KR100204612B1 - Printing method of printed circuit board - Google Patents
Printing method of printed circuit board Download PDFInfo
- Publication number
- KR100204612B1 KR100204612B1 KR1019960020821A KR19960020821A KR100204612B1 KR 100204612 B1 KR100204612 B1 KR 100204612B1 KR 1019960020821 A KR1019960020821 A KR 1019960020821A KR 19960020821 A KR19960020821 A KR 19960020821A KR 100204612 B1 KR100204612 B1 KR 100204612B1
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- Prior art keywords
- printing
- circuit board
- printed circuit
- hole
- resist ink
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Abstract
스루홀(Through Hole)의 일정폭으로만 인쇄가 이루어지도록 하여 인쇄로 인한 불량을 개선시킨 인쇄회기판에서의 인쇄방법에 관한 것이다.The present invention relates to a printing method on a printed circuit board in which defects due to printing are improved by printing only with a predetermined width of a through hole.
본 발명은 인쇄회로기판의 스루홀(Through Hole)을 포함한 영역에 대하여 스크린을 이용한 인쇄회로기판에서의 인쇄방법에 있어서, 상기 스루홀에 해당하는 상기 스크린의 영역을 감광성유체로 커버(Cover)하여 상기 인쇄회로기판상에 소정의 배선도형이 인쇄됨으로써 이루어진다.A method of printing on a printed circuit board using a screen with respect to an area including a through hole of a printed circuit board, the method comprising: covering an area of the screen corresponding to the through hole with a photosensitive fluid; And a predetermined wiring pattern is printed on the printed circuit board.
따라서, 후속공정에서 오는 불량을 해소시켜 생산성의 향상을 가져오고, 또한 고가의 레지스트잉크의 사용량이 줄어들어 제조비용을 절감시키는 효과가 있다.Therefore, defects resulting from subsequent processes are eliminated to improve productivity, and the amount of expensive resist ink to be used is reduced, thereby reducing manufacturing costs.
Description
제1도는 종래의 인쇄회로기판에서의 인쇄방법을 나타내는 단면도이다.FIG. 1 is a cross-sectional view showing a printing method on a conventional printed circuit board.
제2도는 본 발명에 따른 인쇄회로기판에서의 인쇄방법의 실시예를 나타내는 단면도이다.FIG. 2 is a cross-sectional view showing an embodiment of a printing method in a printed circuit board according to the present invention.
*도면의 주요부분에 대한 부호의 설명DESCRIPTION OF THE REFERENCE NUMERALS
10, 20 : 스루홀 12, 22 : 기판10, 20: Through holes 12, 22: Substrate
14, 24 : 감광성유체 16. 26 : 스크린14, 24: photosensitive fluid 16. 26: screen
본 발명은 인쇄회로기판(Printed Circuit Board)에서의 인쇄방법에 관한 것으로서, 보다 상세하게는 스루홀(Through Hole)의 일정폭으로만 인쇄가 이루어지도록 하여 인쇄로 인한 불량을 개선시킨 인쇄회기판에서의 인쇄방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printing method in a printed circuit board (PCB), and more particularly, to a printing method in which printing is performed only with a predetermined width of a through hole And the like.
통상, 인쇄회로기판은 회로부품을 접속하는 전기배선을 회로설계에 기초하여 배선도형으로 표현하고 이것을 패턴(Pattem)인쇄 및 식각 등의 기술에 의해 기판위에 배선도형으로서 완성시킨 것으로, 페이퍼-페놀(Paper-Phenol)수지 또는 글래스-에폭시(Glass-Epoxy)수지 등과 같은 절연체 위에 단면 또는 양면에 동박이 적층된 기판을 재료로 하여 제조되어 지고, 또한 여러장의 동박이 적층되는 다층기판을 재료로 하여 제조되기도 한다.Typically, a printed circuit board is an electrical wiring that connects circuit components to a wiring diagram based on a circuit design and is completed as a wiring diagram on a substrate by a technique such as pattern printing and etching, Layer substrate in which a plurality of copper foils are stacked on a substrate made of a substrate on which a copper foil is laminated on one or both sides thereof on an insulator such as a paper-phenol resin or a glass-epoxy resin. It is.
