KR100251245B1 - 부분도금방법및그장치 - Google Patents
부분도금방법및그장치 Download PDFInfo
- Publication number
- KR100251245B1 KR100251245B1 KR1019940035335A KR19940035335A KR100251245B1 KR 100251245 B1 KR100251245 B1 KR 100251245B1 KR 1019940035335 A KR1019940035335 A KR 1019940035335A KR 19940035335 A KR19940035335 A KR 19940035335A KR 100251245 B1 KR100251245 B1 KR 100251245B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- plating
- sparger
- support
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/456—Materials
- H10W70/457—Materials of metallic layers on leadframes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993-345308 | 1993-12-20 | ||
| JP5345308A JP2551531B2 (ja) | 1993-12-20 | 1993-12-20 | 部分メッキ方法、および部分メッキ装置 |
| JP93-345308 | 1993-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950018680A KR950018680A (ko) | 1995-07-22 |
| KR100251245B1 true KR100251245B1 (ko) | 2000-04-15 |
Family
ID=18375721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940035335A Expired - Fee Related KR100251245B1 (ko) | 1993-12-20 | 1994-12-20 | 부분도금방법및그장치 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2551531B2 (https=) |
| KR (1) | KR100251245B1 (https=) |
| TW (1) | TW293942B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101149158B1 (ko) | 2009-05-26 | 2012-06-01 | 현대제철 주식회사 | 프레스 성형품의 국부도금방법 및 그에 이용되는 금형 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100724068B1 (ko) * | 2006-08-07 | 2007-06-07 | 대성하이피(주) | 분할식 부분 전기도금장치 |
-
1993
- 1993-12-20 JP JP5345308A patent/JP2551531B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-20 KR KR1019940035335A patent/KR100251245B1/ko not_active Expired - Fee Related
- 1994-12-20 TW TW083111913A patent/TW293942B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101149158B1 (ko) | 2009-05-26 | 2012-06-01 | 현대제철 주식회사 | 프레스 성형품의 국부도금방법 및 그에 이용되는 금형 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2551531B2 (ja) | 1996-11-06 |
| TW293942B (https=) | 1996-12-21 |
| JPH07173670A (ja) | 1995-07-11 |
| KR950018680A (ko) | 1995-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| FPAY | Annual fee payment |
Payment date: 20021203 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20040112 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20040112 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |