JPH1126205A - Resistor and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor which can be lessened in mounting area including a soldered part on a mounting board, by a method wherein the upper electrode of the resistor is soldered to a side electrode provided to a part of the upper side of the board. SOLUTION: Gold organic metal compound is baked spreading partially over the edge of the main surface and side face of a board 31 which contains 96% alumina so as to provide an upper electrode layer 32. At this point, the upper electrode layer 32 is half or less as large in area as the side of the board 31. A pair of second upper electrode layer 33 which are electrically connected to the first upper electrode layer 32 and contain silver conductive powder and glass are formed. A resistive layer 34 which is electrically connected to the second upper electrode layers 33 and whose main component is ruthenium oxide is formed, and a protective layer 35 whose main component is glass is provided to the upside of the resistive layer 34. Then, a third upper electrode layer 36 which contains silver conductive powder and glass is formed on a part of the upside of the second upper electrode layer 33, and then a nickel plating layer 37 and a solder plating layer 38 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a method for manufacturing the same.

[0002]

2. Description of the Related Art The prior art is disclosed in Japanese Patent Laid-Open No. 4-102302.
Is disclosed in US Pat.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 14 is a sectional view of a conventional resistor. In the figure, reference numeral 1 denotes an insulating substrate. Reference numeral 2 denotes a first upper electrode layer provided on both left and right ends of the upper surface of the insulating substrate 1. 3
Is a resistance layer provided so as to partially overlap the first upper electrode layer 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a second upper electrode layer provided on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1. 8 is a side electrode layer provided on the side surface of the insulating substrate 1. 9 and 10 are the second upper electrode layers 7
And a nickel plating layer and a solder plating layer provided on the surface of the side electrode layer 8. At this time, the solder plating layer 1
0 is provided lower than the second protective layer 6. That is, in the conventional resistor, the second protective layer 6 is provided highest.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

FIG. 15 is a process chart showing a conventional method for manufacturing a resistor. First, as shown in FIG. 15A, a first upper electrode layer 2 is formed on both sides of the upper surface of the insulating substrate 1 by coating.

Next, as shown in FIG. 15B, a resistive layer 3 is applied on the upper surface of the insulating substrate 1 so as to partially overlap the first upper electrode layer 2.

Next, as shown in FIG. 15C, after a first protective layer 4 is formed by coating so as to cover only the entire resistive layer 3, the total resistance of the resistive layer 3 is reduced to a predetermined value. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to fall within the range of the value.

Next, as shown in FIG. 15D, a second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

As shown in FIG. 15E, a second upper electrode layer 7 is formed on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1.

Next, as shown in FIG. 15 (f), the first upper electrode layer 2 and the first, left and right side surfaces of the insulating substrate
The side electrode layer 8 is formed by coating so as to be electrically connected to the second upper electrode layers 2 and 7.

Finally, after nickel plating is applied to the surfaces of the second upper electrode layer 7 and the side electrode layer 8, a nickel plating layer 9 and a solder plating layer 10 are formed by applying solder plating. Was manufacturing resistors.

[0013]

However, in the resistor according to the above-described conventional configuration and manufacturing method, when soldering is performed on a mounting board, FIG. 16A is a cross-sectional view showing a mounting state of the conventional resistor. As shown, a fillet mounting structure is formed in which a fillet 23 is formed by soldering both the side electrode layer (not shown) and the lower electrode layer (not shown). As shown in the top view showing the mounting state, an area 25 for soldering the side surface is required in addition to the component area 24, and a mounting area 26 in which these are combined is required. In addition, in order to improve the mounting density, the smaller the external dimensions of the component, the larger the ratio of the soldering area to the mounting area, and there is a limit in improving the mounting density for miniaturizing electronic devices. Had.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resistor capable of reducing a soldering area occupying a mounting area when mounted on a mounting board and a method of manufacturing the same. is there.

[0015]

In order to achieve the above object, the present invention provides a pair of first or second upper electrode layers provided over the side and part of the side surface of the main surface of the substrate,
A resistive layer provided to be electrically connected to the upper surface electrode layer, a protective layer provided to cover at least the upper surface of the resistive layer, and a first upper surface electrode layer or a second upper surface electrode layer. It has a third upper electrode layer overlapping a part of the upper surface.

