JPH07201505A - Composite electronic component - Google Patents
Composite electronic componentInfo
- Publication number
- JPH07201505A JPH07201505A JP33584293A JP33584293A JPH07201505A JP H07201505 A JPH07201505 A JP H07201505A JP 33584293 A JP33584293 A JP 33584293A JP 33584293 A JP33584293 A JP 33584293A JP H07201505 A JPH07201505 A JP H07201505A
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminal
- protective film
- electronic component
- insulating substrate
- composite electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、絶縁基板上に形成され
た複数の電極端子と、複数の受動素子と、保護膜とを有
する複合電子部品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component having a plurality of electrode terminals formed on an insulating substrate, a plurality of passive elements, and a protective film.
【０００２】[0002]
【従来の技術】この種の例えば図６に平面図を示すよう
なネットワーク抵抗器について、以下製造工法を説明す
る。その工程順を図７に示す。以下、図６と図７とを参
照しながら説明する。まず、セラミック等の絶縁基板６
１の両端部に銀・パラジウム等の導体用ペーストをスク
リーン印刷した後高温焼成して電極端子部６２を形成す
る。次に、同様に抵抗用ペーストを前記の各電極端子に
重複するようにスクリーン印刷・高温焼成して抵抗回路
を形成する。2. Description of the Related Art A method of manufacturing a network resistor of this type, for example, a plan view of which is shown in FIG. 6, will be described below. The order of the steps is shown in FIG. Hereinafter, description will be given with reference to FIGS. 6 and 7. First, an insulating substrate 6 such as ceramic
A conductor paste of silver, palladium, or the like is screen-printed on both end portions of 1 and then baked at a high temperature to form electrode terminal portions 62. Next, similarly, a resistor paste is screen-printed and baked at a high temperature so that the resistor paste is overlapped with the above-mentioned electrode terminals to form a resistor circuit.
【０００３】しかるのち、当該抵抗素子の汚染防止や抵
抗膜の安定化のためのパッシベーション膜を施し、前記
の電極端子にプローブ（探針）を接触させて抵抗素子の
抵抗値を測定しつつ、当該抵抗素子にレーザー等による
抵抗値トリミングを実行し、所定の抵抗値になるように
調節する。Thereafter, a passivation film for preventing contamination of the resistance element and stabilizing the resistance film is applied, and a probe (probe) is brought into contact with the electrode terminal to measure the resistance value of the resistance element, Resistance value trimming is performed on the resistance element with a laser or the like to adjust the resistance value to a predetermined resistance value.
【０００４】そしてこのトリミング工程を終了した後、
絶縁基板の上面に前記抵抗素子を覆う保護膜６３として
ガラスペーストや樹脂ペースト等を塗布し高温焼成す
る。After the trimming process is completed,
A glass paste, a resin paste, or the like is applied as a protective film 63 covering the resistive element on the upper surface of the insulating substrate, and is baked at a high temperature.
【０００５】その後、保護膜の上に抵抗値６４、共通電
極端子や第１電極端子６２ａ等を示す印６５を捺印す
る。Thereafter, a mark 64 indicating the resistance value 64, the common electrode terminal, the first electrode terminal 62a, etc. is imprinted on the protective film.
