KR100273784B1 - Shadow mask and method of manufacturing the same - Google Patents

Abstract

The present invention is a method for producing a shadow mask having good shape, linearity, and dimensional accuracy of an etching hole when the electrode base material has a thickness of about 20 to 80 μm. In the present invention, a resist is coated on both sides of a substrate and one side thereof. The electrode pattern is exposed only to the resist of the resist, the resist on the side where the electrode pattern is printed is developed and patterned, and the resist on the opposite side that does not expose the electrode pattern is left on the entire surface. Cover the substrate with a reinforcement resin layer that protects the planarity of the substrate and remove the instability of the substrate by the spray pressure during etching, and etching only one side of the substrate on the side of the patterned resist to form the etching hole. By obtaining a shadow mask having good linearity and dimensional accuracy, an etching hole having a dimension larger than that of the electrode base material can be formed. Method is also shown.

Description

Shadow mask and method of manufacturing the same

1 is a view for explaining the manufacturing process of one embodiment of the manufacturing method of the present invention shadow mask 1-3.

2 is a view for explaining the manufacturing process of the embodiment of the manufacturing method 4 of the present invention shadow mask.

3 is a view for explaining a manufacturing process by a one-step etching method on the conventional both sides.

4 is a view for explaining a manufacturing process by a two-step etching method in the conventional both sides.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a shadow mask for color CRT, and more particularly, to a shadow mask having a sheet thickness of about 20 to 80 µm and a method for producing the shadow mask.

In recent years, with the increase in the size of CRT display devices such as color televisions, the size of shadow masks has also been required. In order to reduce the shadow mask itself, a thin sheet having a thickness of about 20 to 80 µm is also used.

By the way, in the conventional manufacturing method of the shadow mask using the base material of 130-150 micrometers in thickness, as shown in FIG. 2) is applied (b) and exposed on both sides of the resist (2) using a glass mask (3), (c), the resist (2) is developed and patterned, dried and used as an etching film (d Then, a method is prepared by etching at both sides of the substrate 1 at the same time to form an opening (e) and then removing the resist 2 (f) by one-step etching. When applied to thin plate materials with a thickness of 20-80㎛, ), Flatness is not maintained and the shape and dimensional accuracy of the finished etching hole are poor.

In addition, as shown in FIG. 4, the electrode substrate 1 is cleaned (a), and then the resist 2 is applied to both surfaces of the substrate 1, (b) and the glass mask is applied to the resist 2 on both sides. After exposure using (3) (c), the resist 2 is then developed, patterned and dried to form an etching film (d), and only one side of the substrate 1 is etched to open a hole (e) (F) and (h) a two-step etching to remove the resist (2) by filling the packing material (4) which is etch-resistant into the hole, and etching again from the opposite side to the hole (g). Although a method is known, a predetermined cross-sectional shape cannot be obtained when the method is applied to a thin plate substrate having a thickness of about 20 to 80 µm. The latter is described in detail in Japanese Patent Laid-Open No. 61-130492.

As described above, in the case where the thickness of the substrate is reduced to about 20 to 80 µm, an etching hole having a width of 60 to 250 µm is formed so that the plate thickness is relatively thin so that the conventional two-step etching method shown in FIG. It is not possible to form a predetermined cross-sectional shape. In other words, the etching holes are penetrated before obtaining the desired cross-sectional shape. In addition, in the one-step etching method on both surfaces of the substrate shown in FIG. 3, the substrate is too thin and the strength thereof is insufficient, and the planarity is not maintained during etching. Never satisfactory.

The present invention has been invented in view of such a situation, and an object thereof is to provide a shadow mask having good shape, linearity and dimensional accuracy of an etching hole when the thickness of the electrode base material is about 20 to 80 m.

Another object of the present invention is to form an etching hole having a dimension larger than the thickness of the electrode base by controlling the cross-sectional shape and maintaining good linearity and dimensional accuracy when the thickness of the electrode base is about 20-80 μm. To provide a shadow mask.

In order to achieve the above object, the present invention provides a method for producing a shadow mask as shown in FIG. 1 (a) using an electrode substrate 1 having a plate thickness of 20 to 80 µm as shown in FIG. )). Next, as shown in FIG. 1 (b), the resists 21 and 22 are applied to both surfaces of the substrate 1. And as shown in FIG. 1 (c), the glass mask 31 with an electrode pattern is used only for the resist 21 of one side, and the glass mask 32 without an electrode pattern is provided for the resist 22 of the other side. After exposure using light source, the resists 21 and 22 are developed, patterned and dried as shown in FIG. 1 (d) to form an etching film. At this time, the opposite resist 22 which does not expose the electrode pattern remains on the entire surface. Thereafter, as shown in FIG. 1 (e), the resin layer 5 has resistance to corrosion, can resist the spray pressure during etching, and has a reinforcement enough to maintain the planarity of the substrate 1. The instability of the base material 1 by the spray pressure at the time of etching is removed by covering the resist 22 of the side which does not expose an electrode pattern. As shown in FIG. 1 (f), only one side of the substrate 1 is etched on the patterned resist 21 side to corrode the substrate 1. After a predetermined amount of etching, as shown in FIG. 1 (g), the reinforcing resin layer 5 and the resists 21 and 22 are peeled off to satisfy quality in terms of the shape, linearity and dimensional accuracy of the etching holes. Get a shadow mask.

In FIG. 1 (e), the reinforcement resin layer 5 may be covered with a resistive film using a resin having no reinforcement but having reinforcement. In addition, instead of covering the resist 22 of the side which does not expose an electrode pattern with the reinforcement resin layer 5, you may cover with the adhesive film which is etch-resistant and reinforcement.

Although the resin layer 5 should just have the said characteristic, it is preferable that it is alkali-soluble, and ultraviolet curing type, such as solvent-soluble resins, such as a nitrocellulose type | system | group and a novolak type | system | group, oligoester acrylate type | system | group, And hot melt resins such as resins and rosin-polyesters.

And as said etch-resistant film or the adhesive film which is etch-resistant and reinforcement, acid-resistant adhesive films, such as polyester type and polyethylene-polypropylene type, are mentioned, for example. In this case, in consideration of the easy peeling as the pressure-sensitive adhesive, it is preferable to use one in which the adhesive force is lowered by heat curing treatment, heat foaming treatment or ultraviolet irradiation treatment.

That is, according to the first manufacturing method of the shadow mask of the present invention, in the manufacturing method of the shadow mask having a plate thickness of 20 to 80 µm, only the resist layer on one side of the electrode substrate coated with the resist layer on both surfaces is patterned, and the other side. The resist layer applied to the substrate is covered with a resin layer having a resistance to corrosion and reinforcement, and only one side of the resist layer is patterned to be etched to corrode the substrate.

The second manufacturing method is a method of manufacturing a shadow mask having a sheet thickness of 20 to 80 µm, in which only the resist layer on one side of the electrode substrate having the resist layer applied on both sides is patterned, and not coated on the other side. The resist layer is covered with a reinforcing resin layer, the resin layer is covered with a etch-resistant adhesive film, and only one side of the patterned resist layer is etched to corrode the substrate.

The third manufacturing method is a method for manufacturing a shadow mask having a plate thickness of 20 to 80 µm, in which only the resist layer on one side of the electrode base material on which the resist layer is applied is patterned on both sides, and is coated and patterned on the other side. The resist layer is covered with a etch-resistant and reinforcing adhesive film, and only one side of the patterned resist layer is etched to corrode the substrate.

In the above production method, the resin layer is preferably made of alkali-soluble resin, and preferably made of a solvent-soluble resin, an ultraviolet curable resin, a hot melt resin, or the like.

In addition, the adhesive film is preferably made of an acid-resistant adhesive film. In this case, it is preferable to use the adhesive whose adhesive force falls by a thermosetting process, a heat-foaming process, or an ultraviolet irradiation process.

In the fourth manufacturing method of the present invention, which is a variation of the manufacturing method described above, a through hole having a size larger than the plate thickness (3 to 5 times the plate thickness) is formed in a steel sheet having a sheet thickness of 20 to 80 µm. In the method of manufacturing a shadow mask formed by etching, a resist layer is applied to both front and back surfaces of a steel sheet, and a pattern of a relatively large opening corresponding to the shape of a hole to be formed in the resist layer of the coated surface is patterned. At least one opening of a relatively small size, which becomes two in at least one cross section corresponding to the edge shape of the hole to be formed in the resist layer on the coated back surface, is patterned with respect to one hole to be formed, After forming a hole by etching through the resist layer to a depth that does not penetrate the steel sheet at the rear surface, the hole is filled with a etch-resistant packing material, and then the steel sheet on the surface through the resist layer on the surface. By forming a hole by etching a hole in communication with (連通) formed on the back surface is a way as to form a through hole.

In this case, the depth of the hole to be etched from the rear surface is preferably set to 50 to 60% of the steel sheet thickness.

