KR100218026B1 - 다이아몬드에 금속 피막을 도포하기 위한 방법 및 그 방법으로 제조되는 제품 - Google Patents
다이아몬드에 금속 피막을 도포하기 위한 방법 및 그 방법으로 제조되는 제품 Download PDFInfo
- Publication number
- KR100218026B1 KR100218026B1 KR1019920011286A KR920011286A KR100218026B1 KR 100218026 B1 KR100218026 B1 KR 100218026B1 KR 1019920011286 A KR1019920011286 A KR 1019920011286A KR 920011286 A KR920011286 A KR 920011286A KR 100218026 B1 KR100218026 B1 KR 100218026B1
- Authority
- KR
- South Korea
- Prior art keywords
- diamond
- metal
- nickel
- substrate
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P5/00—Setting gems or the like on metal parts, e.g. diamonds on tools
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Chemically Coating (AREA)
- Carbon And Carbon Compounds (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/722,575 US5190796A (en) | 1991-06-27 | 1991-06-27 | Method of applying metal coatings on diamond and articles made therefrom |
| US722,575 | 1991-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930000202A KR930000202A (ko) | 1993-01-15 |
| KR100218026B1 true KR100218026B1 (ko) | 1999-09-01 |
Family
ID=24902432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920011286A Expired - Fee Related KR100218026B1 (ko) | 1991-06-27 | 1992-06-26 | 다이아몬드에 금속 피막을 도포하기 위한 방법 및 그 방법으로 제조되는 제품 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5190796A (enExample) |
| EP (1) | EP0520776B1 (enExample) |
| JP (1) | JP3333551B2 (enExample) |
| KR (1) | KR100218026B1 (enExample) |
| AT (1) | ATE142283T1 (enExample) |
| CA (1) | CA2068176C (enExample) |
| DE (1) | DE69213360T2 (enExample) |
| IE (1) | IE922078A1 (enExample) |
| ZA (1) | ZA924325B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100602482B1 (ko) * | 2004-06-29 | 2006-07-19 | 한국지질자원연구원 | 무전해 니켈도금법에 의한 니켈-다이아몬드 복합분말의형상제어 제조방법 |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05202483A (ja) * | 1991-04-25 | 1993-08-10 | Shipley Co Inc | 無電解金属化方法と組成物 |
| US5463271A (en) * | 1993-07-09 | 1995-10-31 | Silicon Video Corp. | Structure for enhancing electron emission from carbon-containing cathode |
| US5608283A (en) * | 1994-06-29 | 1997-03-04 | Candescent Technologies Corporation | Electron-emitting devices utilizing electron-emissive particles which typically contain carbon |
| US5615747A (en) * | 1994-09-07 | 1997-04-01 | Vail, Iii; William B. | Monolithic self sharpening rotary drill bit having tungsten carbide rods cast in steel alloys |
| US6547017B1 (en) | 1994-09-07 | 2003-04-15 | Smart Drilling And Completion, Inc. | Rotary drill bit compensating for changes in hardness of geological formations |
| CA2163953C (en) * | 1994-11-30 | 1999-05-11 | Yasuyuki Kanada | Diamond sintered body having high strength and high wear-resistance and manufacturing method thereof |
| GB9426078D0 (en) | 1994-12-23 | 1995-02-22 | Cadbury Schweppes Plc | Process for manufacture of reduced fat chocolate |
| KR960039315A (ko) * | 1995-04-06 | 1996-11-25 | 이대원 | 리드프레임 제조방법 |
| EP0821745A1 (en) * | 1995-04-17 | 1998-02-04 | The Board Of Trustees Of The University Of Arkansas | Method of electroplating a substrate, and products made thereby |
| US5755299A (en) * | 1995-08-03 | 1998-05-26 | Dresser Industries, Inc. | Hardfacing with coated diamond particles |
| US5759623A (en) * | 1995-09-14 | 1998-06-02 | Universite De Montreal | Method for producing a high adhesion thin film of diamond on a Fe-based substrate |
| US5631046A (en) * | 1996-03-25 | 1997-05-20 | Boudreaux; Paul J. | Method of metallizing a diamond substrate without using a refractory metal |
