JPS5930545Y2 - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5930545Y2
JPS5930545Y2 JP1976130359U JP13035976U JPS5930545Y2 JP S5930545 Y2 JPS5930545 Y2 JP S5930545Y2 JP 1976130359 U JP1976130359 U JP 1976130359U JP 13035976 U JP13035976 U JP 13035976U JP S5930545 Y2 JPS5930545 Y2 JP S5930545Y2
Authority
JP
Japan
Prior art keywords
solder resist
printed wiring
wiring board
printed
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976130359U
Other languages
Japanese (ja)
Other versions
JPS5347559U (en
Inventor
秀明 小鮒
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1976130359U priority Critical patent/JPS5930545Y2/en
Publication of JPS5347559U publication Critical patent/JPS5347559U/ja
Application granted granted Critical
Publication of JPS5930545Y2 publication Critical patent/JPS5930545Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【考案の詳細な説明】 本考案は印刷配線板に関し特に電子部品等を実装するた
めに、その位置形状等を明示するためのマーキング印刷
に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board, and particularly to marking printing for clearly indicating the position, shape, etc. of electronic components on which electronic components are mounted.

従来印刷配線板では電子部品の実装位置、方向性測定タ
ーミナル等を指定する必要があるものについて、特定の
形状のシンボルや、英数字を指定すべき位置近傍の印刷
配線板表面上に、白色・青色等のスクリン印刷パターン
として表示をするか、または、配線導体パターンの一部
として、前記シンボル類をエツチングによる残り文字、
またはパターンとして表示することが、通常行なわれて
いる。
Conventionally, on printed wiring boards, where it is necessary to specify the mounting position of electronic components, directionality measurement terminals, etc., symbols of a specific shape or alphanumeric characters are placed on the surface of the printed wiring board in the vicinity of the positions where they should be specified. The remaining characters may be displayed as a screen-printed pattern in blue, etc., or by etching the symbols as part of the wiring conductor pattern.
Or, it is usually displayed as a pattern.

また一方では電子部品等の半田付は実装時の作業性を向
上させる目的で、通称ソルダーレジストと呼ばれる耐熱
性有機被膜を配線板の表面保護等に使用しているが、こ
の場合、文字印刷に先立って、あらかじめ、そのソルダ
ーレジストを印刷配線板上に印刷しておき、その層上に
、下地ソルダーレジストと異なる色調のインクにより印
刷文字またはパターンを印刷する。
On the other hand, when soldering electronic components, etc., a heat-resistant organic film commonly known as solder resist is used to protect the surface of wiring boards in order to improve workability during mounting. In advance, the solder resist is printed on a printed wiring board, and printed characters or patterns are printed on the layer using ink of a different tone from that of the underlying solder resist.

さもなければ第1図に示したところの実公昭43−19
740のごとく、基材としてベークライト等の赤茶色の
下地を有する印刷配線板では、2回印刷の工数低減のた
めに、緑色のソルダーレジスト1等の基材との色対比の
目立つ色構成のソルダーレジストインクを使用し、ソル
ダーレジストの印刷されぬ部分の形状でツルグーレジス
ト1上に番号2、矢印3、英文字4または指定パターン
を表示する通称抜き文字と称される手法も行なわれてい
る。
Otherwise, the actual situation as shown in Figure 1
740, which has a reddish-brown base material such as Bakelite as a base material, in order to reduce the number of steps required for two-time printing, a solder with a color composition that stands out in color contrast with the base material, such as green solder resist 1, is used. There is also a method commonly known as cut-out characters that uses resist ink to display numbers 2, arrows 3, English letters 4, or designated patterns on the solder resist 1 in the shape of the unprinted parts of the solder resist. .

しかしながら、前記の従来手法では文字印刷とソルダー
レジスト印刷を個別に2回分割して印刷した場合、ソル
ダーレジスト印刷の前後処理および印刷工程とも、工数
が重複するための工数アップはさけられなかった。
However, in the conventional method described above, when character printing and solder resist printing are separately printed twice, the number of man-hours is increased in both the pre- and post-processing and printing steps of solder resist printing, which inevitably increases the number of man-hours.