【０００６】そして、シート状に形成されたネットワー
ク抵抗器を個片に分割した後、電極端子の電気導通性能
と実装性能（はんだ付け性）を向上させるため、ニッケ
ルめっき・はんだめっきを施す。After the sheet-shaped network resistor is divided into individual pieces, nickel plating / solder plating is applied in order to improve the electrical conduction performance and mounting performance (solderability) of the electrode terminals.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら前記従来
の工法では保護膜の上に抵抗値と共通電極端子や第１電
極端子を示す印を印刷する際、その回路構成毎に共通電
極端子や第１電極端子を示す印を印刷する専用マスクも
しくは、抵抗値と同時に共通電極端子や第１電極端子を
示す印を印刷する専用マスクが必要となる。しかしなが
ら、前者の方法では抵抗値表示と共通電極端子や第１電
極端子を別の工程で印刷することになるので、印刷工数
が多くなり、かつ両印刷間に相対的な位置ずれが発生す
るという課題が生じる。また、後者の方法ではマスクの
種類が多くなり管理が複雑になるという課題を有してい
た。さらに上記共通の課題として、図７の保護膜形成工
程後の仕掛かり品において、回路構成が判別できないこ
とが挙げられる。However, in the conventional method described above, when the resistance value and the mark indicating the common electrode terminal and the first electrode terminal are printed on the protective film, the common electrode terminal and the first electrode terminal are formed for each circuit configuration. A dedicated mask for printing a mark indicating the electrode terminal or a mask for printing a mark indicating the common electrode terminal and the first electrode terminal at the same time as the resistance value is required. However, in the former method, since the resistance value display and the common electrode terminal and the first electrode terminal are printed in separate steps, the number of printing steps increases and a relative positional deviation occurs between the two printings. Challenges arise. Further, the latter method has a problem that the number of masks increases and management becomes complicated. Further, the common problem is that the circuit configuration cannot be determined in the work-in-process product after the protective film forming step in FIG.
【０００８】本発明は前記従来の課題を解決するもの
で、保護膜を印刷する際に共通電極端子や第１電極端子
を示す印を同時に形成することにより、保護膜の上に抵
抗値を示す数値だけを印刷することで、印刷工数と捺印
位置ずれ不良の低減、および印刷マスクと仕掛かり品管
理を簡略化することを目的とする。The present invention solves the above-mentioned conventional problems. When the protective film is printed, a mark indicating the common electrode terminal or the first electrode terminal is simultaneously formed, so that the resistance value is shown on the protective film. By printing only numerical values, it is an object to reduce printing man-hours, improper printing position shift defects, and simplify print mask and work-in-process management.
【０００９】[0009]
【課題を解決するための手段】この目的を達成するため
に本発明の複合電子部品は、絶縁基板上に形成された複
数の電極端子と、複数の受動素子と、保護膜とを有する
複合電子部品において、共通電極端子の隣接部に、前記
保護膜の一部を延長した凸形パターンを備えたものであ
る。To achieve this object, a composite electronic component of the present invention is a composite electronic device having a plurality of electrode terminals formed on an insulating substrate, a plurality of passive elements, and a protective film. In the component, a convex pattern obtained by extending a part of the protective film is provided adjacent to the common electrode terminal.
【００１０】[0010]
【作用】この構成によって、保護膜を印刷する際に共通
電極端子や第１電極端子を示す印を同時に形成すること
により、印刷工数と捺印位置ずれ不良の低減、および印
刷マスクと仕掛かり品管理の簡略化が実現できる。With this structure, when the protective film is printed, marks indicating the common electrode terminals and the first electrode terminals are simultaneously formed, thereby reducing the number of printing steps and improper printing position deviation, and managing the print mask and work in process. Can be simplified.
【００１１】[0011]
（実施例１）以下本発明の一実施例のネットワーク抵抗
器について、図面を参照しながら説明する。図１（ａ）
は本発明の一実施例におけるネットワーク抵抗器の表面
図を示し、図１（ｂ）と図１（ｃ）はそれぞれ図１
（ａ）に示すネットワーク抵抗器の側面図と裏面図を示
す。図５は本発明の一実施例におけるネットワーク抵抗
器の工程図を示す。図１（ａ），（ｂ），（ｃ）におい
て、アルミナ基板を用いて短冊状に形成した絶縁基板１
１と、この絶縁基板１１の長手方向の両端面に対称に形
成した電極端子部１２と、この電極端子部１２と接続さ
れてなる抵抗回路を覆う保護膜１３と、この保護膜１３
上に抵抗値を表示する捺印１４と、電極端子部１２の中
の共通電極端子部１２ａ，１２ｂと、この共通電極端子
部１２ａの隣接部に形成された保護膜１３からなる凸パ
ターン１３ａ，１３ｂとを備えた固定抵抗器を示してい
る。図２は図１に示されたネットワーク抵抗器の回路図
を示している。(Embodiment 1) Hereinafter, a network resistor according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 (a)
Shows a front view of a network resistor according to an embodiment of the present invention, and FIGS. 1 (b) and 1 (c) respectively show FIG.
