the set case 214. At this time, the heat dissipating material is fixed to the cover plate 210 by the adhesive layer 240 in at least one portion. The adhesive layer 240 is preferably selected from materials having excellent thermal conductivity.

Since the heat dissipation material 260 is formed of a material having flexibility, the heat dissipation material 260 is modified to adapt to the size of the space between the cover plate 210 and the set case 214. In particular, as shown in Figures 2 to 3, the heat dissipating material is preferably made of a hollow cylindrical shape. That is, the heat dissipation material is preferably formed in a ring type.

As shown in FIG. 3, the heat dissipating material 260 is formed of two layers, and the heat dissipating material includes a heat conductive layer 262 formed outside and a heat radiating layer 264 formed inside. Therefore, heat conduction occurs along the outer surface of the heat dissipation material, and heat radiation occurs on the inner space and the inner surface of the heat dissipation material. In particular, the thermal conductive layer 262 includes a metal thin plate layer, and the thermal radiation layer 264 includes a ceramic layer. Therefore, the ceramic layer is formed inside the metal thin layer. Naturally, the ceramic layer and the metal thin layer are also flexible.

In the plasma display device 200 having the above-described configuration, heat generated from the panel assembly 201 is transferred to the chassis base 204 via the heat dissipation sheet 205 and is dissipated during driving.

In addition, heat generated from the driving IC 221 of the tape carrier package 208 is primarily discharged through the end 204a of the chassis base 204 via the heat conductive medium 225, and at the same time, the cover plate Through 210, the secondary can be discharged.

Here, as shown in FIG. 4, heat that is secondarily released through the cover plate is conducted through the heat conducting layer 262 of the heat dissipating material 260 and transferred to the set case 214. The heat radiation layer 264 in the interior of the 260 is passed through the internal space of the heat dissipating material 260 by heat radiation to the set case 214 is released. In FIG. 4, an arrow denoted by reference numeral 280 denotes a path of radiated heat, and an arrow denoted by reference numeral 282 denotes a path of conducted heat.

The discharged heat is cooled by air introduced from the outside through the plurality of vent holes 214a formed in the set case 214, and flows from the lower end of the case to the upper end by the convection phenomenon and is discharged to the outside, or is directly set. It will radiate out of the case.

As shown in FIG. 3, the tape carrier package 208 has one end connected to the electrode terminal of the panel assembly 201 and the other end connected to the connector 207a of the drive circuit 207. One surface of the IC 221 is in contact with the outer surface of the thermal conductive medium 225.

Meanwhile, to protect the tape carrier package 208, the cover plate 210 is positioned to surround the end 204a of the chassis base 204 outside of the tape carrier package 208. Accordingly, the tape carrier package 208 is located between the end plate 204a of the chassis base 204 and the cover plate 210.

Subsequently, a predetermined pressing force is applied and fixed while the other surface of the driving IC 221 is connected to the heat dissipation sheet 211 attached to the cover plate 210.

In this case, even when the pressure applied to the driving IC 221 increases due to deformation of the chassis base 204 or bending due to an external force in the assembling process of the plasma display device 200, Since the insulating sheet 224 is disposed between the end portions 204a of the chassis base 204 to cover the width of the end portions 204a of the chassis base 204, the wirings to which the film 223 is torn and exposed. Short circuits or shorts in the unit 222 can be prevented.

As shown in FIG. 2, the heat dissipation material 260 extends continuously along the longitudinal direction of the cover plate 210.

FIG. 5 is a graph comparing heat dissipation performance between the ring-shaped heat dissipation member and another type of heat dissipation structure shown in FIG. 3. As shown in FIG. 5, according to an experiment, in a state in which the heat dissipation means is not particularly provided, while an internal temperature of 91 degrees Celsius is maintained, heat is dissipated using a heat sink having a width of 30 mm and a height of 7.5 mm. Compared to the untreated state, the cooling was about 20% more and the temperature inside the display device dropped to 78 degrees Celsius. In comparison, when the ring-type heat dissipating material of the present invention was used, the cooling performance was improved by 30% compared to the untreated state, and the cooling temperature was 73 degrees Celsius. Therefore, it can be seen through experiments that the heat dissipation performance is excellent when a flexible ring-type heat dissipation material such as the present invention is used.

Figure 6 shows the structure of a heat dissipation material according to another embodiment of the present invention.

Unlike FIG. 2, the heat dissipating material 260 ′ of FIG. 6 is not a structure extending continuously along the length direction of the cover plate 210 but is intermittently extended, so that a plurality of heat dissipating materials having a short length are used. Structure.

Although not shown, the heat dissipating material of the present invention is not necessarily limited to being interposed between the cover plate 210 and the set case 214. That is, the heat dissipation material of the present invention may be mounted in thermal contact with not only heat generated from the driving IC 221 of the tape carrier package 208 but also heat sinks, IPM, and SMPS mounted in the driving circuit unit 270 of the module. . Therefore, heat generated in the driving circuit unit 270 can be effectively released to the outside through heat conduction and heat radiation. Even in this case, the structure of the heat dissipation material may be designed in the same manner as in the above-described embodiment.

As described above, the plasma display device of the present invention can obtain the following effects.

The heat generated inside the plasma display module is transferred not only through heat conduction but also through heat radiation, thereby effectively achieving cooling. Experiments have shown that an additional cooling effect of about 30% can be achieved.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (16)

Panel assembly; A chassis base for supporting the panel assembly; A driving circuit unit attached to a rear surface of the chassis base; A tape carrier package connecting each terminal of the panel assembly to a driving circuit unit; A cover plate covering the tape carrier package; A set case disposed on a rear surface of the chassis base and surrounding the chassis base; And And a heat dissipation material interposed between the cover plate and the set case. The method of claim 1, And the heat dissipating material is in thermal contact with the cover plate and the set case. The method of claim 2, And the heat dissipating material is flexible. The method of claim 3, wherein And the heat dissipating material is a hollow cylindrical shape. The method of claim 1, The heat dissipating material includes a heat conducting layer and a heat radiating layer. The method of claim 5, wherein And the heat conducting layer comprises a metal thin plate layer, and the heat reflecting layer comprises a ceramic layer. The method of claim 6, And the ceramic layer is formed inside the metal thin plate layer. The method of claim 1, And the heat dissipation member extends in the longitudinal direction of the cover plate. The method of claim 1, And the heat dissipating material is intermittently extended along the longitudinal direction of the cover plate. Panel assembly; A chassis base for supporting the panel assembly; A driving circuit unit attached to a rear surface of the chassis base; A set case disposed on a rear surface of the chassis base and surrounding the chassis base; And And a heat dissipation member interposed between the driving circuit unit and the set case. The method of claim 10, And the heat dissipating material is in thermal contact with the driving circuit portion and the set case. The method of claim 11, And the heat dissipating material is flexible. The method of claim 12, And the heat dissipating material is a hollow cylindrical shape. The method of claim 10, The heat dissipating material includes a heat conducting layer and a heat radiating layer. The method of claim 14, And the heat conducting layer comprises a metal thin plate layer and the heat radiating layer comprises a ceramic layer. The method of claim 15, And the ceramic layer is formed inside the metal thin plate layer.

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