GB2257382B - Improved composite polishing pad for semiconductor process - Google Patents

Improved composite polishing pad for semiconductor process

Info

Publication number
GB2257382B
GB2257382B GB9203649A GB9203649A GB2257382B GB 2257382 B GB2257382 B GB 2257382B GB 9203649 A GB9203649 A GB 9203649A GB 9203649 A GB9203649 A GB 9203649A GB 2257382 B GB2257382 B GB 2257382B
Authority
GB
United Kingdom
Prior art keywords
polishing pad
semiconductor process
improved composite
composite polishing
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9203649A
Other languages
English (en)
Other versions
GB9203649D0 (en
GB2257382A (en
Inventor
Joseph R Breivogel
Sam F Louke
Michael R Oliver
Leo D Yau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of GB9203649D0 publication Critical patent/GB9203649D0/en
Publication of GB2257382A publication Critical patent/GB2257382A/en
Application granted granted Critical
Publication of GB2257382B publication Critical patent/GB2257382B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB9203649A 1991-07-09 1992-02-19 Improved composite polishing pad for semiconductor process Expired - Fee Related GB2257382B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/727,829 US5212910A (en) 1991-07-09 1991-07-09 Composite polishing pad for semiconductor process

Publications (3)

Publication Number Publication Date
GB9203649D0 GB9203649D0 (en) 1992-04-08
GB2257382A GB2257382A (en) 1993-01-13
GB2257382B true GB2257382B (en) 1994-11-30

Family

ID=24924248

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9203649A Expired - Fee Related GB2257382B (en) 1991-07-09 1992-02-19 Improved composite polishing pad for semiconductor process

Country Status (8)

Country Link
US (1) US5212910A (https=)
JP (1) JP3099209B2 (https=)
KR (1) KR100214163B1 (https=)
FR (1) FR2679067B1 (https=)
GB (1) GB2257382B (https=)
HK (1) HK66195A (https=)
IE (1) IE66126B1 (https=)
TW (1) TW220002B (https=)