The side view and the back view of the network resistor shown in (a) are shown. FIG. 5 is a process diagram of a network resistor according to an embodiment of the present invention. 1A, 1B, and 1C, an insulating substrate 1 formed in a strip shape using an alumina substrate.
1, electrode terminal portions 12 symmetrically formed on both end surfaces of the insulating substrate 11 in the longitudinal direction, a protective film 13 for covering a resistance circuit connected to the electrode terminal portions 12, and the protective film 13
The marking 14 for displaying the resistance value, the common electrode terminal portions 12a, 12b in the electrode terminal portion 12, and the convex patterns 13a, 13b made of the protective film 13 formed adjacent to the common electrode terminal portion 12a. 3 shows a fixed resistor with and. FIG. 2 shows a circuit diagram of the network resistor shown in FIG.
【００１２】本実施例では、絶縁基板１１として９６％
アルミナ基板、電極端子部１２の材料としてＡｇ系また
はＡｇ／Ｐｄ系厚膜ペースト、抵抗材料としてＲｕＯ2
系厚膜ペーストを用い、絶縁基板１１にスクリーン印刷
の後、８５０℃の高温で焼成して電極端子部１２とこれ
に接続する抵抗回路を形成している。次に電極端子部１
２を除いて、印刷焼成後に絶縁基板１１上に形成された
抵抗回路上にパッシベーション膜を施してから、抵抗値
を調整するためレーザー等によるトリミングを行う。こ
の後、絶縁基板１１上に形成された抵抗回路を覆うため
保護膜１３として黒色のガラスペーストもしくは樹脂ペ
ーストを印刷して、抵抗回路を保護すると共に共通電極
端子部１２ａ，１２ｂの隣接部に保護膜１３からなる凸
パターン１３ａ，１３ｂも同時に形成する。そして、保
護膜１３を乾燥もしくは焼成した後、抵抗値を表示する
捺印１４を印刷焼成する。In this embodiment, the insulating substrate 11 is 96%.
Alumina substrate, Ag-based or Ag / Pd-based thick film paste as a material for the electrode terminal portion 12, RuO 2 as a resistance material
Screen printing is performed on the insulating substrate 11 using a system thick film paste, followed by firing at a high temperature of 850 ° C. to form the electrode terminal portion 12 and the resistance circuit connected thereto. Next, the electrode terminal portion 1
Except for 2, the passivation film is formed on the resistance circuit formed on the insulating substrate 11 after printing and baking, and then trimming is performed by laser or the like to adjust the resistance value. Thereafter, a black glass paste or a resin paste is printed as a protective film 13 to cover the resistance circuit formed on the insulating substrate 11 to protect the resistance circuit and protect the adjacent portions of the common electrode terminal portions 12a and 12b. The convex patterns 13a and 13b made of the film 13 are also formed at the same time. Then, after the protective film 13 is dried or fired, the imprint 14 indicating the resistance value is printed and fired.
【００１３】この後、多数の単体を集合させたシート状
に形成されたネットワーク抵抗器を一個ずつの個片に分
割した後、電極端子の電気導通性能と実装性能（はんだ
付け性）を向上させるため、ニッケルめっき・はんだめ
っきを施す。Thereafter, a sheet-shaped network resistor formed by assembling a large number of single bodies is divided into individual pieces, and then the electrical conduction performance and mounting performance (solderability) of the electrode terminals are improved. Therefore, nickel plating / solder plating is applied.