Further, in order to achieve the above object, the present invention is directed to a first or a second step which straddles an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove and in which an electrode paste is poured into the dividing groove or sputtered. Providing an upper electrode layer, providing a resistance layer so as to electrically connect the first or second upper electrode layer, and providing a protective layer so as to cover at least an upper surface of the upper electrode layer and the resistance layer; Forming a third upper electrode layer overlapping a part of the upper surface of the first upper electrode layer or the second upper electrode layer; dividing the sheet substrate into strips by dividing grooves of the sheet substrate; The substrate is divided into individual pieces.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a substrate, a pair of first upper electrode layers provided over a part of a side surface and a side surface of the upper surface of the substrate, and 1
A pair of second upper electrode layers provided so as to be electrically connected to the upper electrode layer; a resistive layer provided so as to be electrically connected to the second upper electrode layer; A third upper electrode layer provided on a part of the upper surface of the second upper electrode layer, and a protective layer provided so as to cover at least the upper surface of the resistance layer.

[0018] Further, the invention according to claim 2 includes a substrate,
A pair of first upper electrode layers provided on the upper surface of the substrate, a resistive layer provided to be electrically connected to the first upper electrode layer, and at least an upper surface of the first upper electrode layer And a second upper electrode layer provided on a part of a side surface of the substrate, a protective layer provided so as to cover at least the resistance layer, and at least a part of an upper surface of the first upper electrode layer. And a third upper electrode layer.

Further, the invention described in claim 3 is the first invention.
Or the first or second upper electrode layer provided on the side surface of the substrate according to Item 2 is provided on the resistance layer side in the height direction of the substrate.

The invention described in claim 4 is the third invention.
The area of the first or second upper electrode layer provided on the side surface of the substrate is not more than half the area of the side surface of the substrate.

The invention described in claim 5 is the first invention.
Or the first, second, and third upper electrode layers are covered with a plating layer, and the plating layer and the protective layer are flush with each other or the plating layer is higher.

The invention according to claim 6 is the first invention.
The first upper electrode layer described above is formed by firing a gold-based organometallic compound or formed by gold-based sputtering.

The invention described in claim 7 is the same as the claim 6.
The second upper surface electrode layer described above is formed by containing a glass in a gold-based or silver-based conductive powder.

The invention according to claim 8 is the same as the invention according to claim 6.
The protective layer described is of a glass type or a resin type.

The invention according to claim 9 is the first invention.
The first upper electrode layer described above is formed by nickel-based sputtering, the second upper electrode layer is made of a silver-based conductive powder containing a resin, and the resistance layer is a resin-based one.

According to a tenth aspect of the present invention, the third upper surface electrode layer according to the first aspect comprises a silver-based conductive powder containing glass or a silver or nickel-based conductive powder. It contains a resin.

[0027] According to an eleventh aspect of the present invention, the first upper electrode layer according to the second aspect comprises silver or gold based conductive powder containing glass.

According to a twelfth aspect of the present invention, the second upper electrode layer according to the eleventh aspect is formed by nickel-based or gold-based sputtering.

According to a thirteenth aspect of the present invention, the protective layer according to the eleventh aspect is a glass-based or resin-based protective layer.

According to a fourteenth aspect of the present invention, in the eleventh aspect, the third upper electrode layer comprises a silver-based conductive powder containing glass, or a silver or nickel-based conductive powder. It contains a resin.

According to a fifteenth aspect of the present invention, the first upper electrode layer and the second upper electrode layer according to the first and second aspects are not in contact with the longitudinal side of the substrate.

According to a sixteenth aspect of the present invention, the first upper surface electrode layer is formed by straddling the side of the upper surface of the sheet substrate having the dividing groove and the upper surface of the dividing groove and pouring the electrode paste into the dividing groove. Providing a second upper electrode layer so as to be electrically connected to the first upper electrode layer;
And a protective layer provided so as to cover at least the upper surface of the resistive layer, and a third layer overlapping at least a part of the upper surface of the second upper electrode layer. An upper electrode layer is provided, the sheet substrate is divided into strip substrates by dividing grooves of the sheet substrate formed with the third upper electrode layer, and the strip substrate is divided into individual pieces. is there.