The present invention includes a shadow mask produced by the above manufacturing methods.

Hereinafter, the operation of the present invention will be described. In the first to third manufacturing methods of the present invention, by etching only one side of the patterned resist side, the substrate having the same plate thickness is etched in one step on both sides thereof. It is excellent in the shape of an etching hole and a linearity. Since the etching is performed on one side, the difference between the width of the resist pattern and the width of the through hole of the finished product (hereinafter referred to as the etching band) becomes larger than the etching on both sides, so that the etching time is relatively long. It is considered that the unevenness is flattened to improve the linearity. That is, it is because an etching stand is enlarged compared with the etching on both surfaces.

In addition, since the insulator of the substrate is prevented by the spray pressure during etching, the coating layer is covered with a layer having a reinforcing force that can resist the spray pressure during etching and maintains the flatness of the substrate.

On the other hand, a method of forming an etching hole on the resist pattern side by attaching a reinforcing supporter directly to the surface without applying a resist layer on the other side can be considered, but in this case, there is no resist layer on the other side. It is not preferable because the edge shape of the through hole is worse and the shape, linearity, and dimensional accuracy of the etching hole are poor. In this case, the reinforcing support is subjected to heat treatment through resist coating, patterning, and baking, so that thermal expansion and thermal contraction occur to cause deformation of the shadow mask. A force is applied at the time of peeling and deformation of a shadow mask similarly occurs. The deformation of the shadow mask is manifested by the warping and skewing of the product, which leads to good dimensional accuracy and difficulty in producing a constant product.

On the other hand, in the first to third manufacturing methods of the present invention, a resistive and reinforcing resin layer, a reinforcing resin layer covered with a resistive adhesive film, or an etching resistance through a resist layer Since the adhesive and reinforcing adhesive film is covered on one side of the electrode base material, the edge shape of the through hole on the other side is good, and the etching hole has excellent shape, linearity and dimensional accuracy. In the case of the resin layer, the resist layer is removed at the same time as the resist layer is removed, so that heating and peeling force are not applied to the substrate. In the case of the adhesive film, the substrate is peeled off after the heat curing treatment, the heat foaming treatment, or the ultraviolet irradiation treatment, so that almost no force is applied to the substrate. As a result, no deformation of the shadow mask occurs during peeling, and there is no warpage or skew of the product, so that the dimensional accuracy is good and the production of a constant product is possible.

In the fourth manufacturing method of the present invention, in the conventional two-stage etching method, at least one cross section corresponding to the edge shape of the hole to be formed in the resist layer applied to the back surface of the steel sheet having a plate thickness of 20 to 80 µm is used. At least one opening of two relatively small sizes is patterned with respect to one hole to be formed, and in the first stage etching, the hole is etched to a depth that does not penetrate the steel sheet through the resist layer on the back side. As a result, a larger through hole can be formed while controlling the cross-sectional shape as compared with the plate thickness of the thin steel sheet. And the diameter of an etching hole can be adjusted by adjusting the space | interval between openings. Further, the etching time can be formed at almost the same time for both large and small holes without depending on the diameter of the holes to be installed.

The shape and dimensional accuracy of the etching holes can be about the same as in the case of the conventional two-stage etching method even for thin steel sheets having a sheet thickness of 20 to 80 µm.

Also in this case, since the etch-resistant packing material is filled through the resist layer, the packing material can be removed at the same time when the resist layer is removed with the resist removal liquid, so that no heating or peeling force is applied. Therefore, the deformation of the shadow mask does not occur, and the dimensional accuracy without warping or skewing of the product is also good, and it is possible to manufacture a constant product.

Hereinafter, the Example of the manufacturing method of the shadow mask of this invention is described.

Example 1

A thin carbon plate made of LC (Low Carbon) is 60 µm thick and is coated with casein resist on both sides of the substrate using a 14-inch sized substrate. On the surface of the resist, hot-melt rosin-polyester-based resin was applied to a thickness of 200-500 μm. Ferric chloride was used as an etching solution to corrode by the spray method to form slit holes. After etching, the resultant was washed with water, the resist and the resin were peeled off with an alkaline solution, washed, and dried to measure the slit width and the slit linearity. The result is shown in the following table compared with the case by the conventional one-step etching method.

As can be clearly seen from the above table, it was obtained that the dimensional accuracy and the linearity were about two times better than the one-step etching method on both surfaces of the conventional substrate.