また第2の手法であるソルダーレジストの抜き文字、ま
たは抜きパターンの形状により、シンボル表示をする場
合には、印刷配線板基材のベークライト等の赤茶色の色
調と、ソルダーレジスト等の緑色の色調の例のごとく、
かなり明確な色調差がある場合には、それほど両者判別
の問題はないが、近年印刷配線板の部品実装密度の向上
と共に、スルホールめっき印刷配線板や多層スルーホー
ルメッキ印刷配線板等のエポキシ・ガラス基材を使用す
る場合に、基材自身の色調が淡緑色であり、さらに表示
文字等も細線で表示せざるを得ない。
In addition, in the second method, when symbols are displayed using cutout letters or cutout patterns of solder resist, the reddish-brown tone of Bakelite, etc. of the printed wiring board base material, and the green tone of solder resist, etc. are used. As in the example,
If there is a fairly clear difference in color tone, there is not much of a problem in distinguishing between the two, but in recent years, with the improvement in component mounting density of printed wiring boards, epoxy glass and other materials such as through-hole plating printed wiring boards and multilayer through-hole plating printed wiring boards have improved. When using a base material, the color tone of the base material itself is pale green, and furthermore, display characters and the like must be displayed using thin lines.

このため抜き文字方式では、色調の差がほとんどなく、
非常に注意して観察しないと判別しにくい。
For this reason, with the cut-out character method, there is almost no difference in color tone,
Difficult to distinguish unless observed very carefully.

また印刷のかぶりや、にじみによって文字が消滅しやす
く、特にQ、1mm以下の細線文字の印刷が困難であっ
た。
In addition, characters tend to disappear due to printing fog or bleeding, and it is particularly difficult to print fine line characters of Q and 1 mm or less.

また印刷配線板に部品実装時、文字がソルダーレジスト
表面よりも窪んでいるため、文字部分に半田付はフラッ
クスが溜りやすく、文字が読みにくい欠点がある。
Furthermore, when components are mounted on a printed wiring board, the characters are recessed below the surface of the solder resist, so flux tends to accumulate in the soldering parts, making the characters difficult to read.

本考案の目的はかかる欠点を解消した印刷配線板を提供
することにある。
An object of the present invention is to provide a printed wiring board that eliminates such drawbacks.

すなわち、本考案による印刷配線板は基板表面に塗布さ
れたソルダーレジストバタン中に、単一または複数の非
印刷開口部を設け、該開口部内にソルダーレジストで英
数字、または一定形状の表示素を設けたことを特徴とす
る。
That is, the printed wiring board according to the present invention has a single or a plurality of non-printing openings in a solder resist baton applied to the surface of the board, and alphanumeric characters or display elements of a certain shape are formed in the solder resist in the openings. It is characterized by having been established.

以下本考案の実施例を第2図により説明する。An embodiment of the present invention will be described below with reference to FIG.

第2図は、本考案の一実施例であり通常の印刷エツチン
グ法等により、製造された印刷配線板表面に、耐熱性エ
ポキシ樹脂インクでスクリーン印刷を行なった後の、そ
のパターン形状である。
FIG. 2 is an embodiment of the present invention, and shows the pattern shape after screen printing with heat-resistant epoxy resin ink is performed on the surface of a printed wiring board manufactured by a conventional printing and etching method.

本考案は第2図で明らかなごとく、ソルダーレジストパ
ターン中に、一定形状の窓わく状の非印刷部5を設け、
その窓わく状非印刷部5内に、部品表示用等のシンボル
、すなわち表示素をソルダーレジストによりかき込みそ
の表示素の形状により、ポジティブ・パターンすなわち
基板表面から突出したパターンとして判読可能ならしむ
る点にある。
As is clear from FIG. 2, the present invention provides a window frame-shaped non-printing part 5 of a fixed shape in the solder resist pattern,
A symbol for displaying parts, that is, a display element is written into the window frame-like non-printing part 5 using solder resist, and the shape of the display element makes it readable as a positive pattern, that is, a pattern protruding from the substrate surface. It is in.

本考案によれば本表示素は、歪板印刷文字となるため、
幅0.05〜Q、lQmm程度の細線まで、忠実に印刷
され印刷かぶりの全く無いファインパターンとなる。
According to the present invention, this display element becomes a distorted plate printed character, so
Even fine lines with a width of 0.05 to Q, 1Q mm can be faithfully printed, resulting in a fine pattern with no printing fog.