여기서 회로설계에 기초한 전기배선을 기판상에 구현하기 위해서 스크린(Screen)을 이용하여 기판에 레지스트잉크(Resist Ink)를 설계된 배선도형과 동일하게 도포하고, 식각을 수행함으로써 이루어진다.Here, in order to implement electric wiring based on the circuit design on a substrate, a resist ink is coated on the substrate using a screen in the same manner as the designed wiring pattern, and etching is performed.
즉, 레지스트잉크가 도포된 부분은 식각공정이 수행되어도 기판상의 동박이 존재하게 되고, 레지스트잉크가 도포되지 않는 부분의 동박은 식각 공정에서 제거된다.That is, even when the etching ink is applied to the portion to which the resist ink is applied, the copper foil on the substrate is present, and the copper foil on the portion where the resist ink is not applied is removed in the etching process.
그리고, 기판상에 존재하는 레지스트잉크를 제거하면 기판에 전기배선이 결정된다.When the resist ink existing on the substrate is removed, the electric wiring is determined on the substrate.
또한 전기배선이 인쇄된 기판위에 부품삽입후 솔더링(Soldering)할 때 필요 이외의 동박면에 납이 묻는 것을 방지하기 위하여 솔더레지스트잉크(Solder Resist Ink)를 도포하는 솔더레지스트인쇄도 스크린을 이용하여 수행한다.In addition, solder resist printing which applies solder resist ink (solder resist ink) is also carried out using a screen in order to prevent lead from being attached to the copper surface other than necessary when soldering after inserting parts on a printed wiring board do.
제1도는 종래의 인쇄회기판에서의 인쇄방법을 나타내는 단면도이다.FIG. 1 is a cross-sectional view showing a printing method on a conventional printed circuit board.
먼저, 스루홀(10)이 형성되어 있는 기판(12)에 인쇄를 수행하기 위해 감광성유제(14)가 코팅(Coating)되어 있는 스크린(18)이 구비되어 있다.First, a screen 18 in which a photosensitive oil agent 14 is coated to perform printing on a substrate 12 on which a through hole 10 is formed is provided.
여기서 스크린(16)은 기판(12)상의 스루홀(10) 외곽의 일정폭으로 패턴을 형성하기 위하여 스루홀(10) 외곽의 일정폭으로만 인쇄가 될 수 있도록 감광성유체(14)가 코팅되어 있지 않는 구조로 이루어져 있다.The screen 16 is coated with the photosensitive fluid 14 so that the screen 16 can be printed only at a predetermined width outside the through hole 10 in order to form a pattern with a constant width outside the through hole 10 on the substrate 12 It does not have a structure.
즉, 감광성유체(14)가 코팅되어 있지 않는 부분으로는 레지스트잉크가 기판(12)상에 도포되고, 감광성유제(14)가 코팅된 부분으로는 레지스트잉크가 기판(12)상에 도포되지 않는다.That is, the resist ink is applied on the substrate 12 as the portion where the photosensitive fluid 14 is not coated, and the resist ink is not applied on the substrate 12 as the portion where the photosensitive oil 14 is coated .
여기서 종래의 방법으로 인쇄를 수행하면 스루홀 영역에서는 레지스트잉크가 정확하게 스루홀(10)의 외곽에만 도포되는 것이 아니라 스루홀(10) 내벽으로도 도포된다.Here, when printing is performed by the conventional method, resist ink is applied not only to the outer periphery of the through hole 10 but also to the inner wall of the through hole 10 in the through hole region.
그리고, 후속공정인 알카리(Alkali) 박리(薄離)공정에서 레지스트잉크를 제거시키는 것으로 이루어진다.Then, the resist ink is removed in a subsequent Alkali stripping process.
그러나 스루홀(10) 내벽에 도포되어 있는 레지스트잉크는 알카리 박리공정에서 완전하게 제거되지 못하고 스루홀(10) 내벽에 잔류한다.However, the resist ink applied on the inner wall of the through hole 10 is not completely removed in the alkaline peeling process, and remains on the inner wall of the through hole 10.