| US6356014B2 (en) | 1997-03-27 | 2002-03-12 | Candescent Technologies Corporation | Electron emitters coated with carbon containing layer |
| US6138779A (en) * | 1998-01-16 | 2000-10-31 | Dresser Industries, Inc. | Hardfacing having coated ceramic particles or coated particles of other hard materials placed on a rotary cone cutter |
| US6102140A (en) * | 1998-01-16 | 2000-08-15 | Dresser Industries, Inc. | Inserts and compacts having coated or encrusted diamond particles |
| US6170583B1 (en) | 1998-01-16 | 2001-01-09 | Dresser Industries, Inc. | Inserts and compacts having coated or encrusted cubic boron nitride particles |
| GB9811213D0 (en) * | 1998-05-27 | 1998-07-22 | Camco Int Uk Ltd | Methods of treating preform elements |
| US6517902B2 (en) | 1998-05-27 | 2003-02-11 | Camco International (Uk) Limited | Methods of treating preform elements |
| US6258717B1 (en) | 1999-07-30 | 2001-07-10 | International Business Machines Corporation | Method to produce high quality metal fill in deep submicron vias and lines |
| US6372012B1 (en) | 2000-07-13 | 2002-04-16 | Kennametal Inc. | Superhard filler hardmetal including a method of making |
| US6559051B1 (en) | 2000-10-05 | 2003-05-06 | Advanced Micro Devices, Inc. | Electroless deposition of dielectric precursor materials for use in in-laid gate MOS transistors |
| US6465334B1 (en) | 2000-10-05 | 2002-10-15 | Advanced Micro Devices, Inc. | Enhanced electroless deposition of dielectric precursor materials for use in in-laid gate MOS transistors |
| US6541115B2 (en) * | 2001-02-26 | 2003-04-01 | General Electric Company | Metal-infiltrated polycrystalline diamond composite tool formed from coated diamond particles |
| US20030152773A1 (en) * | 2002-02-14 | 2003-08-14 | Chrysler Gregory M. | Diamond integrated heat spreader and method of manufacturing same |
| US7435276B2 (en) * | 2003-05-09 | 2008-10-14 | Diamond Innovations, Inc. | Abrasive particles having coatings with tortuous surface topography |
| JP4714453B2 (ja) * | 2004-10-25 | 2011-06-29 | 株式会社リード | ダイヤモンドまたはcBN工具及びその製造方法 |
| US8021721B2 (en) * | 2006-05-01 | 2011-09-20 | Smith International, Inc. | Composite coating with nanoparticles for improved wear and lubricity in down hole tools |
| US20080060508A1 (en) * | 2006-09-12 | 2008-03-13 | Jamin Micarelli | Lightweight armor composite, method of making same, and articles containing the same |
| WO2008057123A1 (en) * | 2006-11-09 | 2008-05-15 | Massachusetts Institute Of Technology | Preparation and properties of cr-c-p hard coatings annealed at high temperature for high temperature applications |
| EP2663667A4 (en) * | 2011-01-11 | 2015-08-05 | Omg Electronic Chemicals Llc | AUTOCATALYTIC DEPOSITION BATH COMPOSITION AND METHOD FOR PLATING PARTICULATE MATERIAL |
| US20150113882A1 (en) * | 2011-12-30 | 2015-04-30 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particulate material including superabrasive material having a coating of metal |
| JP6291572B2 (ja) * | 2013-06-28 | 2018-03-14 | サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド | ニッケル被覆ダイヤモンド粒子および該粒子の製造方法 |
| CN103694955B (zh) * | 2013-12-11 | 2015-04-08 | 北京保利世达科技有限公司 | 一种单晶金刚石磨粒的制备方法 |
| EP3266406B1 (de) * | 2016-07-04 | 2020-03-04 | Coltène/Whaledent AG | Dentalinstrument |
| JP2020536177A (ja) | 2017-09-28 | 2020-12-10 | マクステリアル インコーポレイテッド | 表面コーティングを含む物品およびこれらを生成するための方法 |
| CN108505022B (zh) * | 2018-05-22 | 2020-09-11 | 北京国瑞升科技股份有限公司 | 金刚石微粉化学镀镍方法以及镀镍金刚石微粉、其制品与用途 |
| CN111793792A (zh) * | 2020-06-18 | 2020-10-20 | 洛阳誉芯金刚石有限公司 | 一种具有表面磁性镀层金刚石及其镀覆方法 |
