KR100214163B1 - 반도체 공정용 개량된 복합 폴리싱 패드 - Google Patents

반도체 공정용 개량된 복합 폴리싱 패드 Download PDF

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Publication number
KR100214163B1
KR100214163B1 KR1019920004336A KR920004336A KR100214163B1 KR 100214163 B1 KR100214163 B1 KR 100214163B1 KR 1019920004336 A KR1019920004336 A KR 1019920004336A KR 920004336 A KR920004336 A KR 920004336A KR 100214163 B1 KR100214163 B1 KR 100214163B1
Authority
KR
South Korea
Prior art keywords
layer
pad
substrate
tiles
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019920004336A
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English (en)
Korean (ko)
Other versions
KR930003269A (ko
Inventor
알.브라이보겔 조셉
에프.로크 샘
알.올리버 마이클
디.야우 리오
Original Assignee
에프.토마스 던랩, 쥬니어
인텔 코오퍼레이션
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Publication of KR930003269A publication Critical patent/KR930003269A/ko
Application granted granted Critical
Publication of KR100214163B1 publication Critical patent/KR100214163B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1019920004336A 1991-07-09 1992-03-17 반도체 공정용 개량된 복합 폴리싱 패드 Expired - Lifetime KR100214163B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/727,829 US5212910A (en) 1991-07-09 1991-07-09 Composite polishing pad for semiconductor process
US727,829 1991-07-09

Publications (2)

Publication Number Publication Date
KR930003269A KR930003269A (ko) 1993-02-24
KR100214163B1 true KR100214163B1 (ko) 1999-08-02

Family

ID=24924248

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920004336A Expired - Lifetime KR100214163B1 (ko) 1991-07-09 1992-03-17 반도체 공정용 개량된 복합 폴리싱 패드

Country Status (8)

Country Link
US (1) US5212910A (https=)
JP (1) JP3099209B2 (https=)
KR (1) KR100214163B1 (https=)
FR (1) FR2679067B1 (https=)
GB (1) GB2257382B (https=)
HK (1) HK66195A (https=)
IE (1) IE66126B1 (https=)
TW (1) TW220002B (https=)

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US5212910A (en) 1993-05-25
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FR2679067A1 (fr) 1993-01-15
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