KR100282038B1 - 스퍼터 캐소드 - Google Patents
스퍼터 캐소드 Download PDFInfo
- Publication number
- KR100282038B1 KR100282038B1 KR1019980038821A KR19980038821A KR100282038B1 KR 100282038 B1 KR100282038 B1 KR 100282038B1 KR 1019980038821 A KR1019980038821 A KR 1019980038821A KR 19980038821 A KR19980038821 A KR 19980038821A KR 100282038 B1 KR100282038 B1 KR 100282038B1
- Authority
- KR
- South Korea
- Prior art keywords
- target
- yoke
- magnets
- face
- bath
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32504—Means for preventing sputtering of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/055—Arrangements for energy or mass analysis magnetic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (3)
- 하나 이상의 부분으로 형성된 평탄한 판형 타깃(8)과, 타깃(8)의 배후에 배치되고 중간 브리지(5)가 마련된 욕조형 요크(3)와, 타깃면의 전방에 만곡된 아치형 자계선(15, 15', …)으로 이루어진 폐쇄 터널을 생성하기 위한 자석(7, 7', …)과, 타깃(8)과 타깃(8)쪽을 향한 요크(3)의 욕조 에지부의 단부면(12)과의 사이의 평면에서 자기 전도성 재료로 이루어진 3개의 박판 재단물(9, 10, 11) 또는 부분 재단물 군을 구비하고, 2개의 박판 재단물(9, 11) 또는 부분 재단물 군은 욕조 에지부의 단부면(12) 및 중간 브리지(5)의 단부면(13)의 상부 구역을, 그리고 제 3 박판 재단물(10) 또는 제 3 부분 재단물 군은 중간 브리지(5)의 단부면(13)과 욕조 에지부의 단부면(12)과의 사이의 구역의 일부를 차폐하며, 모든 박판 재단물(9, 10, 11)은 함께 단부면(12, 13)을 따라 평행하게 연장되는 2개의 틈새(a, b)를 형성하고, 자석(7, 7', …)은 각각 요크의 바닥 속에 삽입되며, 타깃(8)쪽을 향한 자석(7, 7', …)의 측면 및 타깃(8)의 반대쪽을 향한 자석(7, 7', …)의 측면은 요크 바닥에 꼭 들어맞게 체결되는 것을 특징으로 하는 스퍼터 캐소드.
- 제1항에 있어서, 욕조형 요크(3)의 바닥부 속에 삽입된 자석(7, 7', …)은 판 또는 포일(20, 20', 21)에 의해 차폐되고, 판 또는 포일의 에지부는 요크(3)의 바닥면에 접착되거나 납땜되거나 용접되는 것을 특징으로 하는 스퍼터 캐소드.
- 제1항에 있어서, 요크(3)의 바닥부 속에 포함되거나 삽입된 자석(7, 7', …)에 추가하여 타깃(8)쪽을 향한 욕조형 요크(3)의 둘레 에지부의 단부면 상에 하나이상의 영구자석(18, 18', …)이 배치되고, 이 자석(18, 18', …)이 배치되는 둘레 에지부의 높이는 중간 브리지(5)의 높이와 일치하는 것을 특징으로 하는 스퍼터 캐소드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19747923A DE19747923C2 (de) | 1997-10-30 | 1997-10-30 | Sputterkathode |
DE19747923.5 | 1997-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990036656A KR19990036656A (ko) | 1999-05-25 |
KR100282038B1 true KR100282038B1 (ko) | 2001-03-02 |
Family
ID=7847086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980038821A KR100282038B1 (ko) | 1997-10-30 | 1998-09-19 | 스퍼터 캐소드 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6183612B1 (ko) |
EP (1) | EP0924744B1 (ko) |
JP (1) | JP4367987B2 (ko) |
KR (1) | KR100282038B1 (ko) |
DE (2) | DE19747923C2 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19750270A1 (de) * | 1997-11-13 | 1999-05-20 | Leybold Systems Gmbh | Sputterkathode |
DE19754986C2 (de) * | 1997-12-11 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
DE10234858A1 (de) * | 2002-07-31 | 2004-02-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Einrichtung zur Erzeugung einer Magnetron-Entladung |
US7247134B2 (en) * | 2002-11-12 | 2007-07-24 | Myocor, Inc. | Devices and methods for heart valve treatment |
KR101213849B1 (ko) * | 2005-12-16 | 2012-12-18 | 엘지디스플레이 주식회사 | 스퍼터링 장치 |
DE102007027372A1 (de) * | 2007-06-11 | 2008-12-18 | Cognis Oleochemicals Gmbh | Verfahren zur Hydrierung von Glycerin |
DE102011081441B4 (de) | 2011-08-23 | 2018-12-06 | Fhr Anlagenbau Gmbh | Vorrichtung zum Sputtern von Substraten |
CN112342511B (zh) * | 2020-09-25 | 2023-02-28 | 杭州比凡科电子科技有限公司 | 平面磁控溅射源 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4198283A (en) * | 1978-11-06 | 1980-04-15 | Materials Research Corporation | Magnetron sputtering target and cathode assembly |