| JP2024527498A (ja) | 2021-06-18 | 2024-07-25 | マックステリアル・インコーポレイテッド | コーティングされた表面、コーティング、及びそれらを使用する物品を製造するためのプロセス |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2411867A (en) * | 1942-12-19 | 1946-12-03 | Brenner Bert | Industrial diamond tool and method of producing same |
| US2694019A (en) * | 1952-04-23 | 1954-11-09 | Gen Am Transport | Processes of chemical nickel plating and baths therefor |
| US3547692A (en) * | 1968-10-17 | 1970-12-15 | Engelhard Min & Chem | Metal coating carbon substrates |
| US3650714A (en) * | 1969-03-04 | 1972-03-21 | Permattach Diamond Tool Corp | A method of coating diamond particles with metal |
| US3819497A (en) * | 1969-09-17 | 1974-06-25 | Macdermid Inc | Electroless and electrolytic copper plating |
| US3957461A (en) * | 1970-02-24 | 1976-05-18 | Allmanna Svenska Elektriska Aktiebolaget | Method for preparing diamonds for use with grinding wheels |
| US3674516A (en) * | 1970-11-27 | 1972-07-04 | Zlata Kovac | Electroless codeposition of nickel alloys |
| USRE33767E (en) * | 1971-12-15 | 1991-12-10 | Surface Technology, Inc. | Method for concomitant particulate diamond deposition in electroless plating, and the product thereof |
| GB1388172A (en) * | 1972-03-22 | 1975-03-26 | De Beers Ind Diamond | Metal coating of diamonds |
| IT1070268B (it) * | 1976-10-19 | 1985-03-29 | Alfachimici Spa | Composizione per la deposizione anelettrica di leghe a base di nichelio |
| JPS5811518B2 (ja) * | 1977-07-19 | 1983-03-03 | 金井 宏之 | 金属−ダイヤモンドの複合メッキ方法 |
| ZA781390B (en) * | 1978-03-09 | 1979-04-25 | De Beers Ind Diamond | The metal coating of abrasive particles |
| US4381227A (en) * | 1980-07-31 | 1983-04-26 | Norton Company | Process for the manufacture of abrasive-coated tools |
| US4327126A (en) * | 1980-11-10 | 1982-04-27 | Ralph Ogden | Method of making printed circuit boards |
| US4435189A (en) * | 1982-01-15 | 1984-03-06 | General Electric Company | Method of preparing rough textured metal coated abrasives and product resulting therefrom |
| DE3220723A1 (de) * | 1982-06-02 | 1983-12-08 | Gewerkschaft Eisenhütte Westfalia, 4670 Lünen | Verfahren zum aufbringen eines korrosionsbestaendigen und verschleissfesten ueberzuges auf die kolbenstangen von arbeitszylindern, insbesondere zur verwendung im untertagebergbau u.dgl. |
| JPS609660A (ja) * | 1983-06-27 | 1985-01-18 | Toshiba Corp | 砥石 |
| JPS6075582A (ja) * | 1983-09-29 | 1985-04-27 | Komatsu Ltd | 超砥粒の無電解めつき法 |
| US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
| US4591363A (en) * | 1985-07-31 | 1986-05-27 | Silverman Warren J | Process of making a coated abrasive for diamond grinding wheels |
| JPS6449130A (en) * | 1987-08-19 | 1989-02-23 | Tokyo Electric Co Ltd | Servo method for optical recording and reproducing device |
| JPH0292532A (ja) * | 1988-09-29 | 1990-04-03 | Idemitsu Petrochem Co Ltd | 積層体およびその製造方法 |
| US4994329A (en) * | 1988-11-15 | 1991-02-19 | Aisin Seiki Kabushiki Kaisha | Article having nickel plated film comprising a varying content of phosphorus |
| US5183433A (en) * | 1992-02-12 | 1993-02-02 | Townsend Engineering Company | Sausage encasing machine having an improved looper horn |
-
1991
- 1991-06-27 US US07/722,575 patent/US5190796A/en not_active Expired - Fee Related
-
1992
- 1992-05-07 CA CA002068176A patent/CA2068176C/en not_active Expired - Fee Related
- 1992-06-12 ZA ZA924325A patent/ZA924325B/xx unknown
- 1992-06-24 AT AT92305816T patent/ATE142283T1/de not_active IP Right Cessation
- 1992-06-24 EP EP92305816A patent/EP0520776B1/en not_active Expired - Lifetime
- 1992-06-24 JP JP16620392A patent/JP3333551B2/ja not_active Expired - Fee Related
- 1992-06-24 DE DE69213360T patent/DE69213360T2/de not_active Expired - Fee Related