Further, the invention according to claim 17 is characterized in that a first upper surface electrode layer is provided by sputtering over the side of the upper surface of the sheet substrate having the dividing groove and the upper surface of the dividing groove, and in the dividing groove by sputtering. A second upper electrode layer is provided so as to be electrically connected to the first upper electrode layer, a resistive layer is provided so as to electrically connect the second upper electrode layer, and at least an upper surface of the resistive layer is provided. A division groove of the sheet substrate formed by providing a protective layer so as to cover, providing a third upper electrode layer overlapping at least a part of the upper surface of the second upper electrode layer, and forming the third upper electrode layer; The sheet substrate is divided into strip-shaped substrates, and the strip-shaped substrate is divided into individual pieces.

According to the present invention, a first upper surface electrode layer is provided on a side of an upper surface of a sheet substrate having a division groove without straddling the upper surface of the division groove, and the first upper surface electrode layer is provided. And a protective layer is provided so as to cover at least an upper surface of the resistive layer, and is electrically connected to at least the first upper surface electrode layer so that an upper surface of the division groove of the sheet substrate is formed. A second upper electrode layer is provided by sputtering in the division groove while being straddled, and a third upper electrode layer is provided so as to overlap at least a part of the upper surface of the first upper electrode layer; The sheet substrate is divided into strip-shaped substrates by dividing grooves of the sheet substrate formed with layers, and the strip-shaped substrates are divided into individual pieces.

With this configuration and the manufacturing method, it is possible to provide a resistor capable of reducing a soldering area occupying a mounting area when mounted on a mounting board and a method of manufacturing the same.

(Embodiment 1) A resistor and a method of manufacturing the resistor according to Embodiment 1 of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a resistor according to the first embodiment of the present invention. In the figure, 31 is a substrate containing 96% alumina. Reference numeral 32 denotes a first upper surface electrode layer formed by sintering a gold-based organometallic compound provided over the side and part of the side surface of the main surface of the substrate, and the first upper surface electrode layer on the side surface of the substrate 31. The area of 32 is not more than half the area of the side surface of the substrate 31. 33 is a first upper electrode layer 3
2 is a pair of second upper electrode layers each containing glass in a silver-based conductive powder electrically connected to the second upper electrode layer. Reference numeral 34 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the second upper electrode layer 33. Reference numeral 35 denotes a protective layer mainly composed of glass provided on the upper surface of the resistance layer 34. 36 is the second
This is a third upper electrode layer made of a silver-based conductive powder provided on a part of the upper surface of the upper electrode layer 33 and containing glass.
Reference numerals 37 and 38 denote a nickel plating layer and a solder plating layer provided as necessary to ensure reliability and the like at the time of soldering.

The method of manufacturing the resistor according to the embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 2 to 4 are process diagrams showing a method of manufacturing the resistor according to the first embodiment of the present invention.

First, as shown in FIG. 2 (a), the surface has a plurality of vertical and horizontal dividing grooves 39, 40 provided on the surface for dividing into strips and individual pieces in a later step. And a sheet-like substrate 31 containing 96% alumina having excellent insulating properties so as to straddle the lateral dividing grooves 40.
An electrode paste containing a gold-based organometallic compound is printed to form the first upper electrode layer 32. Next, firing is performed at a temperature of about 850 ° C. in order to make the first upper electrode layer 32 a stable film. At this time, the electrode paste enters the lateral dividing groove 40 and can form the first upper electrode layer 32 to the depth of the dividing groove. The substrate 31 of the dividing grooves 39 and 40
Is generally formed so as to be equal to or less than half the thickness of the substrate 31 so as not to be broken during handling in a manufacturing process.

Next, as shown in FIG. 2B, an electrode paste containing silver-based conductive powder and glass is printed so as to be electrically connected to the first upper electrode layer 32. The second upper electrode layer 33 is formed. Next, baking is performed at a temperature of about 850 ° C. to make the second upper electrode layer 33 a stable film.

Next, as shown in FIG. 2C, a resistance paste containing ruthenium oxide as a main component is printed to form a resistance layer 34 so as to be electrically connected to the second upper electrode layer 33. . Next, baking is performed at a temperature of about 850 ° C. in order to make the resistance layer 34 a stable film.

Next, as shown in FIG.
In order to correct the resistance value of No. 4 to a predetermined value, trimming is performed by forming a trimming groove 41 with a YAG laser. At this time, the trimming probe for measuring the resistance value is set on the second upper electrode layer 33 to perform trimming.