여기서 스루홀(10) 내벽에 잔류하는 레지스트잉크는 스루홀(10)을 통해서 전류가 흐를 수 있도록 도전성 페이스트(Paste)를 접착시키는 공정에서 도전성 페이스트의 접착을 방해하는 원인으로 작용한다.Here, the resist ink remaining on the inner wall of the through hole 10 acts as a cause for obstructing the adhesion of the conductive paste in the step of bonding the conductive paste (paste) so that current can flow through the through hole 10.
또한 스루홀(10) 내벽까지 레지스트잉크가 도포되어 고가인 레지스트잉크가 불필요하게 소모된다.Further, the resist ink is applied to the inner wall of the through hole 10, and expensive expensive resist ink is unnecessarily consumed.
그리고 종래의 인쇄방법으로 솔더레지스트잉크를 기판상에 도포할 때에도 스루홀 영역에서는 전술한 구성과 동일한 문제점이 지적된다.Even when the solder resist ink is coated on the substrate by the conventional printing method, the same problem as described above is pointed out in the through hole region.
따라서 종래의 인쇄회로기판에서의 인쇄방법은 정확하게 스루홀 외곽으로 인쇄가 이루어지지 않아 후속공정에서 불량의 원인으로 작용하고, 또한 고가의 레지스트잉크가 필요이상으로 소모되는 문제점들이 있었다.Therefore, the conventional printing method on the printed circuit board has problems that precise printing is not performed on the outer periphery of the through hole, which causes defects in subsequent processes and consumes more expensive resist ink than necessary.
본 발명의 목적은, 스루홀 외곽의 일정폭에만 레지스트잉크를 정확하게 도포하기 위한 인쇄회로기판에서의 인쇄방법을 제공하는 데 있다.It is an object of the present invention to provide a printing method on a printed circuit board for accurately applying a resist ink only to a predetermined width outside the through hole.
상기 목적을 달성하기 위한 본 발명에 따른 인쇄회로기판에서의 인쇄방법은, 인쇄회로기판의 스루홀(Through Hole)을 포함한 영역에 대하여 스크린을 이용한 인쇄회로기판에서의 인쇄방법에 있어서, 상기 스루홀에 해당하는 상기 스크린의 영역을 감광성유제로 커버(Cover)하여 상기 인쇄회로기판상에 소정의 배선도형이 인쇄됨으로써 이루어진다.According to another aspect of the present invention, there is provided a method of printing on a printed circuit board using a screen for a region including a through hole of a printed circuit board, And a predetermined wiring pattern is printed on the printed circuit board by covering the area of the screen corresponding to the wiring pattern with the photosensitive oil.
그리고 상기 인쇄는 상기 인쇄회로기판상에 전기배선을 인쇄하기 위한 패턴인쇄공정이거나, 솔더레지스트를 인쇄하기 위한 솔더레지스트인쇄공정이 수행되는 것이 바람직하다.Preferably, the printing is a pattern printing process for printing an electric wiring on the printed circuit board, or a solder resist printing process for printing a solder resist.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제2도는 본 발명에 따른 인쇄회로기판에서의 인쇄방법의 실시예를 나타내는 단면도이다.FIG. 2 is a cross-sectional view showing an embodiment of a printing method in a printed circuit board according to the present invention.
먼저, 스루홀(20)이 형성되어 있는 기판(22)에 설계된 배선도형대로 인쇄를 수행하기 위해 감광성유체(24)가 코팅되어 있는 스크린(26)이 구비되어 있다.First, a screen 26 on which a photosensitive fluid 24 is coated is provided on a substrate 22 on which a through hole 20 is formed to perform printing according to a designed wiring pattern.
본 발명의 인쇄방법을 수행하기 위한 스크린(26)은 스루홀(20) 외곽의 일정폭으로만 인쇄가 이루어지도록 스루홀(20)에 해당하는 스크린(26)의 영역을 감광성유체(24)로 커버(Cover), 즉 코팅되어 있는 구조이다.The screen 26 for performing the printing method of the present invention is configured such that the area of the screen 26 corresponding to the through hole 20 is printed with the photosensitive fluid 24 so as to be printed only at a predetermined width outside the through hole 20 Cover, that is, coated.
