KR100333298B1 - Resistor and method of producing the same - Google Patents

Abstract

The present invention relates to a resistor and a method for manufacturing the same, and an object of the present invention is to provide a resistor and a method for manufacturing the same that can reduce the soldering area of the installation area when installed on the mounting substrate. As long as the substrate 21 is provided so as to be electrically connected to the pair of first upper electrode layers 22 and the first upper electrode layers 22 provided over a part of the side and side surfaces of the upper surface of the substrate 21. A pair of second top electrode layers 23, a resistance layer 24 provided to be electrically connected to the second top electrode layer 23, and a protective layer 25 formed to cover at least the top surface of the resistance layer 24. And a soldered portion on the mounting substrate such that the area of the side electrodes of the resistor is reduced by the pair of first top electrode layers 22 provided over the side portions and side portions of the upper surface of the substrate 21. New Year It is one to reduce the decrease in the area.

Description

Resistor and its manufacturing method {RESISTOR AND METHOD OF PRODUCING THE SAME}

In recent years, with the miniaturization of electronic devices, there is an increasing demand for miniaturization in order to improve the installation density of electronic components used in circuit boards. In order to reduce the mounting area on the mounting substrate for the resistor, there is an increasing demand for a resistor having a small size and a high precision of the resistance value tolerance.

Conventionally, what is disclosed in Unexamined-Japanese-Patent No. 4-102302 is known as this kind of resistor.

Hereinafter, a conventional resistor and a manufacturing method thereof will be described with reference to the drawings.

50 is a cross-sectional view of a conventional resistor.

In the figure, 1 is an insulating substrate. 2 is a first upper electrode layer provided on both left and right ends of the upper surface of the insulating substrate 1. 3 is a resistance layer provided so that a part may overlap with the 1st upper surface electrode layer 2. As shown in FIG. 4 is a 1st protective layer provided so that the whole of the resistance layer 3 may be covered. 5 is a trimming groove provided in the resistance layer 3 and the first protective layer 4 in order to correct the resistance value. 6 is a second protective layer provided on the upper surface of the first protective layer 4. 7 is a second upper electrode layer provided on the upper surface of the first upper electrode layer 2 to extend as much as the width of the insulating substrate 1. 8 is a side electrode layer provided on the side of the insulating substrate 1. 9 and 10 are nickel plating layers and solder plating layers provided on the surface of the 2nd top electrode layer 7 and the side electrode layer 8, respectively.

The conventional resistor configured as described above will be described below with reference to the drawings.

Fig. 51 is a process chart showing a conventional method for manufacturing a resistor.

First, as shown in Fig. 51A, the first upper electrode layer 2 is formed by printing on both left and right ends of the upper surface of the insulating substrate 1.

Next, as shown in Fig. 51B, a resistive layer 3 is formed on the upper surface of the insulating substrate 1 so as to partially overlap the first upper electrode layer 2.

Next, as shown in Fig. 51 (c), after the first protective layer 4 is formed by printing to cover the entirety of the resistive layer 3, the total resistance value in the resistive layer 3 is predetermined. Trimming grooves 5 are formed in the resistance layer 3 and the first protective layer 4 by a laser or the like so as to fall within the range of the resistance value.

Next, as shown in Fig. 51 (d), the second protective layer 6 is formed on the upper surface of the first protective layer 4 by printing.

Next, as shown in Fig. 51E, the second upper electrode layer 7 is formed on the upper surface of the first upper electrode layer 2 so as to extend as much as the width of the insulating substrate 1 by printing.

Next, as shown in Fig. 51 (f), the first and second top electrode layers 2 and 7 are electrically connected to the first and second top electrode layers 2 and the side surfaces of the left and right ends of the insulating substrate 1, respectively. The side electrode layer 8 is applied and formed.

Finally, the nickel plating layer 9 and the solder plating layer 10 are formed by performing nickel plating on the surfaces of the second upper electrode layer 7 and the side electrode layer 8, and then manufacturing a conventional resistor. there was.

However, in the resistor according to the conventional configuration and manufacturing method, when soldered to the mounting substrate, the side electrode layer (not shown) and the lower surface as shown in the cross-sectional view showing the mounting state of the conventional resistor in Fig. 52A are shown. (FIGURE) A pellet mounting structure in which a filler 11 is formed by soldering at both electrode layers (not shown), and is shown in the top view showing the installation state of a conventional resistor in FIG. 52 (b). As described above, an area 13 for soldering the side surfaces in addition to the part area 12 is required, and an installation area 14 in which these are combined is required. In addition, when the external dimensions of the component are reduced in order to improve the installation density, the proportion of the soldered area to the installation area becomes large, and accordingly, there is a problem that there is a limit in improving the installation density for miniaturizing electronic devices. .

An object of the present invention is to provide a resistor and a method for manufacturing the same, which can reduce the soldering area of the installation area when installed on the installation substrate.

The present invention relates to a resistor and a method of manufacturing the same.

1 is a cross-sectional view of a resistor in a first embodiment of the present invention.

2 (a) to 2 (c) are process drawings showing a method of manufacturing the copper resistor.

3 (a) to 3 (d) are process charts showing the manufacturing method of the copper resistor.

Fig. 4A is a sectional view showing a state in which a copper resistor is provided.

Fig. 4B is a top view showing the installation state.

Fig. 5 is a sectional view of the resistor in the second embodiment of the present invention.

6 (a) to 6 (c) are process charts showing the manufacturing method of the copper resistor.

7 (a) to 7 (d) are process drawings showing the manufacturing method of the copper resistor.

8 is a sectional view of a resistor in a third embodiment of the present invention.

9 (a) to 9 (c) are process charts showing the manufacturing method of the copper resistor.

10 (a) to 10 (c) are process charts showing the manufacturing method of the copper resistor.

11 (a) and 11 (b) are process charts showing the manufacturing method of the copper resistor.

Fig. 12A is a sectional view showing the installation state of the copper resistor.

Fig. 12B is a top view showing the installation state.

Fig. 13 is a sectional view of a resistor in the fourth embodiment of the present invention.

14 (a) to 14 (c) are process diagrams showing the manufacturing method of the copper resistor.

15A to 15C are process charts showing the manufacturing method of the copper resistor.

16A and 16B are process charts showing the manufacturing method of the copper resistor.

Fig. 17 is a sectional view of a resistor in the fifth embodiment of the present invention.

18A to 18C are process drawings showing the manufacturing method of the copper resistor.

19 (a) to 19 (c) are process diagrams showing the manufacturing method of the copper resistor.

20A and 20B are process charts showing the manufacturing method of the copper resistor.

Fig. 21 is a sectional view of a resistor in the sixth embodiment of the present invention.

22A to 22C are process charts showing the manufacturing method of the copper resistor.

23 (a) and 23 (b) are process charts showing the manufacturing method of the copper resistor.

24A and 24B are process charts showing the manufacturing method of the same resistor.

Fig. 25A is a sectional view when the same resistor is provided.

Fig. 25B is a top view of the same resistor provided.

Fig. 26 is a sectional view of a resistor in the seventh embodiment of the present invention.

27 (a) to 27 (c) are process drawings showing the manufacturing method of the copper resistor.

28A to 28C are process charts showing the manufacturing method of the copper resistor.

29A and 29B are process charts showing the manufacturing method of the same resistor.

Fig. 30 is a sectional view of a resistor in the eighth embodiment of the present invention.

31A to 31C are process charts showing the manufacturing method of the copper resistor.

32 (a) to 32 (c) are process drawings showing the manufacturing method of the copper resistor.

Fig. 33A is a sectional view when the same resistor is provided.

Fig. 33 (b) is a top view when the same resistor is provided.

Fig. 34 is a sectional view of a resistor in the ninth embodiment of the present invention.

35A to 35C are process drawings showing the manufacturing method of the copper resistor.

36A to 36C are process drawings showing the manufacturing method of the copper resistor.

Fig. 37 is a sectional view of a resistor in the tenth embodiment of the present invention.

38 (a) to 38 (c) are process drawings showing the manufacturing method of the copper resistor.

39 (a) to 39 (c) are process drawings showing the manufacturing method of the copper resistor.

Fig. 40 (a) is a sectional view when the same resistor is provided.

Fig. 40 (b) is a top view when the same resistor is provided.

Fig. 41 is a sectional view of a resistor in the eleventh embodiment of the present invention.

42A to 42C are process charts showing the manufacturing method of the copper resistor.

43A to 43D are process drawings showing the manufacturing method of the copper resistor.

Figure 44 is a sectional view of a resistor in the twelfth embodiment of the present invention.

45 (a) to 45 (c) are process drawings showing the manufacturing method of the copper resistor.

46A to 46D are process drawings showing the manufacturing method of the copper resistor.

Fig. 47 is a sectional view of a resistor in the thirteenth embodiment of the present invention.

48A to 48C are process drawings showing the manufacturing method of the copper resistor.

49A to 49D are process drawings showing the manufacturing method of the copper resistor.

50 is a cross-sectional view of a conventional resistor.

51 (a) to 51 (f) are process drawings showing the manufacturing method of the copper resistor.

Fig. 52 (a) is a sectional view when the same resistor is provided.

Fig. 52 (b) is a top view when the same resistor is provided.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the resistor of this invention is a pair provided so that it may electrically connect to a board | substrate, a pair of 1st top electrode layer provided over the part of the side part, and the side surface of the upper surface of the said board | substrate, and the said 1st top electrode layer. A second upper electrode layer, a resistance layer provided to be electrically connected to the second upper electrode layer, and a protective layer provided to cover at least the upper surface of the resistance layer.

According to the above-mentioned resistor, since a pair of 1st top electrode layer is provided over part of the side part and side surface of the upper surface of a board | substrate, the side electrode of this resistor becomes small, and this resistor is soldered on a mounting board | substrate. In this case, since the area is soldered to the small side electrode, the area for forming the fillet of the solder can be made small, thereby reducing the installation area including the soldered portion on the installation substrate.

(First embodiment)

EMBODIMENT OF THE INVENTION Hereinafter, the resistor and its manufacturing method in a 1st Example of this invention are demonstrated, referring drawings.

1 is a cross-sectional view of a resistor in a first embodiment of the present invention.

In the figure, 21 is a substrate containing 96% alumina. 22 is a first top electrode layer formed by firing a gold-based organometallic compound provided over a part of the side and side surfaces of the substrate 21, and the ridge line of the first top electrode layer 22. Is rounded. In addition, the area of the first upper electrode layer 22 on the side surface of the substrate 21 is less than half the area of the side surface of the substrate 21. 23 is a 2nd top electrode layer formed by containing glass in the electrically conductive powder of the silver system electrically connected to the 1st top electrode layer 22. As shown in FIG. 24 is a resistance layer mainly composed of ruthenium oxide which is electrically connected to the second upper electrode layer 23. 25 is a protective layer mainly containing glass provided on the upper surface of the resistive layer 24. 26 and 27 are nickel plating layers and solder plating layers provided in order to ensure reliability, etc. at the time of soldering as needed.

A resistor in the first embodiment of the present invention configured as described above will be described below with reference to the drawings.

2 and 3 are process charts showing the manufacturing method of the resistor in the first embodiment of the present invention.

First, as shown in Fig. 2 (a), a plurality of longitudinal and horizontal dividing grooves 28, which are provided for dividing the surface into strips and strips in a subsequent process in a subsequent step, An electrode paste made of a gold-based organic metal so as to span the horizontally divided grooves 29 of the sheet-like substrate 21 made of 96% alumina having excellent heat resistance and insulation ( paste) is printed to form the first upper electrode layer 22. In this case, the electrode paste containing the gold-based organic metal may enter the horizontal division groove 29 to form the first upper electrode layer 22 up to the division groove. In addition, baking is performed at a temperature of about 850 ° C. in order to make this first top electrode layer 22 a safe film. The depth with respect to the thickness of the board | substrate 21 of these division grooves 28 and 29 is generally formed in less than half of the thickness of the board | substrate 21 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in FIG. 2B, an electrode paste made of silver-based conductive powder and glass is printed to overlap a part of the first top electrode layer 22 to form a second top electrode layer 23. do. Next, baking is performed at a temperature of about 850 ° C. in order to make this second top electrode layer 23 a stable film.

Next, as shown in Fig. 2C, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the second upper electrode layer 23, thereby forming the resistive layer 24. Figs. Next, in order to make this resistance layer 24 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 3A, in order to correct the resistance value of the resistance layer 24 to a predetermined value, the trimming groove 30 is formed by the YAG laser and trimming is performed. At this time, a trimming probe for measuring a resistance value is set on the second upper electrode layer 23 and trimmed.

Next, as shown in Fig. 3B, in order to protect the resistance layer 24 after the resistance value correction, a paste containing glass as a main component is printed to form the protective layer 25. As shown in FIG. At this time, you may form the printing pattern of the protective layer 25 so that the some resistance layer 24 arrange | positioned in the horizontal direction may be covered continuously over the division groove 28 of a vertical direction. Next, in order to make this protective layer 25 into a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 3C, a first top electrode layer 22, a second top electrode layer 23, a resistance layer 24, trimming grooves 30 and a protective layer 25 are formed. The sheet is divided into strip-shaped substrates 31 along the dividing grooves 29 in the horizontal direction of the sheet-shaped substrate 21. At this time, the first upper surface electrode layer 22 formed on the side surface in the longitudinal direction of the strip-shaped substrate 31 is formed to the depth of the division groove 29 in the horizontal direction.