Next, as shown in FIG. 3B, a paste containing glass as a main component is printed to protect the resistance layer 34 whose resistance has been corrected, thereby forming a protection layer 35. At this time, the plurality of resistance layers 34 arranged in the horizontal direction are divided into the vertical dividing grooves 3.
The print pattern of the protective layer 35 may be formed so as to continuously cover the protection layer 9. Next, firing is performed at a temperature of about 600 ° C. in order to make the protective layer 35 a stable film.

Next, as shown in FIG. 3C, a silver-based material is formed over a part of the upper surfaces of the first upper electrode layer 32 and the second upper electrode layer 33 without straddling the lateral division grooves 40. The third upper electrode layer 36 is formed by printing the electrode paste containing the conductive powder and glass. Next, baking is performed at a temperature of about 600 ° C. in order to make the third upper electrode layer 36 a stable film.

Next, as shown in FIG. 4A, the first upper electrode layer 32, the second upper electrode layer 33, the resistance layer 34, the trimming groove 41, the protective layer 35, and the third upper electrode layer The sheet 36 is divided along the horizontal dividing grooves 40 of the sheet substrate 31 having been formed, and is divided into strip substrates 42. At this time, the first upper surface electrode layer 32 formed earlier is formed on the side surface in the longitudinal direction of the strip substrate 42 to the depth of the horizontal dividing groove 40.

Finally, as shown in FIG. 4B, the exposed first upper electrode layer 32 and second upper electrode layer 3 are exposed.
As a preparation step for plating the third and third upper electrode layers 36, the strip substrate 42 is divided along the vertical division grooves 39 and divided into individual substrates 43. Then, the exposed first upper surface electrode layer 32 and the second upper surface electrode layer 33
In order to prevent electrode erosion during soldering of the third upper surface electrode layer 36 and to ensure reliability during soldering, a nickel plating layer (not shown) is used as an intermediate layer by electroplating, and a solder plating layer is formed. (Not shown) is formed as an outermost layer to manufacture a resistor.

The resistor constructed and manufactured in the first embodiment of the present invention is soldered to a mounting board. As shown in the cross-sectional view of the mounting state of the first embodiment of the present invention in FIG. 5A, mounting is performed with the surface on which the protective layer is formed facing downward, and the first, second, and third upper surface electrodes Layer (not shown)
And the resistance layer on the side surface of the substrate, but the fillet 44 is formed only slightly because the area where the side surface electrode is formed is small. Therefore,
As shown in the top view of the mounted state in FIG. 5B, the mounting area 47 is the combined area of the component area 45 and the land pattern 46 necessary for soldering the side surface of the component.
Becomes 0.6 × 0.3mm square chip resistor,
Comparing the mounting area with a product having a conventional structure, it is possible to reduce the size by about 20%.

Therefore, according to the structure of the present embodiment, since the area of the side electrode of the resistor is small, the area for forming the solder fillet on the mounting substrate can be small, and the mounting area can be reduced. can do.

In the first embodiment of the present invention, the solder plating layer 38 and the protection layer 35 are flush with each other or the solder plating layer 38 is made higher, so that the gap between the solder plating layer 38 and the land pattern 46 at the time of mounting is improved. Is less likely to occur, and the mounting quality can be further improved.

In Embodiment 1 of the present invention, the second
When the upper electrode layer 33, the protective layer 35, and the third upper electrode layer 36 are combined as shown in (Table 1), other characteristics can be improved.

[0052]

[Table 1]

In the first embodiment of the present invention, it can easily be considered that the mounting area can be further reduced by forming no side electrode.

(Embodiment 2) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 2 of the present invention will be described with reference to the drawings.

FIG. 6 is a sectional view of a resistor according to the second embodiment of the present invention. In the figure, reference numeral 51 denotes a substrate containing 96% alumina. Reference numeral 52 denotes a first upper surface electrode layer provided on a side portion and a part of a side surface of the main surface of the substrate, which is provided by gold-based sputtering.
The area of the upper electrode layer 52 is not more than half the area of the side surface of the substrate 51. Reference numeral 53 denotes a second upper electrode layer containing a silver-based conductive powder electrically connected to the first upper electrode layer 52 and glass. Reference numeral 54 denotes a resistance layer containing ruthenium oxide as a main component and electrically connected to the second upper electrode layer 53.
55 is a protective layer mainly composed of glass provided on the upper surface of the resistance layer 54. 56 is the first upper electrode layer 52,
The third upper electrode layer is made of a silver-based conductive powder provided on a part of the upper surface of the upper electrode layer 53 and containing glass.
Reference numerals 57 and 58 denote a nickel plating layer and a solder plating layer provided for ensuring reliability and the like at the time of soldering as necessary.