이러한 구조로 이루어진 스크린(26)을 이용하여 레지스트잉크를 기판(22)상에 도포시키면 정확하게 스루홀(20) 외곽의 일정폭에만 레지스트잉크가 도포된다.When the resist ink is applied onto the substrate 22 using the screen 26 having such a structure, the resist ink is applied only to a predetermined width of the outer periphery of the through hole 20 accurately.
즉, 스루홀(20) 내벽으로는 레지스트잉크가 도포되지 않는다.That is, resist ink is not applied to the inner wall of the through hole 20.
그러면 알카리 박리공정에서 레지스트잉크를 제거한 후 스루홀(20) 내벽에 도전성 페이스트를 접착하는 공정에서 레지스트잉크로 인한 불량, 즉 도전성 페이스트가 접착되지 않는 것을 완전히 해소시킨다.Then, in the step of removing the resist ink in the alkaline peeling step and bonding the conductive paste to the inner wall of the through hole 20, the defect caused by the resist ink, that is, the conductive paste is not adhered completely.
또한 레지스트잉크가 스루홀(20) 내벽으로는 도포되지 않아 고가의 레지스트잉크의 사용량이 절감된다.In addition, since the resist ink is not applied to the inner wall of the through hole 20, the amount of expensive resist ink to be used is reduced.
여기서 본 발명의 인쇄방법을 이용하여 인쇄회로기판상에 전기배선을 인쇄하기 위한 패턴인쇄공정을 수행할 수 있고, 또한 솔더레지스트를 인쇄하기 위한 솔더레지스트인쇄공정을 수행할 수 있다.Here, the pattern printing process for printing the electric wiring on the printed circuit board can be performed using the printing method of the present invention, and the solder resist printing process for printing the solder resist can be performed.
그리고 전술한 구성의 스크린을 형성하는 방법은 설계가 달라져야 하고, 달라진 설계로서 필름(Film)을 제작하여 감광성유체가 전면에 코팅된 스크린에 노광 및 현상공정을 수행하여 제작해야 하는 것으로 본 기술분야의 일반적 지식을 가진 자라면 누구나 이해할 수 있다.The method of forming the screen having the above-mentioned structure requires different design, and it is required to manufacture a film by performing exposure and development processes on a screen coated with a photosensitive fluid, Anyone with general knowledge can understand.
본 발명의 인쇄회로기판에서의 인쇄방법은 스루홀 부분에 레지스트잉크를 도포시키면 스루홀 내벽으로는 레지스트잉크가 도포되지 않아 스루홀 내벽에 도전성 페이스트를 접착시킬 때 레지스트잉크로 인한 미접착의 원인을 해소시키고, 또한 불필요하게 소모되는 레지스트잉크의 사용량을 절감시킨다.In the printing method of the present invention, when the resist ink is applied to the through hole portion, the resist ink is not applied to the inner wall of the through hole, and when the conductive paste is adhered to the inner wall of the through hole, And the amount of the resist ink consumed unnecessarily is reduced.
따라서, 후속공정에서 오는 불량을 해소시켜 생산성의 향상을 가져오고, 또한 고가의 레지스트잉크의 사용량이 줄어들어 제조비용을 절감시키는 효과가 있다.Therefore, defects resulting from subsequent processes are eliminated to improve productivity, and the amount of expensive resist ink to be used is reduced, thereby reducing manufacturing costs.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구의범위에 속함은 당연하다.While the invention has been shown and described with reference to certain exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960020821A KR100204612B1 (en) | 1996-06-11 | 1996-06-11 | Printing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960020821A KR100204612B1 (en) | 1996-06-11 | 1996-06-11 | Printing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980007888A KR980007888A (en) | 1998-03-30 |
| KR100204612B1 true KR100204612B1 (en) | 1999-06-15 |
Family
ID=19461462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960020821A KR100204612B1 (en) | 1996-06-11 | 1996-06-11 | Printing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100204612B1 (en) |
-
1996
- 1996-06-11 KR KR1019960020821A patent/KR100204612B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR980007888A (en) | 1998-03-30 |
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