Finally, as shown in Fig. 3 (d), as a preparation step for plating the exposed first top electrode layer 22 and the second top electrode layer 23, the strip-shaped substrate 31 It divides along the longitudinal dividing groove 28, and divides into the piece-shaped board | substrates 32. As shown in FIG. In addition, a nickel plating layer (not shown) is formed on the intermediate layer by electroplating to prevent electrode squeezing during soldering and to secure reliability during soldering of the exposed first and second upper electrode layers 22 and 23. The solder plating layer (not shown) is formed as the outermost layer to manufacture a resistor.

The resistor in the first embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate. As shown in the cross-sectional view showing the installation state of the resistor of the first embodiment of the present invention in Fig. 4A, the surface on which the protective layer is formed is provided on the lower side, and the upper electrode layer (not shown) and the side surface of the substrate are provided. Although soldering is performed on both sides of the portion of the resistive layer, only the fillet 33 is formed because the area where the side electrodes are formed is small. Therefore, as shown in the top view showing the installation state of the resistor in the first embodiment of the present invention of FIG. 4 (b), the area where the component area 34 and the area 35 necessary for soldering the side surfaces are added together. This installation area 36 is obtained. In the angular chip resistors having a size of 0.6 × 0.3 mm, a reduction of about 20% can be achieved by comparing the installation area with a product having a conventional structure.

Therefore, according to the structure of this invention, since the area of the side electrode of a resistor is small, the area for forming the filler for soldering on a mounting board | substrate becomes small, and an installation area can be reduced.

Further, in the first embodiment of the present invention, the solder plating layer 27 and the protective layer 25 are made to have the same surface or the solder plating layer 27, so that the solder plating layer 27 and the land pattern at the time of installation are It is difficult to create a gap of, which can further improve the installation quality.

In the first embodiment of the present invention, when the second upper electrode layer 23 and the protective layer 25 are combined as shown in Table 1, other characteristics can be improved.

Combination Second upper electrode layer 23 Protective layer (25) Improved Characteristics One Gold-based conductive powder + glass (850 ℃ firing) Glass system (600 degrees Celsius firing) Less ion migration improves load life characteristics 2 Silver conductive powder + glass (850 ℃ firing) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 25 is low, there is no process change of the resistance value, so that the resistance value error of the product becomes small. 3 Gold-based conductive powder + glass (850 degrees Celsius firing) Resin-based (200 ° C curing) Has all the features of combinations 1 and 2 above

In addition, in the first embodiment of the present invention, it can be easily considered that the side without the side electrode can further reduce the installation area.

(2nd Example)

Hereinafter, a resistor and a manufacturing method thereof according to a second embodiment of the present invention will be described with reference to the drawings.

Fig. 5 is a sectional view of the resistor in the second embodiment of the present invention.

In the figure, 41 is a substrate containing 96% alumina. 42 is a first top electrode layer provided by gold-based sputtering provided over a part of side and side surfaces of the upper surface of the substrate 41, and the ridge lines of the first upper electrode layer 42 are rounded. In addition, the area of the first upper electrode layer 42 on the side surface of the substrate 41 is less than half the area of the side surface of the substrate 41. 43 is a second top electrode layer made of silver-based conductive powder and glass electrically connected to the first top electrode layer 42. 44 is a resistance layer mainly composed of ruthenium oxide electrically connected to the second upper electrode layer 43. 45 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 44. 46 and 47 are nickel plating layers and solder plating layers which are provided in order to ensure reliability, etc. at the time of soldering, as needed.

A resistor in the second embodiment of the present invention configured as described above will be described below with reference to the drawings.

6 and 7 are process charts showing the manufacturing method of the resistor in the second embodiment of the present invention.

First, as shown in Fig. 6 (a), the heat resistance and insulating property having a plurality of longitudinal and transverse dividing grooves 48 and 49 provided on the surface for dividing into strips and pieces in a subsequent step. The first upper surface of the sheet-like substrate 41 containing excellent 96% alumina was coated with gold by the sputtering method and made into a desired electrode pattern by a photolithography method generally performed by LSI or the like. The electrode layer 42 is formed, and heat treatment is performed at a temperature of about 300 to 400 ° C. in order to make the first top electrode layer 42 a stable film. In this case, the first upper electrode layer 42 may enter the division groove 49 in the horizontal direction to form the first upper electrode layer 42 up to the inside of the division groove. The depth with respect to the thickness of the board | substrate 41 of these division grooves 48 and 49 is generally formed below half the thickness of the board | substrate 41 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 6B, an electrode paste made of silver-based conductive powder and glass is printed so as to be electrically connected to the first top electrode layer 42, so that the second top electrode layer 43 is printed. Form. Next, in order to make this 2nd top electrode layer 43 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 6C, a resistive paste containing ruthenium oxide as a main component is printed to form the resistive layer 44 so as to be electrically connected to the second upper electrode layer 43. Next, in order to make this resistance layer 44 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 7A, in order to correct the resistance value of the resistance layer 44 to a predetermined value, a trimming groove 50 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the second upper electrode layer 43 and trimmed.

Next, as shown in Fig. 7B, in order to protect the resistance layer 44 after the resistance value correction, a paste containing glass as a main component is printed to form the protective layer 45. At this time, you may form the printing pattern of the protective layer 45 so that the some resistance layer 44 arrange | positioned in the horizontal direction may be covered continuously over the division groove 48 of the vertical direction. Next, in order to make this protective layer 45 into a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in FIG. 7C, the first upper electrode layer 42, the second upper electrode layer 43, the resistance layer 44, the trimming groove 50, and the protective layer 45 are formed. The sheet is divided into strip-shaped substrates 51 along the division grooves 49 in the horizontal direction of the sheet-shaped substrate 41. At this time, the first upper surface electrode layer 42 formed on the side surface in the longitudinal direction of the strip-shaped substrate 51 is formed to the depth of the division groove 49 in the horizontal direction.

Finally, as shown in Fig. 7 (d), as a preparatory step for plating the exposed first top electrode layer 42 and the second top electrode layer 43, the strip-shaped substrate 51 is formed. It divides along the longitudinal dividing groove 48, and divides into the piece-shaped board | substrates 52. As shown in FIG. The nickel plated layer (not shown) is formed on the intermediate layer by electroplating to prevent electrode squeezing during soldering of the first upper electrode layer 42 and the second upper electrode layer 43 and to ensure reliability during soldering. The solder plating layer (not shown) is formed as the outermost layer to manufacture a resistor.

The effect of the case where the resistor in the second embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as that of the first embodiment described above, and thus the description thereof is omitted.

Further, in the second embodiment of the present invention, when the first top electrode layer 42, the second top electrode layer 43, the resistance layer 44, and the protective layer 45 are combined as shown in Table 2, other characteristics are improved. You can.

Combination First upper electrode layer 42 Second upper electrode layer 43 Resistance layer (44) Protective Layer (45) Feature improved 4 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Gold-based conductive powder + glass (850 ℃ firing) Ruthenium oxide type (850 degreeC firing) Glass system (600 degrees Celsius baking) Less ion migration improves load life characteristics. 5 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Silver conductive powder + glass (850 ℃ firing) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) Since the processing temperature of the protective layer is low, there is no process change of the resistance value, so the resistance value error of the product becomes small. 6 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Gold-based conductive powder + glass (850 ℃ firing) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) Has all the features of combinations 4 and 5 7 Nickel-based sputtering (300 ~ 400 ℃ heat treatment) Silver Conductive Powder + Resin (200 ℃ Curing) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) It has the characteristics of the said combination 5, and since a 1st top electrode layer becomes a nonmetal, it can manufacture at low cost. 8 Nickel-based sputtering (300 ~ 400 ℃ heat treatment) Nickel-based conductive powder + resin (200 ℃ hardening) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) It has the characteristics of the said combination 7, and since a 2nd top electrode layer becomes a nonmetal, it can manufacture at low cost.

(Third Embodiment)

Hereinafter, a resistor in the third embodiment of the present invention and a manufacturing method thereof will be described with reference to the drawings.

8 is a sectional view of a resistor in a third embodiment of the present invention.

In Fig. 8, 61 is a substrate containing 96% alumina. 62 is a first top electrode layer formed by firing a gold-based organometallic compound provided over a part of a side and a side of a main surface of the substrate 61, and a first top electrode layer 62 on the side of the substrate 61. The area of is less than half of the area of the side surface of the substrate 61. 63 is a pair of 2nd top electrode layers which contain glass in the electrically conductive powder of silver type | system | group electrically connected to the 1st top electrode layer 62. FIG. 64 is a resistance layer mainly composed of ruthenium oxide electrically connected to the second upper electrode layer 63. 65 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 64. 66 is a third top electrode layer formed by containing glass in a silver-based conductive powder provided on a part of the surface of the second top electrode layer 63. 67 and 68 are nickel plating layers and solder plating layers provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the third embodiment of the present invention configured as described above will be described below with reference to the drawings.

9 to 11 are process charts showing the manufacturing method of the resistor in the third embodiment of the present invention.

First, as shown in Fig. 9 (a), the heat resistance and insulation property having a plurality of longitudinal and transverse dividing grooves 69 and 70 provided on the surface for dividing into strips and pieces in a subsequent step. The first upper electrode layer 62 is printed by printing an electrode paste made of a gold-based organometallic compound so as to span the horizontally divided grooves 70 of the sheet-like substrate 61 containing excellent 96% alumina. Form. Next, baking is performed at a temperature of about 850 ° C. in order to make this first top electrode layer 62 a stable film. In this case, the electrode paste may enter the division groove 70 in the horizontal direction to form the first upper electrode layer 62 up to the inside of the division groove. The depth with respect to the thickness of the board | substrate 61 of these division grooves 69 and 70 is generally formed in half or less of the thickness of the board | substrate 61 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 9B, an electrode paste made of silver-based conductive powder and glass is printed to electrically connect with the first top electrode layer 62 to form a second top electrode layer 63. do. Next, baking is performed at a temperature of about 850 ° C. in order to make this second top electrode layer 63 a stable film.

Next, as shown in Fig. 9C, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the second upper electrode layer 63 to form the resistive layer 64. Next, in order to make this resistance layer 64 into a stable film | membrane, it bakes at a temperature of about 850 degreeC.

Next, as shown in Fig. 10A, in order to correct the resistance value of the resistance layer 64 to a predetermined value, a trimming groove 71 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the second upper electrode layer 63 and trimmed.

Next, as shown in Fig. 10B, in order to protect the resistance layer 64 after the resistance value correction, a paste mainly composed of glass is printed to form a protective layer 65. At this time, you may form the printing pattern of the protective layer 65 so that the some resistance layer 64 arrange | positioned in the horizontal direction may be covered continuously over the division groove 69 of a vertical direction. Next, baking is performed at the temperature of about 600 degreeC in order to make this protective layer 65 into a stable film.

Next, as shown in FIG. 10 (c), the silver-based conductivity is performed so as not to span the divided grooves 70 in the horizontal direction on a part of the upper surfaces of the first upper electrode layer 62 and the second upper electrode layer 63. An electrode paste made of powder and glass is printed to form a third top electrode layer 66. Next, baking is performed at the temperature of about 600 degreeC in order to make the 3rd top electrode layer 66 into a stable film | membrane.

Next, as shown in Fig. 11A, the first top electrode layer 62, the second top electrode layer 63, the resistive layer 64, the trimming groove 71, the protective layer 65 and the third The upper electrode layer 66 is divided into strip-shaped substrates 72 by dividing along the divided grooves 70 in the horizontal direction of the sheet-like substrate 61 after formation. At this time, the first upper surface electrode layer 62 formed on the side surface in the longitudinal direction of the strip-shaped substrate 72 is formed to the depth of the divided groove 70 in the horizontal direction.

Finally, as shown in Fig. 11B, as a preparation step for plating the exposed first top electrode layer 62, second top electrode layer 63, and third top electrode layer 66, The strips are divided along the longitudinal dividing grooves 69 of the substrate 72 to be divided into pieces 73. Nickel is electroplated by electroplating to prevent electrode squeezing during soldering and to ensure reliability during soldering of the exposed first top electrode layer 62, second top electrode layer 63, and third top electrode layer 66. The resistor is manufactured by forming a plating layer (not shown) as an intermediate layer and forming a solder plating layer (not shown) as the outermost layer.