Families Citing this family (226)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284524A (en) * 1991-10-03 1994-02-08 Rockwell International Corporation Method and apparatus for enhancing surface treatment of perforated materials
JPH0556651U (ja) * 1992-01-13 1993-07-27 富士通テン株式会社 車載用電子機器の取付構造
US5437754A (en) 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US6439979B1 (en) * 1992-02-12 2002-08-27 Tokyo Electron Limited Polishing apparatus and polishing method using the same
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JP2891083B2 (ja) * 1993-12-14 1999-05-17 信越半導体株式会社 シート状研磨部材およびウエーハ研磨装置
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
DE69512971T2 (de) 1994-08-09 2000-05-18 Ontrak Systems Inc., Milpitas Linear Poliergerät und Wafer Planarisierungsverfahren
US5575707A (en) * 1994-10-11 1996-11-19 Ontrak Systems, Inc. Polishing pad cluster for polishing a semiconductor wafer
US5571044A (en) * 1994-10-11 1996-11-05 Ontrak Systems, Inc. Wafer holder for semiconductor wafer polishing machine
US5593344A (en) * 1994-10-11 1997-01-14 Ontrak Systems, Inc. Wafer polishing machine with fluid bearings and drive systems
JP3960635B2 (ja) * 1995-01-25 2007-08-15 株式会社荏原製作所 ポリッシング装置
USRE39262E1 (en) * 1995-01-25 2006-09-05 Ebara Corporation Polishing apparatus including turntable with polishing surface of different heights
US6876454B1 (en) * 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6099954A (en) 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US5945347A (en) * 1995-06-02 1999-08-31 Micron Technology, Inc. Apparatus and method for polishing a semiconductor wafer in an overhanging position
JP3329644B2 (ja) * 1995-07-21 2002-09-30 株式会社東芝 研磨パッド、研磨装置及び研磨方法
KR100189970B1 (ko) * 1995-08-07 1999-06-01 윤종용 웨이퍼 연마장치
TW334379B (en) * 1995-08-24 1998-06-21 Matsushita Electric Industrial Co Ltd Compression mechanism for grinding machine of semiconductor substrate
US5609517A (en) * 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
KR100335483B1 (ko) * 1995-11-28 2002-11-20 삼성전자 주식회사 반도체소자의스페이서형성방법
US6135856A (en) * 1996-01-19 2000-10-24 Micron Technology, Inc. Apparatus and method for semiconductor planarization
TW349896B (en) * 1996-05-02 1999-01-11 Applied Materials Inc Apparatus and chemical mechanical polishing system for polishing a substrate
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5785584A (en) * 1996-08-30 1998-07-28 International Business Machines Corporation Planarizing apparatus with deflectable polishing pad
JP2738392B1 (ja) * 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法
JPH10156705A (ja) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
KR100210840B1 (ko) * 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
JP3865444B2 (ja) * 1997-01-06 2007-01-10 スリーエム カンパニー 手工具
KR100487455B1 (ko) * 1997-01-13 2005-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US5944583A (en) * 1997-03-17 1999-08-31 International Business Machines Corporation Composite polish pad for CMP
US7018282B1 (en) * 1997-03-27 2006-03-28 Koninklijke Philips Electronics N.V. Customized polishing pad for selective process performance during chemical mechanical polishing
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
EP1011922B1 (en) * 1997-04-18 2002-11-06 Cabot Microelectronics Corporation Polishing pad for a semiconductor substrate
CN1118354C (zh) * 1997-05-09 2003-08-20 罗德尔控股公司 镶嵌式抛光垫及其制造方法
US5921855A (en) † 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6071178A (en) 1997-07-03 2000-06-06 Rodel Holdings Inc. Scored polishing pad and methods related thereto
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
US5919082A (en) 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
JP3056714B2 (ja) * 1997-10-06 2000-06-26 松下電子工業株式会社 半導体基板の研磨方法
US6190237B1 (en) 1997-11-06 2001-02-20 International Business Machines Corporation pH-buffered slurry and use thereof for polishing
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
JPH11156699A (ja) * 1997-11-25 1999-06-15 Speedfam Co Ltd 平面研磨用パッド
US6113462A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Feedback loop for selective conditioning of chemical mechanical polishing pad
JPH11277408A (ja) 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
US6210257B1 (en) 1998-05-29 2001-04-03 Micron Technology, Inc. Web-format polishing pads and methods for manufacturing and using web-format polishing pads in mechanical and chemical-mechanical planarization of microelectronic substrates
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US7718102B2 (en) * 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
JP3858462B2 (ja) * 1998-07-30 2006-12-13 株式会社日立製作所 半導体装置の製造方法
US6254463B1 (en) 1998-10-09 2001-07-03 International Business Machines Corporation Chemical planar head dampening system
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6354915B1 (en) 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6220942B1 (en) * 1999-04-02 2001-04-24 Applied Materials, Inc. CMP platen with patterned surface