The method of manufacturing the resistor according to the second embodiment of the present invention configured as described above will be described below with reference to the drawings.

7 to 9 are process diagrams showing a method for manufacturing a resistor according to the second embodiment of the present invention.

First, as shown in FIG. 7 (a), the surface has a plurality of vertical and horizontal dividing grooves 59, 60 provided on the surface for dividing into strips and individual pieces in a later step. Then, gold is deposited on the entire upper surface of the sheet-like substrate 51 containing 96% alumina having excellent insulating properties by a sputtering method, and a desired electrode pattern is formed by a photolithography method generally used in LSIs and the like. Is formed, and heat treatment is performed at a temperature of about 300 to 400 ° C. in order to make the first upper electrode layer 52 a stable film. At this time, the first upper electrode layer 52 can enter the lateral dividing groove 60 and form the first upper electrode layer 52 to the depth of the dividing groove. The depth of the dividing grooves 59 and 60 with respect to the thickness of the substrate 51 is generally formed to be half or less of the thickness of the substrate 51 so as not to be broken during handling in a manufacturing process.

Next, as shown in FIG. 7 (b), an electrode paste containing silver-based conductive powder and glass is printed so as to be electrically connected to the first upper electrode layer 52, and the second paste is formed. Of the upper electrode layer 53 is formed. Next, the second upper electrode layer 53
Is fired at a temperature of about 850 ° C. to make a stable film.

Next, as shown in FIG. 7C, a resistance paste mainly containing ruthenium oxide is printed to form a resistance layer 54 so as to be electrically connected to the second upper electrode layer 53. . Next, firing is performed at a temperature of about 850 ° C. in order to make the resistance layer 54 a stable film.

Next, as shown in FIG.
In order to correct the resistance value of No. 4 to a predetermined value, trimming is performed by forming a trimming groove 61 with a YAG laser. At this time, the trimming probe for measuring the resistance value is set on the second upper electrode layer 53 to perform trimming.

Next, as shown in FIG. 8B, a protective layer 55 is formed by printing a paste containing glass as a main component to protect the resistance layer 54 whose resistance has been corrected. At this time, the plurality of resistance layers 54 arranged in the horizontal direction are divided into the vertical dividing grooves 5.
The print pattern of the protective layer 55 may be formed so as to continuously cover the step 9. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 55 a stable film.

Next, as shown in FIG. 8C, a silver-based material is formed over a part of the upper surfaces of the first upper electrode layer 52 and the second upper electrode layer 53 without straddling the lateral dividing groove 60. The third upper electrode layer 56 is formed by printing the electrode paste containing the conductive powder and glass. Next, the third upper electrode layer 5
Baking is performed at a temperature of about 600 ° C. to make 6 a stable film.

Next, as shown in FIG. 9A, a first upper electrode layer 52, a second upper electrode layer 53, a resistive layer 54, a trimming groove 61, a protective layer 55, and a third upper electrode layer The sheet 56 is divided along the horizontal dividing grooves 60 of the sheet-like substrate 51 having been formed, and divided into strip substrates 62. At this time, the first upper electrode layer 52 formed previously is formed on the side surface in the longitudinal direction of the strip substrate 62 to the depth of the horizontal dividing groove 60.

Finally, as shown in FIG. 9B, preparation for plating the exposed first upper electrode layer 52, second upper electrode layer 53, and third upper electrode layer 56 is performed. As a step, the strip substrate 62 is divided along the vertical dividing grooves 59 to be divided into individual substrates 63. In order to prevent the exposed first upper surface electrode layer 52, the second upper surface electrode layer 53, and the third upper surface electrode layer 56 from being eroded during soldering and to ensure reliability during soldering. A resistor is manufactured by forming a nickel plating layer (not shown) as an intermediate layer and a solder plating layer (not shown) as an outermost layer by electroplating.

The effect of soldering the resistor constructed and manufactured as described above in the second embodiment of the present invention to a mounting board is the same as that in the first embodiment, and will not be described. Omitted.

In Embodiment 2 of the present invention, the first
Upper electrode layer 52, second upper electrode layer 53, resistance layer 5
4. The protective layer 55 and the third upper electrode layer 56 are formed as shown in Table 2.
When the combination shown in (1) is adopted, other characteristics can be improved.

[0068]

[Table 2]

In the second embodiment of the present invention, it is easily considered that the mounting area can be further reduced by not forming the side electrode.

(Embodiment 3) Hereinafter, a resistor and a method of manufacturing the same according to Embodiment 3 of the present invention will be described with reference to the drawings.

FIG. 10 is a sectional view of a resistor according to the third embodiment of the present invention. In the figure, reference numeral 71 denotes a substrate containing 96% alumina. Reference numeral 72 denotes a first upper electrode layer provided on the side of the main surface of the substrate and made of silver-based conductive powder containing glass. Reference numeral 73 denotes a resistance layer mainly composed of ruthenium oxide and electrically connected to the first upper electrode layer 72. Reference numeral 74 denotes a protective layer mainly composed of glass provided on the upper surface of the resistance layer 73. 75 is the first upper electrode layer 7
A second upper surface electrode layer formed by using gold-based sputtering provided on a part of the upper surface and side surfaces of the substrate 2.
The area of the second upper electrode layer 75 on the side surface of the substrate 71 is not more than half the area of the side surface of the substrate 71. Reference numeral 76 denotes a third upper electrode layer made of a silver-based conductive powder that contains glass and partially overlaps the upper surfaces of the first upper electrode layer 72 and the second upper electrode layer 75. Reference numerals 77 and 78 denote a nickel plating layer and a solder plating layer provided as necessary to ensure reliability and the like at the time of soldering.

The method of manufacturing the resistor according to the third embodiment of the present invention configured as described above will be described below with reference to the drawings.

FIGS. 11 to 13 are process diagrams showing a method of manufacturing a resistor according to the third embodiment of the present invention.

First, as shown in FIG. 11 (a), a plurality of vertical and horizontal dividing grooves 79 and 80 provided on the surface for dividing into strips and individual pieces in a later step are provided. An electrode paste containing silver-based conductive powder and glass is printed without straddling the horizontal dividing groove 80 of the sheet-like substrate 71 containing 96% alumina having excellent insulating properties, and the first paste is printed. Of the upper electrode layer 72 is formed.

Next, as shown in FIG. 11B, a resistance paste containing ruthenium oxide as a main component is printed to form a resistance layer 73 so as to be electrically connected to the first upper electrode layer 72. . Next, baking is performed at a temperature of about 850 ° C. in order to make the resistance layer 73 a stable film.

Next, as shown in FIG. 11C, in order to correct the resistance value of the resistance layer 73 to a predetermined value, a trimming groove 81 is formed with a YAG laser to perform trimming. At this time, the trimming probe for measuring the resistance value is set on the first upper electrode layer 72 to perform trimming.

Next, as shown in FIG. 12A, a paste containing glass as a main component is printed to protect the resistance layer 73 whose resistance value has been corrected, and a protection layer 74 is formed. At this time, the plurality of resistance layers 73 arranged in the horizontal direction are divided into the vertical dividing grooves 7.
The printed pattern of the protective layer 74 may be formed so as to continuously cover step 9. Next, baking is performed at a temperature of about 600 ° C. in order to make the protective layer 74 a stable film.

Next, as shown in FIG.
A resist material made of a resin is applied to the entire upper surface of the substrate 2, and a hole of a desired film formation pattern of the second upper electrode layer 75 is formed in the resist material by a photolithography method. Further, gold is deposited on the entire upper surface of the substrate by a sputtering method, and the resist material in a portion other than a desired film formation pattern of the second upper surface electrode layer 75 is removed. By this method, the second upper electrode layer 7 is formed.
5 is formed. At this time, the second upper electrode layer 75 can enter the lateral dividing groove 80 and form the second upper electrode layer 75 to the depth of the dividing groove.

The depth of the dividing grooves 79 and 80 with respect to the thickness of the substrate 71 is generally formed to be less than half the thickness of the substrate 71 so as not to be broken during handling in the manufacturing process.

Next, as shown in FIG. 12C, a silver-based conductive powder and glass are overlapped so as to partially overlap the upper surfaces of the first upper electrode layer 72 and the second upper electrode layer 75. The contained electrode paste is printed to form a third upper electrode layer 76. Next, baking is performed at a temperature of about 850 ° C. in order to make the third upper electrode layer 76 a stable film.

Next, as shown in FIG. 13A, the first upper electrode layer 72, the second upper electrode layer 75, the third upper electrode layer 76, the resistance layer 73, the trimming groove 81, the protection layer The horizontal dividing groove 8 of the sheet-like substrate 71 on which 74 has been formed
It is divided along the zero and divided into strip substrates 82. At this time,
On the side surface in the longitudinal direction of the strip substrate 82, the second
Of the upper surface electrode layer 75 is formed up to the depth of the horizontal dividing groove 80.

Finally, as shown in FIG. 13B, the exposed first upper electrode layer 72 and second upper electrode layer 75 are exposed.
In addition, as a preparation step for plating the third upper surface electrode layer 76, the strip substrate 82 is divided along the vertical division grooves 79 and divided into individual substrates 83. In order to prevent the exposed first upper electrode layer 72, the second upper electrode layer 75, and the third upper electrode layer 76 from being eroded during soldering and to ensure reliability during soldering. A resistor is manufactured by forming a nickel plating layer (not shown) as an intermediate layer and a solder plating layer (not shown) as an outermost layer by electroplating.

The effect of soldering the resistor constructed and manufactured as described above in the third embodiment of the present invention to a mounting board is the same as that in the first embodiment, and will not be described. Omitted.

Further, in Embodiment 3 of the present invention, the first
Upper electrode layer 72, resistance layer 73, protective layer 74 and second
When the upper electrode layer 75 and the third upper electrode layer 76 are combined as shown in (Table 3), other characteristics can be improved.

[0085]

[Table 3]

It is easily conceivable that in the third embodiment of the present invention, the mounting area can be further reduced by not forming the side electrodes.

[0087]

As described above, according to the present invention, since the upper surface electrode and the side electrode provided on a part of the side surface of the upper surface of the substrate are soldered, the area for forming the soldered fillet is reduced. It is possible to provide a resistor capable of reducing the mounting area including a soldered portion on a mounting board and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a sectional view of a resistor according to a first embodiment of the present invention.

FIG. 2 is a process chart showing the manufacturing method.

FIG. 3 is a process chart showing the manufacturing method.

FIG. 4 is a process chart showing the manufacturing method.

5A is a cross-sectional view showing the same mounting state, and FIG. 5B is a top view showing the same mounting state.

FIG. 6 is a sectional view of the resistor according to the second embodiment of the present invention.

FIG. 7 is a process chart showing the manufacturing method.

FIG. 8 is a process chart showing the manufacturing method.

FIG. 9 is a process chart showing the manufacturing method.

FIG. 10 is a sectional view of a resistor according to a third embodiment of the present invention.

FIG. 11 is a process chart showing the manufacturing method.

FIG. 12 is a process chart showing the manufacturing method.

FIG. 13 is a process chart showing the same manufacturing method.

FIG. 14 is a sectional view of a conventional resistor.

FIG. 15 is a process chart showing the same manufacturing method.

FIG. 16A is a cross-sectional view showing the mounted state. FIG. 16B is a top view showing the mounted state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 31 Substrate 32 1st upper surface electrode layer 33 2nd upper surface electrode layer 34 Resistive layer 35 Protective layer 36 3rd upper surface electrode layer 37 Nickel plating layer 38 Solder plating layer

Claims (18)