The resistor in the third embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate. As shown in the sectional view showing the installation state of the third embodiment of the present invention in Fig. 12A, the first, second and third upper electrode layers (not shown) are provided with the surface on which the protective layer is formed on the lower side. The solders are soldered on both sides of the substrate and the portion of the resistive layer on the side of the substrate, but only the fillet 74 is formed because the area where the side electrodes are formed is small. Therefore, as shown in the top view of the installation state of FIG. 12 (b), the area which combined the part area 75 and the area 76 required for soldering the side surface of this part becomes the installation area 77. As shown in FIG. In the angular chip resistors having a size of 0.6 × 0.3 mm, a reduction of about 20% can be achieved by comparing the installation area with a product having a conventional structure.

Therefore, according to the configuration of the third embodiment of the present invention, since the area of the side electrode of the resistor is small, the area for forming the solder fillet on the mounting substrate becomes small, and the mounting area can be reduced.

In the third embodiment of the present invention, the solder plating layer 68 and the protective layer 65 are made to have the same surface or the solder plating layer 68, so that the solder plating layer 68 and the land pattern 76 at the time of installation are increased. The gap is less likely to be created, further improving the installation quality.

In the third embodiment of the present invention, when the second top electrode layer 63, the protective layer 65, and the third top electrode layer 66 are combined as shown in Table 3, other characteristics can be improved.

Combination Second upper electrode layer 63 Third upper electrode layer 66 Protective layer (65) Feature improved One Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Glass type (600 ℃ firing) Since the processing temperature of the third upper electrode layer 66 is low, there is no process change of the resistance value, so the resistance value error of the product is reduced. 2 Silver conductive powder (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Glass type (600 ℃ firing) It has the characteristics of the said combination 1, and since the 3rd top electrode layer 66 turns into a nonmetal, it can manufacture more inexpensively. 3 Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Resin type (200 ℃ hardening) Since the processing temperature of the protective layer 65 is lowered, the process change is smaller than that of the combination 1, so that the resistance value error of the product can be reduced. 4 Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Resin type (200 ℃ hardening) It has the characteristics of the said combination 3, and since a 3rd top electrode layer becomes a nonmetal, it can manufacture more inexpensively. 5 Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (600 ℃ firing) Glass type (600 ℃ firing) Less ion migration improves load life characteristics 6 Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + resin (200 ℃ hardening) Glass type (600 ℃ firing) Has all the features of combinations 1 and 5 7 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ℃ hardening) Glass type (600 ℃ firing) Has all the features of combinations 2 and 5 8 Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + resin (200 ℃ hardening) Resin type (200 ℃ hardening) Has all the features of combinations 3 and 5 9 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ℃ hardening) Resin type (200 ℃ hardening) Has all the features of combinations 4 and 5

In addition, in the third embodiment of the present invention, it can be easily considered that the side electrode is not formed to further reduce the installation area.

(Example 4)

Hereinafter, a resistor and a manufacturing method thereof according to a fourth embodiment of the present invention will be described with reference to the drawings.

Fig. 13 is a sectional view of a resistor in the fourth embodiment of the present invention.

In Fig. 13, 81 is a substrate containing 96% alumina. 82 is a first top electrode layer provided by gold-based sputtering provided on a part of side and side surfaces of the upper surface of the substrate 81, and the area of the first upper surface electrode layer 82 on the side surface of the substrate 81 is larger than that of the substrate 81. It is less than half of the area of the side surface. 83 is a second top electrode layer containing silver conductive powder and glass electrically connected to the first top electrode layer 82. 84 is a resistance layer mainly containing ruthenium oxide electrically connected to the second top electrode layer 83. 85 is a protective layer mainly comprising glass provided on the upper surface of the resistive layer 84. 86 is a 3rd top electrode layer formed by containing glass in the silver-type electrically conductive powder provided in the one part of the surface of the 1st top electrode layer 82 and the 2nd top electrode layer 83. FIG. 87 and 88 are nickel plating layers and solder plating layers provided as needed to ensure reliability, etc. at the time of soldering.

A resistor in the fourth embodiment of the present invention configured as described above will be described below with reference to the drawings.

14 to 16 are process drawings showing the manufacturing method of the resistor in the fourth embodiment of the present invention.

First, as shown in Fig. 14 (a), heat resistance and insulation properties having a plurality of longitudinal and transverse dividing grooves 89 and 90 provided on the surface for dividing into strips and pieces in a subsequent step. The first upper surface of the sheet-like substrate 81 containing excellent 96% alumina was coated with gold by the sputtering method and made into a desired electrode pattern by the photolithography method generally performed by LSI. The electrode layer 82 is formed, and heat treatment is performed at a temperature of about 300 to 400 ° C. in order to make the first top electrode layer 82 a stable film. In this case, the first upper electrode layer 82 may enter the division groove 90 in the horizontal direction and form the first upper electrode layer 82 to the inside of the division groove. The depth with respect to the thickness of the board | substrate 81 of these division grooves 89 and 90 is generally formed in half or less of the thickness of the board | substrate 81 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 14B, an electrode paste containing silver-based conductive powder and glass is printed so as to be electrically connected to the first top electrode layer 82 to form a second top electrode layer 83. do. Next, baking is performed at a temperature of about 850 ° C. in order to make this second top electrode layer 83 a stable film.

Next, as shown in Fig. 14C, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the second upper electrode layer 83 to form a resistive layer 84. Figs. Next, in order to make this resistance layer 84 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 15A, in order to correct the resistance value of the resistance layer 84 to a predetermined value, a trimming groove 91 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the second upper electrode layer 83 and trimmed.

Next, as shown in Fig. 15B, in order to protect the resistance layer 84 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 85. At this time, you may form the printing pattern of the protective layer 85 so that the some resistance layer 84 arrange | positioned in the horizontal direction may be covered continuously over the division groove 89 of a vertical direction. Next, in order to make this protective layer 85 into a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 15 (c), the silver-based conductivity is not applied to a part of the upper surface of the first upper electrode layer 82 and the second upper electrode layer 83 without spreading the divided groove 90 in the horizontal direction. An electrode paste made of powder and glass is printed to form a third top electrode layer 86. Next, in order to make this 3rd top electrode layer 86 into a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 16A, the first top electrode layer 82, the second top electrode layer 83, the resistive layer 84, the trimming groove 91, the protective layer 85, and the third The upper electrode layer 86 is divided into strip-shaped substrates 92 by dividing along the divided grooves 90 in the horizontal direction of the sheet-shaped substrate 81 after formation. At this time, the first upper surface electrode layer 82 formed on the side of the strip-shaped substrate 92 in the longitudinal direction is formed to the depth of the dividing groove 90 in the horizontal direction.

Finally, as shown in Fig. 16B, as a preparation step for plating the exposed first top electrode layer 82, second top electrode layer 83, and third top electrode layer 86, The strip is divided along the longitudinal dividing groove 89 of the strip-shaped substrate 82 and divided into a strip-shaped substrate 93. Nickel is electroplated by electroplating to prevent electrode squeezing during soldering and to secure reliability during soldering of the exposed first and second upper electrode layers 82, 83, and third upper electrode layers 86. A resistor is manufactured by forming a plating layer (not shown) as an intermediate layer and forming a solder plating layer (not shown) as the outermost layer.

The effect of the case where the resistor in the fourth embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as in the above-described third embodiment, and thus description thereof is omitted.

In addition, in the fourth embodiment of the present invention, the first top electrode layer 82, the second top electrode layer 83, the resistance layer 84, the protective layer 85, and the third top electrode layer 86 are shown in Table 4. When combined, other characteristics can be improved.

Combination First upper electrode layer 82 Second upper electrode layer 83 Third top electrode layer 86 Resistance layer 84: upper protective layer 85: lower Feature improved 10 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (200 ℃ hardening) Ruthenium oxide type (850 degreeC baking) Glass type (600 degreeC baking) Same characteristics as combination 1 of table 1 11 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) Glass type (600 degreeC baking) Same as Combination 2 of Table 1 12 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same characteristics as combination 3 of table 1 13 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same as Combination 4 of Table 1 14 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (600 ℃ firing) Ruthenium oxide type (850 degreeC baking) Glass type (600 degreeC baking) Same characteristics as combination 5 of table 1 15 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) Glass type (600 degreeC baking) Same characteristics as combination 6 of Table 1 16 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) Glass type (600 degreeC baking) Same characteristics as combination 7 of table 1 17 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same characteristics as combination 8 of table 1 18 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same as Combination 9 of Table 1 19 Nickel-based Sputtering Silver Conductive Powder + Resin (200 ℃ Curing) Silver Conductive Powder + Resin (200 ℃ Curing) Carbon resin system (200 degrees Celsius hardening) Resin system (200 degrees Celsius hardening) Since the low temperature treatment material is used for the second upper electrode layer 83 and the resistive layer 84, power can be saved. 20 Nickel-based Sputtering Silver Conductive Powder + Resin (200 ℃ Curing) Nickel-based conductive powder + resin (200 ° C curing) Carbon resin system (200 degrees Celsius hardening) Resin system (200 degrees Celsius hardening) Since the characteristics of the combination 19 and the third top electrode layer 86 are nonmetals, they can be manufactured at low cost.

Further, in the fourth embodiment of the present invention, it can be easily considered that the side without the side electrode can further reduce the installation area.

(Example 5)

Hereinafter, a resistor and a manufacturing method thereof according to a fifth embodiment of the present invention will be described with reference to the drawings.

Fig. 17 is a sectional view of a resistor in the fifth embodiment of the present invention.

In Fig. 17, 101 is a substrate containing 96% alumina. 102 is a first top electrode layer formed of glass in a silver-based conductive powder provided on the side of the main surface of the substrate 101. 103 is a resistance layer mainly composed of ruthenium oxide electrically connected to the first top electrode layer 102. 104 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 103. 105 is a second top electrode layer formed using gold-based sputtering provided on a part of the surface and side surfaces of the first top electrode layer 102, and the area of the second top electrode layer 105 on the side of the substrate 101 is the substrate 101. It is less than half of the area of the side surface). 106 is a third top electrode layer made of glass containing silver-based conductive powder overlapping a part of the top surfaces of the first top electrode layer 102 and the second top electrode layer 105. 107 and 108 are nickel plating layers and solder plating layers which are provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the fifth embodiment of the present invention configured as described above will be described below with reference to the drawings.

18 to 20 are process drawings showing the manufacturing method of the resistor in the fifth embodiment of the present invention.

First, as shown in Fig. 18 (a), the surface having a plurality of longitudinal and transverse dividing grooves 109 and 110 provided for dividing into strips and pieces in a subsequent step is 96% excellent in heat resistance and insulation. The first upper electrode layer 102 is formed by printing an electrode paste made of silver-based conductive powder and glass without spreading the divided grooves 110 in the horizontal direction of the sheet-shaped substrate 101 containing alumina. do.

Next, as shown in Fig. 18B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first upper electrode layer 102 to form a resistive layer 103. As shown in Figs. Next, baking is performed at the temperature of about 850 degreeC in order to make this resistance layer 103 into a stable film | membrane.

Next, as shown in Fig. 18 (c), in order to correct the resistance value of the resistance layer 103 to a predetermined value, the trimming groove 111 is formed with a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the first upper electrode layer 102 and trimmed.

Next, as shown in Fig. 19A, in order to protect the resistance layer 103 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 104. At this time, you may form the printing pattern of the protective layer 104 so that the some resistance layer 103 arrange | positioned in the horizontal direction may be continuously covered over the division groove 109 of a vertical direction. Next, in order to make this protective layer 104 into a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 19B, a resist material made of a resin is applied to the entire upper surface of the substrate 101, and a predetermined second upper electrode layer 105 is applied to the resist material by a photolithography method. The hole of the film-forming pattern is formed. Further, the entire surface of the upper surface of the substrate is covered with gold by a sputtering method, and the resist material of the portion excluding the film forming pattern of the desired second upper electrode layer 105 is removed. By this method, the second upper electrode layer 105 is formed. In this case, the second top electrode layer 105 may enter the division groove 110 in the horizontal direction and form the second top electrode layer 105 to the inside of the division groove.

The depth with respect to the thickness of the board | substrate 101 of these division grooves 109 and 110 is generally formed in less than half of the thickness of the board | substrate 101 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in FIG. 19 (c), an electrode paste containing silver-based conductive powder and glass is printed so as to overlap a part of the surfaces of the first top electrode layer 102 and the second top electrode layer 105. Thus, the third upper electrode layer 106 is formed. Next, baking is performed at a temperature of about 850 ° C. in order to make this third top electrode layer 106 a stable film.

Next, as shown in Fig. 20A, the first top electrode layer 102, the second top electrode layer 105, the third top electrode layer 106, the resistance layer 103, the trimming groove 111, and The protective layer 104 is divided into strip-shaped substrates 112 by dividing along the divided grooves 110 in the horizontal direction of the sheet-like substrate 101 after formation. At this time, the second upper electrode layer 105 formed on the side of the strip-shaped substrate 112 in the longitudinal direction is formed to the depth of the divided groove 110 in the horizontal direction.

Finally, as shown in Fig. 20B, as a preparation step for plating the exposed first top electrode layer 102, second top electrode layer 105 and third top electrode layer 106, The strip-shaped substrate 112 is divided along the longitudinal dividing groove 109 and divided into a strip-shaped substrate 113. Nickel is deposited by electroplating in order to prevent electrode squeezing during soldering and to secure reliability during soldering of the exposed first and second upper electrode layers 102, 105 and 106. The resistor is manufactured by forming a plating layer (not shown) as an intermediate layer and forming a solder plating layer (not shown) as the outermost layer.