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
USD447299S1 (en) 1999-04-16 2001-08-28 Foamex L.P. Mop head
USD436702S1 (en) 1999-04-16 2001-01-23 Foamex L.P. Mop head
USD452053S1 (en) 1999-04-16 2001-12-11 Foamex L.P. Mop head
USD447297S1 (en) 1999-04-16 2001-08-28 Foamex L.P. Mop head
USD447610S1 (en) 1999-04-16 2001-09-04 Foamex L.P. Mop head
USD446616S1 (en) 1999-04-16 2001-08-14 Foamex L.P. Mop head
USD451656S1 (en) 1999-04-16 2001-12-04 Foamex L.P. Mop head
USD447300S1 (en) 1999-04-16 2001-08-28 Foamex L.P. Mop head
USD446367S1 (en) 1999-04-16 2001-08-07 Foamex L.P. Mop head
USD439386S1 (en) 1999-04-16 2001-03-20 Foamex L.P. Mop head
USD435949S1 (en) 1999-05-06 2001-01-02 Foamex L.P. Mop head
WO2001011843A1 (en) * 1999-08-06 2001-02-15 Sudia Frank W Blocked tree authorization and status systems
USD429859S (en) * 1999-08-31 2000-08-22 Foamex Lp Mop head
USD429860S (en) * 1999-08-31 2000-08-22 Foamex Lp Mop head
USD446895S1 (en) 1999-08-31 2001-08-21 Foamex L.P. Mop head
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
USD431100S (en) * 1999-08-31 2000-09-19 Foamex Lp Mop head
USD429545S (en) * 1999-08-31 2000-08-15 Foamex Lp Mop head
USD435710S (en) * 1999-09-02 2000-12-26 Foamex Lp Mop head
USD429861S (en) * 1999-09-02 2000-08-22 Foamex Lp Mop head
US6520843B1 (en) * 1999-10-27 2003-02-18 Strasbaugh High planarity chemical mechanical planarization
JP2001150332A (ja) * 1999-11-22 2001-06-05 Nec Corp 研磨パッドおよび研磨方法
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
DE19962564C1 (de) * 1999-12-23 2001-05-10 Wacker Siltronic Halbleitermat Poliertuch
US6626740B2 (en) * 1999-12-23 2003-09-30 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
KR20010093677A (ko) * 2000-03-29 2001-10-29 추후기재 향상된 슬러리 분배를 위하여 특수 설계된 연마 패드
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6390891B1 (en) * 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad
US6267654B1 (en) * 2000-06-02 2001-07-31 United Microelectronics Corp. Pad backer for polishing head of chemical mechanical polishing machine
WO2002002274A2 (en) * 2000-06-30 2002-01-10 Rodel Holdings, Inc. Base-pad for a polishing pad
US6495464B1 (en) * 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6666751B1 (en) * 2000-07-17 2003-12-23 Micron Technology, Inc. Deformable pad for chemical mechanical polishing
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US6929534B2 (en) * 2001-01-05 2005-08-16 Seiko Epson Corporation Polisher and polishing method
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
US6383065B1 (en) 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6544107B2 (en) 2001-02-16 2003-04-08 Agere Systems Inc. Composite polishing pads for chemical-mechanical polishing
US6641470B1 (en) * 2001-03-30 2003-11-04 Lam Research Corporation Apparatus for accurate endpoint detection in supported polishing pads
US6620031B2 (en) 2001-04-04 2003-09-16 Lam Research Corporation Method for optimizing the planarizing length of a polishing pad
US6517426B2 (en) 2001-04-05 2003-02-11 Lam Research Corporation Composite polishing pad for chemical-mechanical polishing
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US20030100250A1 (en) * 2001-10-29 2003-05-29 West Thomas E. Pads for CMP and polishing substrates
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
KR20050052513A (ko) * 2002-09-25 2005-06-02 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 윈도를 가진 연마 패드
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
JP4484466B2 (ja) * 2003-07-10 2010-06-16 パナソニック株式会社 研磨方法およびその研磨方法に用いる粘弾性ポリッシャー
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
TWI227521B (en) * 2003-11-12 2005-02-01 United Microelectronics Corp Polishing element
KR100576465B1 (ko) * 2003-12-01 2006-05-08 주식회사 하이닉스반도체 연마입자 함침 조성물을 이용한 연마 패드
TW200521167A (en) * 2003-12-31 2005-07-01 San Fang Chemical Industry Co Polymer sheet material and method for making the same
US20070207687A1 (en) * 2004-05-03 2007-09-06 San Fang Chemical Industry Co., Ltd. Method for producing artificial leather
TWI293266B (en) * 2004-05-05 2008-02-11 Iv Technologies Co Ltd A single-layer polishing pad and a method of producing the same
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
TWI285590B (en) * 2005-01-19 2007-08-21 San Fang Chemical Industry Co Moisture-absorbing, quick drying, thermally insulating, elastic composite and method for making
US7189156B2 (en) * 2004-08-25 2007-03-13 Jh Rhodes Company, Inc. Stacked polyurethane polishing pad and method of producing the same
TWI275679B (en) * 2004-09-16 2007-03-11 San Fang Chemical Industry Co Artificial leather materials having elongational elasticity
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US20080149264A1 (en) * 2004-11-09 2008-06-26 Chung-Chih Feng Method for Making Flameproof Environmentally Friendly Artificial Leather