DE3429988A1 (de) * | 1983-12-05 | 1985-06-13 | Leybold-Heraeus GmbH, 5000 Köln | Magnetronkatode zum zerstaeuben ferromagnetischer targets |
JPS61183467A (ja) * | 1985-02-08 | 1986-08-16 | Hitachi Ltd | スパッタリング方法及びその装置 |
DE3727901A1 (de) * | 1987-08-21 | 1989-03-02 | Leybold Ag | Zerstaeubungskathode nach dem magnetronprinzip |
DE3738845A1 (de) * | 1987-11-16 | 1989-05-24 | Leybold Ag | Zerstaeubungskatode nach dem magnetronprinzip |
JPH01147063A (ja) * | 1987-12-03 | 1989-06-08 | Ulvac Corp | マグネトロン・スパッタ装置 |
JP2625789B2 (ja) * | 1987-12-21 | 1997-07-02 | 松下電器産業株式会社 | マグネトロンスパッタカソード |
US4865708A (en) * | 1988-11-14 | 1989-09-12 | Vac-Tec Systems, Inc. | Magnetron sputtering cathode |
DE3929695C2 (de) * | 1989-09-07 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
BE1003701A3 (fr) * | 1990-06-08 | 1992-05-26 | Saint Roch Glaceries | Cathode rotative. |
DE4038577A1 (de) * | 1990-08-09 | 1992-06-11 | Leybold Ag | Verfahren und vorrichtung zum reaktiven beschichten eines substrats |
DE4109018C2 (de) * | 1991-03-20 | 2002-02-28 | Unaxis Deutschland Holding | Vorrichtung zum Beschichten eines Substrats |
DE4201551C2 (de) * | 1992-01-22 | 1996-04-25 | Leybold Ag | Zerstäubungskathode |
DE4237517A1 (de) * | 1992-11-06 | 1994-05-11 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten |
EP0724652B1 (en) * | 1993-10-22 | 2003-10-01 | Manley, Kelly | Method and apparatus for sputtering magnetic target materials |
US5415754A (en) * | 1993-10-22 | 1995-05-16 | Sierra Applied Sciences, Inc. | Method and apparatus for sputtering magnetic target materials |
DE19614487A1 (de) * | 1996-04-12 | 1997-10-16 | Leybold Ag | Sputterkathode |
US5863399A (en) * | 1996-04-13 | 1999-01-26 | Singulus Technologies Gmbh | Device for cathode sputtering |
DE19617057C2 (de) * | 1996-04-29 | 1998-07-23 | Ardenne Anlagentech Gmbh | Sputteranlage mit zwei längserstreckten Magnetrons |
DE19622606C2 (de) * | 1996-06-05 | 2002-02-28 | Applied Films Gmbh & Co Kg | Sputterkathode |
DE19622605A1 (de) * | 1996-06-05 | 1997-12-11 | Leybold Systems Gmbh | Sputterkathode |
DE19622607B4 (de) * | 1996-06-05 | 2007-12-27 | Oerlikon Deutschland Holding Gmbh | Sputterkathode |
US5876576A (en) * | 1997-10-27 | 1999-03-02 | Applied Materials, Inc. | Apparatus for sputtering magnetic target materials |
-
1997
- 1997-10-30 DE DE19747923A patent/DE19747923C2/de not_active Expired - Lifetime
-
1998
- 1998-08-19 EP EP98115594A patent/EP0924744B1/de not_active Expired - Lifetime
- 1998-08-19 DE DE59809710T patent/DE59809710D1/de not_active Expired - Lifetime
- 1998-09-19 KR KR1019980038821A patent/KR100282038B1/ko not_active IP Right Cessation
- 1998-10-27 US US09/179,398 patent/US6183612B1/en not_active Expired - Lifetime
- 1998-10-29 JP JP30856398A patent/JP4367987B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6183612B1 (en) | 2001-02-06 |
DE19747923C2 (de) | 2002-09-12 |
DE59809710D1 (de) | 2003-10-30 |
KR19990036656A (ko) | 1999-05-25 |
EP0924744A1 (de) | 1999-06-23 |
JP4367987B2 (ja) | 2009-11-18 |
DE19747923A1 (de) | 1999-05-06 |
EP0924744B1 (de) | 2003-09-24 |
JPH11213939A (ja) | 1999-08-06 |
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