【００１４】以上の本実施例によれば、絶縁基板１１上
に形成された抵抗回路を覆うため保護膜１３としてガラ
スペーストもしくは樹脂ペーストを印刷して、抵抗回路
を保護すると共に共通電極端子部１２ａ，１２ｂの隣接
部に保護膜１３からなる凸パターン１３ａ，１３ｂを形
成することにより、その後工程においては抵抗値を表示
する捺印１４を印刷焼成するだけでよく、共通電極端子
部１２ａ，１２ｂを示す捺印をする必要がなくなるの
で、印刷工数と捺印位置ずれ不良の低減、および印刷マ
スクと仕掛かり品管理の簡略化が実現できる。According to the present embodiment as described above, a glass paste or a resin paste is printed as the protective film 13 to cover the resistance circuit formed on the insulating substrate 11 to protect the resistance circuit and at the same time the common electrode terminal portion 12a. , 12b, the convex patterns 13a, 13b made of the protective film 13 are formed, so that in the subsequent step, the marking 14 indicating the resistance value may be printed and baked, and the common electrode terminal portions 12a, 12b are shown. Since it is not necessary to stamp, it is possible to reduce the number of printing steps and improper printing position misalignment, and simplify the management of print masks and work-in-process.
【００１５】なお、本実施例の図２に示すネットワーク
抵抗器の回路において、全ての抵抗値を同じとする並列
回路の場合、共通電極端子部１２ａ，１２ｂが点対称に
配置されるので実装方向性がなくなり、実装間違いを防
ぐことにもなる。In the circuit of the network resistor shown in FIG. 2 of the present embodiment, in the case of a parallel circuit in which all the resistance values are the same, the common electrode terminal portions 12a and 12b are arranged point-symmetrically, so that the mounting direction It also eliminates the possibility of implementation errors.
【００１６】（実施例２）以下本発明の第２の実施例の
ネットワーク抵抗器について、図面を参照しながら説明
する。図３は本発明の一実施例におけるネットワーク抵
抗器の平面図を示す。図３において、アルミナ基板を用
いて短冊状に形成した絶縁基板３１と、この絶縁基板３
１の長手方向の両端面に対称に形成した電極端子部３２
と、この電極端子部３２と接続されてなる抵抗回路を覆
う保護膜３３と、この保護膜３３上に抵抗値を表示する
捺印３４と、電極端子部３２の中の共通電極端子部３２
ａと、この共通電極端子部３２ａの隣接部に形成された
保護膜３３からなる凸パターン３３ａとを備えた固定抵
抗器を示している。図４は図３に示されたネットワーク
抵抗器の回路図を示している。(Second Embodiment) A network resistor according to a second embodiment of the present invention will be described below with reference to the drawings. FIG. 3 shows a plan view of a network resistor according to an embodiment of the present invention. In FIG. 3, an insulating substrate 31 formed in a strip shape using an alumina substrate and the insulating substrate 3
1. Electrode terminal portions 32 symmetrically formed on both end faces in the longitudinal direction of 1
A protective film 33 for covering the resistance circuit connected to the electrode terminal portion 32, a marking 34 for displaying a resistance value on the protective film 33, and a common electrode terminal portion 32 in the electrode terminal portion 32.
3A shows a fixed resistor including a and a convex pattern 33a formed of a protective film 33 formed in a portion adjacent to the common electrode terminal portion 32a. FIG. 4 shows a circuit diagram of the network resistor shown in FIG.
【００１７】本実施例では、絶縁基板３１として９６％
アルミナ基板、電極端子部３２の材料としてＡｇ系また
はＡｇ／Ｐｄ系厚膜ペースト、抵抗材料としてＲｕＯ2
系厚膜ペーストを用い、絶縁基板３１にスクリーン印刷
の後、８５０℃の高温で焼成して電極端子部３２とこれ
に接続する抵抗回路を形成している。なお、必要に応じ
て電極端子部３２を除いて、印刷焼成後に絶縁基板３１
上に形成された抵抗回路上にパッシベーション膜を施
し、抵抗値を調整するためレーザー等によるトリミング
を行う。この後、絶縁基板３１上に形成された抵抗回路
を覆うため保護膜３３としてガラスペーストもしくは樹
脂ペーストを印刷して、抵抗回路を保護すると共に共通
電極端子部３２ａの隣接部に保護膜３３からなる凸パタ
ーン３３ａを形成する。そして、保護膜３３を乾燥もし
くは焼成した後、抵抗値を表示する捺印３４を印刷焼成
する。In this embodiment, the insulating substrate 31 is 96%.