The effect of the case where the resistor in the fifth embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as in the above-described third embodiment, and thus description thereof is omitted.

Further, in the fifth embodiment of the present invention, the first top electrode layer 102, the resistive layer 103, the protective layer 104, the second top electrode layer 105, and the third top electrode layer 106 are shown in Table 5. When combined, other characteristics can be improved.

Combination Second top electrode layer 105 First upper electrode layer 102 Third top electrode layer 106 Resistance layer 103: Top protective layer 104: Bottom Feature improved 21 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) glass system (600 degreeC baking) Same characteristics as combination 1 of table 1 22 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) glass system (600 degreeC baking) Same as Combination 2 of Table 1 23 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same characteristics as combination 3 of table 1 24 Golden chicken sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same as Combination 4 of Table 1 25 Nickel-based Sputtering Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Combination 23 has a feature, and since the second upper electrode layer 105 is made of a non-metal, it can be manufactured at low cost. 26 Nickel-based Sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) It has the characteristics of the combination 25 and can be manufactured at low cost since the third upper electrode layer 106 is made of a non-metal. 27 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (600 ℃ firing) Ruthenium Oxide (850 ℃) Glass (600 ℃) Same characteristics as combination 5 of table 1 28 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium Oxide (850 ℃) Glass (600 ℃) Same characteristics as combination 6 of Table 1 29 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium Oxide (850 ℃) Glass (600 ℃) Same characteristics as combination 7 of table 1 30 Golden chicken sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same characteristics as combination 8 of table 1 31 Golden Rooster Sputtering Gold-based conductive powder + resin (200 ° C firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Same as Combination 9 of Table 1 32 Nickel-based Sputtering Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Has both the characteristics of combination 25 and combination 5 of table 1 33 Nickel-based Sputtering Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Ruthenium oxide type (850 degreeC baking) resin system (200 degreeC hardening) Has both the characteristics of combination 26 and combination 5 of table 1

In addition, in the fifth embodiment of the present invention, it can be easily considered that the side electrode is not formed to further reduce the installation area.

(Example 6)

Hereinafter, a resistor and a manufacturing method thereof in a sixth embodiment of the present invention will be described with reference to the drawings.

Fig. 21 is a sectional view of a resistor in the sixth embodiment of the present invention.

In Fig. 21, 121 is a substrate containing 96% alumina. 122 is a pair of top electrode layers made of a gold-based thin film provided on the side of the main surface of the substrate 121. 123 is a resistive layer made of a thin film of nickel-chromium or chromium-silicon provided on the upper surface of the substrate 121. 124 is a protective layer made of epoxy resin or the like provided on the upper surface of the resistance layer 123. 125 is a side electrode layer made of a nickel-based thin film provided on the side of the substrate 121. 126 and 127 are nickel plating layers and solder plating layers provided for ensuring reliability, etc. at the time of soldering as needed, and the ridge lines of these nickel plating layers 126 and solder plating layers 127 are formed round, and the board | substrate 121 is carried out. The area of the solder plating layer 127 on the side surface of () is equal to or less than half the area of the side surface of the substrate 121.

A resistor in the sixth embodiment of the present invention configured as described above will be described below with reference to the drawings.

22 to 24 are process charts showing the manufacturing method of the resistor in the sixth embodiment of the present invention.

First, as shown in Fig. 22A, the surface has a plurality of longitudinal and transverse dividing grooves 128 and 129 provided for dividing the strip into strips and pieces in a subsequent step, and at the same time, heat and insulating properties. Screen an electrode paste made of metal organic material mainly composed of gold or the like without covering the division grooves 129 in the horizontal direction of the upper surface of the sheet-like substrate 121 containing the excellent 96% alumina. After printing and drying, only the organic component of the electrode paste made of a metal organic material or the like is blown off, and only the metal component is about 850 ° C. by a belt type continuous firing furnace for plastic adhesion on the substrate 121. Is fired by a profile of about 45 minutes at, to form a top electrode layer 122 made of a thin film.

Next, as shown in Fig. 22 (b), nickel-chromium, by sputtering, is formed on the entire upper surface of the sheet-like substrate 121 formed by forming the upper electrode layer 122 (not shown in the figure). The entire resistor layer 130 is formed by coating chromium-silicon or the like.

Next, as shown in Fig. 22 (c), the resistive layer 123 having the desired resistive pattern is formed by the photolithography method which is generally performed by LSI or the like. In order to make the layer 123 a stable film, heat treatment is performed at a temperature of about 300 to 400 ° C.

Next, as shown in Fig. 23A, in order to correct the resistance value of the resistive layer 123 to a predetermined value, a trimming groove 131 is formed with a YAG laser and trimming is performed. At this time, the trimming probe for measuring the resistance value is set on the upper electrode layer 122, and the trimming is performed by the serpentine cut method (straight cut of multiple lines), whereby the resistance value is high from the low resistance value. The resistance value can be adjusted freely.

Next, as shown in Fig. 23B, in order to protect the resistance layer 123 after the resistance value correction, an epoxy resin paste is screened so as to form individual protective layer printing patterns on the individual resistance layers. After printing, the protective layer 124 is formed by thermosetting with a profile of about 30 minutes at about 200 ° C. by a continuous continuous curing furnace in order to adhere firmly onto the substrate 121. At this time, you may form a protective layer printing pattern so that the some resistance layer 123 arrange | positioned in the horizontal direction may be covered continuously over the division groove 128 of a vertical direction.

Next, as shown in the figure, the side electrode layer 125 made of a nickel-chromium thin film is formed by sputtering so as to be electrically connected to the upper electrode layer 122 over the division grooves 129 in the horizontal direction. do. At this time, a resist layer is formed below a portion forming the side electrode layer in advance, and a nickel-chromium layer is formed on the entire substrate by sputtering, and then the side electrode layer is removed at the same time as the resist is removed by a lift-off method. The other nickel-chromium layer is removed.

Next, as shown in Fig. 24A, the sheet-shaped substrate 121 is divided into horizontally divided dividing grooves 129 and firstly divided into a strip-shaped substrate 132. At this time, the side electrode layer 125 is formed to the depth of the division groove 129 in the horizontal direction on the side surface in the longitudinal direction of the strip-shaped substrate 132.

Finally, as shown in Fig. 24B, as a preparatory step for plating the exposed upper electrode layer 122 and the side electrode layer 125, the strip-shaped substrate 132 is formed into a piece of substrate. Secondary division is performed by dividing to 133, and the electroplating is performed by electroplating as necessary to prevent the electrode squeezing during the soldering of the exposed top electrode layer 122 and the side electrode layer 125 and to ensure the reliability during the soldering. A resistor is manufactured by forming a nickel plating layer (not shown) as an intermediate layer and forming a solder plating layer (not shown) as the outermost layer.

The resistor in the sixth embodiment of the present invention constructed and manufactured as described above was soldered to the mounting substrate. As shown in the cross sectional view of the installation state of Fig. 25A, the surface on which the protective layer is formed is provided downward and soldered from both the upper electrode layer (not shown) and the portion of the resistive layer on the side of the substrate. Since the area where the side electrodes are formed is small, only the filtrate 134 is formed. Therefore, as shown in the top view of the installation state of FIG. 25 (b), the area where the component area 135 and the area 136 required for soldering the side surfaces are combined is the installation area 137. In the angular chip resistors having a size of 0.6 x 0.3 mm, a reduction of about 20% was achieved by comparing the installation area with the product of the conventional structure.

Therefore, according to the structure of this invention, since the area of the side electrode of a resistor is small, the area for forming the soldering filler on a mounting board | substrate becomes small, and an installation area can be reduced.

In addition, by forming the side electrode layer 125 by sputtering, the adhesion strength with the substrate is strong, and linearity can be obtained at the boundary line between the substrate 121 and the solder plating layer 127 at the side surface of the substrate, and the appearance is improved. The effect of being favorable can also be acquired.

In the sixth embodiment of the present invention, it is easy to think that the side electrode layer 125 is not formed to further reduce the installation area. However, in the current manufacturing process of electronic equipment, soldering inspection after installation is actually performed by image recognition, and when no side electrode is formed, no filtrate is formed, and automatic inspection by image recognition cannot be performed. There is a problem of becoming.

In addition, in the sixth embodiment of the present invention, the solder plating layer 127 and the protection layer 124 are made to have the same surface or the solder plating layer 127 higher, so that a gap between the solder plating layer 127 and the land pattern during installation is generated. It is difficult to improve the installation quality further.

The same effect can be obtained in addition to the combination of the upper electrode layer 122, the resistance layer 123, and the protective layer 124 in the sixth embodiment of the present invention. The combinations and features are summarized in Table 6.

Combination Top electrode layer 122 Resistance layer (123) Protective layer (124) Characteristic One Silver or gold conductive powder + glass (850 ° C firing) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) Good resistance value due to low formation temperature of protective layer 2 Silver or gold conductive powder + glass (850 ° C firing) Ruthenium oxide type (850 degreeC firing) Glass system (600 degrees Celsius firing) Moisture resistance is good because protective film is glass 3 Silver or gold conductive powder + glass (850 ° C firing) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) In addition to the characteristics of Combination 1, the formation temperature of the resistive layer is low, and thus energy saving is possible. 4 Silver or gold conductive powder + glass (850 ° C firing) Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) Same as feature 1 5 Gold-based organometallic compound (850 ° C firing) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) In addition to the characteristics of the combination 1, since the amount of gold used is small, it can be configured at low cost. 6 Gold-based organometallic compound (850 ℃ firing) Ruthenium oxide type (850 degreeC firing) Glass system (600 degrees Celsius firing) In addition to the characteristics of combination 2, since the amount of gold used is small, it can be configured at low cost. 7 Gold-based organometallic compound (850 ° C firing) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) In addition to the characteristics of combination 3, since the amount of gold used is small, it can be configured at low cost. 8 Gold-based organometallic compound (850 ° C firing) Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) (Combination of the first embodiment) 9 Nickel or Copper or Gold Sputtering Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) In addition to the characteristics of the combination 7, in the case of nickel or copper, since it is a non-metal, it can be comprised at low cost.

(Seventh embodiment)

Hereinafter, a resistor and a manufacturing method thereof in a seventh embodiment of the present invention will be described with reference to the drawings.

Fig. 26 is a sectional view of a resistor in the seventh embodiment of the present invention.

In FIG. 26, 141 is a substrate containing 96% alumina. 142 is a pair of first upper electrode layers made of a gold-based thin film provided on the side of the surface of the substrate 141. 143 is a resistive layer made of a thin film of nickel-chromium or chromium-silicon provided between the upper electrode layers 142. 144 is a protective layer made of epoxy resin or the like provided on the surface of the resistive layer 143. 145 is a pair of second upper electrode layers made of a resin containing silver or nickel-based conductive powder. 146 is a side electrode layer provided on the side of the substrate 141 so as to be connected to the first top electrode layer 142 or the second top electrode layer 145. 147 and 148 are nickel plating layers and solder plating layers provided to ensure reliability during soldering as necessary, and the ridges of these nickel plating layers 147 and solder plating layers 148 are rounded, and the substrate 141 is formed. The area of the solder plating layer 148 on the side surface of () is less than half the area of the side surface of the substrate 141.

A resistor in the seventh embodiment of the present invention configured as described above will be described below with reference to the drawings.

27 to 29 are process drawings showing the manufacturing method of the resistor in the seventh embodiment of the present invention.

First, as shown in Fig. 27 (a), the surface has a plurality of longitudinal and transverse dividing grooves 149 and 150 provided for dividing into strips and pieces in a subsequent step, and at the same time, heat and insulating properties. Screen printing and drying of an electrode paste made of metal organic material mainly composed of gold or the like, without spreading the horizontally divided grooves 150 on the upper surface of the sheet-like substrate 141 containing the excellent 96% alumina. Thereafter, only the organic components of the electrode paste made of metal organic materials or the like are blown off, and only the metal components are fired by a profile of about 45 minutes at about 850 ° C. by a belt-type continuous firing furnace in order to plastically attach the metal components on the substrate 141. An upper electrode layer 142 formed of a film is formed.

Next, as shown in Fig. 27 (b), nickel-chromium is formed by sputtering on the entire upper surface of the sheet-like substrate 141 formed by forming the upper electrode layer 142 (not shown in this drawing). The entire resistor layer 151 is formed by coating chromium-silicon or the like.

Next, as shown in Fig. 27 (c), the resistive layer 143 having the desired resistive pattern is formed by the photolithography method which is generally performed by LSI or the like, and the resist is formed. In order to make the layer 143 a stable film, heat treatment is performed at a temperature of about 300 to 400 캜.

Next, as shown in Fig. 28A, in order to correct the resistance value of the resistance layer 143 to a predetermined value, a trimming groove 152 is formed by a YAC laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the upper electrode layer 142, and the trimming can be freely adjusted from a low resistance value to a high resistance value by using the serpentine cut method (straight cut of multiple lines).