Where dimension precision ( ) Is expressed by the light transmittance of the slit of a predetermined limited area (multiple), and is a standard deviation value for 100 sheets. R _z, R _max represents the linearity of the standard JIS (B0601 - 1982) is one to destroy the electrode plate to be defined by measuring the roughness (粗度) of the section.

Moreover, the etching stand of the resist pattern was 30 micrometers, and it was larger than the etching stand in the conventional one-step etching method on both surfaces. Rosin-polyester-based resin was used as the reinforcing resin. However, the resin layer is alkali-soluble and resistant to etching, resists the spray pressure during etching, and maintains the planarity of the substrate. It is preferable that it is easy to form. The rosin-polyester-based resin used herein was applied and formed on the resist in the dissolved state by being dissolved at about 120 ° C. The rosin-polyester resin is solidified in the etching treatment temperature range from normal temperature after application and drying, and has sufficient reinforcement, good etching resistance and alkali solubility.

In the above embodiment, the etching solution temperature was 60 ° C. and the etching liquid specific gravity was 46 Bowme. However, the same effect was obtained even in the range of the liquid temperature of 50 to 75 ° C. and the liquid specific gravity of 45 to 49 Bowme.

Example 2

An embodiment of the fourth manufacturing method of the present invention will be described with reference to FIG.

The base material 1 is cleaned as shown in FIG. 2 (a) using the electrode base material 1 of LC (Low Carbon) material of 20-80 micrometers of plate | board thicknesses, for example. Then, as shown in FIG. 2 (b), the resists 21 and 22 are applied to both surfaces of the substrate 1. As shown in FIG. 2 (c), the electrode patterns are exposed to the resists 21 and 22 on both sides using the glass masks 31 and 32. FIG. At this time, the surface pattern plate 31 has one light shielding portion 311 for each hole having a size corresponding to the diameter of the concave hole to be etched on the surface of the substrate 1 as in the conventional two-step etching method. Although the back surface pattern plate 32 has a cross section, two light shielding portions 321 and 322 having small dimensions are provided at a portion corresponding to the edge of a hole opened on the back surface of the substrate 1. Therefore, when the hole opened in the base material 1 is a circular hole, the light shielding portions 321 and 322 provided in the back pattern plate 32 have a ring shape corresponding to the shape around the circular hole in plan view. And the light shielding portions 321 and 322 in the case where the hole opened in the base material 1 is a slot or a slit hole are located parallel to the positions corresponding to both ends of the slot to the slit hole. Thin lines.

After exposing and printing the surface pattern plate 31 and the back pattern plate 32, the resists 21 and 22 are developed, patterned, and dried. As shown in FIG. An opening 211 corresponding to the light blocking portion 311 of the pattern plate 31 is formed, and the openings 221 corresponding to the light blocking portions 321 and 322 of the back pattern plate 32 are formed in the resist 22 on the back surface. 222 is formed.

Thereafter, first, as shown in FIG. 1 (e), using only the back surface resist 22 as an etching film, only the back surface side of the base material 1 is etched, that is, the shape corresponding to the portions corresponding to the openings 221 and 222, namely, If the hole to be opened in the base material 1 is a circular hole, a concave hole of a ring groove shape, and if the hole to be opened in the base material 1 is a slot to a slit hole, the holes are located parallel to the positions corresponding to both ends of the slot to the slit hole. Two concave holes are formed. In order to maintain the dimensional accuracy and cross-sectional shape of the through hole by etching at a practical level, the depth of the concave hole on the back surface is preferably about 50 to 60% of the thickness of the substrate 1.

Thereafter, as shown in FIG. 1 (f), the hole is filled with a etch-resistant packing material 4 and etched again through the opening 211 of the resist 21 on the surface opposite to the hole. A concave hole is formed as shown in Fig. 1 (g) to form a through hole of a desired shape.

Finally, as shown in FIG. 1 (h), the packing material 4 and the resists 21 and 22 are peeled off, and a large hole is formed in terms of cross-sectional shape, linearity, and dimensional accuracy compared to the thickness of the base material 1. It is possible to obtain a shadow mask that can be satisfactorily achieved.

On the other hand, the diameter of the etching hole can be adjusted by adjusting the gap between the openings (221, 222). As apparent from the opening of the hole, the etching time can be formed at about the same time for both large and small holes without depending on the diameter of the hole to be installed.

In addition, one or more separate openings may be provided between the openings 221 and 222 so as not to cause etching residues in the etching holes, particularly when forming slots or slits.

