KR100260118B1 - 기판의 검출장치 및 방법 - Google Patents

기판의 검출장치 및 방법 Download PDF

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Publication number
KR100260118B1
KR100260118B1 KR1019930021776A KR930021776A KR100260118B1 KR 100260118 B1 KR100260118 B1 KR 100260118B1 KR 1019930021776 A KR1019930021776 A KR 1019930021776A KR 930021776 A KR930021776 A KR 930021776A KR 100260118 B1 KR100260118 B1 KR 100260118B1
Authority
KR
South Korea
Prior art keywords
light receiving
light emitting
light
optical sensors
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930021776A
Other languages
English (en)
Korean (ko)
Other versions
KR940010257A (ko
Inventor
쇼오리 모쿠오
Original Assignee
다카시마 히로시
도오교오 에레구토론 큐우슈우 가부시키가이샤
히가시 데쓰로
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다카시마 히로시, 도오교오 에레구토론 큐우슈우 가부시키가이샤, 히가시 데쓰로, 동경 엘렉트론 주식회사 filed Critical 다카시마 히로시
Publication of KR940010257A publication Critical patent/KR940010257A/ko
Application granted granted Critical
Publication of KR100260118B1 publication Critical patent/KR100260118B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P74/00—
    • H10P72/0416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1019930021776A 1992-10-20 1993-10-20 기판의 검출장치 및 방법 Expired - Fee Related KR100260118B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-307750 1992-10-20
JP30775092A JP3131750B2 (ja) 1992-10-20 1992-10-20 被処理体検出装置及び方法

Publications (2)

Publication Number Publication Date
KR940010257A KR940010257A (ko) 1994-05-24
KR100260118B1 true KR100260118B1 (ko) 2000-07-01

Family

ID=17972823

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930021776A Expired - Fee Related KR100260118B1 (ko) 1992-10-20 1993-10-20 기판의 검출장치 및 방법

Country Status (4)

Country Link
US (1) US5406092A (cg-RX-API-DMAC10.html)
JP (1) JP3131750B2 (cg-RX-API-DMAC10.html)
KR (1) KR100260118B1 (cg-RX-API-DMAC10.html)
TW (1) TW235376B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854978B1 (ko) 2005-04-01 2008-08-28 주식회사 에이디피엔지니어링 기판 적재 장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758558B2 (ja) * 1993-12-10 1998-05-28 信越半導体株式会社 ウェーハハンドリング装置
JP3249309B2 (ja) * 1994-09-13 2002-01-21 東京エレクトロン株式会社 基板の搬送装置及び基板の搬送方法並びに塗布現像処理装置
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
JPH11176912A (ja) 1997-12-08 1999-07-02 Mitsubishi Electric Corp 半導体基板処理装置及びその制御方法
EP1066649A1 (en) * 1998-03-23 2001-01-10 Lehighton Electronics Inc. Method and apparatus for testing of sheet material
US6202482B1 (en) 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
KR20010066612A (ko) * 1999-12-31 2001-07-11 황인길 반도체 웨이퍼 감지장치
KR100450668B1 (ko) * 2001-12-20 2004-10-01 삼성전자주식회사 반도체 클리닝 시스템 및 그 구동 방법
US6808589B2 (en) * 2002-06-14 2004-10-26 Taiwan Semiconductor Manufacturing Co. Ltd Wafer transfer robot having wafer blades equipped with sensors
US8207748B2 (en) * 2004-08-11 2012-06-26 Lehighton Electronics, Inc. Device and handling system for measurement of mobility and sheet charge density
JP2007059856A (ja) * 2005-08-25 2007-03-08 Anywire:Kk マッピングセンサシステム
ES2380638T3 (es) 2005-11-14 2012-05-17 Lehighton Electronics Inc. Sistema de medición de la conductancia/resistencia laminar
JP2008187156A (ja) * 2007-01-31 2008-08-14 Hitachi Kokusai Electric Inc 基板検出装置
JP4937953B2 (ja) * 2008-03-27 2012-05-23 ラピスセミコンダクタ株式会社 ウェハ搬送装置
CN104813438B (zh) * 2012-11-28 2017-07-25 盛美半导体设备（上海）有限公司 半导体硅片的清洗方法和装置
US11556064B2 (en) 2018-08-23 2023-01-17 Asml Netherlands B.V. Stage apparatus and method for calibrating an object loading process
CN111069127A (zh) * 2019-12-20 2020-04-28 江苏兴汇智能科技有限公司 一种智能家居用红外探测器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0139785B1 (ko) * 1990-03-20 1998-07-15 카자마 젠쥬 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치
JPH04186862A (ja) * 1990-11-21 1992-07-03 Tokyo Electron Sagami Ltd キャリア内基板の検出装置
JP2984958B2 (ja) * 1991-07-26 1999-11-29 東京エレクトロン株式会社 基板の枚葉検出装置
US5327921A (en) * 1992-03-05 1994-07-12 Tokyo Electron Limited Processing vessel for a wafer washing system
US5225691A (en) * 1992-05-18 1993-07-06 Avalon Engineering, Inc. Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100854978B1 (ko) 2005-04-01 2008-08-28 주식회사 에이디피엔지니어링 기판 적재 장치

Also Published As

Publication number Publication date
JP3131750B2 (ja) 2001-02-05
KR940010257A (ko) 1994-05-24
TW235376B (cg-RX-API-DMAC10.html) 1994-12-01
US5406092A (en) 1995-04-11
JPH06132269A (ja) 1994-05-13

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