- 1992-06-26 KR KR1019920011286A patent/KR100218026B1/ko not_active Expired - Fee Related
- 1992-07-01 IE IE207892A patent/IE922078A1/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100602482B1 (ko) * | 2004-06-29 | 2006-07-19 | 한국지질자원연구원 | 무전해 니켈도금법에 의한 니켈-다이아몬드 복합분말의형상제어 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0520776A2 (en) | 1992-12-30 |
| EP0520776B1 (en) | 1996-09-04 |
| KR930000202A (ko) | 1993-01-15 |
| DE69213360T2 (de) | 1997-03-06 |
| IE922078A1 (en) | 1992-12-30 |
| US5190796A (en) | 1993-03-02 |
| JPH05201782A (ja) | 1993-08-10 |
| ZA924325B (en) | 1993-04-13 |
| CA2068176C (en) | 2002-12-24 |
| EP0520776A3 (enExample) | 1994-04-06 |
| JP3333551B2 (ja) | 2002-10-15 |
| ATE142283T1 (de) | 1996-09-15 |
| CA2068176A1 (en) | 1992-12-28 |
| DE69213360D1 (de) | 1996-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100218026B1 (ko) | 다이아몬드에 금속 피막을 도포하기 위한 방법 및 그 방법으로 제조되는 제품 | |
| IE922381A1 (en) | Organometallic fluorenyl compounds | |
| US5058799A (en) | Metallized ceramic substrate and method therefor | |
| US5250105A (en) | Selective process for printing circuit board manufacturing | |
| KR100749559B1 (ko) | 도금기판, 무전해 도금방법 및 이 방법을 사용한회로형성방법 | |
| US5100714A (en) | Metallized ceramic substrate and method therefor | |
| KR100437569B1 (ko) | 표면처리동박 및 그 표면처리동박의 제조방법 및 그표면처리동박을 사용한 동 클래드 적층판 | |
| EP0216531A1 (en) | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits | |
| EP0103149B1 (en) | Poly(arylene sulfide) printed circuit boards | |
| JP2010111951A (ja) | クロムを含まない変色防止・接着促進処理組成物 | |
| US4964923A (en) | Method of forming a copper film on a ceramic body | |
| JPS601890A (ja) | プリント回路製造のアデイテイブ法 | |
| JPH10237664A (ja) | 微多孔性銅皮膜およびこれを得るための無電解銅めっき液 | |
| CA2072274C (en) | Improved method of applying metal coatings on cubic boron nitride and articles made therefrom | |
| JP2000073170A (ja) | 金属化されたサブストレ―ト材料の製造方法 | |
| JPH03204992A (ja) | 無電解金属前に合成樹脂を前処理するための膨潤剤、全面の金属化された基材の製造方法、全面の金属化された基材、及びプリント配線板、チツプ支持体、ハイブリツド回路、多層積層物半製品及び電磁遮蔽用半製品の製造方法 | |
| JPH0694593B2 (ja) | 陽極酸化アルミニウム上への無電解ニッケル鍍金 | |
| EP0131031B1 (en) | Method of treating thermoplastic surfaces | |
| JPH03170680A (ja) | 非導電性支持体を直接金属被覆する方法 | |
| JPH01500913A (ja) | 非導電性基体の金属化のための方法 | |
| JP3371072B2 (ja) | 銅または銅合金の変色防止液並びに変色防止方法 | |
| CA1332328C (en) | Method for removing residual precious metal catalyst from the surface of metal plated-plastics | |
| JPH0610146A (ja) | 触媒活性の非常に高いプラチナ金属層を得る方法 | |
| GB2253415A (en) | Selective process for printed circuit board manufacturing employing noble metal oxide catalyst. | |
| CA2327801A1 (en) | Copper on polymer component having improved adhesion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
Fee payment year number: 1 St.27 status event code: A-2-2-U10-U11-oth-PR1002 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 4 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 5 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| FPAY | Annual fee payment |
Payment date: 20040601 Year of fee payment: 6 |
|
| PR1001 | Payment of annual fee |
Fee payment year number: 6 St.27 status event code: A-4-4-U10-U11-oth-PR1001 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R14-asn-PN2301 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
Not in force date: 20050609 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE St.27 status event code: A-4-4-U10-U13-oth-PC1903 |
|
| PC1903 | Unpaid annual fee |
Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20050609 St.27 status event code: N-4-6-H10-H13-oth-PC1903 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |