KR100297282B1 - 열처리장치 및 열처리방법 - Google Patents

열처리장치 및 열처리방법 Download PDF

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Publication number
KR100297282B1
KR100297282B1 KR1019940019770A KR19940019770A KR100297282B1 KR 100297282 B1 KR100297282 B1 KR 100297282B1 KR 1019940019770 A KR1019940019770 A KR 1019940019770A KR 19940019770 A KR19940019770 A KR 19940019770A KR 100297282 B1 KR100297282 B1 KR 100297282B1
Authority
KR
South Korea
Prior art keywords
wafer
heat
heat treatment
treatment apparatus
process tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940019770A
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English (en)
Korean (ko)
Other versions
KR950006955A (ko
Inventor
오오카세와타루
Original Assignee
마쓰바 구니유키
도오교오에레구토론도오호쿠가부시끼가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21905093A external-priority patent/JP3241887B2/ja
Priority claimed from JP23101093A external-priority patent/JPH0766148A/ja
Priority claimed from JP23100993A external-priority patent/JPH0766147A/ja
Priority claimed from JP35139893A external-priority patent/JP3322472B2/ja
Application filed by 마쓰바 구니유키, 도오교오에레구토론도오호쿠가부시끼가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 마쓰바 구니유키
Publication of KR950006955A publication Critical patent/KR950006955A/ko
Application granted granted Critical
Publication of KR100297282B1 publication Critical patent/KR100297282B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/62—Heating elements specially adapted for furnaces
    • H05B3/66—Supports or mountings for heaters on or in the wall or roof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Furnace Details (AREA)
KR1019940019770A 1993-08-11 1994-08-11 열처리장치 및 열처리방법 Expired - Fee Related KR100297282B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP93-219050 1993-08-11
JP21905093A JP3241887B2 (ja) 1993-08-11 1993-08-11 熱処理装置
JP93-231010 1993-08-24
JP23101093A JPH0766148A (ja) 1993-08-24 1993-08-24 熱処理装置および熱処理方法
JP93-231009 1993-08-24
JP23100993A JPH0766147A (ja) 1993-08-24 1993-08-24 熱処理装置
JP35139893A JP3322472B2 (ja) 1993-12-28 1993-12-28 熱処理装置
JP93-351398 1993-12-28

Publications (2)

Publication Number Publication Date
KR950006955A KR950006955A (ko) 1995-03-21
KR100297282B1 true KR100297282B1 (ko) 2001-10-24

Family

ID=27529662

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940019770A Expired - Fee Related KR100297282B1 (ko) 1993-08-11 1994-08-11 열처리장치 및 열처리방법

Country Status (3)

Country Link
US (1) US5763856A (enExample)
KR (1) KR100297282B1 (enExample)
TW (1) TW303498B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5993591A (en) * 1996-12-18 1999-11-30 Texas Instruments Incorporated Coring of leadframes in carriers via radiant heat source
US6005225A (en) * 1997-03-28 1999-12-21 Silicon Valley Group, Inc. Thermal processing apparatus
JP3147048B2 (ja) * 1997-09-12 2001-03-19 日本電気株式会社 半導体装置
JPH1197446A (ja) * 1997-09-18 1999-04-09 Tokyo Electron Ltd 縦型熱処理装置
US6059567A (en) * 1998-02-10 2000-05-09 Silicon Valley Group, Inc. Semiconductor thermal processor with recirculating heater exhaust cooling system
US6064799A (en) * 1998-04-30 2000-05-16 Applied Materials, Inc. Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature
US6462310B1 (en) * 1998-08-12 2002-10-08 Asml Us, Inc Hot wall rapid thermal processor
US6300600B1 (en) * 1998-08-12 2001-10-09 Silicon Valley Group, Inc. Hot wall rapid thermal processor
US6900413B2 (en) 1998-08-12 2005-05-31 Aviza Technology, Inc. Hot wall rapid thermal processor
US6310328B1 (en) * 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
US6402848B1 (en) * 1999-04-23 2002-06-11 Tokyo Electron Limited Single-substrate-treating apparatus for semiconductor processing system
WO2001013054A1 (en) * 1999-08-12 2001-02-22 Asml Us, Inc. Hot wall rapid thermal processor
JP2001085346A (ja) * 1999-09-17 2001-03-30 Nec Kyushu Ltd 半導体装置の製造装置及び半導体装置の製造方法
JP3554297B2 (ja) * 2001-07-26 2004-08-18 株式会社エフティーエル 半導体基板熱処理装置及び半導体素子の製造方法
US20090078202A1 (en) * 2007-09-26 2009-03-26 Neocera, Llc Substrate heater for material deposition
US8388755B2 (en) * 2008-02-27 2013-03-05 Soitec Thermalization of gaseous precursors in CVD reactors
TW201200628A (en) * 2010-06-29 2012-01-01 Hon Hai Prec Ind Co Ltd Coating apparatus
CN102485935B (zh) * 2010-12-06 2013-11-13 北京北方微电子基地设备工艺研究中心有限责任公司 均热板及应用该均热板的基片处理设备
US9905443B2 (en) 2011-03-11 2018-02-27 Applied Materials, Inc. Reflective deposition rings and substrate processing chambers incorporating same
US8404048B2 (en) 2011-03-11 2013-03-26 Applied Materials, Inc. Off-angled heating of the underside of a substrate using a lamp assembly
US8987641B2 (en) * 2011-06-20 2015-03-24 Arsalan Emami High performance heater
JP5508487B2 (ja) * 2012-08-23 2014-05-28 株式会社リケン 管状ヒーターモジュール
US9373529B2 (en) * 2013-10-23 2016-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Process tool having third heating source and method of using the same
US11147129B2 (en) 2016-03-10 2021-10-12 Arsalan Emami Industrial heater
US11444053B2 (en) * 2020-02-25 2022-09-13 Yield Engineering Systems, Inc. Batch processing oven and method
US11688621B2 (en) 2020-12-10 2023-06-27 Yield Engineering Systems, Inc. Batch processing oven and operating methods

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158915A (ja) * 1982-03-16 1983-09-21 Fujitsu Ltd 薄膜生成装置
DE3855871T2 (de) * 1987-09-11 1997-10-16 Hitachi Ltd Vorrichtung zur Durchführung einer Wärmebehandlung an Halbleiterplättchen
US5259883A (en) * 1988-02-16 1993-11-09 Kabushiki Kaisha Toshiba Method of thermally processing semiconductor wafers and an apparatus therefor
US4857689A (en) * 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
US4981815A (en) * 1988-05-09 1991-01-01 Siemens Aktiengesellschaft Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors
KR0155545B1 (ko) * 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
US5156820A (en) * 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US5148714A (en) * 1990-10-24 1992-09-22 Ag Processing Technology, Inc. Rotary/linear actuator for closed chamber, and reaction chamber utilizing same
JP3138304B2 (ja) * 1991-10-28 2001-02-26 東京エレクトロン株式会社 熱処理装置
US5429498A (en) * 1991-12-13 1995-07-04 Tokyo Electron Sagami Kabushiki Kaisha Heat treatment method and apparatus thereof

Also Published As

Publication number Publication date
KR950006955A (ko) 1995-03-21
TW303498B (enExample) 1997-04-21
US5763856A (en) 1998-06-09

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