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US8075745B2 (en) * 2004-11-29 2011-12-13 Semiquest Inc. Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
WO2006057720A1 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US20080095945A1 (en) * 2004-12-30 2008-04-24 Ching-Tang Wang Method for Making Macromolecular Laminate
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
US8398463B2 (en) 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
TWI297049B (en) * 2005-05-17 2008-05-21 San Fang Chemical Industry Co Artificial leather having ultramicro fiber in conjugate fiber of substrate
TW200641193A (en) * 2005-05-27 2006-12-01 San Fang Chemical Industry Co A polishing panel of micro fibers and its manufacturing method
US20080187715A1 (en) * 2005-08-08 2008-08-07 Ko-Feng Wang Elastic Laminate and Method for Making The Same
US7549914B2 (en) 2005-09-28 2009-06-23 Diamex International Corporation Polishing system
US7226345B1 (en) * 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
US20080220701A1 (en) * 2005-12-30 2008-09-11 Chung-Ching Feng Polishing Pad and Method for Making the Same
US20070155268A1 (en) * 2005-12-30 2007-07-05 San Fang Chemical Industry Co., Ltd. Polishing pad and method for manufacturing the polishing pad
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치
TWI287486B (en) 2006-05-04 2007-10-01 Iv Technologies Co Ltd Polishing pad and method thereof
CN101073880B (zh) * 2006-05-16 2010-08-11 智胜科技股份有限公司 研磨垫及其制造方法
US7789738B2 (en) * 2006-07-03 2010-09-07 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US7316605B1 (en) * 2006-07-03 2008-01-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
US20080064310A1 (en) * 2006-09-08 2008-03-13 Chung-Chih Feng Polishing pad having hollow fibers and the method for making the same
TWI302575B (en) * 2006-12-07 2008-11-01 San Fang Chemical Industry Co Manufacturing method for ultrafine carbon fiber by using core and sheath conjugate melt spinning
TW200825244A (en) 2006-12-13 2008-06-16 San Fang Chemical Industry Co Flexible artificial leather and its manufacturing method
EP1961519A1 (de) * 2007-02-22 2008-08-27 sia Abrasives Industries AG Schleifkörper
US20090252876A1 (en) * 2007-05-07 2009-10-08 San Fang Chemical Industry Co., Ltd. Sheet for mounting polishing workpiece and method for making the same
USD586965S1 (en) * 2007-12-05 2009-02-17 The Libman Company Mop head
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
KR20110019442A (ko) * 2008-06-26 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 다공성 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법 및 이용 방법
US20110183583A1 (en) * 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWM352126U (en) * 2008-10-23 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
TWI379736B (en) 2009-03-06 2012-12-21 Bestac Advanced Material Co Ltd Sheet having discontinuous adhesion points and the method for making the same
US8336868B2 (en) * 2010-09-16 2012-12-25 Woodworker's Supply, Inc. No-mar workpiece support
USD667034S1 (en) 2010-09-16 2012-09-11 Woodworker's Supply, Inc. No-mar workpiece support
CN102884612B (zh) * 2011-01-03 2017-02-15 应用材料公司 压力控制的抛光压板
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
SG11201402224WA (en) * 2011-11-29 2014-09-26 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
CN103072077B (zh) * 2013-01-29 2016-06-15 中国科学院长春光学精密机械与物理研究所 一种双柔性自适应抛光磨头
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
JP6279309B2 (ja) * 2013-12-20 2018-02-14 スリーエム イノベイティブ プロパティズ カンパニー 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品
SG11201608134YA (en) 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
CN106457508B (zh) * 2014-05-21 2019-05-31 富士纺控股株式会社 研磨垫及其制造方法
JP2016047566A (ja) * 2014-08-27 2016-04-07 株式会社フジミインコーポレーテッド 研磨パッド
JP6426403B2 (ja) * 2014-08-27 2018-11-21 株式会社フジミインコーポレーテッド 研磨方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
HK1253061A1 (zh) 2015-06-08 2019-06-06 艾利丹尼森公司 用於化学机械平坦化应用的粘合剂
KR20230169424A (ko) * 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
JP6754519B2 (ja) * 2016-02-15 2020-09-16 国立研究開発法人海洋研究開発機構 研磨方法
TWI621501B (zh) * 2017-01-06 2018-04-21 三芳化學工業股份有限公司 研磨墊及研磨裝置
TWI626117B (zh) * 2017-01-19 2018-06-11 智勝科技股份有限公司 研磨墊及研磨方法
KR102015128B1 (ko) * 2017-03-02 2019-08-27 박대원 연마 패드 및 연마 패드의 제조방법
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
US20240069069A1 (en) * 2019-11-12 2024-02-29 Alliance Material Co., Ltd. Probe pin cleaning pad and cleaning method for probe pin
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210323114A1 (en) * 2020-04-21 2021-10-21 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112338820B (zh) * 2020-10-27 2021-10-29 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN117564931A (zh) * 2023-09-18 2024-02-20 万华化学集团电子材料有限公司 一种具有轨道支撑结构的化学机械抛光垫及其应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece
EP0004454A3 (en) * 1978-03-23 1979-10-31 Robert Michael Barron Improvements in coated abrasives
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate

Also Published As

Publication number Publication date
FR2679067B1 (fr) 1994-04-29
IE66126B1 (en) 1995-12-13
KR100214163B1 (ko) 1999-08-02
TW220002B (https=) 1994-02-01
JPH05212669A (ja) 1993-08-24
US5212910A (en) 1993-05-25
JP3099209B2 (ja) 2000-10-16
IE921103A1 (en) 1993-01-13
KR930003269A (ko) 1993-02-24
GB9203649D0 (en) 1992-04-08
FR2679067A1 (fr) 1993-01-15
GB2257382A (en) 1993-01-13
HK66195A (en) 1995-05-12

Similar Documents

Publication Publication Date Title
GB2257382B (en) Improved composite polishing pad for semiconductor process
GB2315694B (en) Wafer polishing machine
ZA896953B (en) Hand scouring pad
GB8817568D0 (en) Wheelhead for grinding machines
TW362551U (en) Polishing pads
EP0457508A3 (en) Diamond semiconductor device
GB2204994B (en) Semiconductor planarization process
EP0465868A3 (en) Controlled compliance polishing pad
GB2259036B (en) Ball lapping machine
GB2260507B (en) Sanding/grinding arrangement
HU9401636D0 (en) Polishing machine
GB8922598D0 (en) Floor polishing machine
GB9116755D0 (en) Tumbling machine for polishing stones
HU9200974D0 (en) Grinding machine
EP0516032A3 (en) Floor grinding machine
GB8727303D0 (en) Polishing machine
GB9011343D0 (en) Buffing pad
CA68805S (en) Pad sander
GB9111766D0 (en) Abrasive pad
GB9221397D0 (en) Polishing pad
GB9205664D0 (en) Polishing pad
GB8818808D0 (en) Improved process for lapping & polishing
AU110151S (en) Pad sander
GB8901740D0 (en) Polishing machine
GB9026724D0 (en) Abrasive refacing pad

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100219