Next, as shown in Fig. 28 (b), in order to protect the resistance layer 143 after the resistance value correction, an epoxy-based pattern is formed so as to form individual protective layer printing patterns on the individual resistance layers 143. After screen-printing the resin paste, the protective layer 144 is formed by heat curing with a profile of about 30 minutes at about 200 ° C. by a belt type continuous curing furnace in order to firmly adhere on the substrate 141. At this time, you may form a protective layer printing pattern so that the some resistance layer 143 arrange | positioned in the horizontal direction may be covered continuously over the division groove 149 of a vertical direction.

Next, as shown in the figure, after screen-printing a conductive paste containing resin in a silver- or nickel-based conductive powder so as to cover the upper electrode layer 142, it is firmly adhered to the substrate 141. In order to form the second upper electrode layer 145 by thermosetting with a profile of about 30 minutes at about 200 ° C. by a belt type continuous curing furnace.

Next, as shown in Fig. 28 (c), the side electrode layer made of a nickel-chromium thin film by sputtering so as to be electrically connected to the top electrode layer 142 over the horizontal division grooves (not shown). 146 is formed. At this time, a resist layer is formed below a portion forming the side electrode layer in advance, and a nickel-chromium layer is formed on the entire substrate by sputtering, and then the nickel-chromium other than the side electrode layer is simultaneously removed by the lift-off method. Remove the layer.

Next, as shown in Fig. 29 (a), the primary substrate is divided into strip-shaped substrates 153 by dividing into the division grooves 150 in the transverse direction of the sheet-shaped substrate 141. At this time, the side electrode layer 146 is formed in the longitudinal side of the strip-shaped substrate 153 to the depth of the divided groove 150 in the horizontal direction.

Finally, as shown in Fig. 29 (b), as a preparatory step for plating the exposed second upper electrode layer 145 and the side electrode layer 146, the strip-shaped substrate 153 is formed into pieces. Secondary division is performed by dividing the second upper electrode layer 145 and the side electrode layer 146 into the substrate 154 of the substrate 154 to prevent the electrode from being pressed during the soldering and to ensure the reliability during the soldering. By plating, a nickel plating layer (not shown) is used as an intermediate layer, and a solder plating layer (not shown) is formed as the outermost layer to manufacture a resistor.

The effect of the case where the resistor in the seventh embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as that of the sixth embodiment described above, and thus description thereof is omitted.

In addition, the same effect can be obtained even if the first upper electrode layer 142, the second upper electrode layer 145, the resistance layer 143, and the protective layer 144 are combined in the seventh embodiment of the present invention. Can be. The combinations and features are summarized in Table 7.

Combination First upper electrode layer 142 Second upper electrode layer 145 Resistance layer (143) Protective layer (144) Characteristic One Silver or gold conductive powder + glass (850 ℃ firing) Silver or gold conductive powder + glass (850 ℃ firing) Ruthenium oxide type (850 degreeC firing) Glass system (600 degrees Celsius firing) Excellent moisture resistance 2 Silver or gold conductive powder + glass (850 ℃ firing) Silver or Nickel + Resin (200 ℃ Curing) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) Same as the characteristics of Combination 1 of Table 1 3 Silver or gold conductive powder + glass (850 ℃ firing) Silver or Nickel + Resin (200 ℃ Curing) Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) Same as above 4 Gold organometallic compound (850 ℃ firing) Silver or gold conductive powder + glass (600 ℃ firing) Ruthenium oxide type (850 degreeC firing) Glass system (600 degrees Celsius firing) Same as the characteristics of Combination 5 in Table 1. 5 Gold organometallic compound (850 ℃ firing) Silver or Nickel + Resin (200 ℃ Curing) Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) (Combination of the second embodiment) 6 Gold organometallic compound (850 ℃ firing) Silver or Nickel + Resin (200 ℃ Curing) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) Same as the characteristics of Combination 7 in Table 1. 7 Nickel or Copper or Gold Sputtering Silver or Nickel + Resin (200 ℃ Curing) Nickel-Chrome-Chrome-Silicon Sputtering Thin Film Resin-based (200 ° C curing) Same as the characteristics of Combination 9 in Table 1. 8 Nickel or Copper or Gold Sputtering Silver or Nickel + Resin (200 ℃ Curing) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) Same as the characteristics of Combination 9 in Table 1.

(Example 8)

Hereinafter, a resistor and a manufacturing method thereof according to an eighth embodiment of the present invention will be described with reference to the drawings.

Fig. 30 is a sectional view of a resistor in the eighth embodiment of the present invention.

In FIG. 30, 161 is a substrate containing 96% alumina. 162 is a top electrode layer containing glass in a silver-based conductive powder provided on a part of side and side surfaces of the main surface of the substrate 161, and the ridge line of the top electrode layer 162 is rounded. In addition, the area of the upper electrode layer 162 on the side surface of the substrate 161 is less than half the area of the side surface of the substrate 161. 163 is a resistance layer mainly composed of ruthenium oxide electrically connected to the upper electrode layer 162. 164 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 163. 165 and 166 are nickel plating layers and solder plating layers provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the eighth embodiment of the present invention configured as described above will be described below with reference to the drawings.

31 and 32 are process charts showing the manufacturing method of the resistor in the eighth embodiment of the present invention.

First, as shown in Fig. 31 (a), 96 having excellent heat resistance and insulation property having a plurality of longitudinal and transverse dividing grooves 167 and 168 provided on the surface for dividing into strips and pieces in a subsequent step. The upper electrode layer 162 is formed by printing an electrode paste made of silver-based conductive powder and glass over the divided grooves 168 in the horizontal direction of the sheet-like substrate 161 containing% alumina. Next, in order to make this top electrode layer 162 into a stable film | membrane, it bakes at the temperature of about 850 degreeC. In this case, the electrode paste may enter the split groove 168 in the horizontal direction and form the top electrode layer 162 up to the split groove. The depth with respect to the thickness of the board | substrate 161 of these division grooves 167 and 168 is generally formed in less than half of the thickness of the board | substrate 161 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 31B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the upper electrode layer 162, thereby forming the resistive layer 163. Then, as shown in Figs. Next, in order to make this resistance layer 163 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 31 (c), in order to correct the resistance value of the resistance layer 163 to a predetermined value, a trimming groove 169 is formed by a YAG laser and trimming is performed. At this time, a trimming probe for resistance measurement is set on the upper electrode layer 162 and trimmed.

Next, as shown in Fig. 32A, in order to protect the resistance layer 163 after the resistance value correction, a paste containing glass as a main component is printed to form the protective layer 164. At this time, you may form the printing pattern of the protective layer 164 so that the some resistance layer 163 arrange | positioned in the horizontal direction may be covered continuously over the division groove 167 of a vertical direction. Next, in order to make this protective layer 164 a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 32 (b), the upper electrode layer 162, the resistive layer 163, the trimming grooves 169, and the protective layer 164 are formed horizontally on the sheet-like substrate 161 after formation. The strip is divided into strip-shaped substrates 170 along the dividing grooves 168 in the direction. At this time, the upper electrode layer 162 formed on the side surface in the longitudinal direction of the strip-shaped substrate 170 is formed to the depth of the divided groove 168 in the horizontal direction.

Finally, as shown in Fig. 32 (c), as a preparatory step for plating the exposed upper electrode layer 162, the longitudinal grooves 167 of the strip-shaped substrate 170 are formed. It divides and divides into the board | substrate 171 of a shape. In addition, a nickel plating layer (not shown) is used as an intermediate layer by electroplating in order to prevent electrode squeezing during soldering and to ensure reliability during soldering of the exposed top electrode layer 162, and a solder plating layer (not shown). Is formed as the outermost layer to manufacture a resistor.

The resistor in the eighth embodiment of the present invention constructed and manufactured as described above was soldered to the mounting substrate. As shown in the cross-sectional view of the installation state of Fig. 33A, the surface on which the protective layer is formed is provided downward and soldered from both the upper electrode layer (not shown) and the portion of the resistive layer on the side of the substrate. Since the area in which the side electrodes are formed is small, only the fillet 173 is formed. Therefore, as shown in the top view of the installation state of FIG. 33 (b), the area that combined the component area 174 and the area 175 necessary for soldering the side surface becomes the installation area 176. In the angular chip resistors having a size of 0.6 x 0.3 mm, a reduction of about 20% was achieved by comparing the installation area with the product of the conventional structure.

Therefore, according to the configuration of the eighth embodiment of the present invention, since the area of the side electrodes of the resistor is small, the area for forming the solder fillet on the mounting substrate becomes small, so that the mounting area can be reduced.

In addition, in the eighth embodiment of the present invention, the solder plating layer 166 and the protection layer 164 are made to have the same surface or the solder plating layer 166, whereby a gap between the solder plating layer 166 and the land pattern during installation is generated. It is difficult to improve the installation quality further.

In the eighth embodiment of the present invention, when the upper electrode layer 162 and the protective layer 164 are combined as shown in Table 8, other characteristics (as shown in Table 8) can be improved.

Combination Top electrode layer 162 Protective layer (164) Feature improved One Gold-based conductive powder + glass (850 degrees Celsius firing) Glass system (600 degrees Celsius firing) Less ion migration improves load life characteristics 2 Silver Conductive Powder + Glass (850 ℃ Baking) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 34 is low, there is no process change of the resistance layer, so that the resistance error of the product is small. 3 Gold-based conductive powder + glass (850 degrees Celsius firing) Resin-based (200 ° C curing) Has all of the features of combinations 1 and 2 4 Gold organometallic compound (850 ℃ firing) Glass system (600 degrees Celsius firing) It has the characteristics of the combination 1, and because the amount of gold used is less can be manufactured at a lower cost than the combination 1 5 Gold-based organometallic compound (850 ° C firing) Resin-based (200 ° C curing) Has all the features of combinations 3 and 4

In addition, in the eighth embodiment of the present invention, it can be easily considered that the side electrode is not formed to further reduce the installation area. However, in the current manufacturing process of electronic equipment, soldering inspection after installation is actually performed by image recognition, and when no side electrode is formed, no filtrate is formed, so that automatic inspection by image recognition cannot be performed. There is a problem.

(Example 9)

Hereinafter, a resistor and a manufacturing method thereof according to a ninth embodiment of the present invention will be described with reference to the drawings.

Fig. 34 is a sectional view of a resistor in the ninth embodiment of the present invention.

In Figure 34, 181 is a substrate containing 96% alumina. 182 is an upper electrode layer provided by gold-based sputtering provided on a part of side and side surfaces of the main surface of the substrate 181, and the ridge line of the upper electrode layer 182 is formed in a round shape. In addition, the area of the upper electrode layer 182 on the side surface of the substrate 181 is less than half the area of the side surface of the substrate 181. 183 is a resistance layer mainly composed of ruthenium oxide electrically connected to the upper electrode layer 182. 184 is a protective layer mainly composed of glass provided on the surface of the resistive layer 183. 185 and 186 are nickel plating layers and solder plating layers provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the ninth embodiment of the present invention constructed as described above will be described below with reference to the drawings.

35 to 36 are process charts showing the manufacturing method of the resistor in the ninth embodiment of the present invention.

First, as shown in Fig. 35 (a), 96 having excellent heat resistance and insulation property having a plurality of longitudinal and transverse dividing grooves 187 and 188 provided on the surface for dividing into strips and pieces in a subsequent step. The upper electrode layer 182 is coated with gold on the entire upper surface of the sheet-like substrate 181 containing% alumina by a sputtering method and made into a desired electrode pattern by a photolithography method generally performed by LSI. In order to form the top electrode layer 182 as a stable film, heat treatment is performed at a temperature of about 300 to 400 ° C. In this case, the top electrode layer 182 may enter the split groove 188 in the horizontal direction and form the top electrode layer 182 to the inside of the split groove. The depth with respect to the thickness of the board | substrate 181 of these division grooves 187 and 188 is generally formed at less than half of the thickness of the board | substrate 181 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 35B, a resistive paste containing ruthenium oxide as a main component is printed to form an resistive layer 183 so as to be electrically connected to the upper electrode layer 182. Figs. Next, in order to make this resistance layer 183 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 35 (c), in order to correct the resistance value of the resistance layer 183 to a predetermined value, the trimming groove 189 is formed with a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the upper electrode layer 182 and trimmed.

Next, as shown in Fig. 36A, in order to protect the resistance layer 183 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 184. At this time, you may form the printed pattern of the protective layer 184 so that the some resistance layer 183 arrange | positioned in the horizontal direction may be covered continuously over the division groove 187 of a vertical direction. Next, in order to make this protective layer 184 a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 36 (b), the upper electrode layer 182, the resistance layer 183, the trimming groove 189, and the protective layer 184 are formed horizontally on the sheet-like substrate 181 after formation. It is divided along the dividing groove 188 in the direction and divided into a strip-shaped substrate 190. At this time, the upper surface electrode layer 182 formed on the side of the strip-shaped substrate 190 in the longitudinal direction is formed to the depth of the dividing groove 188 in the horizontal direction.