Alumina substrate, Ag-based or Ag / Pd-based thick film paste as a material for the electrode terminal portion 32, and RuO 2 as a resistance material
After screen printing on the insulating substrate 31 using a system thick film paste, baking is performed at a high temperature of 850 ° C. to form the electrode terminal portion 32 and the resistance circuit connected thereto. Note that the insulating substrate 31 is removed after printing and baking, except for the electrode terminal portion 32 as necessary.
A passivation film is formed on the resistor circuit formed above, and trimming is performed with a laser or the like to adjust the resistance value. After that, a glass paste or a resin paste is printed as a protective film 33 to cover the resistance circuit formed on the insulating substrate 31, thereby protecting the resistance circuit and forming the protective film 33 on the adjacent portion of the common electrode terminal portion 32a. The convex pattern 33a is formed. Then, after the protective film 33 is dried or fired, the imprint 34 indicating the resistance value is printed and fired.
【００１８】この後、シート状に形成されたネットワー
ク抵抗器を個片に分割した後、電極端子の電気導通性能
と実装性能（はんだ付け性）を向上させるため、ニッケ
ルめっき・はんだめっきを施す。After that, the sheet-shaped network resistor is divided into individual pieces, and then nickel plating / solder plating is applied in order to improve the electrical conduction performance and mounting performance (solderability) of the electrode terminals.
【００１９】以上のように本実施例によれば、絶縁基板
３１上に形成された抵抗回路を覆うため保護膜３３とし
て下地と色彩、明度等が異なるガラスペーストもしくは
樹脂ペーストを印刷して、抵抗回路を保護すると共に共
通電極端子部３２ａの隣接部に保護膜３３からなる凸パ
ターン３３ａを形成することにより、その後工程におい
ては抵抗値を表示する捺印３４を印刷焼成するだけでよ
く、共通電極端子３２ａを示す捺印をする必要がなくな
るので、印刷工数と捺印位置ずれ不良の低減、および印
刷マスクと仕掛かり品管理の簡略化が実現できる。As described above, according to this embodiment, in order to cover the resistance circuit formed on the insulating substrate 31, as the protective film 33, a glass paste or a resin paste different in color, brightness, etc. from the base is printed, and the resistance is reduced. By protecting the circuit and forming the convex pattern 33a made of the protective film 33 on the adjacent portion of the common electrode terminal portion 32a, in the subsequent step, only the seal 34 indicating the resistance value is printed and baked. Since it is not necessary to perform the marking showing the mark 32a, it is possible to reduce the number of printing steps and improper printing position deviation, and simplify the management of the print mask and work-in-progress.
【００２０】なお、本実施例では、同一抵抗値を有する
並列回路のネットワーク抵抗器の例を想定して説明した
が、異種抵抗値が混在するような回路や抵抗だけでなく
コンデンサ等の他受動素子を有する複合電子部品の特定
の電極端子を示すのにも本発明が有効であることは明ら
かである。Although the present embodiment has been described on the assumption of an example of a network resistor of a parallel circuit having the same resistance value, not only a circuit or a resistor in which different resistance values are mixed but also another passive element such as a capacitor. It is obvious that the present invention is also effective for indicating a specific electrode terminal of a composite electronic component having an element.
