KR100274308B1 - 멀티 챔버 처리시스템 - Google Patents

멀티 챔버 처리시스템 Download PDF

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Publication number
KR100274308B1
KR100274308B1 KR1019950012843A KR19950012843A KR100274308B1 KR 100274308 B1 KR100274308 B1 KR 100274308B1 KR 1019950012843 A KR1019950012843 A KR 1019950012843A KR 19950012843 A KR19950012843 A KR 19950012843A KR 100274308 B1 KR100274308 B1 KR 100274308B1
Authority
KR
South Korea
Prior art keywords
chamber
load lock
arm
chambers
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950012843A
Other languages
English (en)
Korean (ko)
Other versions
KR950034486A (ko
Inventor
데루오 아사카와
히로아키 사에키
Original Assignee
히가시 데쓰로
동경엘렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14848594A external-priority patent/JP3486462B2/ja
Application filed by 히가시 데쓰로, 동경엘렉트론주식회사 filed Critical 히가시 데쓰로
Publication of KR950034486A publication Critical patent/KR950034486A/ko
Application granted granted Critical
Publication of KR100274308B1 publication Critical patent/KR100274308B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019950012843A 1994-05-23 1995-05-23 멀티 챔버 처리시스템 Expired - Fee Related KR100274308B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP94-108483 1994-05-23
JP10848394 1994-05-23
JP14848594A JP3486462B2 (ja) 1994-06-07 1994-06-07 減圧・常圧処理装置
JP94-148485 1994-06-07

Publications (2)

Publication Number Publication Date
KR950034486A KR950034486A (ko) 1995-12-28
KR100274308B1 true KR100274308B1 (ko) 2001-01-15

Family

ID=51397711

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950012843A Expired - Fee Related KR100274308B1 (ko) 1994-05-23 1995-05-23 멀티 챔버 처리시스템

Country Status (2)

Country Link
KR (1) KR100274308B1 (https=)
TW (1) TW282559B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100831906B1 (ko) * 2000-11-24 2008-05-26 가부시키가이샤 알박 온도 제어실 및 그 온도 제어실을 이용한 진공 처리 장치
KR101118914B1 (ko) * 2004-03-08 2012-02-27 주성엔지니어링(주) 진공펌핑 시스템 및 방법과 이를 이용하는 공정장치
KR20150024794A (ko) * 2013-08-27 2015-03-09 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 시스템 및 기억 매체
KR20180037279A (ko) * 2015-09-03 2018-04-11 카와사키 주코교 카부시키 카이샤 기판 이송 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110616406A (zh) * 2018-11-29 2019-12-27 爱发科豪威光电薄膜科技(深圳)有限公司 磁控溅射镀膜机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JPH07335711A (ja) * 1994-06-07 1995-12-22 Tokyo Electron Ltd 減圧・常圧処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186718A (en) * 1989-05-19 1993-02-16 Applied Materials, Inc. Staged-vacuum wafer processing system and method
JPH07335711A (ja) * 1994-06-07 1995-12-22 Tokyo Electron Ltd 減圧・常圧処理装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100831906B1 (ko) * 2000-11-24 2008-05-26 가부시키가이샤 알박 온도 제어실 및 그 온도 제어실을 이용한 진공 처리 장치
KR101118914B1 (ko) * 2004-03-08 2012-02-27 주성엔지니어링(주) 진공펌핑 시스템 및 방법과 이를 이용하는 공정장치
KR20150024794A (ko) * 2013-08-27 2015-03-09 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 시스템 및 기억 매체
KR102265232B1 (ko) 2013-08-27 2021-06-15 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 시스템 및 기억 매체
KR20180037279A (ko) * 2015-09-03 2018-04-11 카와사키 주코교 카부시키 카이샤 기판 이송 장치
KR102092868B1 (ko) * 2015-09-03 2020-03-25 카와사키 주코교 카부시키 카이샤 기판 이송 장치

Also Published As

Publication number Publication date
TW282559B (https=) 1996-08-01
KR950034486A (ko) 1995-12-28

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