Finally, as shown in Fig. 36 (c), as a preparatory process for plating the exposed top electrode layer 182, the longitudinal grooves 187 in the longitudinal direction of the strip-shaped substrate 190 are formed. The film is divided into pieces of substrate 191. The nickel plating layer (not shown) is used as an intermediate layer by electroplating in order to prevent electrode squeezing during the soldering of the exposed top electrode layer 182 and to ensure reliability during soldering, and a solder plating layer (not shown) is used. It forms as an outermost layer and manufactures a resistor.

The effect of the case where the resistor in the ninth embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as that in the eighth embodiment, and thus description thereof is omitted.

In the ninth embodiment of the present invention, when the upper electrode layer 182, the resistive layer 183, and the protective layer 184 are shown in Table 9, other characteristics (described in Table 9) can be improved.

Combination Top electrode layer 182 Resistance layer 183 Protective layer (184) Feature improved 6 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Ruthenium oxide type (850 degreeC firing) Resin-based (200 ° C curing) Due to the low processing temperature of the protective layer, there is no process change and the resistance error of the product is small. 7 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) The combination 6 has a feature, and since the processing temperature of the resistive layer is lower than that of the combination 6, it is possible to save power and save energy. 8 Nickel-based Sputtering (Heat Treatment at 300-400 ℃) Carbon resin system (200 degrees Celsius hardening) Resin-based (200 ° C curing) It has the characteristics of the combination 7, and the electrode material is made of a non-metal than the combination 7, it is possible to manufacture at low cost

(Example 10)

Hereinafter, a resistor and a manufacturing method thereof in a tenth embodiment of the present invention will be described with reference to the drawings.

Fig. 37 is a sectional view of a resistor in the tenth embodiment of the present invention.

In Fig. 37, 201 is a substrate containing 96% alumina. 202 is a first top electrode layer formed of glass in a silver-based conductive powder provided on a part of side and side surfaces of the main surface of the substrate 201, and the area of the first top electrode layer 202 on the side of the substrate 201 is a substrate. It is less than half of the area of the side surface of 201. 203 is a resistance layer mainly composed of ruthenium oxide electrically connected to the first top electrode layer 202. 204 is a protective layer mainly composed of glass provided on the surface of the resistive layer 203. 205 is a second top electrode layer containing glass in the silver-based conductive powder provided on the top surface of the first top electrode layer 202, and the ridge lines of the second top electrode layer 205 are formed in a round shape. 206 and 207 are nickel plating layers and solder plating layers which are provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the tenth embodiment of the present invention constructed as described above will be described below with reference to the drawings.

38 to 39 are process drawings showing the manufacturing method of the resistor in the tenth embodiment of the present invention.

First, as shown in Fig. 38 (a), 96 having excellent heat resistance and insulation property having a plurality of longitudinal and transverse dividing grooves 208 and 209 provided on the surface for dividing into strips and pieces in a subsequent step. The first upper electrode layer 202 is formed by printing an electrode paste made of silver-based conductive powder and glass to span the horizontally divided grooves 209 of the sheet-like substrate 201 containing% alumina. do. Next, in order to make this 1st top electrode layer 202 a stable film | membrane, it bakes at the temperature of about 850 degreeC. In this case, the electrode paste may enter the division groove 209 in the horizontal direction to form the first upper electrode layer 202 up to the inside of the division groove. The depth with respect to the thickness of the board | substrate 201 of these division grooves 208 and 209 is generally formed to be less than half the thickness of the board | substrate 201 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in FIG. 38 (b), a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first top electrode layer 202 to form a resistive layer 203. As shown in FIG. Next, in order to make this resistance layer 203 a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 38 (c), in order to correct the resistance value of the resistance layer 203 to a predetermined value, the trimming groove 210 is formed with a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the first upper electrode layer 202 and trimmed.

Next, as shown in the thirty-third (a), in order to protect the resistance layer 203 after the resistance value correction, a paste containing glass as a main component is printed to form the protective layer 204. At this time, you may form the printing pattern of the protective layer 204 so that the some resistance layer 203 arrange | positioned in the horizontal direction may be covered continuously over the division groove 208 of a vertical direction. Next, in order to make this protective layer 204 a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in FIG. 39 (b), an electrode paste made of silver-based conductive powder and glass is formed on the upper surface of the first upper electrode layer 202 without being divided by the division grooves 209 in the horizontal direction. The second upper electrode layer 205 is formed by printing. At this time, the printing pattern of the second upper electrode layer 205 may be formed on the plurality of first upper electrode layers 202 arranged side by side in the horizontal direction so as to span the vertical division grooves 208. Next, baking is performed at the temperature of about 600 degreeC in order to make the 2nd top electrode layer 205 into a stable film | membrane.

Next, as shown in Fig. 39 (c), the first top electrode layer 202, the resistance layer 203, the trimming groove 210, the protective layer 204, and the second top electrode layer 205 are formed. Subsequently, the strip-shaped substrate 211 is divided along the division grooves 209 in the horizontal direction of the sheet-like substrate 201. At this time, the upper electrode layer 202 formed on the side of the strip-shaped substrate 211 in the longitudinal direction is formed to the depth of the divided groove 209 in the horizontal direction.

Finally, as shown in FIG. 39 (d), as a preparatory process for plating the exposed first top electrode layer 202 and the second top electrode layer 205, the strip-shaped substrate 211 is provided. The dividing is divided along the longitudinal dividing groove 208 and divided into pieces of substrate 212. The nickel plated layer (not shown) is formed on the intermediate layer by electroplating to prevent electrode squeezing during soldering and to ensure reliability during soldering of the exposed first and second upper electrode layers 202 and 205. The solder plating layer (not shown) is formed as the outermost layer to manufacture a resistor.

The resistor in the tenth embodiment of the present invention constructed and manufactured as described above was soldered to the mounting substrate. As shown in the sectional view of the installation state of Fig. 40 (a), the surface on which the protective layer is formed is provided downward and soldered at both the upper electrode layer (not shown) and the portion of the resistive layer on the side of the substrate. Since the area in which the side electrodes are formed is small, only the fillet 213 is formed. Therefore, as shown in the top view of the installation state of FIG. 40 (b), the area which combined the component area 214 and the area 215 required for soldering the side surface becomes the installation area 216. FIG. In the angular chip resistors having a size of 0.6 x 0.3 mm, a reduction of about 20% was achieved by comparing the installation area with the product of the conventional structure.

Therefore, according to the structure of this invention, since the area of the side electrode of a resistor is small, the area for forming the filler for soldering on a mounting board | substrate becomes small, and an installation area can be reduced.

In the tenth embodiment of the present invention, the solder plating layer 207 and the protection layer 204 are made to have the same surface or the solder plating layer 207 so that the gap between the solder plating layer 207 and the land pattern during installation is increased. It is difficult to produce, further improving the installation quality.

In the tenth embodiment of the present invention, when the first top electrode layer 202, the protective layer 204, and the second top electrode layer 205 are shown in Table 10, other characteristics (as shown in Fig. 10) are improved. I can do it.

Combination First top electrode layer 202 Second top electrode layer 205 Protective Layer (204) Feature improved One Silver conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 204 is low, there is no process change of the resistance value, so that the resistance value error of the product becomes small. 2 Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Resin-based (200 ° C curing) It has the characteristics of the said combination 1, and can make it low cost, making the material of the 2nd top electrode layer 205 a nonmetal. 3 Silver conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (600 ℃ firing) Glass system (600 degrees Celsius hardening) Less ion migration improves load life characteristics 4 Gold-based conductive powder + glass (850 ℃ firing) Silver Conductive Powder + Resin (200 ℃ Curing) Resin-based (200 ° C curing) Has all the features of combinations 1 and 3 5 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ° C curing) Resin-based (200 ° C curing) Has all the features of combinations 2 and 3 6 Gold-based organometallic compound (850 ° C firing) Silver conductive powder + glass (600 ℃ firing) Glass system (600 degrees Celsius hardening) It is characterized by the above-mentioned combination 3, and is inexpensive because the amount of gold used is reduced. 7 Gold-based organometallic compound (850 ° C firing) Silver Conductive Powder + Resin (200 ℃ Curing) Resin-based (200 ° C curing) Has all the features of combinations 1 and 6 8 Gold-based organometallic compound (850 ° C firing) Nickel-based conductive powder + resin (200 ° C curing) Resin-based (200 ° C curing) Has all the features of combinations 2 and 6

In addition, in the tenth embodiment of the present invention, it can be easily considered that the side without the side electrode can further reduce the installation area. However, in the current manufacturing process of electronic equipment, soldering inspection after installation is actually performed by image recognition, and when no side electrode is formed, no filtrate is formed, and automatic inspection by image recognition can be performed. There is a problem that there is no.

(Example 11)

Hereinafter, a resistor and a manufacturing method thereof in the eleventh embodiment of the present invention will be described with reference to the drawings.

Fig. 41 is a sectional view of a resistor in the eleventh embodiment of the present invention.

In Fig. 41, reference numeral 221 denotes a substrate containing 96% alumina. 222 is a first upper electrode layer provided by gold-based sputtering provided on a part of side and side surfaces of the main surface of the substrate 221, and the area of the first upper electrode layer 222 on the side of the substrate 221 is the area of the substrate 221. It is less than half of area of side surface. 223 is a resistance layer mainly composed of ruthenium oxide electrically connected to the first top electrode layer 222. 224 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 223. 225 is a second top electrode layer containing glass in the silver-based conductive powder provided on the top surface of the first top electrode layer 222, and the ridge lines of the second top electrode layer 225 are formed in a round shape. 226 and 227 are nickel plating layers and solder plating layers which are provided for ensuring reliability, etc. at the time of soldering as needed.

A resistor in the eleventh embodiment of the present invention configured as described above will be described below with reference to the drawings.

42 and 43 are process charts showing the manufacturing method of the resistor in the eleventh embodiment of the present invention.

First, as shown in Fig. 42 (a), 96 having excellent heat resistance and insulation property having a plurality of longitudinal and transverse dividing grooves 228, 229 provided on the surface for dividing into strips and pieces in a subsequent step. A first upper electrode layer (coated with gold on the entire upper surface of the sheet-like substrate 221 containing% alumina by sputtering method and made into a desired electrode pattern by a port lithography method generally performed by LSI or the like) 222 is formed, and heat treatment is performed at a temperature of about 300 to 400 ° C. to make the first top electrode layer 222 a stable film. In this case, the first upper electrode layer 222 may enter the division groove 229 in the horizontal direction and form the first upper electrode layer 222 to the inside of the division groove. The depth with respect to the thickness of the board | substrate 221 of these division grooves 228 and 229 is generally formed in less than half of the thickness of the board | substrate 221 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 42B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first top electrode layer 222, thereby forming the resistive layer 223. Figs. Next, in order to make this resistance layer 223 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 42 (c), in order to correct the resistance value of the resistance layer 223 to a predetermined value, a trimming groove 230 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the first upper electrode layer 222 and trimmed.

Next, as shown in Fig. 43A, in order to protect the resistance layer 223 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 224. At this time, you may form the printing pattern of the protective layer 224 so that the some resistance layer 223 arrange | positioned in the horizontal direction may be covered continuously over the division groove 228 of a vertical direction. Next, in order to make this protective layer 224 a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in FIG. 43 (b), an electrode paste made of silver-based conductive powder and glass is placed on the upper surface of the first upper electrode layer 222 so as not to cross the dividing groove 229 in the horizontal direction. The second upper electrode layer 225 is formed by printing. Next, baking is performed at a temperature of about 600 ° C. in order to make this second top electrode layer 225 a stable film.

Next, as shown in Fig. 43 (c), the first upper electrode layer 222, the resistance layer 223, the trimming groove 230, the protective layer 224, and the second upper electrode layer 225 are formed. The sheet-shaped substrate 221 is divided along the horizontal dividing grooves 229 and divided into a strip-shaped substrate 231. At this time, the first upper surface electrode layer 222 formed on the side surface in the longitudinal direction of the strip-shaped substrate 231 is formed to the depth of the divided groove 229 in the horizontal direction.

Finally, as shown in FIG. 43 (d), as a preparatory process for plating the exposed top electrode layer 222, the divided grooves 228 in the longitudinal direction of the strip-shaped substrate 231 are formed. The film is divided into pieces 232 of substrate. The nickel plating layer (not shown) is used as an intermediate layer by electroplating to prevent electrode squeezing during the soldering of the exposed upper electrode layer 222 and to ensure reliability during soldering. The solder plating layer (not shown) is used. It forms as an outermost layer and manufactures a resistor.

The result of the case where the resistor in the eleventh embodiment of the present invention constructed and manufactured is soldered to the mounting substrate is the same as that of the tenth embodiment described above, and thus description thereof is omitted.

In the eleventh embodiment of the present invention, when the first top electrode layer 222, the protective layer 224, and the second top electrode layer 225 are combined as shown in Table 11, other characteristics (as shown in Table 11) are improved. I can do it.