[Claims] 1. A substrate, a pair of first upper electrode layers provided over a side and a part of a side surface of an upper surface of the substrate, and a pair of first upper electrode layers provided so as to be electrically connected to the first upper electrode layer. A pair of second upper electrode layers, a resistive layer provided to be electrically connected to the second upper electrode layer, and at least a portion of the upper surface of the second upper electrode layer. A third upper electrode layer, and a protective layer provided so as to cover at least an upper surface of the resistance layer. 2. A substrate, a pair of first upper electrode layers provided on an upper surface of the substrate, and a resistive layer provided to be electrically connected to the first upper electrode layer; A second upper electrode layer provided on the upper surface of the first upper electrode layer and a part of the side surface of the substrate, a protective layer provided so as to cover at least the resistive layer, and at least the first upper electrode A resistor comprising a third top electrode layer overlapping a portion of the layer. 3. The resistor according to claim 1, wherein the first or second upper electrode layer provided on the side surface of the substrate is provided on the resistance layer side in the height direction of the substrate. 4. The resistor according to claim 3, wherein the area of the first or second upper electrode layer on the side surface of the substrate is less than half the area of the side surface of the substrate. 5. The resistor according to claim 1, wherein the first, second, and third upper electrode layers are covered with a plating layer, and the plating layer and the protective layer are flush with each other or the plating layer is higher. . 6. The resistor according to claim 1, wherein the first upper electrode layer is formed by firing a gold-based organometallic compound or by gold-based sputtering. 7. The resistor according to claim 6, wherein the second upper electrode layer is made of silver or gold based conductive powder containing glass. 8. The resistor according to claim 6, wherein the protective layer is made of glass or resin. 9. The first upper electrode layer is formed by nickel-based sputtering, the second upper electrode layer is made of silver-based conductive powder containing resin, and the resistance layer is made of resin. The resistor according to claim 1, wherein: 10. The resistor according to claim 1, wherein the third upper electrode layer comprises silver-based conductive powder containing glass, or silver or nickel-based conductive powder containing resin. 11. The resistor according to claim 2, wherein the first upper electrode layer is made of silver or gold-based conductive powder containing glass. 12. The resistor according to claim 11, wherein the second upper electrode layer is formed by nickel-based or gold-based sputtering. 13. The resistor according to claim 11, wherein the protective layer is made of glass or resin. 14. The resistor according to claim 11, wherein the third upper electrode layer comprises a silver-based conductive powder containing glass, or a silver or nickel-based conductive powder containing resin. 15. The resistor according to claim 1, wherein the first upper electrode layer and the second upper electrode layer do not contact the longitudinal side of the substrate. 16. A first top electrode layer is provided by straddling a side portion of an upper surface of a sheet substrate having a division groove and an upper surface of the division groove and pouring an electrode paste into the division groove. A second upper electrode layer is provided so as to be electrically connected to the second upper electrode layer; a resistive layer is provided so as to electrically connect the second upper electrode layer; and a protective layer is provided so as to cover at least an upper surface of the resistive layer. A third upper surface electrode layer overlapping at least a part of the upper surface of the second upper surface electrode layer;
2. The resistor according to claim 1, wherein the sheet substrate is divided into strip-shaped substrates by dividing grooves of the sheet substrate formed with the third upper surface electrode layer, and the strip-shaped substrate is divided into individual pieces. Production method. 17. A first upper electrode layer is provided by sputtering over a side portion of an upper surface of a sheet substrate having a dividing groove and an upper surface of the dividing groove, and a first upper electrode layer is provided in the dividing groove by sputtering. A second upper electrode layer is provided so as to connect to the second upper electrode layer, a resistance layer is provided so as to electrically connect the second upper electrode layer, and a protection layer is provided so as to cover at least an upper surface of the resistance layer. A third upper surface electrode layer overlapping a part of the upper surface of the second upper surface electrode layer is provided, and the sheet substrate is formed into a strip-shaped substrate by a division groove of the sheet substrate formed with the third upper surface electrode layer. A method of manufacturing a resistor which is divided and the strip-shaped substrate is divided into individual pieces. 18. A first upper electrode layer is provided on a side portion of an upper surface of a sheet substrate having a dividing groove without straddling the upper surface of the dividing groove, and a resistance is provided so as to electrically connect the first upper electrode layers. A protective layer is provided so as to cover at least the upper surface of the resistive layer, is electrically connected to at least the first upper electrode layer, straddles the upper surface of the division groove of the sheet substrate, and is sputtered in the division groove. A sheet substrate provided with a second upper electrode layer, a third upper electrode layer provided so as to at least partially overlap the upper surface of the first upper electrode layer, and forming the third upper electrode layer; A method of manufacturing a resistor, wherein the sheet substrate is divided into strip-shaped substrates by the division grooves, and the strip-shaped substrate is divided into individual pieces.