As described above, according to the method for producing a shadow mask of the present invention, a shadow mask having a good shape, linearity, and index accuracy of an etching hole can be manufactured from a thin substrate having a thickness of 20 to 80 µm. In addition, a large through hole can be formed in a thin steel sheet having a thickness of 20 to 80 µm in a short time while being an etching hole having good shape, linearity, and dimensional accuracy, compared with the plate thickness of the steel sheet.

Claims (15)

In the method of manufacturing a shadow mask having a sheet thickness of 20 to 80 µm, only a resist layer on one side of an electrode substrate having a resist layer coated on both surfaces is patterned, and a resist layer applied on the other side and not patterned is etched. And covering only one surface of the resist layer patterned with a reinforcing resin layer to corrode the substrate to produce a shadow mask. In the method for producing a shadow mask having a sheet thickness of 20 to 80 µm, only the resist layer on one side of the electrode substrate having the resist layer applied on both sides is patterned, and the resist layer applied on the other side and not patterned is reinforced. A method for producing a shadow mask, wherein the resin layer is covered with a resin layer, the resin layer is covered with a pressure-sensitive adhesive film, and only one side of the resist layer is patterned is etched to corrode the substrate. In the method of manufacturing a shadow mask having a sheet thickness of 20 to 80 µm, only a resist layer on one side of an electrode substrate having a resist layer coated on both surfaces is patterned, and a resist layer applied on the other side and not patterned is etched. And covering only one side of the resist layer patterned with a reinforcing adhesive film, and causing the substrate to corrode through the substrate. The shadow mask manufacturing method according to claim 1 or 2, wherein the resin layer is made of an alkali-soluble resin. The method of manufacturing a shadow mask according to claim 1 or 2, wherein the resin layer is a solvent-soluble resin. The shadow mask manufacturing method according to claim 1 or 2, wherein the resin layer is made of an ultraviolet curable resin. The shadow mask manufacturing method according to claim 1 or 2, wherein the resin layer is made of a hot melt resin. The method of manufacturing a shadow mask according to claim 2 or 3, wherein the adhesive film is an acid resistant adhesive film. The method of manufacturing a shadow mask according to claim 2 or 3, wherein the adhesive force is lowered by heat curing treatment, heat foaming treatment or ultraviolet irradiation treatment as an adhesive film adhesive. The method for producing a shadow mask according to any one of claims 1 to 9, wherein the shadow mask is a slit shadow mask. The shadow mask manufactured by the manufacturing method of any one of Claims 1-9. In the method of manufacturing a shadow mask, which is formed by etching through-holes having dimensions larger than the plate thickness on a steel sheet having a sheet thickness of 20 to 80 µm, a resist layer is applied to both front and back surfaces of the steel sheet and formed on the coated surface resist layer. A relatively large sized opening corresponding to the shape of the hole to be patterned is formed, and a relatively small sized opening which becomes two in at least one cross section corresponding to the edge shape of the hole to be formed in the resist layer on the applied back surface can be formed. One or more holes are patterned for one hole, and the hole is formed by etching through the resist layer on the back to a depth that does not penetrate the steel sheet on the back, and then filling the hole with a etch-resistant packing material, and then applying the resist on the surface. Through-holes are formed by etching the steel plate from the surface through the layers to form holes communicating with the holes formed on the back surface. Method of manufacturing a shadow mask for a. The method of manufacturing a shadow mask according to claim 12, wherein the through hole to be formed has a dimension of 3 to 5 times the sheet thickness of the steel sheet, and the depth of the hole to be etched from the back surface is 50 to 60% of the sheet thickness of the steel sheet. . A resist layer is applied to both front and back surfaces of a steel plate having a plate thickness of 20 to 80 µm, and a pattern of relatively large openings corresponding to the shape of holes to be formed in the applied surface resist layer is patterned, and formed in the resist layer on the applied back surface. At least one opening of a relatively small size, which is two in at least one cross section corresponding to the edge shape of the hole to be patterned, is patterned for at least one hole to be formed, and does not penetrate the steel sheet from the back side through the resist layer on the back side. After etching to a depth to form a hole, the hole is filled with a etch-resistant packing material, and then, through a resist layer on the surface, the steel sheet is etched from the surface to form a through hole communicating with the hole formed on the back surface. Shadow mask characterized in that. 15. The shadow mask according to claim 14, wherein the through hole to be formed has a dimension of 3 to 5 times the sheet thickness of the steel sheet, and the depth of the hole to be etched from the back surface is 50 to 60% of the sheet thickness of the steel sheet.