Combination First top electrode layer 222 Second Top Electrode Layer (225) Protective Layer (224) Improved Characteristics 9 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Silver conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 224 is low, there is no process change of the resistance value, so that the resistance value error of the product becomes small. 10 Gold-based sputtering (300 ~ 400 ℃ heat treatment) Nickel-based conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) It has the characteristics of the said combination 9, and can manufacture it cheaply, making the material of a 2nd upper electrode layer into a nonmetal. 11 Nickel-based Sputtering (Heat Treatment at 300-400 ℃) Silver conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) As the resistive layer, a carbon resin system is required. Power saving is possible by using carbon resin system

(Example 12)

Hereinafter, a resistor and a manufacturing method thereof according to a twelfth embodiment of the present invention will be described with reference to the drawings.

Figure 44 is a sectional view of a resistor in the twelfth embodiment of the present invention.

In Figure 44, 241 is a substrate containing 96% alumina. Reference numeral 242 denotes a first upper electrode layer formed of glass in a silver-based conductive powder provided on the side of the main surface of the substrate 241. 243 is a resistance layer mainly composed of ruthenium oxide electrically connected to the first top electrode layer 242. 244 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 243. 245 is a second top electrode layer formed by containing glass in the conductive powder of silver system provided on the top surface of the first top electrode layer 242 and a part of the side surface of the substrate 241, and the second top electrode layer on the side surface of the substrate 241 ( The area of 245 is less than half the area of the side surface of the substrate 241. The ridge lines of the second top electrode layer 245 are formed round. 246 and 247 are nickel plating layers and solder plating layers provided for ensuring reliability, etc. at the time of soldering as needed.

45 and 46 are process charts showing the manufacturing method of the resistor in the twelfth embodiment of the present invention.

First, as shown in Fig. 45 (a), 96% of heat resistance and insulation excellent in the upper surface having a plurality of longitudinal and transverse dividing grooves 248 and 249 provided for dividing into strips and pieces in a subsequent process. The first upper electrode layer 242 is formed by printing an electrode paste made of silver-based conductive powder and glass so as not to cross the dividing grooves 249 in the horizontal direction of the sheet-like substrate 241 containing alumina. do. Next, baking is performed at a temperature of about 850 ° C. in order to make this first top electrode layer 242 a stable film. The depth with respect to the thickness of the board | substrate 241 of these division grooves 248 and 249 is generally formed below half the thickness of the board | substrate 241 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 45B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first top electrode layer 242, thereby forming a resistive layer 243. As shown in Figs. Next, in order to make this resistance layer 243 into a stable film | membrane, it bakes at about 850 degreeC.

Next, as shown in Fig. 45 (c), in order to correct the resistance value of the resistance layer 243 to a predetermined value, a trimming groove 250 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the first upper electrode layer 242 and trimmed.

Next, as shown in Fig. 46A, in order to protect the resistance layer 243 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 244. Next, as shown in FIG. At this time, you may form the printing pattern of the protective layer 244 so that the some resistance layer 243 arrange | positioned in the horizontal direction may be covered continuously over the division groove 248 of a vertical direction. Next, in order to make this protective layer 244 a stable film | membrane, it bakes at the temperature of about 600 degreeC.

Next, as shown in Fig. 46 (b), the silver-based conductive powder and the glass are placed on the upper surface of the first substrate 242 so that the divided grooves 249 in the horizontal direction of the sheet-like substrate 241 are hung. The electrode paste formed by printing is printed to form the second upper electrode layer 245. In this case, the electrode paste may enter the division groove 249 in the horizontal direction to form the second upper electrode layer 245 up to the division groove. At this time, the printing pattern of the second upper electrode layer 245 may be formed on the plurality of first upper electrode layers 242 arranged side by side in a continuous manner over the division grooves 248 in the vertical direction. Next, baking is performed at the temperature of about 600 degreeC in order to make the 2nd top electrode layer 245 into a stable film | membrane.

Next, as shown in Fig. 46 (c), a first top electrode layer 242, a resistance layer 243, a trimming groove 250, a protective layer 244, and a second top electrode layer 245 are formed. The sheet-shaped substrate 241 is divided along the horizontal dividing groove 249 and divided into a strip-shaped substrate 251. At this time, the second upper electrode layer 245 formed on the side surface in the longitudinal direction of the strip-shaped substrate 251 is formed to the depth of the dividing groove 249 in the horizontal direction.

Finally, as shown in Fig. 46 (d), as the preparatory process for plating the exposed second upper electrode layer 245, the longitudinal division grooves 248 of the strip-shaped substrate 251 are formed. By dividing along, the fragment is divided into pieces of substrate 252. The nickel plating layer (not shown) is used as an intermediate layer by electroplating to prevent electrode squeezing during soldering and to ensure reliability during soldering of the exposed second upper electrode layer 245, and a solder plating layer (not shown). ) Is formed as the outermost layer to manufacture a resistor.

The effect of the case where the resistor in the twelfth embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as that in the tenth embodiment described above, and thus description thereof is omitted.

In the twelfth embodiment of the present invention, when the first top electrode layer 242, the protective layer 244, and the second top electrode layer 245 are combined as shown in Table 12, other characteristics (as shown in Table 12) are improved. You can.

Combination First Top Electrode Layer 242 Second upper electrode layer 245 Protective Layer (244) Feature improved 12 Silver conductive powder + glass (850 ℃ firing) Silver conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 244 is low, there is no process change of the resistance layer, so that the resistance value error of the product becomes small. 13 Silver conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) It has the characteristics of the said Combination 12, and can manufacture it cheaply, making the material of a 2nd upper electrode layer into a nonmetal. 14 Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + glass (600 ℃ firing) Glass system (600 degrees Celsius hardening) Less ion migration improves load life characteristics 15 Gold-based conductive powder + glass (850 ℃ firing) Silver conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Has all the features of combinations 12 and 14 16 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Has all the features of combinations 13 and 14 17 Gold organometallic compound (850 ℃ firing) Silver conductive powder + glass (600 ℃ hardening) Glass system (600 degrees Celsius hardening) It has the characteristics of the said combination 14, and it is low cost because the usage-amount of gold reduces. 18 Gold organometallic compound (850 ℃ firing) Silver conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Has all the features of combinations 12 and 17 19 Gold organometallic compound (850 ℃ firing) Nickel-based conductive powder + resin (200 ℃ hardening) Resin-based (200 ° C curing) Has all the features of combinations 13 and 17

(Example 13)

Hereinafter, a resistor and a manufacturing method thereof according to a thirteenth embodiment of the present invention will be described with reference to the drawings.

Fig. 47 is a sectional view of a resistor in the thirteenth embodiment of the present invention.

In Figure 47, 261 is a substrate containing 96% alumina. 262 is a first top electrode layer formed of glass in silver-based conductive powder provided on the side of the main surface of the substrate 261. 263 is a resistance layer mainly composed of ruthenium oxide electrically connected to the first top electrode layer 262. 264 is a protective layer mainly composed of glass provided on the upper surface of the resistive layer 263. 265 is a second top electrode layer formed using gold-based sputtering provided on a portion of the top and side surfaces of the first top electrode layer 262, and the area of the second top electrode layer 265 on the side of the substrate 261 is the substrate 261. It is less than half of the area of the side surface). The ridge lines of the second top electrode layer 265 are formed round. 266 and 267 are nickel plating layers and solder plating layers provided to ensure reliability during soldering, etc., as necessary.

A resistor in the thirteenth embodiment of the present invention configured as described above will be described below with reference to the drawings.

48 and 49 are process charts showing the manufacturing method of the resistor in the thirteenth embodiment of the present invention.

First, as shown in Fig. 48 (a), the surface having a plurality of longitudinal and transverse dividing grooves 268, 269 formed for dividing into strips and pieces in a subsequent step is 96% excellent in heat resistance and insulation. The first upper electrode layer 262 is formed by printing an electrode paste made of silver-based conductive powder and glass so as not to span the horizontally divided grooves 269 of the sheet-shaped substrate 261 containing alumina. do.

Next, as shown in Fig. 48B, a resistive paste containing ruthenium oxide as a main component is printed so as to be electrically connected to the first top electrode layer 262, thereby forming the resistive layer 263. As shown in Figs. Next, in order to make this resistance layer 263 into a stable film | membrane, it bakes at the temperature of about 850 degreeC.

Next, as shown in Fig. 48 (c), in order to correct the resistance value of the resistance layer 263 to a predetermined value, a trimming groove 270 is formed by a YAG laser and trimming is performed. At this time, the trimming probe for resistance measurement is set on the first upper electrode layer 262 and trimmed.

Next, as shown in Fig. 49A, in order to protect the resistance layer 263 after the resistance value correction, a paste containing glass as a main component is printed to form a protective layer 264. Next, as shown in FIG. At this time, you may form the printing pattern of the protective layer 264 so that the some resistance layer 263 arrange | positioned in the horizontal direction may be covered continuously over the division groove 268 of a vertical direction. Next, baking is performed at the temperature of about 600 degreeC in order to make this protective layer 264 a stable film.

Next, as shown in Fig. 49B, a resist material made of resin is applied to the entire upper surface of the substrate 261, and the desired second upper electrode layer 265 is applied to the resist material by photolithography. The hole of the film-forming pattern is formed. Further, the entire surface of the substrate 261 is coated with gold by a sputtering method to remove the resist material of the portion excluding the film forming pattern of the desired second upper electrode layer 265. By this step, the second upper electrode layer 265 is formed. In this case, the second top electrode layer 265 may enter the horizontal division groove 269 to form the second top electrode layer 265 up to the division groove.

The depth with respect to the thickness of the board | substrate 261 of the division grooves 268 and 269 is generally formed in less than half of the thickness of the board | substrate 261 so that it may not be broken at the time of handling in a manufacturing process.

Next, as shown in Fig. 49 (c), a first upper electrode layer 262, a resistance layer 263, a trimming groove 270, a protective layer 264, and a second upper electrode layer 265 are formed. The sheet is divided into strip-shaped substrates 271 along the horizontal dividing grooves 269 of the sheet-shaped substrate 261. At this time, the second upper surface electrode layer 265 formed on the side surface in the longitudinal direction of the strip-shaped substrate 271 is formed to the depth of the dividing groove 269 in the horizontal direction.

Finally, as shown in Fig. 49 (d), as a preparatory process for plating the exposed upper electrode layer 265, along the divided grooves 268 in the longitudinal direction of the strip-shaped substrate 271. The film is divided into pieces of the substrate 272 in the shape of pieces. In order to prevent the electrode from being pressed during the soldering of the exposed second upper electrode layer 265 and to ensure the reliability during the soldering, the nickel plating layer (not shown) is used as the intermediate layer by the electroplating, and the solder plating layer (not shown). ) Is formed as the outermost layer to manufacture a resistor.

The effect of the case where the resistor in the thirteenth embodiment of the present invention constructed and manufactured as described above is soldered to the mounting substrate is the same as that in the tenth embodiment described above, and thus description thereof is omitted.

In the thirteenth embodiment of the present invention, when the first top electrode layer 262, the protective layer 264, and the second top electrode layer 265 are combined as shown in Table 13, other characteristics (as shown in Table 13) are improved. You can.

Combination First Top Electrode Layer 262 Second upper electrode layer 265 Protective layer (264) Improved Characteristics 20 Silver conductive powder + glass (850 ℃ firing) Gold-based sputtering (200 ℃ heat treatment) Resin-based (200 ° C curing) Since the processing temperature of the protective layer 264 is low, there is no process change of the resistance value, so the resistance error of the product is small. 21 Silver conductive powder + glass (850 ℃ firing) Nickel-based Sputtering (200 ℃ Curing) Glass system (600 degrees Celsius firing) The material of the second top electrode can be manufactured at low cost by using a non-metal. 22 Gold-based conductive powder + glass (850 ℃ firing) Gold-based sputtering (200 ℃ heat treatment) Glass system (600 degrees Celsius firing) Less ion migration improves load life characteristics 23 Gold-based conductive powder + glass (850 ℃ firing) Gold-based sputtering (200 ℃ heat treatment) Resin-based (200 ° C curing) Has all the features of combinations 20 and 22 24 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based Sputtering (200 ℃ Heat Treatment) Glass system (200 degrees Celsius hardening) Has all the features of combinations 21 and 22 25 Gold-based conductive powder + glass (850 ℃ firing) Nickel-based Sputtering (200 ℃ Heat Treatment) Resin-based (200 ° C curing) Has all the features of combinations 21, 22 and 20 above 26 Gold organometallic compound (850 ℃ firing) Gold-based sputtering (200 ℃ heat treatment) Glass system (600 degrees Celsius firing) It has the characteristics of the combination 22 and can be manufactured at low cost because the amount of gold used is small. 27 Gold organometallic compound (850 ℃ firing) Gold-based sputtering (200 ℃ heat treatment) Resin-based (200 ° C curing) It has the characteristics of the combination 23 and can be manufactured at low cost because the amount of gold used is small. 28 Gold organometallic compound (850 ℃ firing) Nickel-based Sputtering (200 ℃ Heat Treatment) Glass system (200 degrees Celsius hardening) It has the characteristics of the combination 24, and can be manufactured at low cost because the amount of gold used is small. 29 Gold organometallic compound (850 ℃ firing) Nickel-based Sputtering (200 ℃ Heat Treatment) Resin-based (200 ° C curing) It has the characteristics of the combination 25 and can be manufactured at low cost because the amount of gold used is small.

