KR980007888A - Print Method on Printed Circuit Board - Google Patents

Print Method on Printed Circuit Board Download PDF

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Publication number
KR980007888A
KR980007888A KR1019960020821A KR19960020821A KR980007888A KR 980007888 A KR980007888 A KR 980007888A KR 1019960020821 A KR1019960020821 A KR 1019960020821A KR 19960020821 A KR19960020821 A KR 19960020821A KR 980007888 A KR980007888 A KR 980007888A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
printing
hole
printed
Prior art date
Application number
KR1019960020821A
Other languages
Korean (ko)
Other versions
KR100204612B1 (en
Inventor
장규현
이충재
Original Assignee
김연혁
대덕산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김연혁, 대덕산업 주식회사 filed Critical 김연혁
Priority to KR1019960020821A priority Critical patent/KR100204612B1/en
Publication of KR980007888A publication Critical patent/KR980007888A/en
Application granted granted Critical
Publication of KR100204612B1 publication Critical patent/KR100204612B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Abstract

스루홀(Through Hole)의 일정폭으로만 인쇄가 이루어지도록 하여 인쇄로 인한 불량을 개선시킨 인쇄방법에 관한 것이다. 본 발명은 인쇄회로기판의 스루홀 (Through Hole)을 포함한 영역에 대하여 스크린을 이용한 인쇄회로기판에서의 인쇄방법에 있어서, 상기 스루홀에 해당하는 상기 스크린의 영역을 감광성유제로 커버(Cover)하여 상기 인쇄회로기판 상에 소정의 배선도형이 인쇄됨으로서 이루어진다. 따라서, 후속 공정에서 오는 불량을 해소시켜 생산성의 향상을 가져오고, 또한 고가의 레티스트잉크의 사용량이 줄어들어 제조비용을 절감시키는 효과가 있다.The present invention relates to a printing method of improving defects caused by printing by printing only through a predetermined width of a through hole. The present invention provides a method of printing on a printed circuit board using a screen for an area including a through hole of the printed circuit board, wherein the area of the screen corresponding to the through hole is covered with a photosensitive emulsion. The predetermined wiring diagram is printed on the printed circuit board. Therefore, it is possible to eliminate the defects coming from the subsequent process to improve the productivity, and also to reduce the use cost of the expensive reist ink, thereby reducing the manufacturing cost.

Description

인쇄회로기판에서의 인쇄방법Print Method on Printed Circuit Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 인쇄회로기판에서의 인쇄방법의 실시예를 나타내는 단면도.2 is a cross-sectional view showing an embodiment of a printing method on a printed circuit board according to the present invention.

Claims (3)

인쇄회로기판의 스루홀(Through Hole)을 포함한 영역에 대하여 스크린을 이용한 인쇄회로기판에서의 인쇄방법에 있어서, 상기 스루홀에 해당하는 상기 스크린의 영역을 감광성유제로 커버(Cover)하여 상기 인쇄회로기판 상에 소정의 배선도형이 인쇄함을 특징으로 하는 인쇄회로기판에서의 인쇄방법.A printing method on a printed circuit board using a screen for a region including a through hole of a printed circuit board, the method comprising: covering the region of the screen corresponding to the through hole with a photosensitive emulsion to cover the printed circuit board A printing method on a printed circuit board, characterized in that a predetermined wiring diagram is printed on a substrate. 제1항에 있어서, 상기 인쇄회로기판 상에 전기배선을 인쇄하기 위한 패턴인쇄공정임을 특징으로 하는 상기 인쇄회로기판에서의 인쇄방법.The printing method of claim 1, wherein the printing is a pattern printing process for printing electrical wiring on the printed circuit board. 제1항에 있어서, 상기 인쇄는 인쇄회로기판 상에 솔더레지스트를 인쇄하기 위한 솔더레지스트인쇄공정임을 특징으로 하는 상기 인쇄회로기판에서의 인쇄방법.The method of claim 1, wherein the printing is a solder resist printing process for printing a solder resist on a printed circuit board.
KR1019960020821A 1996-06-11 1996-06-11 Printing method of printed circuit board KR100204612B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020821A KR100204612B1 (en) 1996-06-11 1996-06-11 Printing method of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020821A KR100204612B1 (en) 1996-06-11 1996-06-11 Printing method of printed circuit board

Publications (2)

Publication Number Publication Date
KR980007888A true KR980007888A (en) 1998-03-30
KR100204612B1 KR100204612B1 (en) 1999-06-15

Family

ID=19461462

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020821A KR100204612B1 (en) 1996-06-11 1996-06-11 Printing method of printed circuit board

Country Status (1)

Country Link
KR (1) KR100204612B1 (en)

Also Published As

Publication number Publication date
KR100204612B1 (en) 1999-06-15

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