【００２１】[0021]
【発明の効果】以上のように本発明は、共通電極端子の
隣接部に保護膜の一部を延長した凸形パターンを設ける
ことにより、保護膜を印刷する際に共通電極端子や特定
の電極端子を示す印を同時に示すことができるので、印
刷工数や捺印位置ずれ不良の低減、および印刷マスクと
仕掛かり品管理の簡略化が実現できるものである。As described above, according to the present invention, by providing the convex pattern in which a part of the protective film is extended in the adjacent portion of the common electrode terminal, the common electrode terminal and the specific electrode are printed when the protective film is printed. Since the mark indicating the terminal can be shown at the same time, it is possible to reduce the number of printing steps, improper printing position deviation, and simplify the print mask and work-in-process management.
【図１】（ａ）本発明の第１の実施例におけるネットワ
ーク抵抗器の表面図 （ｂ）同ネットワーク抵抗器の側面図 （ｃ）同ネットワーク抵抗器の裏面図1A is a front view of a network resistor according to a first embodiment of the present invention, FIG. 1B is a side view of the network resistor, and FIG. 1C is a rear view of the network resistor.
【図２】同ネットワーク抵抗器の回路図FIG. 2 is a circuit diagram of the network resistor.
【図３】本発明の第２の実施例におけるネットワーク抵
抗器の平面図FIG. 3 is a plan view of a network resistor according to a second embodiment of the present invention.
【図４】同ネットワーク抵抗器の回路図FIG. 4 is a circuit diagram of the network resistor.
【図５】本発明の各実施例におけるネットワーク抵抗器
の工程図FIG. 5 is a process diagram of a network resistor according to each embodiment of the present invention.
【図６】従来のネットワーク抵抗器の平面図FIG. 6 is a plan view of a conventional network resistor.
【図７】同ネットワーク抵抗器の工程図FIG. 7 is a process diagram of the network resistor.
１１，３１ 絶縁基板 １２，３２ 電極端子部 １２ａ，３２ａ 共通電極端子部 １２ｂ 共通電極端子部 １３，３３ 保護膜 １３ａ，３３ａ 保護膜凸パターン部 １３ｂ 保護膜凸パターン部 11, 31 Insulating substrate 12, 32 Electrode terminal part 12a, 32a Common electrode terminal part 12b Common electrode terminal part 13, 33 Protective film 13a, 33a Protective film convex pattern part 13b Protective film convex pattern part
Claims (2)
と、複数の受動素子と、保護膜とを有する複合電子部品
において、共通電極端子の隣接部に、前記保護膜の一部
を延長した凸形パターンを備えた複合電子部品。1. In a composite electronic component having a plurality of electrode terminals formed on an insulating substrate, a plurality of passive elements, and a protective film, a part of the protective film is extended to a portion adjacent to a common electrode terminal. Composite electronic component with a raised convex pattern.
と、複数の受動素子と、保護膜とを有する複合電子部品
において、特定の電極端子の隣接部に、前記保護膜の一
部を延長した凸形パターンを備えた複合電子部品。2. A composite electronic component having a plurality of electrode terminals formed on an insulating substrate, a plurality of passive elements, and a protective film, wherein a part of the protective film is provided adjacent to a specific electrode terminal. Composite electronic component with extended convex pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33584293A JP3226401B2 (en) | 1993-12-28 | 1993-12-28 | Composite electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33584293A JP3226401B2 (en) | 1993-12-28 | 1993-12-28 | Composite electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07201505A true JPH07201505A (en) | 1995-08-04 |
| JP3226401B2 JP3226401B2 (en) | 2001-11-05 |
Family
ID=18293010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33584293A Expired - Fee Related JP3226401B2 (en) | 1993-12-28 | 1993-12-28 | Composite electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3226401B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017612A (en) * | 2001-06-28 | 2003-01-17 | Rohm Co Ltd | Semiconductor device |
-
1993
- 1993-12-28 JP JP33584293A patent/JP3226401B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017612A (en) * | 2001-06-28 | 2003-01-17 | Rohm Co Ltd | Semiconductor device |
| JP4541597B2 (en) * | 2001-06-28 | 2010-09-08 | ローム株式会社 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3226401B2 (en) | 2001-11-05 |
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