さらに一定形状の窓わく部が設けられており、表示部分
のソルダーレジストと表示素の間に、間隙部分を有して
いるので、作業者は表示素のある部分を基材とソルダー
レジストが、たとえ類似した色調であっても、窓わく状
の段差があるので簡単に判別することが出来る等の利点
がある。
Furthermore, a window frame part of a certain shape is provided, and there is a gap between the solder resist of the display part and the display element, so that the operator can place the part where the display element is located between the base material and the solder resist. Even if the colors are similar, they have the advantage that they can be easily distinguished because of the window frame-like steps.

また、表示素(文字)はソルダーレジスト表面より窒ん
でいないため、印刷配線基板に部品実装時でも、半田付
はフラックスが表示素部分に溜ることなく、表示素が読
みにくいことは生じない。
In addition, since the display elements (characters) are not stuck to the surface of the solder resist, even when components are mounted on a printed wiring board, soldering flux does not accumulate in the display elements, and the display elements do not become difficult to read.

さらにソルダーレジストとシンボル印刷を同時にも行え
るため、製作工数的にも有利である。
Furthermore, since solder resist and symbol printing can be performed simultaneously, it is advantageous in terms of manufacturing man-hours.

さらにまた、窓わく状のソルダーレジストは表示素が外
力によって損傷を受けたり摩耗して判読不能になってし
まうことも防止する役目を果たし、長寿命の表示機能を
実現させている点も見逃がせない利点である。
Furthermore, the window frame-shaped solder resist also prevents the display element from being damaged by external forces or becoming unreadable due to wear and tear, and it is important to note that it achieves a long-life display function. There is no advantage.

以上本考案の一実施例をもって、本考案の内容を説明し
たが、本考案はきわめて簡単な構成で製作工数を大幅に
低減し、かつ人的誤差の発生のきわめて少い表示素をも
つ印刷配線板を提供できる効果がある。
The content of the present invention has been explained above with reference to an embodiment of the present invention.The present invention has an extremely simple configuration, greatly reduces the number of manufacturing steps, and has printed wiring with display elements that are extremely free from human error. It has the effect of providing a board.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のプリント配線基板の要部平面図、第2図
は本考案の1実施例の要部平面図である。 図中の符号 1:ソルダーレジス)、2,12:番号、
3.13:矢印などの記号、4,14 :英文字、5:
窓わく状の非印刷部。
FIG. 1 is a plan view of the main parts of a conventional printed wiring board, and FIG. 2 is a plan view of the main parts of an embodiment of the present invention. Codes in the diagram 1: Solder register), 2, 12: Number,
3.13: Symbols such as arrows, 4, 14: English letters, 5:
Non-printed part shaped like a window frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田付は個所を除いて配線導体パターンおよび基板表面
に塗布されたソルダーレジストパターン中に一定形状の
窓わく状の非印刷部を設け、該非印刷部内に該ソルダー
レジストからなる所定の表示素を前記基板表面から突出
させて設けたことを特徴とする印刷配線板。
For soldering, a non-printed part in the shape of a window frame of a certain shape is provided in the solder resist pattern applied to the wiring conductor pattern and the surface of the board, except for the parts, and a predetermined display element made of the solder resist is placed in the non-printed part. A printed wiring board characterized by being provided so as to protrude from the surface of the substrate.
JP1976130359U 1976-09-28 1976-09-28 printed wiring board Expired JPS5930545Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976130359U JPS5930545Y2 (en) 1976-09-28 1976-09-28 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976130359U JPS5930545Y2 (en) 1976-09-28 1976-09-28 printed wiring board

Publications (2)

Publication Number Publication Date
JPS5347559U JPS5347559U (en) 1978-04-22
JPS5930545Y2 true JPS5930545Y2 (en) 1984-08-31

Family

ID=28739503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976130359U Expired JPS5930545Y2 (en) 1976-09-28 1976-09-28 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5930545Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331414Y2 (en) * 1979-10-09 1988-08-22
JPS6260010U (en) * 1985-10-03 1987-04-14

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4810854U (en) * 1971-06-17 1973-02-07
JPS4977177A (en) * 1972-11-30 1974-07-25
JPS5065872A (en) * 1973-10-09 1975-06-03
JPS5135664B2 (en) * 1973-02-13 1976-10-04

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5135664U (en) * 1974-09-10 1976-03-17

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4810854U (en) * 1971-06-17 1973-02-07
JPS4977177A (en) * 1972-11-30 1974-07-25
JPS5135664B2 (en) * 1973-02-13 1976-10-04
JPS5065872A (en) * 1973-10-09 1975-06-03

Also Published As

Publication number Publication date
JPS5347559U (en) 1978-04-22

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