As described above, the resistor of the present invention includes a substrate, a pair of first upper electrode layers provided over a portion of the side and side surfaces of the upper surface of the substrate, and a pair of second upper surfaces provided to be electrically connected to the first upper electrode layer. An electrode layer, a resistance layer provided to be electrically connected to the second upper electrode layer, and a protective layer provided to cover at least an upper surface of the resistance layer. According to this configuration, a part of the side and side surfaces of the upper surface of the substrate is provided. Since the pair of first upper electrode layers are formed, the area of the side electrodes of the resistor is small, and in the case of soldering the resistor on the mounting substrate, the area of the resistor is soldered to the small side electrodes, so that the fillers of solder are removed. The area for forming can be made small, and as a result, the installation area including the soldered portion on the installation substrate can be reduced. A.

Claims (30)

A pair of substrates, a pair of first top electrode layers provided over part of the side and side surfaces of the top surface of the substrate, a pair of second top electrode layers provided to electrically connect to the first top electrode layer, and the second top electrode layer And a protective layer provided so as to be electrically connected to the substrate, and a protective layer provided so as to cover at least an upper surface of the resistance layer. The resistor of Claim 1 WHEREIN: The resistor provided with the 1st upper surface electrode layer located in a part of side surface of a board | substrate at the side of the said resistance layer of the height direction of the said board | substrate. The resistor of claim 2 wherein the area of the first top electrode layer located on a portion of the side of the substrate is less than half the area of the side of the substrate. The resistor according to claim 1, wherein the first upper electrode layer and the second upper electrode layer are covered with a plating layer, and the plating layer and the protective layer are made of the same surface or the plating layer is high. The resistor according to claim 1, wherein the first top electrode layer is formed by firing a gold-based organometallic compound or formed by gold-based sputtering. The resistor according to claim 5, wherein the second top electrode layer contains glass in silver or gold conductive powder. The resistor according to claim 6, wherein the protective layer is made of either resin or glass. The resistor of claim 1, wherein the first upper electrode layer is formed by sputtering of nickel. The resistor according to claim 8, wherein the second upper electrode layer, the resistance layer, and the protective layer are made of resin. The resistor according to claim 1, wherein the first top electrode layer and the second top electrode layer are not in contact with the sides of the substrate in the longitudinal direction. The second top electrode layer is formed so as to extend across the top surface of the divided groove of the sheet-shaped substrate having the divided grooves and flow electrode paste into the divided grooves to form a first top electrode layer, and to electrically connect with the first top electrode layer. Forming a resistive layer so as to electrically connect the second upper electrode layers, forming a protective layer to cover at least the upper surface of the resistive layer, and forming the first upper electrode layer. A method of manufacturing a resistor having an electrode on a part of a substrate side, wherein the sheet-shaped substrate is divided into a strip-shaped substrate in a groove and the strip-shaped substrate is divided into pieces. The first top electrode layer is formed by sputtering in the divided grooves while being spread over the top surface of the divided grooves of the sheet-like substrate having the divided grooves, and the second top electrode layers are formed to be electrically connected to the first top electrode layers. And forming a resistive layer to electrically connect the second upper electrode layers, forming a protective layer to cover at least an upper surface of the resistive layer, and forming the first upper electrode layer. The sheet-like substrate is divided into a strip-shaped substrate, and the strip-shaped substrate is divided into pieces. A pair of substrates, a pair of first top electrode layers provided over part of the side and side surfaces of the top surface of the substrate, a pair of second top electrode layers provided to electrically connect to the first top electrode layer, and the second top electrode layer And a resistance layer provided so as to be electrically connected to the second electrode, a third upper electrode layer provided on at least part of the upper surface of the second upper electrode layer, and a protective layer provided to cover at least the upper surface of the resistance layer. A substrate, a pair of first upper electrode layers provided on the upper surface of the substrate, a resistance layer provided to be electrically connected to the first upper electrode layer, and at least part of an upper surface of the first upper electrode layer and a part of the side surface of the substrate. And a second top electrode layer, a protective layer provided to cover at least the resistance layer, and a third top electrode layer overlapping at least a portion of the first top electrode layer. The electrode paste flows through the side surface of the upper surface of the sheet-shaped substrate having the divided grooves and the upper surface of the divided grooves to form an electrode paste into the divided grooves to form a first upper electrode layer, and to electrically connect with the first upper electrode layer. A second upper electrode layer, a resistance layer is formed to electrically connect between the second upper electrode layers, a protective layer is formed to cover at least the upper surface of the resistance layer, and at least a part of the upper surface of the second upper electrode layer In the dividing groove of the sheet-shaped substrate formed by forming an overlapping third top electrode layer, the third top electrode layer is formed, the sheet-shaped substrate is divided into strip-shaped substrates, and the strip-shaped substrate is divided into pieces. Method for producing a resistor made of. A second top surface is formed so as to span the side of the top surface of the sheet-shaped substrate having the divided grooves and the top surface of the divided grooves and to be electrically connected to the first top electrode layer by sputtering in the divided grooves. An electrode layer, a resistive layer formed to electrically connect between the second upper electrode layers, a protective layer formed to cover at least the upper surface of the resistive layer, and overlapping at least a part of the upper surface of the second upper electrode layer Formed by dividing the sheet-shaped substrate into strip-shaped substrates and dividing the strip-shaped substrate into pieces in a divided groove of the sheet-shaped substrate formed by forming three upper electrode layers, and forming the third upper electrode layer. Method of manufacturing a resistor. A first upper electrode layer is formed on the side of the upper surface of the sheet-shaped substrate having the divided grooves without covering the upper surface of the divided grooves, and a resistance layer is formed so as to electrically connect between the first upper electrode layers, and at least the resistance layer. A protective layer is formed to cover the top surface of the substrate, and is electrically connected to at least the first top electrode layer to cover the top surface of the divided groove of the sheet-shaped substrate, and simultaneously forms a second top electrode layer by sputtering in the divided groove. Forming a third upper electrode layer so as to overlap at least a portion of an upper surface of the first upper electrode layer, and forming the third upper electrode layer, thereby forming the sheet-shaped substrate in a split groove of the sheet-shaped substrate. And dividing the strip substrate into pieces. A substrate, a pair of upper electrode layers provided on the side of the upper surface of the substrate, a resistance layer provided to electrically connect to the upper electrode layer, a protective layer provided to cover at least the resistance layer, and an electrical connection with the upper electrode layer. And a side electrode layer provided on a portion of the side of the substrate. A pair of substrates, a pair of first upper electrode layers provided on the side of the upper surface of the substrate, a resistance layer provided to be electrically connected to the first upper electrode layer, and at least a second upper electrode layer provided on the upper surface of the first upper electrode layer; And a protective layer provided so as to cover at least an upper surface of the resistance layer, and a side electrode layer provided on a part of the side surface of the substrate to electrically connect with the first upper electrode layer or the second upper electrode layer. Forming a pair of upper electrode layers on the upper surface of the sheet-shaped substrate having the divided grooves without covering the divided grooves, forming a resistive layer so as to electrically connect the upper electrode layers, and at least the upper surface of the resistive layer Forming a protective layer so as to cover the gap; forming a pair of side electrode layers over the divided grooves between the adjacent upper electrode layers and electrically connecting the upper electrode layers; and forming the upper electrode layers. And a step of dividing the sheet-shaped substrate into strip-shaped substrates in a split groove of a sheet-shaped substrate, and dividing the strip-shaped substrate into pieces. Forming a pair of first upper electrode layers on the upper surface of the sheet-shaped substrate having the divided grooves without covering the divided grooves, forming a resistance layer so as to electrically connect the upper electrode layers, and at least a resistance layer Forming a protective layer to cover the top surface of the substrate; forming a second top electrode layer to cover at least the top surface of the first top electrode layer; and dividing between the adjacent first top electrode layers or the second top electrode layer. Forming a pair of side electrode layers so as to be connected to the grooves and electrically connected to the first top electrode layer or the second top electrode layer; and in the divided grooves of the sheet-shaped substrate formed by forming the top electrode layers. A resistor having a step of dividing the substrate into strip-shaped substrates and a step of dividing the strip-shaped substrate into pieces Manufacturing method. A substrate, a pair of upper electrode layers provided on portions of the side and side surfaces of the main surface of the substrate, a resistance layer provided to electrically connect to the upper electrode layer, and a protective layer provided to cover at least the upper surface of the resistance layer. resistor. Forming an upper electrode layer by flowing electrode paste into the divided grooves and spreading the upper surface of the divided grooves of the sheet-shaped substrate having the divided grooves; and forming a resistance layer to electrically connect the upper electrode layers. And forming a protective layer so as to cover at least the upper surface of the upper electrode layer and the resistive layer, and dividing the sheet-shaped substrate into a strip-shaped substrate in a division groove of the sheet-shaped substrate formed by forming the upper electrode layer. And a step of dividing the strip substrate into pieces. Forming a top electrode layer by sputtering in the divided grooves while being spread over the top surface of the divided grooves of the sheet-like substrate having the divided grooves, and forming a resistance layer to electrically connect the top electrode layers; Forming a protective layer so as to cover at least the upper surface of the upper electrode layer and the resistive layer; and dividing the sheet-shaped substrate into a strip-shaped substrate in a division groove of the sheet-shaped substrate formed by forming the upper electrode layer. And a step of dividing the strip-shaped substrate into pieces. A pair of first upper electrode layers provided on the substrate, a part of the side and side surfaces of the upper surface of the substrate, a resistance layer provided to be electrically connected to the first upper electrode layer, and at least an upper surface of the first upper electrode layer; 2. A resistor having a top electrode layer and a protective layer formed to cover at least the top surface of the resistor layer. A substrate, a pair of first upper electrode layers provided on the upper surface of the substrate, a resistance layer provided to be electrically connected to the first upper electrode layer, and at least part of an upper surface of the first upper electrode layer and a part of the side surface of the substrate. And a second upper electrode layer and a protective layer formed to cover at least the resistance layer. Forming a first top electrode layer by flowing electrode paste into the divided grooves while covering the upper side of the upper surface of the sheet-shaped substrate having the divided grooves and the upper surface of the divided grooves; and electrically connecting the first upper electrode layers between the first upper electrode layers. Forming a resistive layer so as to be connected, forming a protective layer so as to cover at least the first top electrode layer and the upper surface of the resistive layer, and forming a second top electrode layer electrically connected to at least the first top electrode layer. A step of dividing the sheet-shaped substrate into strip-shaped substrates in a dividing groove of the sheet-shaped substrate formed by forming the second upper electrode layer, and of dividing the strip-shaped substrate into pieces. The manufacturing method of the resistor which has an electrode in a part of board | substrate side surface. Forming a first top electrode layer by sputtering in the split groove while being spread over the side of the top surface of the sheet-shaped substrate having the split grooves and the top of the split grooves; and electrically connecting between the first top electrode layers. Forming a resistive layer, forming a protective layer so as to cover at least the first upper electrode layer and the upper surface of the resistive layer, and forming a second upper electrode layer electrically connected to at least the first upper electrode layer; And dividing the sheet-shaped substrate into strip-shaped substrates in the dividing grooves of the sheet-shaped substrate formed by forming the second upper electrode layer, and dividing the strip-shaped substrate into pieces. A method for producing a resistor having an electrode on a portion of a substrate side. Forming a first upper electrode layer on the side of the upper surface of the sheet-shaped substrate having the divided grooves without covering the upper surface of the divided grooves, forming a resistance layer so as to electrically connect the first upper electrode layers; Forming a protective layer so as to cover at least the first top electrode layer and the upper surface of the resistive layer, and electrically connecting with the first top electrode layer at least and covering the top surface of the divided groove of the sheet-like substrate; Forming a second top electrode layer by introducing an electrode paste into the inside; dividing the sheet-shaped substrate into strip-shaped substrates in a division groove of the sheet-shaped substrate formed by forming the second top electrode layer; And a step of dividing the strip-shaped substrate into pieces. Forming a first upper electrode layer on the side of the upper surface of the sheet-shaped substrate having the divided grooves without covering the upper surface of the divided grooves, forming a resistance layer so as to electrically connect the first upper electrode layers; Forming a protective layer so as to cover at least the first top electrode layer and the upper surface of the resistive layer, and electrically connecting with the first top electrode layer at least and covering the top surface of the divided groove of the sheet-like substrate; Forming a second upper electrode layer by sputtering therein, dividing the sheet-shaped substrate into a strip-shaped substrate in a split groove of the sheet-shaped substrate formed by forming the second upper electrode layer, and the strip A method of manufacturing a resistor having an electrode on a part of a substrate side surface, the method comprising dividing the substrate in pieces into pieces.